Flexible circuit board and display device

Abstract

The utility model provides a flexible circuit board and a display device, and the flexible circuit board comprises a substrate which comprises a component area; the covering layer is located on one side of the substrate, and the covering layer is arranged around the component area; and the adhesive cutting part is positioned on one side, far away from the substrate, of the covering layer and is contacted with the covering layer. According to the flexible circuit board provided by the embodiment of the utility model, the glue cutting part is arranged on one side, far away from the substrate, of the covering layer and is in contact with the covering layer. When the glue cutting part is arranged on the covering layer, when the component is arranged in the component area and the component is fixed by glue, the glue cutting part can prevent the glue from flowing, so that the glue can accurately cover the preset area and does not overflow to the non-preset area, and the accuracy of glue covering is improved. And meanwhile, the glue cutting part is in contact with the covering layer, and the glue can be in contact with the side surface of the glue cutting part and the substrate, so that the contact area of the glue and the flexible circuit board is increased, and the connection strength between the component and the flexible circuit board is enhanced.

Description

Technical Field

[0001] The embodiments of the present utility model relate to the technical field of displays, and in particular, to a flexible circuit board and a display device Background Art

[0002] In the prior art, components on a flexible circuit board are fixed to the flexible circuit board by means of dispensing glue. However, in the prior art, there is no dedicated structure to precisely control the flow of the glue during the installation of the components, resulting in the glue overflowing into non-prescribed areas when fixing the components. At the same time, the contact area between the glue and the flexible circuit board is also small, making it difficult to ensure a firm connection between the components and the flexible circuit board Summary of the Utility Model

[0003] The present utility model provides a flexible circuit board and a display device, so as to improve the accuracy of glue coverage, increase the contact area between the glue and the flexible circuit board, and enhance the connection strength between the components and the flexible circuit board

[0004] According to a first aspect of the present utility model, there is provided a flexible circuit board, comprising:

[0005] A substrate, the substrate comprising a component area;

[0006] A cover layer, located on one side of the substrate, the cover layer surrounding the component area;

[0007] A glue-cutting portion, located on the side of the cover layer away from the substrate and in contact with the cover layer

[0008] Optionally, the substrate further comprises a wiring layer, located on the side of the cover layer away from the glue-cutting portion;

[0009] The cover layer comprises a first opening, the first opening exposing a part of the wiring layer below the cover layer;

[0010] The component area is arranged within the area where the first opening is located;

[0011] The glue-cutting portion is arranged annularly around the first opening on the cover layer outside the first opening

[0012] According to a second aspect of the present utility model, there is provided a display device, comprising: the flexible circuit board provided in any embodiment of the present utility model, components, and glue;

[0013] The components are arranged on the component area of the flexible circuit board;

[0014] The glue covers the components and at least covers a part of the component area of the flexible circuit board;

[0015] Along the first direction, the vertical distance between the glue cutting part and the component is a first distance; the direction from the center of the component to the covering layer is the first direction;

[0016] The first distance is less than or equal to the glue flow distance.

[0017] Optionally, the first distance is 40 μm; and / or, the glue flow distance is 0.2 mm.

[0018] Optionally, the projection of the glue on the substrate at least partially covers the projection of the glue cutting part on the substrate.

[0019] Optionally, the glue cutting part generates a glue mark, and the projection of the edge of the glue mark on the substrate coincides with the projection of the edge of the glue on the substrate.

[0020] Optionally, the projection of the glue on the substrate is adjacent to or separated from the projection of the glue cutting part on the substrate.

[0021] Optionally, when the projection of the glue on the substrate is separated from or adjacent to the projection of the glue cutting part on the substrate, the actual glue flow distance is less than or equal to the first distance.

[0022] Optionally, between the edge side of the glue cutting part close to the component area and the edge side of the nearest component area is a first area; at the first area, the thickness of the glue is a first thickness; the first thickness is less than or equal to the thickness of the glue cutting part.

[0023] Optionally, the first thickness is less than 20 μm; and / or, the thickness of the glue cutting part is 25 μm.

[0024] In the technical solution provided by the embodiments of the present utility model, a glue cutting part is arranged on the side of the covering layer away from the substrate and is in contact with the covering layer. When the glue cutting part is arranged on the covering layer, when the component is arranged in the component area and fixed with glue, the glue cutting part can block the flow of the glue, ensuring that the glue can accurately cover the preset area without overflowing to the non-preset area, improving the accuracy of glue coverage. At the same time, the glue cutting part is arranged in contact with the covering layer, and the glue can contact the side of the glue cutting part and the substrate, increasing the contact area between the glue and the flexible circuit board and enhancing the connection strength between the component and the flexible circuit board.

[0025] It should be understood that the content described in this part is not intended to identify the key or important features of the embodiments of the present utility model, nor is it used to limit the scope of the present utility model. Other features of the present utility model will become easily understood through the following description. Description of the Drawings

[0026] To more clearly illustrate the technical solutions in the embodiments of the present utility model, the following will briefly introduce the drawings required for the description of the embodiments. Obviously, the drawings in the following description are only some embodiments of the present utility model. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on these drawings.

[0027] Figure 1 It is a schematic diagram of a flexible circuit board structure in the related art;

[0028] Figure 2 It is a schematic diagram of the structure of a flexible circuit board provided by an embodiment of the present utility model;

[0029] Figure 3 It is a schematic diagram of the structure of another flexible circuit board provided by an embodiment of the present utility model;

[0030] Figure 4 It is a schematic diagram of the structure of a circuit component connected to a display panel in a display device provided by an embodiment of the present utility model;

[0031] Figure 5 It is a schematic diagram of the structure of another circuit component connected to a display panel in a display device provided by an embodiment of the present utility model;

[0032] Figure 6 It is a schematic diagram of the structure of another circuit component connected to a display panel in a display device provided by an embodiment of the present utility model. Detailed implementation manners

[0033] In order to enable those skilled in the art to better understand the solutions of the present utility model, the following will clearly and completely describe the technical solutions in the embodiments of the present utility model in conjunction with the drawings in the embodiments of the present utility model. Obviously, the described embodiments are only a part of the embodiments of the present utility model, rather than all of the embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present utility model.

[0034] It should be noted that the terms "first", "second", etc. in the description, claims and the above-mentioned drawings of the present utility model are used to distinguish similar objects, and do not necessarily have to be used to describe a specific order or sequence. It should be understood that the data used in this way can be interchanged under appropriate circumstances, so that the embodiments of the present utility model described herein can be implemented in an order other than those illustrated or described herein. In addition, the terms "comprising" and "having" and any variations thereof are intended to cover non-exclusive inclusion. For example, a process, method, system, product or device comprising a series of steps or units does not necessarily have to be limited to those steps or units clearly listed, but may include other steps or units not clearly listed or inherent to these processes, methods, products or devices.

[0035] It should be understood that various forms of the flow shown above can be used, reordering, adding or deleting steps. For example, the steps described in the present utility model can be executed in parallel, sequentially or in a different order, as long as the desired results of the technical solution of the present utility model can be achieved, and no limitation is made herein.

[0036] Figure 1 is a schematic structural diagram of a flexible circuit board in the related art, as Figure 1 shown, a first substrate 0101, a first cover layer 0102, a first component area 0103 and an opening 0104 are provided.

[0037] In the flexible circuit board of the related art, the first component area 0103 is arranged in the opening 0104, and components are arranged in the first component area 0103. When performing the dispensing operation, the glue flows in the opening 0104. When the glue flows out of the opening 0104, glue overflow occurs. Glue overflow easily occurs during the dispensing operation in the flexible circuit board of the related art, and at the same time, the contact area between the glue and the flexible circuit board is small.

[0038] Figure 2 is a schematic structural diagram of a flexible circuit board provided by an embodiment of the present utility model, as Figure 2 shown, the flexible circuit board includes: a substrate 101, and the substrate 101 includes a component area 104; a cover layer 102, located on one side of the substrate 101, and the cover layer 102 is arranged around the component area 104; a glue-cutting part 103, located on the side of the cover layer 102 away from the substrate 101 and in contact with the cover layer 102.

[0039] Specifically, when the glue-cutting part is arranged on the side of the covering layer away from the base, when the component is arranged in the component area 104 and fixed with glue, when the glue flows to the glue-cutting part 103, the glue will stop flowing. That is, it limits the coverage of the glue in the preset area and will not overflow in the non-preset area, thereby improving the accuracy of glue coverage. The preset area is the area surrounded by the glue-cutting part.

[0040] Arrange the component in the component area 104, and set the glue to cover the component and at the same time cover a part of the flexible circuit board. So as to fix the component and the flexible circuit board. Optionally, the glue-cutting part 103 is arranged around the component area 104. After the component is arranged on the component area 104, the glue will cover the component and at the same time cover a part of the component area and part of the glue will contact the glue-cutting part 103. The contact area between the glue and the flexible circuit board is increased, and the connection strength between the component and the flexible circuit board is enhanced. When the glue contacts a part of the glue-cutting part 103, the glue contacts the side of the glue-cutting part 103 close to the component area 104, or the glue contacts the side of the glue-cutting part 103 close to the component area and the side of the glue-cutting part away from the base. The contact area between the glue and the glue-cutting part 103 is related to factors such as the fluidity of the glue, the amount of glue, the size of the component area, and the size of the glue-cutting part.

[0041] The covering layer 102 is located on one side of the base 101 and is a layer of material on the flexible circuit board. This layer of material protects the surface of the flexible circuit board from being eroded by external substances, and at the same time can increase the wear resistance and stain resistance of the flexible circuit board, thereby improving the reliability and service life of the flexible circuit board. In the embodiment of the present invention, arranging the covering layer 102 around the component area 104 can protect the base 101 around the component area 104 from being damaged by the components in the component area 104 or by other components to the base 101. At the same time, the glue-cutting part 103 is arranged on the side of the covering layer 102 away from the base 101 and contacts the covering layer 102. It also makes the covering layer 102 play a role in raising the glue-cutting part 103, making the glue-cutting part 103 higher than the surface of the base 101, and enhancing the restricting effect of the glue-cutting part 103 on the flow of the glue.

[0042] Optionally, the material of the covering layer 102 is polyester film or polypropylene film. Specifically, the material of the covering layer 102 is set according to the actual situation and is not limited here.

[0043] Optionally, the material of the glue-cutting part 103 can be the same as that of the covering layer 102; or special ink; or glue with poor fluidity. Specifically, the material of the glue-cutting part 103 is set according to the actual situation and is not limited here.

[0044] Optionally, the base 101 includes a wiring layer 1011.

[0045] Among them, the wiring layer 1011 is a layer in the flexible circuit board for arranging and connecting circuit wires. The wiring layer 1011 can be disposed on the side of the cover layer 102 away from the glue cutting portion 103. At the same time, a part of the wiring layer 1011 exposed in the component area 104 and its surrounding area. When components are disposed on the component area 104, the components are in contact with the wiring layer 1011. In an embodiment of the present invention, the glue cutting portion 103 and the cover layer 102 surrounding the component area 104 play a role in blocking the flow of glue to limit the flow range of the glue. Since the wiring layer 1011 is in direct contact with the components, during the dispensing operation, the glue will come into contact with the wiring layer 1011. That is, the glue covers at least a part of the area of the wiring layer 1011, and the wiring layer 1011 provides space for the flow of the glue. Optionally, the wiring layer 1011 around the component area 104 is processed to slow down the flow rate of the glue, so as to avoid the glue overflowing before it solidifies.

[0046] An embodiment of the present invention provides a flexible circuit board and a display device. The flexible circuit board includes: a substrate, the substrate includes a component area; a cover layer, located on one side of the substrate, the cover layer is disposed around the component area; a glue cutting portion, located on the side of the cover layer away from the substrate and in contact with the cover layer. In the flexible circuit board provided by the embodiment of the present invention, the glue cutting portion is disposed on the side of the cover layer away from the substrate and in contact with the cover layer. When the glue cutting portion is disposed on the cover layer, when components are disposed in the component area and fixed with glue, the glue cutting portion can block the flow of the glue, ensuring that the glue can accurately cover the preset area without overflowing to the non-preset area, improving the accuracy of glue coverage. At the same time, the glue cutting portion is disposed in contact with the cover layer, and the glue can contact the side surface of the glue cutting portion and the substrate, increasing the contact area between the glue and the flexible circuit board and enhancing the connection strength between the components and the flexible circuit board.

[0047] Figure 3 is a schematic structural diagram of another flexible circuit board provided by an embodiment of the present invention. On the basis of the above embodiment, as Figure 2 and Figure 3 shown, the substrate 101 further includes a wiring layer 1011, located on the side of the cover layer 102 away from the glue cutting portion 103; the cover layer 102 includes a first opening 105, and the first opening 105 exposes a part of the wiring layer 1011 below the cover layer 102; the component area 104 is disposed in the area where the first opening 105 is located; the glue cutting portion 103 is disposed around the first opening 105 and on the cover layer 102 outside the first opening 105 in a ring shape.

[0048] Specifically, the cover layer 102 includes a first opening 105 to expose the wiring layer 1011, and the component area 104 is disposed in the first opening 105. When components are disposed on the component area 104, the components are disposed on the wiring layer 1011. When the glue-cutting portion 103 is disposed annularly around the first opening 105 on the cover layer 102 outside the first opening 105, and glue is disposed to cover the components and a part of the flexible circuit board, it can be seen that the preset area where the glue flows is the area surrounded by the annular glue-cutting portion 103.

[0049] Optionally, when glue is disposed to cover the components and a part of the flexible circuit board, the glue covers the components and at least a part of the first opening area; or the glue covers the components, the first opening area, and at least a part of the side surface of the glue-cutting portion 103 close to the component area; or the glue covers the components, the first opening area, and at least a part of the side surface of the glue-cutting portion 103 close to the component area; or the glue covers the components, the first opening area, the side surface of the glue-cutting portion 103 close to the component area, and at least a part of the surface of the glue-cutting portion 103 away from the substrate 101.

[0050] Figure 4 It is a schematic structural diagram of a circuit component connected to a display panel in a display device provided by an embodiment of the present invention. As Figure 4 shown: the flexible circuit board, the component 200, and the glue 300 in any of the above embodiments; the component 200 is disposed on the component area 104 of the flexible circuit board; the glue 300 covers the component 200 and at least covers a part of the flexible circuit board; along the first direction X, the perpendicular distance between the glue-cutting portion 103 and the component 200 is the first distance 01; the direction from the center of the component 200 to the cover layer 103 is the first direction X; the first distance 01 is less than or equal to the flow distance of the glue 300.

[0051] Specifically, as Figure 4 shown and in the above embodiments, in the flexible circuit board provided in any of the above embodiments, the component 200 is disposed in the component area 104, and the glue 300 is disposed to cover the component and at least a part of the flexible circuit board. Optionally, as Figure 4 shown, the glue 300 covers at least a part of the first opening in the flexible circuit board, and covers at least a part of the side surface of the cover layer 103 close to the component area 104. Wherein the glue-cutting portion 103 is in contact with the cover layer 102, so that the glue can contact the side surface of the glue-cutting portion 103, the side surface of the cover layer 102, and the substrate 101 of the flexible circuit board, increasing the contact area between the glue 300 and the flexible circuit board and enhancing the connection strength between the component 200 and the flexible circuit board.

[0052] Specifically, along the first direction X, the vertical distance between the glue cutting portion 103 and the component 200 is the first distance 01, and the first distance 01 is less than or equal to the flow distance of the glue 300. Then, as Figure 4 As can be seen from the above embodiment, when the glue cutting portion 103 is arranged on the covering layer 102, a preset area is surrounded. When the glue is used to fix the component 200, the glue 300 flows within the preset area; blocked by the glue cutting portion 103, the glue 300 will not exceed the preset area. In the actual production process, there are corresponding standard designs for the dispensing of components: the flow range of the glue cannot exceed the preset, otherwise glue overflow will occur and affect the performance of the display device. Therefore, optionally, the glue flow distance is the preset acceptable glue flow range. And the first distance 01 is less than or equal to the glue flow distance, which also enables the setting of the glue 300 to meet the requirement that the glue will not overflow the acceptable glue flow range under the block of the glue cutting portion 103.

[0053] Optionally, the first distance 01 is 40 μm; and / or the glue flow distance is 0.2 mm.

[0054] The embodiment of the present utility model provides a display device, including the flexible circuit board, the component and the glue in any of the above embodiments; the component is arranged on the component area of the flexible circuit board; the glue covers the component and at least partially covers the flexible circuit board; in the first direction, the pure distance between the glue cutting portion and the component is less than or equal to the glue flow distance. The display device provided by the embodiment of the present utility model increases the contact area between the glue and the flexible circuit board, so as to make the fixation of the component more firm; at the same time, the preset area surrounded by the glue cutting portion enables the glue cutting portion to block the flow of the glue in the preset area and avoid the occurrence of glue overflow.

[0055] Figure 5 It is a schematic structural diagram of a circuit component connected to a display panel in another display device provided by the embodiment of the present utility model. As Figure 5 shown, on the basis of the above embodiment, the projection of the glue 300 on the substrate 101 at least partially covers the projection of the glue cutting portion 103 on the substrate 101. The glue cutting portion 103 generates a glue mark, and the projection of the edge of the glue mark on the substrate 101 coincides with the projection of the edge of the glue 300 on the substrate 101.

[0056] Specifically, on the side where the glue 300 is away from the component along the first direction X, a part of the glue 300 flows onto the glue-cutting part 103. Such a situation may be due to factors such as a large amount of glue, a small first distance 01, or strong fluidity of the glue. The specific reason for the glue flowing onto the glue-cutting part is not limited here. At this time, the projection of the glue 300 on the substrate 101 at least partially covers the projection of the glue-cutting part 103 on the substrate 101. Meanwhile, along the first direction X, the distance between the edge side of the projection of the glue 300 on the substrate 101 away from the component and the component is less than or equal to the distance between the edge side of the glue-cutting part 103 away from the component and the component. That is, although a part of the glue 300 will flow onto the glue-cutting part 103, the flow of the glue 300 will not exceed the edge side of the glue-cutting part 103 away from the component. The setting of the glue-cutting part 103 provides a certain accommodation area for the flow of the glue 300, so that there is an accommodation area for the glue to flow during the dispensing operation, avoiding large-scale glue overflow. Optionally, the accommodation area is the side of the glue-cutting part 103 away from the flexible circuit board substrate.

[0057] Continue to refer to Figure 5 , on the basis of the above embodiment, when a part of the glue 300 flows onto the glue-cutting part 103 on the side where the glue 300 is away from the component along the first direction X, due to the material properties of the glue 300 and / or the glue-cutting part 103, glue marks will be generated on the glue-cutting part 103. The projection of the edge of the glue marks on the substrate 101 coincides with the projection of the edge of the glue 300 on the substrate 101. The operator can observe the flow situation of the glue 300 by observing the generation of the glue marks.

[0058] Optionally, when observing the flow situation of the glue 300 by observing the glue marks, along the first direction X:

[0059] When the glue marks are far from the edge side of the glue-cutting part 103 away from the component 200, it indicates that the amount of glue flowing into the glue-cutting part 103 is small. At this time, the dispensing situation is evaluated as "A";

[0060] When the glue marks are moderately far from the edge side of the glue-cutting part 103 away from the component 200, it indicates that the amount of glue flowing into the glue-cutting part 103 is moderate. At this time, the dispensing situation is evaluated as "B";

[0061] When the glue marks are close to the edge side of the glue-cutting part 103 away from the component 200, it indicates that the amount of glue flowing into the glue-cutting part 103 is large. At this time, the dispensing situation is evaluated as "C".

[0062] When the glue marks significantly exceed the edge side of the glue-cutting part 103 away from the component 200, it indicates that glue overflow has occurred.

[0063] Optionally, in the above evaluation of the dispensing situation, if the risk of glue overflow is considered and the intensity of the glue overflow risk is used as the standard, then Evaluation A is "excellent", Evaluation B is "medium", and Evaluation C is "poor". It is also possible to consider, under the condition of avoiding glue overflow, using the strength of the glue fixing the components during the dispensing operation as the standard. Then, without glue overflow, the larger the contact area between the glue and the flexible circuit board, the better. In this case, Evaluation A is "poor", Evaluation B is "medium", and Evaluation C is "excellent". The evaluations at all levels for the dispensing situation are selected according to the actual situation and are not limited here.

[0064] Continue to refer to Figure 4 , based on the above embodiment, the projection of the glue 300 on the substrate 101 is in contact with the projection of the glue-cutting part 103 on the substrate 101. When the projection of the glue 300 on the substrate 101 is in contact with the projection of the glue-cutting part 103 on the substrate 101, the actual flowing distance of the glue 300 is equal to the first distance 01.

[0065] Specifically, as Figure 4 shown, when the projection of the glue 300 on the substrate 101 is in contact with the projection of the glue-cutting part 103 on the substrate 101, it can be seen that the glue 300 flows in the area surrounded by the edge side of the glue-cutting part 103 close to the component, and the actual flowing distance of the glue 300 is equal to the first distance 01. At this time, the part of the flexible circuit board contacted by the glue 300 includes the substrate in the first opening 105 and the side surface of the glue-cutting part 103 and the covering layer 102 close to the component. In the first opening area, the thickness of the glue 300 is larger, and the contact area between the glue 300 and the flexible circuit board is also larger, thereby improving the stability of the glue 300 in fixing the component 200. At the same time, the setting of the glue-cutting part 103 also limits the flowing range of the glue 300 to avoid glue overflow during the dispensing operation.

[0066] Figure 6 FIG. is a schematic structural diagram of a circuit component connected to a display panel in another display device provided by an embodiment of the present invention. As Figure 6 shown, based on the above embodiment, the projection of the glue 300 on the substrate 101 is separated from the projection of the glue-cutting part 103 on the substrate 101. When the projection of the glue 300 on the substrate 101 is separated from the projection of the glue-cutting part 103 on the substrate 101, the actual flowing distance of the glue 300 is less than the first distance 01.

[0067] Specifically, as Figure 6As shown, when the projection of the glue 300 on the substrate 101 is separated from the projection of the glue-cutting part 103 on the substrate 101, it can be seen that in the first opening, the glue stops flowing before flowing to the edge of the first opening far from the component. At this time, the actual flowing distance of the glue 300 is less than the first distance 01. In this case, it shows that the setting of the first distance 01 is larger and the selected glue has weaker fluidity, avoiding the glue overflow during the dispensing operation.

[0068] Continue to refer to Figure 4 , on the basis of the above embodiments, between the edge side of the glue-cutting part 103 close to the component area 104 and the edge side of the nearest component area 104 includes the first area 11; at the first area 11, the thickness of the glue 300 is the first thickness; the first thickness is less than or equal to the thickness of the glue-cutting part 103.

[0069] Specifically, as Figure 4 shown, between the edge side of the glue-cutting part 103 close to the component area 104 and the edge side of the nearest component area 104 includes the first area 11, where the first area 11 can be a leveling area. The glue 300 flows in the first area 11 and stops flowing when the glue 300 flows to the edge side of the glue-cutting part 103 close to the component area 104. The thickness of the glue 300 in the first area is the first thickness, and the first thickness is less than the thickness of the glue-cutting part 103. So that the glue stops flowing when flowing to the edge side of the glue-cutting part 103, avoiding the glue overflowing from the first opening 105.

[0070] Optionally, the first thickness is less than 20μm; and / or, the thickness of the glue-cutting part is 25μm. The specific size of the first thickness and the thickness of the glue-cutting part are set according to the actual situation and are not limited here.

[0071] The above specific embodiments do not constitute a limitation to the protection scope of the present invention. Those skilled in the art should understand that various modifications, combinations, sub-combinations and substitutions can be made according to design requirements and other factors. Any modifications, equivalent substitutions and improvements made within the spirit and principle of the present invention shall be included within the protection scope of the present invention.

Claims

1. A flexible circuit board, characterized in that, Comprising: A substrate, the substrate including a component area; A covering layer, located on one side of the substrate, the covering layer being disposed around the component area; A glue-cutting portion, located on the side of the covering layer away from the substrate and in contact with the covering layer.

2. The flexible circuit board according to claim 1, characterized in that, The substrate further includes a wiring layer, located on the side of the covering layer away from the glue-cutting portion; The covering layer includes a first opening, the first opening exposing a part of the wiring layer below the covering layer; The component area is disposed within the area where the first opening is located; The glue-cutting portion is disposed annularly around the first opening on the covering layer outside the first opening.

3. A display device, characterized in that, The display device includes: the flexible circuit board, components, and glue according to any one of claims 1-2 above; Components are provided on the component area of the flexible circuit board; The glue covers the components and at least covers a part of the flexible circuit board; Along a first direction, the perpendicular distance between the glue-cutting portion and the component is a first distance; the direction from the center of the component to the covering layer is the first direction; The first distance is less than or equal to the glue flow distance.

4. The display device according to claim 3, wherein The first distance is 40 μm; and / or, the glue flow distance is 0.2 mm.

5. The display device according to claim 3, characterized in that, The projection of the glue on the substrate at least partially covers the projection of the glue-cutting portion on the substrate.

6. The display device according to claim 5, characterized in that, The glue-cutting portion generates a glue mark, and the projection of the edge of the glue mark on the substrate coincides with the projection of the edge of the glue on the substrate.

7. The display device according to claim 3, wherein The projection of the glue on the substrate is in contact with or separated from the projection of the glue-cutting portion on the substrate.

8. The display device according to claim 7, wherein When the projection of the glue on the substrate is separated from or in contact with the projection of the glue-cutting portion on the substrate, the actual glue flow distance is less than or equal to the first distance.

9. The display device according to claim 3, wherein Between the edge side of the glue-cutting portion close to the component area and the edge side of the nearest component area, there is a first area; at the first area, the thickness of the glue is a first thickness; the first thickness is less than or equal to the thickness of the glue-cutting portion.

10. The display device according to claim 9, characterized in that, The first thickness is less than 20 μm; and / or, the thickness of the glue-cutting portion is 25 μm.

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