Tail gas condensing device and semiconductor process system

Abstract

The utility model relates to a tail gas condensing device and a semiconductor process system. The tail gas condensing device comprises a gas inlet unit, a tail gas treatment unit, a liquid cooling unit, a gas cooling unit and a discharge unit. The system has the advantages that tail gas is conveyed to the tail gas treatment unit through the gas inlet unit, gas bath is circulated for the liquid cooling unit through the gas cooling unit, the temperature of the liquid cooling unit is reduced through heat exchange, then the tail gas of the tail gas treatment unit is condensed, and the condensed tail gas is conveyed to the next process through the discharge unit; through air bath temperature control, accurate control of the temperature can be realized; meanwhile, gas of the gas cooling unit can be recycled, deionized water capable of being recycled is arranged in the liquid cooling unit, the risk of waste and supply interruption is reduced, the device is simple in structure, the gas cooling unit and the tail gas treatment unit are relatively independent, and later maintenance is easy; the environment temperature can be reasonably controlled, and the tail gas condensation efficiency is greatly improved.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor tail gas treatment, in particular to a tail gas condensation device and a semiconductor process system. Background Art

[0002] Many chemical gases are used in the semiconductor manufacturing process, and a large amount of waste gas is usually generated in these processes. These waste gases not only contain unreacted raw material gases but may also contain harmful by-products. For environmental protection and cost-effectiveness, it is necessary to effectively treat and recycle the tail gas. Traditional treatment methods include thermal oxidation, wet scrubbing, adsorption, and condensation, etc. Among them, condensation, as an important link in tail gas treatment, mainly refers to the process of condensing the condensable components in the gas into a liquid state by lowering the gas temperature.

[0003] Chinese Utility Model Patent CN 220573060 U discloses a tail gas treatment device with a condensation mechanism, including a tail gas pipe, a condensation water pool, and a filtering part. A cooling pipe is arranged in the condensation water pool. The intake end of the cooling pipe is communicated with the tail gas pipe, and the outlet end of the cooling pipe is communicated with the filtering part through a connecting pipe. An internal cooling pipe is arranged in the cooling pipe, and both ends of the internal cooling pipe are respectively communicated with the outer walls on the opposite sides of the cooling pipe; a plurality of internal cooling pipes are distributed in the cooling pipe. By arranging the internal cooling pipe in the cooling pipe, while the cooling water can cool the outer wall of the cooling pipe, the middle part of the cooling pipe can be cooled through the internal cooling pipe, thereby improving the cooling effect on the tail gas and shortening the cooling time.

[0004] The above-mentioned tail gas treatment device can condense the tail gas. However, there are the following deficiencies. First, the cooling water is process circulating water, with a large consumption and a risk of cut-off supply; second, relying on the ability of the condensation water pool itself, the condensation efficiency is too low and it is difficult to control the temperature; third, the structure is complex, there are too many pipelines set, and too many connections are not conducive to maintenance; at the same time, the above device cannot accurately control the temperature. The treatment efficiency of the tail gas treatment device is closely related to the temperature. If the temperature difference is too large, it will affect the treatment efficiency.

[0005] In view of the problems in the related art, such as the waste of cooling water supply, low cooling efficiency, inaccurate temperature control, and complex device, no effective solution has been proposed yet. Summary of the Utility Model

[0006] The purpose of the utility model is to provide a tail gas condensation device and a semiconductor process system for the deficiencies in the prior art, so as to solve the problems in the related art, such as the waste of cooling water supply, low cooling efficiency, inaccurate temperature control, and complex device.

[0007] To achieve the above purpose, the technical solution adopted by the utility model is:

[0008] The first aspect of the present utility model is to provide an exhaust gas condensation device, comprising:

[0009] An intake unit, which is connected to the exhaust gas delivery system and is used for delivering exhaust gas;

[0010] An exhaust gas treatment unit, which is connected to the intake unit and is used for treating the exhaust gas;

[0011] A liquid cooling unit, which is arranged inside the exhaust gas treatment unit and is used for condensing the exhaust gas;

[0012] A gas cooling unit, the outlet end of which is connected to the inlet end of the liquid cooling unit, and the inlet end of which is connected to the outlet end of the liquid cooling unit, and is used for delivering low-temperature gas to the liquid cooling unit, recovering high-temperature gas from the liquid cooling unit, and cooling the high-temperature gas into low-temperature gas;

[0013] An emission unit, which is respectively connected to the exhaust gas treatment unit and the gas cooling unit, and is used for outputting the exhaust gas treated by the exhaust gas treatment unit, the low-temperature gas output by the gas cooling unit, and the high-temperature gas input into the gas cooling unit.

[0014] In some embodiments, the intake unit comprises:

[0015] A first intake element, which is connected to the exhaust gas treatment unit of the exhaust gas condensation device and is used for delivering exhaust gas to the exhaust gas treatment unit.

[0016] In some embodiments, the treatment unit comprises:

[0017] A housing element, inside which the liquid cooling unit is arranged;

[0018] A reaction element, which is arranged inside the housing element and is located inside the liquid cooling unit, and is used for treating the exhaust gas;

[0019] A second intake element, which is arranged on the reaction element and is connected to the intake unit, and is used for delivering exhaust gas to the reaction element;

[0020] A first outlet element, which is arranged on the reaction element and is connected to the emission unit, and is used for outputting the treated exhaust gas to the emission unit.

[0021] In some embodiments, the liquid cooling unit comprises:

[0022] A liquid cooling element, which is arranged inside the exhaust gas treatment unit and is used for condensing the exhaust gas;

[0023] A circulation element is arranged in the liquid cooling element, the air inlet end of the circulation element is connected to the air outlet end of the air cooling unit, and the air outlet end of the circulation element is connected to the air inlet end of the air cooling unit, and is used to obtain low-temperature gas from the air cooling unit, use the low-temperature gas to heat exchange the condensed liquid of the liquid cooling element to cool the condensed liquid and obtain high-temperature gas, and output the high-temperature gas to the air cooling unit.

[0024] In some embodiments, the liquid cooling unit further comprises:

[0025] A temperature detection element is provided on the liquid cooling element and is used to monitor the temperature of the condensed liquid.

[0026] In some embodiments, the air cooling unit includes:

[0027] Air cooling elements;

[0028] a gas driving element, the gas driving element being in communication with the air cooling element and being used for driving the gas flow;

[0029] a second gas outlet element, the second gas outlet element being in communication with the gas cooling element and the liquid cooling unit, respectively, and being configured to deliver low-temperature gas to the liquid cooling unit under the action of the gas driving element;

[0030] A third air intake element is connected to the air cooling element and the liquid cooling unit respectively, and is used to transport high-temperature gas to the air cooling element under the action of the gas driving element.

[0031] In some embodiments, the air cooling unit further comprises:

[0032] A first opening and closing element is provided on the second gas outlet element and is used to control the opening and closing of the second gas outlet element.

[0033] In some embodiments, the air cooling unit further comprises:

[0034] A first pressure regulating element is provided on the second gas outlet element and is used for regulating the pressure of the low-temperature gas.

[0035] In some embodiments, the air cooling unit further comprises:

[0036] The second opening and closing element is provided on the third air intake element and is used to control the opening and closing of the third air intake element.

[0037] In some embodiments, the air cooling unit further comprises:

[0038] A second pressure regulating element, which is arranged on the third air inlet element and is used for regulating the pressure of the high-temperature gas.

[0039] In some embodiments thereof, the discharge unit includes:

[0040] A first discharge element, which is communicated with the tail gas treatment unit and is used for outputting the tail gas treated by the tail gas treatment unit and the liquid cooling unit;

[0041] A second discharge element, which is respectively communicated with the first discharge element and the air cooling unit and is used for relieving the pressure of the low-temperature gas when the pressure reaches the pressure threshold;

[0042] A third discharge element, which is respectively communicated with the first discharge element and the air cooling unit and is used for relieving the pressure of the high-temperature gas when the pressure reaches the pressure threshold.

[0043] In some embodiments thereof, the discharge unit further includes:

[0044] A first pressure relief element, which is arranged on the second discharge element and is used for relieving the pressure.

[0045] In some embodiments thereof, the discharge unit further includes:

[0046] A second pressure relief element, which is arranged on the third discharge element and is used for relieving the pressure.

[0047] The second aspect of the present utility model is to provide a semiconductor process system, including:

[0048] The tail gas condensation device as described in the first aspect.

[0049] The present utility model adopts the above technical solutions, and compared with the prior art, has the following technical effects:

[0050] An exhaust gas condensation device and a semiconductor process system of the present utility model use an intake unit to transport exhaust gas to an exhaust gas treatment unit, and use an air cooling unit to circulate a gas bath for a liquid cooling unit, reducing the temperature of the liquid cooling unit through heat exchange, and then condensing the exhaust gas of the exhaust gas treatment unit. The condensed exhaust gas is transported to the next process through an emission unit; through gas bath temperature control, high-precision temperature control can be achieved, and temperature control of ±0.5°C can be achieved at most; at the same time, the gas of the air cooling unit can be recycled, and deionized water is set in the liquid cooling unit, reducing the risk of waste and supply interruption, and solving the problem that cooling water is prone to waste; the structure of this device is simple, the air cooling unit and the exhaust gas treatment unit are relatively independent, and later maintenance and servicing are simple, solving the problem of complex devices; and the ambient temperature can be controlled more precisely. Through the combination of the air cooling unit and the liquid cooling unit, heat exchange is more thorough, the cooling efficiency is higher, and the exhaust gas condensation efficiency is greatly improved, solving the problem of low cooling efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0051] Figure 1 is a schematic diagram of an exhaust gas condensation device according to an embodiment of the present utility model;

[0052] Figure 2 is a schematic diagram of an intake unit according to an embodiment of the present utility model;

[0053] Figure 3 is a schematic diagram of an exhaust gas treatment unit according to an embodiment of the present utility model;

[0054] Figure 4 is a schematic diagram (I) of a liquid cooling unit according to an embodiment of the present utility model;

[0055] Figure 5 is a schematic diagram (I) of an air cooling unit according to an embodiment of the present utility model;

[0056] Figure 6 is a schematic diagram (I) of an emission unit according to an embodiment of the present utility model;

[0057] Figure 7 is a schematic diagram (II) of a liquid cooling unit according to an embodiment of the present utility model;

[0058] Figure 8 is a schematic diagram (II) of an air cooling unit according to an embodiment of the present utility model;

[0059] Figure 9 is a schematic diagram (II) of an emission unit according to an embodiment of the present utility model.

[0060] The reference numerals therein are:

[0061] 10. Intake unit; 11. First intake element;

[0062] 20. Exhaust gas treatment unit; 21. Housing element; 22. Reaction element; 23. Second intake element; 24. First outlet element;

[0063] 30. Liquid cooling unit; 31. Liquid cooling element; 32. Circulation element; 33. Temperature detection element;

[0064] 40. Air cooling unit; 41. Air cooling element; 42. Gas driving element; 43. Second outlet element; 44. Third intake element; 45. First opening and closing element; 46. First pressure regulating element; 47. Second opening and closing element; 48. Second pressure regulating element;

[0065] 50. Emission unit; 51. First emission element; 52. Second emission element; 53. Third emission element; 54. First pressure relief element; 55. Second pressure relief element. Detailed implementation manners

[0066] In order to make the objectives, technical solutions and advantages of the present application clearer and more understandable, the present application will be described and explained below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and are not used to limit the present application. Based on the embodiments provided in the present application, all other embodiments obtained by those of ordinary skill in the art without creative efforts fall within the scope of protection of the present application.

[0067] Obviously, the accompanying drawings in the following description are only some examples or embodiments of the present application. For those of ordinary skill in the art, without creative efforts, the present application can also be applied to other similar scenarios based on these drawings. In addition, it can also be understood that although the efforts made in this development process may be complex and lengthy, for those of ordinary skill in the art related to the content disclosed in the present application, some design, manufacturing or production changes based on the technical content disclosed in the present application are only conventional technical means and should not be understood as the content disclosed in the present application being insufficient.

[0068] Referring to "embodiments" in the present application means that the specific features, structures or characteristics described in combination with the embodiments can be included in at least one embodiment of the present application. The appearance of this phrase in various positions in the specification does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment mutually exclusive with other embodiments. Those of ordinary skill in the art explicitly and implicitly understand that the embodiments described in the present application can be combined with other embodiments without conflict.

[0069] Unless otherwise defined, the technical terms or scientific terms involved in this application shall have the ordinary meanings understood by those with ordinary skills in the technical field to which this application belongs. The words such as "a", "an", "one kind", "the" and the like involved in this application do not indicate a limitation in quantity and may represent a singular or plural number. The terms "comprising", "including", "having" and any variations thereof involved in this application are intended to cover non-exclusive inclusion; for example, a process, method, system, product or device that includes a series of steps or units (units) is not limited to the listed steps or units, but may further include steps or units not listed, or may further include other steps or units inherent to these processes, methods, products or devices. The similar words such as "connected", "coupled" and "linked" involved in this application are not limited to physical or mechanical connections, but may include electrical connections, whether direct or indirect. The "plurality" involved in this application means two or more. "And / or" describes the association relationship of associated objects and indicates that three relationships may exist. For example, "A and / or B" may represent: A exists alone, A and B exist simultaneously, and B exists alone. The character " / " generally represents an "or" relationship between the associated objects before and after. The terms "first", "second", "third" and the like involved in this application are only used to distinguish similar objects and do not represent a specific order of the objects.

[0070] Embodiment 1

[0071] This embodiment relates to the tail gas condensation device of the present utility model.

[0072] A schematic embodiment of the present utility model, as Figure 1 shown, a tail gas condensation device includes an intake unit 10, a tail gas treatment unit 20, a liquid cooling unit 30, a gas cooling unit 40, and an exhaust unit 50. Among them, the intake unit 10 is communicated with the tail gas delivery system for delivering tail gas; the tail gas treatment unit 20 is communicated with the intake unit 10 for treating the tail gas; the liquid cooling unit 30 is arranged inside the tail gas treatment unit 20 for condensing the tail gas; the gas outlet end of the gas cooling unit 40 is communicated with the gas inlet end of the liquid cooling unit 30, and the gas inlet end of the gas cooling unit 40 is communicated with the gas outlet end of the liquid cooling unit 30 for delivering low-temperature gas to the liquid cooling unit 30, recovering high-temperature gas from the liquid cooling unit 30, and cooling the high-temperature gas into low-temperature gas; the exhaust unit 50 is respectively communicated with the tail gas treatment unit 20 and the gas cooling unit 40 for outputting the tail gas treated by the tail gas treatment unit 20, the low-temperature gas output by the gas cooling unit 40, and the high-temperature gas input into the gas cooling unit 40.

[0073] As Figure 2As shown, the intake unit 10 includes a first intake element 11. Among them, the first intake element 11 is in communication with the tail gas treatment unit 20 and is used to convey tail gas to the tail gas treatment unit 20.

[0074] In some of these embodiments, the first intake element 11 is a first intake pipe.

[0075] As Figure 3 As shown, the tail gas treatment unit 20 includes a housing element 21, a reaction element 22, a second intake element 23, and a first outlet element 24. Among them, a liquid cooling unit 30 is provided inside the housing element 21; the reaction element 22 is disposed inside the housing element 21 and is located inside the liquid cooling unit 30 for treating tail gas; the second intake element 23 is disposed on the reaction element 22 and is in communication with the intake unit 10 for conveying tail gas to the reaction element 22; the first outlet element 24 is disposed on the reaction element 22 and is in communication with the discharge unit 50 for outputting the treated tail gas to the discharge unit 50.

[0076] Specifically, the second intake element 23 is in communication with the first intake element 11.

[0077] In some of these embodiments, the housing element 21 is a box, a tank.

[0078] The size of the reaction element 22 matches the size of the housing element 21. Generally, the radial dimensions (such as outer diameter, length, width) of the reaction element 22 are smaller than the radial dimensions (such as outer diameter, length, width) of the housing element 21, and the height of the reaction element 22 is smaller than the height of the housing element 21.

[0079] In some of these embodiments, the reaction element 22 is a reaction chamber.

[0080] The connection manner between the second intake element 23 and the reaction element 22 is a fixed connection or a detachable connection. Among them, the fixed connection manner includes but is not limited to integral molding, welding; the detachable connection manner includes but is not limited to flange connection.

[0081] The connection manner between the second intake element 23 and the first intake element 11 is a fixed connection or a detachable connection. Among them, the fixed connection manner includes but is not limited to integral molding, welding; the detachable connection manner includes but is not limited to flange connection.

[0082] The size of the second intake element 23 matches the size of the reaction element 22. Generally, the radial dimension (such as outer diameter) of the second intake element 23 is smaller than the radial dimensions (such as outer diameter, length, width) of the reaction element 22.

[0083] The size of the second intake element 23 matches the size of the first intake element 11. Generally, the radial dimension (such as the outer diameter) of the second intake element 23 is equal to the radial dimension (such as the outer diameter) of the first intake element 11.

[0084] In some of the embodiments, the second intake element 23 is a second intake pipe.

[0085] The first outlet element 24 is fixedly or detachably connected to the reaction element 22. Among them, the fixed connection methods include but are not limited to integral molding and welding; the detachable connection methods include but are not limited to flange connection.

[0086] The size of the first outlet element 24 matches the size of the reaction element 22. Generally, the radial dimension (such as the outer diameter) of the first outlet element 24 is smaller than the radial dimension (such as the outer diameter, length, width) of the reaction element 22.

[0087] In some of the embodiments, the first outlet element 24 is a first outlet pipe.

[0088] As Figure 4 shown, the liquid cooling unit 30 includes a liquid cooling element 31 and a circulation element 32. Among them, the liquid cooling element 31 is arranged inside the tail gas treatment unit 20 for condensing the tail gas; the circulation element 32 is arranged on the liquid cooling element 31. The intake end of the circulation element 32 is communicated with the outlet end of the air cooling unit 40, and the outlet end of the circulation element 32 is communicated with the intake end of the air cooling unit 40, for obtaining low-temperature gas from the air cooling unit 40, using the low-temperature gas to exchange heat with the condensed liquid of the liquid cooling element 31 to cool the condensed liquid and obtaining high-temperature gas, and outputting the high-temperature gas to the air cooling unit 40.

[0089] Specifically, the liquid cooling element 31 is arranged inside the housing element 21 and is located outside the reaction element 22.

[0090] In the present utility model, the liquid of the liquid cooling unit 30 is deionized water and can be recycled.

[0091] The size of the liquid cooling element 31 matches the size of the housing element 21. Generally, the radial dimension (such as the outer diameter, length, width) of the liquid cooling element 31 is smaller than the radial dimension (such as the outer diameter, length, width) of the housing element 21, and the height of the liquid cooling element 31 is smaller than the height of the housing element 21.

[0092] The size of the liquid cooling element 31 matches the size of the reaction element 22. Generally, the radial dimension (such as the outer diameter, length, width) of the liquid cooling element 31 is larger than the radial dimension (such as the outer diameter, length, width) of the reaction element 22, and the height of the liquid cooling element 31 is larger than the height of the reaction element 22.

[0093] In some of these embodiments, the liquid cooling element 31 is a liquid cooling device.

[0094] In some of these embodiments, the circulation element 32 is spirally wound around the reaction element 22.

[0095] The size of the circulation element 32 matches the size of the liquid cooling element 31. Generally, the radial dimension (such as the outer diameter) of the cross-section of the circulation element 32 is less than the difference between the outer diameter and the inner diameter of the liquid cooling element 31, and the coiling height of the circulation element 32 is less than the height of the liquid cooling element 31.

[0096] The size of the circulation element 32 matches the size of the reaction element 22. Generally, the radial dimension (such as the inner diameter) of the spiral formed by the circulation element 32 is greater than the radial dimension (such as the outer diameter) of the reaction element 22.

[0097] In some of these embodiments, the circulation element 32 is an annular gas pipeline.

[0098] As Figure 5 shown, the air cooling unit 40 includes an air cooling element 41, a gas driving element 42, a second air outlet element 43, and a third air inlet element 44. Among them, the gas driving element 42 is communicated with the air cooling element 41 for driving the gas to flow; the second air outlet element 43 is respectively communicated with the air cooling element 41 and the liquid cooling unit 30 for delivering low-temperature gas to the liquid cooling unit 30 under the action of the gas driving element 42; the third air inlet element 44 is respectively communicated with the air cooling element 41 and the liquid cooling unit 30 for delivering high-temperature gas to the air cooling element 41 under the action of the gas driving element 42.

[0099] Specifically, the second air outlet element 43 is communicated with the inlet end of the circulation element 32; the third air inlet element 44 is communicated with the outlet end of the circulation element 32.

[0100] In the present utility model, the gas circulating in the air cooling unit 30 includes but is not limited to hydrogen (H2).

[0101] In some of these embodiments, the air cooling element 41 is an air bath thermostat shaker.

[0102] The connection mode between the gas driving element 42 and the air cooling element 41 is a detachable connection. Among them, the detachable connection mode includes but is not limited to bolt connection.

[0103] In some of these embodiments, the gas driving element 42 is a gas circulation pump.

[0104] The connection mode between the second air outlet element 43 and the air cooling element 41 is a fixed connection. Among them, the fixed connection mode includes but is not limited to integral molding and welding.

[0105] The connection mode between the second air outlet element 43 and the circulation element 32 is a fixed connection or a detachable connection. Among them, the fixed connection mode includes but is not limited to welding; the detachable connection mode includes but is not limited to flange connection.

[0106] The size of the second air outlet element 43 matches the size of the circulation element 32. Generally, the radial dimension (such as the outer diameter) of the second air outlet element 43 is equal to the radial dimension (such as the outer diameter) of the circulation element 32.

[0107] In some of the embodiments, the second air outlet element 43 is a second air outlet pipe.

[0108] The connection mode between the third air inlet element 44 and the air cooling element 41 is a fixed connection. Among them, the fixed connection mode includes but is not limited to integral molding and welding.

[0109] The connection mode between the third air inlet element 44 and the circulation element 32 is a fixed connection or a detachable connection. Among them, the fixed connection mode includes but is not limited to welding; the detachable connection mode includes but is not limited to flange connection.

[0110] The size of the third air inlet element 44 matches the size of the air cooling element 41. Generally, the radial dimension (such as the outer diameter) of the third air inlet element 44 is smaller than the radial dimension (such as the outer diameter, length, width) of the cross-section of the air cooling element 41 where it is located.

[0111] The size of the third air inlet element 44 matches the size of the circulation element 32. Generally, the radial dimension (such as the outer diameter) of the third air inlet element 44 is equal to the radial dimension (such as the outer diameter) of the circulation element 32.

[0112] In some of the embodiments, the third air inlet element 44 is a third air inlet pipe.

[0113] As Figure 6 shown, the discharge unit 50 includes a first discharge element 51, a second discharge element 52, and a third discharge element 53. Among them, the first discharge element 51 is communicated with the tail gas treatment unit 20 and is used to output the tail gas treated by the tail gas treatment unit 20 and the liquid cooling unit 30; the second discharge element 52 is respectively communicated with the first discharge element 51 and the air cooling unit 40 and is used to relieve the pressure of the low-temperature gas when the pressure reaches the pressure threshold; the third discharge element 53 is respectively communicated with the first discharge element 51 and the air cooling unit 40 and is used to relieve the pressure of the high-temperature gas when the pressure reaches the pressure threshold.

[0114] Specifically, the first discharge element 51 is communicated with the first air outlet element 24; the second discharge element 52 is communicated with the second air outlet element 43; the third discharge element 53 is communicated with the third air inlet element 44.

[0115] The connection between the first discharge element 51 and the first air outlet element 24 is a fixed connection or a detachable connection. Among them, the fixed connection methods include but are not limited to integral molding and welding; the detachable connection methods include but are not limited to flange connection.

[0116] The size of the first discharge element 51 matches the size of the first air outlet element 24. Generally, the radial dimension (such as the outer diameter) of the first discharge element 51 is equal to the radial dimension (such as the outer diameter) of the first air outlet element 24.

[0117] In some of the embodiments, the first discharge element 51 is a first discharge pipe.

[0118] The connection between the second discharge element 52 and the first discharge element 51 is a fixed connection or a detachable connection. Among them, the fixed connection methods include but are not limited to integral molding and welding; the detachable connection methods include but are not limited to flange connection.

[0119] The connection between the second discharge element 52 and the second air outlet element 43 is a fixed connection or a detachable connection. Among them, the fixed connection methods include but are not limited to integral molding and welding; the detachable connection methods include but are not limited to flange connection.

[0120] The size of the second discharge element 52 matches the size of the first discharge element 51. Generally, the radial dimension (such as the outer diameter) of the second discharge element 52 is not greater than the radial dimension (such as the outer diameter) of the first discharge element 51.

[0121] The size of the second discharge element 52 matches the size of the second air outlet element 43. Generally, the radial dimension (such as the outer diameter) of the second discharge element 52 is not greater than the radial dimension (such as the outer diameter) of the second air outlet element 43.

[0122] In some of the embodiments, the second discharge element 52 is a second discharge pipe.

[0123] The connection between the third discharge element 53 and the first discharge element 51 is a fixed connection or a detachable connection. Among them, the fixed connection methods include but are not limited to integral molding and welding; the detachable connection methods include but are not limited to flange connection.

[0124] The connection between the third discharge element 53 and the third air inlet element 44 is a fixed connection or a detachable connection. Among them, the fixed connection methods include but are not limited to integral molding and welding; the detachable connection methods include but are not limited to flange connection.

[0125] The size of the third discharge element 53 matches the size of the first discharge element 51. Generally, the radial dimension (such as the outer diameter) of the third discharge element 53 is not greater than the radial dimension (such as the outer diameter) of the first discharge element 51.

[0126] The size of the third discharge element 53 matches the size of the third intake element 44. Generally, the radial dimension (such as the outer diameter) of the third discharge element 53 is not greater than the radial dimension (such as the outer diameter) of the third intake element 44.

[0127] In some of these embodiments, the third discharge element 53 is the third exhaust pipe.

[0128] Usage method of the present utility model:

[0129] (1) The first intake element 11 receives the discharged tail gas from the front-end tail gas output device, and sends the tail gas through the second intake element 23 into the reaction element 22 for treatment. The treated tail gas is output to the next process equipment through the first discharge element 51 via the first outlet element 24;

[0130] (2) The gas cooling element 41 cools the gas (such as hydrogen), and under the action of the gas driving element 42, it is transported to the circulation element 32 through the second outlet element 43. The circulation element 32 exchanges heat with the liquid cooling element 31 to reduce the temperature of the liquid cooling element 31; the heated high-temperature gas is re-transported to the third intake element 44 through the outlet end of the circulation element 32 and then enters the liquid cooling element 31 for cooling. The low-temperature gas at a certain temperature is then input into the circulation element 32 through the second outlet element 43.

[0131] The technical effects of the present utility model are as follows:

[0132] The intake unit is used to transport the tail gas to the tail gas treatment unit, and the gas cooling unit is used to circulate the gas bath of the liquid cooling unit. The temperature of the liquid cooling unit is reduced through heat exchange, and then the tail gas of the tail gas treatment unit is condensed. The condensed tail gas is transported to the next process through the discharge unit; through the gas bath temperature control of the gas cooling unit, high-precision temperature control can be achieved, and the temperature control of ±0.5 °C can be achieved at the highest; at the same time, the gas of the gas cooling unit can be recycled, and the liquid cooling unit is provided with recycled deionized water, reducing the risk of waste and supply interruption, and solving the problem that cooling water is easy to cause waste; the structure of this device is simple, the gas cooling unit and the tail gas treatment unit are relatively independent, and the later maintenance and repair are simple, solving the problem of complex device; and the ambient temperature can be controlled more precisely. Through the combination of the gas cooling unit and the liquid cooling unit, the heat exchange is more thorough, the cooling efficiency is higher, and the tail gas condensation efficiency is greatly improved, solving the problem of low cooling efficiency.

[0133] Embodiment 2

[0134] This embodiment is a variant embodiment of Embodiment 1.

[0135] As Figure 7 shown, the liquid cooling unit 30 further includes a temperature detection element 33. Among them, the temperature detection element 33 is arranged on the liquid cooling element 31 for monitoring the temperature of the condensed liquid.

[0136] The connection mode between the temperature detection element 33 and the liquid cooling element 31 is a detachable connection. Among them, the detachable connection mode includes but is not limited to bolt connection.

[0137] The size of the temperature detection element 33 matches the size of the liquid cooling element 31. Generally, the radial dimensions (such as outer diameter, length, width) of the temperature detection element 33 are smaller than the radial dimensions (such as outer diameter, length, width) of the liquid cooling element 31 where it is located.

[0138] In some of these embodiments, the temperature detection element 33 is a temperature detector.

[0139] The usage method of this embodiment is as follows:

[0140] The temperature detection element 33 monitors the temperature of the liquid in the liquid cooling element 31 in real time and transmits the temperature information to the control system. When the temperature detected by the temperature detection element 33 exceeds the preset threshold, the control system controls the air cooling element 41 to adjust the temperature of the gas so that the temperature in the liquid cooling element 31 meets the requirements.

[0141] The technical effects of this embodiment are as follows:

[0142] Using the temperature detection element to detect the temperature of the liquid cooling element in real time can ensure temperature stability, and then accurately control the temperature of the tail gas in the tail gas treatment unit to ensure that the tail gas is condensed in time.

[0143] Embodiment 3

[0144] This embodiment is a variant embodiment of Embodiment 1 to Embodiment 2.

[0145] As Figure 8 shown, the air cooling unit 40 further includes a first opening and closing element 45. Among them, the first opening and closing element 45 is arranged on the second air outlet element 43 and is used to control the opening and closing of the second air outlet element 43.

[0146] In some of these embodiments, the first opening and closing element 45 is a first stop valve.

[0147] Furthermore, as ​ shown, the air cooling unit 40 further includes a first pressure regulating element 46. Among them, the first pressure regulating element 46 is arranged on the second air outlet element 43 and is used to regulate the pressure of the low-temperature gas.

[0148] In some of these embodiments, the first pressure regulating element 46 is a first regulating valve.

[0149] As ​ shown, the air cooling unit 40 further includes a second opening and closing element 47. Among them, the second opening and closing element 47 is arranged on the third air inlet element 44 and is used to control the opening and closing of the third air inlet element 44.

[0150] In some of these embodiments, the second opening and closing element 47 is a second cut-off valve.

[0151] Furthermore, as ​ shown, the air-cooling unit 40 further includes a second pressure-regulating element 48. Among them, the second pressure-regulating element 48 is disposed on the third intake element 44 for regulating the pressure of the high-temperature gas.

[0152] In some of these embodiments, the second pressure-regulating element 48 is a second regulating valve.

[0153] The usage method of this embodiment is as follows:

[0154] When it is necessary to stop delivering the low-temperature gas to the liquid-cooling element 31, close the first opening and closing element 45 and simultaneously close the second opening and closing element 47;

[0155] When it is necessary to deliver the low-temperature gas to the liquid-cooling element 31, open the first opening and closing element 45, and the gas from the second gas outlet element 43 is delivered to the circulation element 32; simultaneously open the second opening and closing element 47 to enable the high-temperature gas of the circulation element 32 to enter the air-cooling element 41.

[0156] When the pressure of the low-temperature gas from the second gas outlet element 43 exceeds the preset range, open the first pressure-regulating element 46 to regulate the pressure of the second gas outlet element 43 to ensure safety; when the pressure of the high-temperature gas from the third intake element 44 exceeds the preset range, open the second pressure-regulating element 48 to regulate the pressure of the third intake element 44 to ensure safety.

[0157] Other usage methods are the same as those in Embodiment 1 and will not be elaborated here.

[0158] The technical effects of this embodiment are as follows:

[0159] By using the first opening and closing element to control the opening and closing of the second gas outlet element and using the second opening and closing element to control the opening and closing of the third intake element, the cyclic delivery of the low-temperature gas and the high-temperature gas can be controlled at any time; by using the first pressure-regulating element and the second pressure-regulating element to respectively regulate the pressures of the gases of the second gas outlet element and the third intake element, the pressure is controlled to be constant to ensure the safety of gas delivery.

[0160] Embodiment 4

[0161] This embodiment is a variant embodiment of Embodiments 1 to 3.

[0162] As ​ shown, the discharge unit 50 further includes a first pressure-relief element 54. Among them, the first pressure-relief element 54 is disposed on the second discharge element 52 for pressure relief.

[0163] In some of these embodiments, the first pressure-relief element 54 is a first pressure-relief valve.

[0164] Furthermore, the discharge unit 50 further includes a second pressure relief element 55. Among them, the second pressure relief element 55 is arranged on the third discharge element 53 for pressure relief.

[0165] In some embodiments thereof, the second pressure relief element 55 is a second pressure relief valve.

[0166] The usage method of this embodiment:

[0167] When the pressure of the second air outlet element 43 exceeds the preset threshold, the first pressure relief element 54 is opened to relieve the pressure of the second air outlet element 43 so that the pressure value of the second air outlet element 43 conforms to the preset threshold;

[0168] When the pressure of the third air inlet element 44 exceeds the preset threshold, the second pressure relief element 55 is opened to relieve the pressure of the third air inlet element 44 so that the pressure value of the third air inlet element 44 conforms to the preset threshold.

[0169] The technical effects of this embodiment are as follows:

[0170] By providing the first pressure relief element and the second pressure relief element, it is avoided that the air-cooling unit explodes due to excessive pressure.

[0171] Embodiment 5

[0172] This embodiment relates to a semiconductor process system of the present invention.

[0173] A schematic embodiment of the present invention, a semiconductor process system, includes the tail gas condensation device described in any one of Embodiments 1 to 4.

[0174] Specifically, the air inlet unit 10 of the tail gas condensation device is connected to the tail gas conveying equipment; the discharge unit 50 of the tail gas condensation device is connected to other process equipment.

[0175] More specifically, the first air inlet element 11 is connected to the tail gas conveying equipment, and the first discharge element 51 is connected to other process equipment. }

[0176] In some embodiments thereof, other process equipment includes, but is not limited to, a zeolite wheel adsorption and concentration device, a catalytic combustion device, etc.

[0177] The above are only the preferred embodiments of the present invention, and do not limit the implementation manners and protection scope of the present invention accordingly. For those skilled in the art, it should be able to realize that all the equivalent replacements and obvious changes made by using the description and illustrations of the present invention should be included in the protection scope of the present invention.

Claims

1. An exhaust gas condensation device, characterized in that, include: An air intake unit, the air intake unit being connected to the exhaust gas delivery system and being used for delivering the exhaust gas; An exhaust gas treatment unit, the exhaust gas treatment unit being in communication with the air intake unit and being used for treating the exhaust gas; a liquid cooling unit, the liquid cooling unit being arranged inside the exhaust gas treatment unit and being used for condensing the exhaust gas; an air cooling unit, wherein the air outlet of the air cooling unit is in communication with the air inlet of the liquid cooling unit, and the air inlet of the air cooling unit is in communication with the air outlet of the liquid cooling unit, and is configured to deliver low-temperature gas to the liquid cooling unit, recover high-temperature gas from the liquid cooling unit, and cool the high-temperature gas to low-temperature gas; The discharge unit is connected to the exhaust gas treatment unit and the air cooling unit respectively, and is used to output the exhaust gas treated by the exhaust gas treatment unit, the low-temperature gas output by the air cooling unit, and the high-temperature gas input to the air cooling unit.

2. The tail gas condensation device according to claim 1, wherein The air intake unit comprises: A first air intake component is connected to the exhaust gas treatment unit and is used to transport exhaust gas to the exhaust gas treatment unit.

3. The tail gas condensation device according to claim 1, wherein The processing unit includes: a housing element, wherein the liquid cooling unit is disposed inside the housing element; a reaction element, the reaction element being disposed inside the housing element and located inside the liquid cooling unit, and being used to process the exhaust gas; a second air intake element, which is disposed on the reaction element and communicates with the air intake unit, and is used to deliver exhaust gas to the reaction element; A first gas outlet element is provided on the reaction element and is in communication with the discharge unit, and is used for outputting the treated tail gas to the discharge unit.

4. The tail gas condensation device according to claim 1, characterized in that, The liquid cooling unit comprises: a liquid cooling element, the liquid cooling element being arranged inside the exhaust gas treatment unit and being used for condensing the exhaust gas; A circulation element is arranged in the liquid cooling element, the air inlet end of the circulation element is connected to the air outlet end of the air cooling unit, and the air outlet end of the circulation element is connected to the air inlet end of the air cooling unit, and is used to obtain low-temperature gas from the air cooling unit, use the low-temperature gas to heat exchange the condensed liquid of the liquid cooling element to cool the condensed liquid and obtain high-temperature gas, and output the high-temperature gas to the air cooling unit.

5. The tail gas condensation device according to claim 4, characterized in that, The liquid cooling unit further comprises: A temperature detection element is provided on the liquid cooling element and is used to monitor the temperature of the condensed liquid.

6. The tail gas condensation device according to claim 1, characterized in that, The air cooling unit comprises: Air cooling elements; a gas driving element, the gas driving element being in communication with the air cooling element and being used for driving the gas flow; a second gas outlet element, the second gas outlet element being in communication with the gas cooling element and the liquid cooling unit, respectively, and being configured to deliver low-temperature gas to the liquid cooling unit under the action of the gas driving element; A third air intake element is connected to the air cooling element and the liquid cooling unit respectively, and is used to transport high-temperature gas to the air cooling element under the action of the gas driving element.

7. The tail gas condensation device according to claim 6, characterized in that The air cooling unit further comprises: a first opening and closing element, the first opening and closing element being provided on the second gas outlet element and being used for controlling the opening and closing of the second gas outlet element; and / or A first pressure regulating element, which is arranged on the second gas outlet element and is used for regulating the pressure of the low-temperature gas; and / or A second opening and closing element, which is arranged on the third gas inlet element and is used for controlling the opening and closing of the third gas inlet element; and / or A second pressure regulating element, which is arranged on the third gas inlet element and is used for regulating the pressure of the high-temperature gas.

8. The tail gas condensation device according to claim 1, characterized in that The discharge unit includes: A first discharge element, which is communicated with the tail gas treatment unit and is used for outputting the tail gas treated by the tail gas treatment unit and the liquid cooling unit; A second discharge element, which is respectively communicated with the first discharge element and the air cooling unit and is used for discharging the low-temperature gas when the pressure reaches a pressure threshold; A third discharge element, which is respectively communicated with the first discharge element and the air cooling unit and is used for discharging the high-temperature gas when the pressure reaches a pressure threshold.

9. The tail gas condensation device according to claim 8, wherein, The discharge unit further includes: A first pressure relief element, which is arranged on the second discharge element and is used for relieving pressure; and / or A second pressure relief element, which is arranged on the third discharge element and is used for relieving pressure.

10. A semiconductor process system, characterized in that, Comprising: The tail gas condensation device according to any one of claims 1 to 9.

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