Silicon controlled cooling structure for diffusion furnace

Abstract

The utility model provides a silicon controlled rectifier cooling structure for a diffusion furnace, which comprises a cooling plate and a connecting frame, the cooling plate comprises a mounting surface for mounting a silicon controlled rectifier and a side wall surrounding the mounting surface, and the mounting surface is in heat conduction connection with the silicon controlled rectifier; the connecting frame is connected with the cooling plate so as to mount the cooling plate on the diffusion furnace; wherein the cooling plate is internally provided with a flow channel for cooling liquid to circularly flow, and the side wall is provided with a flow channel inlet and a flow channel outlet. The technical problem of poor cooling and heat dissipation effects of the silicon controlled rectifier in the prior art can be improved.

Description

Technical Field

[0001] The utility model relates to the technical field of refrigeration equipment, in particular to a thyristor cooling structure for a diffusion furnace. Background Art

[0002] Diffusion furnaces are a crucial piece of equipment in the pre-processing stages of semiconductor production lines, used for diffusion, oxidation, annealing, alloying, and sintering processes in industries such as large-scale integrated circuits, discrete devices, power electronics, optoelectronics, and optical fibers. Thyristors (SCRs) play a crucial role in regulating and stabilizing the temperature of diffusion furnaces, serving as a core temperature control component. Because SCRs carry large currents and generate significant heat, enhanced heat dissipation measures are essential during their application.

[0003] If the cooling effect of the thyristor is not good, it may cause the thyristor to overheat and burn out, causing it to fail, thus affecting the normal operation of the equipment. The existing method of cooling the thyristor is usually to install a cooling fan and heat sink, but this cooling method is not ideal, the installation and maintenance are complicated, and the installation cost is high. Utility Model Content

[0004] In view of the above shortcomings of the prior art, the utility model provides a thyristor cooling structure for a diffusion furnace to improve the technical problem of poor cooling and heat dissipation effect of the thyristor in the prior art.

[0005] To achieve the above-mentioned purpose and other related purposes, the present invention provides a thyristor cooling structure for a diffusion furnace, comprising a cooling plate and a connecting frame, wherein the cooling plate comprises a mounting surface for mounting the thyristor and a side wall arranged around the mounting surface, wherein the mounting surface is thermally connected to the thyristor; the connecting frame is connected to the cooling plate for mounting the cooling plate on the diffusion furnace; wherein a flow channel for circulating coolant is provided inside the cooling plate, and the side wall is provided with a flow channel inlet and a flow channel outlet.

[0006] In an example of the thyristor cooling structure of the present invention, the flow channel includes a first flow channel and a second flow channel that are interconnected. The first flow channel and the second flow channel respectively penetrate along the length and width directions of the cooling plate and form multiple flow channel openings on the side wall; two of the flow channel openings form the flow channel inlet and the flow channel outlet, and the remaining flow channel openings are all provided with plugs.

[0007] In an example of the thyristor cooling structure of the present invention, the flow channel inlet and the flow channel outlet are both equipped with metal pipe joints connected to the hard pipe.

[0008] In an example of the thyristor cooling structure of the present invention, both the flow channel inlet and the flow channel outlet are provided with a liquid leakage detection device.

[0009] In an example of the thyristor cooling structure of the present invention, the mounting surface is provided with thermal conductive silicone grease, and the thyristor is in contact with the mounting surface through the thermal conductive silicone grease.

[0010] In an example of the thyristor cooling structure of the present invention, the thyristor cooling structure further includes a temperature sensor for detecting the operating temperature of the cooling plate.

[0011] In an example of the thyristor cooling structure of the present invention, the connecting frame includes a plurality of mounting legs, and the plurality of mounting legs are symmetrically arranged on both sides of the cooling plate.

[0012] In an example of the thyristor cooling structure of the present invention, the mounting legs are adjustably connected to the diffusion furnace.

[0013] In an example of the thyristor cooling structure of the present invention, the mounting legs are adjustably connected to the cooling plate.

[0014] In an example of the thyristor cooling structure of the present invention, along the height direction of the cooling plate, the side of the cooling plate facing away from the mounting surface has a bottom wall, and the mounting leg has a connecting surface connected to the diffusion furnace, and the connecting surface is protruding from the bottom wall.

[0015] The present invention provides a thyristor cooling structure for a diffusion furnace. A flow channel is provided within a cooling plate. Coolant circulates within the channel, promptly removing heat generated by the thyristor. Because the coolant generally has a high specific heat capacity, it absorbs and transfers more heat as it flows within the channel, thereby achieving optimal cooling for the thyristor and ensuring its service life. Furthermore, compared to heat sink and fan structures, the cooling plate of the present invention has a simpler structure and fewer components, resulting in a lower failure rate during use and more convenient and quick installation and maintenance. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other embodiments can be obtained based on these drawings without paying any creative work.

[0017] Figure 1 This is a three-dimensional structural diagram of an embodiment of a thyristor cooling structure of the present invention;

[0018] Figure 2This is a top view of an embodiment of the thyristor cooling structure of the present utility model;

[0019] Figure 3 This is a side view of the thyristor cooling structure and the thyristor installation position of the present utility model;

[0020] Figure 4 This is the other side view of the thyristor cooling structure and the thyristor installation position of the present utility model;

[0021] Figure 5 This is a partial explosion diagram between the thyristor cooling structure and the thyristor of the present utility model.

[0022] Element number description

[0023] 100. Thyristor cooling structure; 110. Cooling plate; 111. Installation surface; 1111. Installation hole; 112. Side wall; 113. Bottom wall; 120. Connecting frame; 121. Installation leg; 1211. Connecting surface; 1212. First installation part; 1213. Second installation part; 130. Flow channel; 131. Flow channel outlet; 132. Flow channel inlet; 133. First flow channel; 134. Second flow channel; 135. Flow channel opening; 136. Plug; 137. Metal pipe joint; 140. Leakage detection device; 150. Thermal grease; 160. Temperature sensor; 170. Air flow channel; 200. Thyristor. Specific implementation mode

[0024] The following illustrates the implementation mode of the present utility model through specific specific examples. Those skilled in the art can easily understand other advantages and effects of the present utility model from the content disclosed in this specification. The present utility model can also be implemented or applied through other different specific implementation modes. Various details in this specification can also be modified or changed based on different viewpoints and applications without departing from the spirit of the present utility model. It should be noted that, without conflict, the following embodiments and the features in the embodiments can be combined with each other. It should also be understood that the terms used in the embodiments of the present utility model are for describing specific specific implementation schemes, rather than for limiting the protection scope of the present utility model. The test methods without specific conditions noted in the following embodiments are usually carried out according to conventional conditions or according to the conditions recommended by each manufacturer.

[0025] When an embodiment gives a numerical range, it should be understood that unless otherwise stated in the present utility model, any value between the two endpoints of each numerical range and any value between the two endpoints can be selected. Unless otherwise defined, all technical and scientific terms used in the present utility model, based on the understanding of those skilled in the art of the prior art and the description of the present utility model, can also use any methods, devices and materials of the prior art similar to or equivalent to the methods, devices and materials described in the embodiments of the present utility model to implement the present utility model.

[0026] It should be noted that the terms such as "upper", "lower", "left", "right", "middle", and "one" cited in this specification are only for the convenience of clear description and are not used to limit the scope of implementation of the present utility model. The change or adjustment of their relative relationship, without substantial change in the technical content, should also be regarded as the scope of implementation of the present utility model.

[0027] Please refer to Figures 1 to 5 , for the thyristor cooling structure 100 provided by the present utility model for a diffusion furnace, a flow channel 130 is provided inside the cooling plate 110. By circulating the coolant in the flow channel 130, the heat generated by the thyristor 200 can be taken away in time, so that the thyristor 200 can obtain a better cooling effect. At the same time, due to the simple structure, it is more convenient for installation and maintenance.

[0028] Please refer to Figures 1 to 5 , the thyristor cooling structure 100 includes: a cooling plate 110 and a connecting frame 120. The cooling plate 110 includes a mounting surface 111 and side walls 112 provided around the mounting surface 111. Along the height direction of the cooling plate 110 (as shown by the Z-axis in Figure 3 ), the side of the cooling plate 110 facing away from the mounting surface 111 includes a bottom wall 113. The thyristor 200 is arranged on the mounting surface 111 and is thermally connected to the mounting surface 111. The thyristor 200 can be directly in contact with the mounting surface 111 to achieve thermal connection, or can be indirectly in contact with the mounting surface 111 through other heat-conducting parts to achieve thermal connection. Mounting holes 1111 are provided on the mounting surface 111, and the thyristor 200 is correspondingly provided with connecting bolts, and the connecting bolts are screwed tightly in the mounting holes 1111 to achieve the fixed connection between the thyristor 200 and the mounting surface 111.

[0029] The shape of the cooling plate 110 can be a cylinder, a cuboid, a cube, etc., as long as the shape and size of the mounting surface 111 meet the mounting requirements of the thyristor 200. The cooling plate 110 can be an integral solid plate structure or a plate-like structure formed by butt-jointing two halves. The cooling plate 110 can be made of any material that meets the heat conduction performance requirements, such as metal, plastic, or ceramic. Optionally, in this embodiment, the cooling plate 110 is made of 304 stainless steel. This material has good strength and stiffness and is not easily deformed during use, so that the mounting surface 111 can have better surface flatness, thereby improving the fitting degree between the mounting surface 111 and the thyristor 200, and further ensuring the heat conduction performance between the cooling plate 110 and the thyristor 200. The number of thyristors 200 mounted on the cooling plate 110 is not limited, and can be one or multiple. Optionally, in this embodiment, the outer shape of the cooling plate 110 is a flat cuboid structure, and the plane on the side with a larger area of the cooling plate 110 is the mounting surface 111. Along the length direction of the cooling plate 110, multiple groups of mounting holes 1111 are provided on the mounting surface 111, and each group of mounting holes 1111 corresponds to one thyristor 200, that is, multiple thyristors 200 can be mounted side by side on one cooling plate 110.

[0030] The connecting frame 120 is connected to the cooling plate 110, and the connection method can be welding fixed connection, threaded detachable connection, etc. The connecting frame 120 can be arranged at any position such as the bottom wall 113, the side wall 112 or the mounting surface 111 of the cooling plate 110. The connecting frame 120 can be an integral frame structure for supporting the cooling plate 110 or a structure of multiple scattered support frames, and no limitation is made thereto. The cooling plate 110 is connected to the diffusion furnace through the connecting frame 120, and the connecting frame 120 can be welded and fixed to the diffusion furnace or can be detachably connected by bolts, etc. Optionally, in this embodiment, the connecting frame 120 is detachably connected to the diffusion furnace by bolts. Such a setting facilitates the replacement and maintenance of the cooling structure on the diffusion furnace.

[0031] A flow channel 130 for the coolant to circulate is provided inside the cooling plate 110, such as Figure 2As shown. The side wall 112 is provided with a runner inlet 132 and a runner outlet 131. The shape of the runner 130 can be various, such as serpentine, meandering or criss-crossing, etc. The runner 130 can be integrally cast and formed with the cooling plate 110, or can be formed by drilling the cooling plate 110. The coolant circulating in the runner 130 can be water, an aqueous solution of ethylene glycol, propylene glycol, etc. Preferably, considering the cooling cost, in this embodiment, water is selected as the coolant. In this embodiment, by the coolant circulating in the runner 130, the heat generated by the thyristor 200 can be taken away in time. Since the specific heat capacity of the coolant is generally high, when the coolant flows in the runner 130, it can absorb and transfer more heat, so that the thyristor 200 can obtain a better cooling effect and ensure the service life of the thyristor 200. At the same time, compared with the heat sink and heat fan structure, the cooling plate 110 structure in the present utility model is simpler and the number of components is less, so the failure rate generated during use will also be reduced, and the installation and maintenance are also more convenient and fast.

[0032] In an example of the thyristor cooling structure 100 of the present utility model, the runner 130 includes a first runner 133 and a second runner 134 that are connected to each other. The first runner 133 and the second runner 134 respectively extend along the length of the cooling plate 110 (such as Figure 2 shown by the X-axis in Figure 2 and the width direction (such as Figure 2 shown by the Y-axis in ), and form a plurality of runner openings 135 on the side wall 112, as

[0033] shown. The number of the first runner 133 and the second runner 134 can be one or multiple. Two of the runner openings 135 form the runner inlet 132 and the runner outlet 131, and plugs 136 are arranged at the remaining runner openings 135. Such a setting facilitates the forming process of the first runner 133 and the second runner 134 on the cooling plate 110, and at the same time, when the runner 130 is blocked, it is also convenient to dredge each runner 130 after removing the plugs 136.

[0033] Specifically, please refer to Figure 2, in this embodiment, there are two first flow channels 133 and one second flow channel 134. The two first flow channels 133 are arranged side by side along the width direction of the cooling plate 110. The second flow channel 134 is arranged near one end of the cooling plate 110 in the length direction, and the second flow channel 134 communicates with the two first flow channels 133. Along the length direction of the cooling plate 110, the flow openings 135 formed by the two first flow channels 133 on the side away from the second flow channel 134 are respectively a flow inlet 132 and a flow outlet 131. Plug heads 136 are arranged at the flow openings 135 formed by the two first flow channels 133 on the side close to the second flow channel 134, and plug heads 136 are also arranged at the flow openings 135 at both ends of the second flow channel 134. Such an arrangement can form the flow channel 130 as shown in FIG. 2, and the flow path of the coolant in the flow channel 130 is as shown by the arrow in Figure 2 . With such an arrangement, the flow-through area of the flow channel 130 on the cooling plate 110 is more dispersed, so that a more uniform cooling effect can be obtained on the mounting surface 111, which is beneficial to improving the uniformity of the cooling effect of the thyristor 200.

[0034] Please refer to Figure 2 . In an example of the thyristor cooling structure 100 of the present utility model, metal pipe connectors 137 connected to hard pipes are installed at both the flow inlet 132 and the flow outlet 131. The material of the metal pipe connector 137 can be copper, stainless steel, brass, aluminum, etc. A first metal pipe connector is installed at the flow inlet 132, and a second metal pipe connector is installed at the flow outlet 131. The first metal pipe connector and the second metal pipe connector can be fixedly connected to the flow inlet 132 and the flow outlet 131 respectively by welding, or can be screwed tightly to the flow inlet 132 and the flow outlet 131 respectively by pipe threads. The first metal pipe connector is communicated with the liquid outlet of a coolant supply device (not shown in the figure) through a first hard pipe (not shown in the figure), and the second metal pipe connector is communicated with the liquid return port of the coolant supply device through a second hard pipe (not shown in the figure). The first hard pipe and the second hard pipe can be metal pipes or plastic pipes, etc. By installing the metal pipe connectors 137 at the flow inlet 132 and the flow outlet 131, hard pipe connection can be realized between the coolant supply device and the flow inlet 132 and the flow outlet 131. Compared with hose connection, hard pipe connection can reduce the probability of liquid leakage during the coolant supply process, thereby reducing the failure rate during the use of the cooling structure.

[0035] In an example of the thyristor cooling structure 100 of the present utility model, please refer to Figure 1, leak detection devices 140 are provided at both the runner inlet 132 and the runner outlet 131. There are various choices for the leak detection device 140. For example, the leak detection device 140 can be a differential pressure sensor, which detects whether there is liquid leakage by sensing the change in the differential pressure between the runner inlet 132 and the runner outlet 131. When the differential pressure exceeds the set initial differential pressure, the differential pressure sensing component will send out an induction signal to indicate that there is liquid leakage during the cooling process. The leak detection device 140 can also be a leak belt with a mass sensor inside. The leak belt is arranged at the positions of the runner inlet 132 and the runner outlet 131. When there is a leak at the runner inlet 132 and the runner outlet 131, the leaked liquid will fall into the corresponding leak belt, and the mass sensor in the leak belt will sense the change in the mass of the leak belt, and then send out an alarm to indicate that there is liquid leakage during the cooling process. By setting the leak detection device 140, the faults that occur during the cooling process can be detected in time, so as to intervene in time to prevent the temperature abnormality of the thyristor 200 caused by the thyristor 200 operating under poor cooling conditions, and thus the service life of the thyristor 200 can be guaranteed.

[0036] Please refer to Figure 3 and Figure 4 , in an example of the thyristor cooling structure 100 of the present utility model, a thermal grease 150 is provided on the mounting surface 111, and the thyristor 200 is in contact with the mounting surface 111 through the thermal grease 150. The thermal grease 150 can be applied to the entire mounting surface 111, or only applied to the position corresponding to the contact between the thyristor 200 and the mounting surface 111. Optionally, in this embodiment, the thermal grease 150 is applied to the entire mounting surface 111. The setting of the thermal grease 150 can eliminate the contact gap between the thyristor 200 and the mounting surface 111, increase the effective contact area between the thyristor 200 and the mounting surface 111, and thus improve the heat dissipation efficiency of the thyristor 200. It should be noted that as the cooling effect of the cooling plate 110 improves, the working temperature of the thermal grease 150 will also decrease relatively. Therefore, it is beneficial to maintain the gel state of the thermal grease 150, reduce the hardening phenomenon caused by high temperature, ensure the heat conduction effect of the thermal grease 150, and thus ensure the cooling effect of the thyristor 200.

[0037] In an example of the thyristor cooling structure 100 of the present utility model, the thyristor cooling structure 100 further includes a temperature sensor 160 for detecting the working temperature of the cooling plate 110. The temperature sensor 160 can be installed on the mounting surface 111 of the cooling plate 110, or installed on the side wall 112 of the cooling plate 110 or any other position that meets the temperature detection requirements. Preferably, please refer to Figure 2, in this embodiment, the temperature sensor 160 is installed at a position close to the mounting surface 111. This can improve the accuracy of temperature detection at the mounting surface 111. By setting the temperature sensor 160, the operating temperature of the cooling plate 110 can be detected in real time, so as to timely discover abnormalities during the cooling process, ensure the normal operation of the cooling structure, and guarantee the cooling effect of the thyristor 200.

[0038] In an example of the thyristor cooling structure 100 of the present utility model, please refer to Figure 1 and Figure 2 , the connecting frame 120 includes a plurality of mounting legs 121, and the plurality of mounting legs 121 are symmetrically arranged on both sides of the cooling plate 110. The plurality of mounting legs 121 can be symmetrically arranged on both sides in the length direction of the cooling plate 110, or can be arranged on both sides in the width direction of the cooling plate 110. The mounting leg 121 can be an L-shaped plate, a U-shaped plate, a flat plate, etc. By setting the mounting leg 121, it is convenient to adjust the mounting position between the connecting frame 120 and the cooling plate 110, and at the same time, it is also convenient to adjust the mounting position between the connecting frame 120 and the diffusion furnace. Specifically, in this embodiment, the mounting leg 121 is an L-shaped plate. The L-shaped plate has a first mounting portion 1212 and a second mounting portion 1213 arranged vertically. The first mounting portion 1212 is fitted and mounted with the side wall 112 of the cooling plate 110, and the second mounting portion 1213 extends toward the outside of the cooling plate 110 and is connected to the diffusion furnace.

[0039] In an example of the thyristor cooling structure 100 of the present utility model, the mounting leg 121 is adjustably connected to the diffusion furnace. The adjustable connection direction is not limited. For example, the mounting leg 121 can be adjustably connected to the diffusion furnace along the length direction of the cooling plate 110, or can be adjustably connected to the diffusion furnace along the width direction of the cooling plate 110. There are various ways of adjustable connection. For example, a plurality of through holes arranged at intervals can be provided on the mounting leg 121, and the adjustable connection with the fixed-spacing threaded holes on the diffusion furnace can be realized by inserting the connecting bolts into different through holes. It can also be that a long slot is provided on the mounting leg 121, and the position of the connecting bolt in the long slot is moved to realize the adjustable connection with the fixed-spacing threaded holes on the diffusion furnace. Since there will be a slight difference in the spacing between the mounting threaded holes on different types of diffusion furnaces, setting the mounting leg 121 to be adjustably connected to the diffusion furnace can match the threaded holes on the mounting leg 121 and different diffusion furnaces by adjusting the position between the mounting leg 121 and the diffusion furnace. Therefore, the installation versatility of the thyristor cooling structure 100 can be improved.

[0040] Specifically, in this embodiment, please refer to Figure 1, the second mounting portion 1213 is provided with a U-shaped groove. The opening of the U-shaped groove faces the outside of the side wall 112, and the U-shaped groove extends along the length direction of the cooling plate 110. The U-shaped groove is matched and corresponding to the threaded hole on the diffusion furnace. By adjusting the position of the connecting bolt in the U-shaped groove, the adjustable connection between the support leg and the diffusion furnace can be achieved.

[0041] Please refer to Figure 1 , in an example of the thyristor cooling structure 100 of the present utility model, the mounting leg 121 is adjustably connected to the cooling plate 110. The adjustable connection direction is not limited. For example, the mounting leg 121 can be adjustable relative to the length direction of the cooling plate 110, or can be adjustable relative to the width direction of the cooling plate 110. There can be various ways of adjustable connection. For example, a long hole can be provided on the mounting leg 121, and a threaded hole can be provided at the position of the side wall 112 corresponding to the long hole. By adjusting the position of the connecting bolt in the long hole, the adjustable connection between the mounting leg 121 and the cooling plate 110 can be achieved; it can also be that a long hole is provided on the side wall 112, and a threaded hole is provided on the mounting leg 121. The threaded hole corresponds to the long hole. By adjusting the position of the connecting bolt in the long hole, the adjustable connection between the mounting leg 121 and the cooling plate 110 can be achieved. By setting the mounting leg 121 and the cooling plate 110 to be adjustably connected, the mounting position between the cooling plate 110 and the diffusion furnace can be achieved by adjusting the position between the mounting leg 121 and the cooling plate 110, which is convenient for the installation and adjustment of the cooling plate 110 on the diffusion furnace.

[0042] In an example of the thyristor cooling structure 100 of the present utility model, please refer to Figure 3 , along the height direction of the cooling plate 110, the mounting leg 121 has a connection surface 1211 for connecting with the diffusion furnace, and the connection surface 1211 protrudes from the bottom wall 113. With this setting, when the connection surface 1211 is connected to the diffusion furnace, an air flow channel 170 is formed between the surface of the diffusion furnace and the bottom wall 113. The setting of the air flow channel 170 can reduce the heat exchange generated by the contact between the cooling plate 110 and the diffusion furnace, and ensure the cooling effect of the cooling plate 110 on the thyristor 200.

[0043] A thyristor cooling structure for a diffusion furnace provided by the present utility model is provided with a flow channel inside the cooling plate. By circulating coolant within the flow channel, the heat generated by the thyristor can be taken away in a timely manner. Since the specific heat capacity of the coolant is generally high, when the coolant flows within the flow channel, it can absorb and transfer more heat, thereby enabling the thyristor to obtain a better cooling effect and ensuring the service life of the thyristor. At the same time, compared with the heat sink and heat fan structure, the cooling plate structure in the present utility model is relatively simple and the number of components is also less. Therefore, the failure rate generated during use will also be reduced, and the installation and maintenance are also more convenient and fast. Therefore, the present utility model effectively overcomes some practical problems in the prior art and thus has high utilization value and practical significance. The above embodiments are only illustrative of the principles and effects of the present utility model and are not used to limit the present utility model. Any person familiar with this technology can modify or change the above embodiments without departing from the spirit and scope of the present utility model. Therefore, all equivalent modifications or changes completed by those with ordinary knowledge in the technical field without departing from the spirit and technical ideas disclosed by the present utility model should still be covered by the claims of the present utility model.

Claims

1. A thyristor cooling structure for a diffusion furnace, characterized in that include: A cooling plate, the cooling plate comprising a mounting surface for mounting the thyristor and a side wall disposed around the mounting surface, the mounting surface being thermally connected to the thyristor; a connecting frame connected to the cooling plate for mounting the cooling plate on the diffusion furnace; Wherein, a flow channel for circulating coolant is provided inside the cooling plate, and a flow channel inlet and a flow channel outlet are provided on the side wall.

2. The thyristor cooling structure according to claim 1, characterized in that, The flow channel includes a first flow channel and a second flow channel that are interconnected. The first flow channel and the second flow channel respectively penetrate along the length and width directions of the cooling plate and form multiple flow channel openings on the side wall; two of the flow channel openings form the flow channel inlet and the flow channel outlet, and the remaining flow channel openings are all provided with plugs.

3. The thyristor cooling structure according to claim 1, characterized in that, The flow channel inlet and the flow channel outlet are both equipped with metal pipe joints connected to hard pipes.

4. The thyristor cooling structure according to claim 1, characterized in that, The flow channel inlet and the flow channel outlet are both provided with a liquid leakage detection device.

5. The thyristor cooling structure according to claim 1, characterized in that, The mounting surface is provided with thermal conductive silicone grease, and the thyristor contacts the mounting surface through the thermal conductive silicone grease.

6. The thyristor cooling structure according to claim 1, wherein, The thyristor cooling structure further includes a temperature sensor for detecting the operating temperature of the cooling plate.

7. The thyristor cooling structure according to any one of claims 1 to 6, characterized in that, The connecting frame includes a plurality of mounting legs, and the plurality of mounting legs are symmetrically arranged on both sides of the cooling plate.

8. The thyristor cooling structure according to claim 7, characterized in that, The mounting legs are adjustably connected to the diffusion furnace.

9. The thyristor cooling structure according to claim 7, wherein The mounting legs are adjustably connected to the cooling plate.

10. The thyristor cooling structure according to claim 7, characterized in that, Along the height direction of the cooling plate, the side of the cooling plate facing away from the installation surface has a bottom wall, and the installation legs have a connecting surface connected to the diffusion furnace, and the connecting surface is protruding from the bottom wall.

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