UV glue packaging equipment for chip

Abstract

The utility model discloses UV glue packaging equipment for chips, and relates to the technical field of chip packaging, the UV glue packaging equipment comprises a rack and a placing table fixedly arranged at the lower end in the rack, a cavity is arranged in the upper end of the rack, a movable plate is slidably arranged in the upper end of the rack in a penetrating manner, a glue spraying pipe is fixedly arranged in the movable plate in a penetrating manner, and the bottom of the glue spraying pipe is communicated with a glue spraying head; a supporting plate is fixedly arranged at the upper end of the outer wall of the rack, a motor is fixedly arranged at the bottom of the supporting plate, the tail end of an output shaft of the motor penetrates out of the supporting plate and is fixedly provided with a rotating plate, a sleeve is arranged in the rotating plate through a positioning mechanism, a sleeve rod rotationally penetrates through the inner wall of the sleeve, and a connecting plate is arranged on the rod wall of the sleeve rod through a length adjusting mechanism. A vertical rod fixedly penetrates through the end of the moving plate, and the moving plate rotationally sleeves the lower end of the outer wall of the vertical rod. According to the utility model, the transverse moving range of the moving plate can be adjusted according to the lengths of different chips, so that the glue spraying range of the glue spraying head is matched with the specifications of the chips, and the glue spraying and packaging effects of the chips are ensured.

Description

Technical Field

[0001] The utility model relates to the technical field of chip packaging, in particular to a UV glue packaging device for chips. Background Art

[0002] UV glue can be quickly cured under ultraviolet irradiation, usually completing the curing process within a few seconds to dozens of seconds. This rapid curing speed can significantly improve production efficiency and reduce production costs, so it can be effectively used in the chip packaging process to complete the packaging process faster.

[0003] After retrieval, the patent document with the publication number CN217770527U discloses a packaging device for PCBA boards. The packaging device is provided with a first moving mechanism to drive the glue spraying mechanism to move linearly back and forth along the first horizontal direction, so as to spray UV glue on the target glue spraying area of the PCBA board, and can reliably package the PCBA board. At the same time, a conveying mechanism is provided to make the feeding surface and the discharging surface located on opposite sides of the workbench, which can realize the automatic placement and taking out of the PCBA board and improve production efficiency.

[0004] However, due to the different overall length specifications of different models of chips, and the fixed glue spraying range of the above device, it is impossible to fully and comprehensively coat the chip surface with UV glue to complete the packaging work. Content of the Utility Model

[0005] In view of the problems existing in the existing UV glue packaging device for chips, the present utility model is proposed.

[0006] Therefore, the purpose of the present utility model is to provide a UV glue packaging device for chips, which solves the problem that due to the different overall length specifications of different models of chips, and the fixed glue spraying range of the existing packaging device, it is impossible to fully and comprehensively coat the chip surface with UV glue to complete the packaging work.

[0007] In order to achieve the above purpose, the present utility model provides the following technical solutions:

[0008] A UV glue packaging device for chips, including a frame and a placement table fixedly arranged at the lower end inside the frame. A cavity is opened inside the upper end of the frame, and a moving plate is slidably penetrated. A glue spraying pipe is fixedly penetrated inside the moving plate, and a glue spraying head is communicated with the bottom of the glue spraying pipe;

[0009] A support plate is fixedly arranged at the upper end of the outer wall of the frame. A motor is fixedly arranged at the bottom of the support plate. The end of the output shaft of the motor penetrates through the support plate and is fixedly provided with a rotating plate. A sleeve is arranged inside the rotating plate through a positioning mechanism. A sleeve rod is slidably penetrated inside the inner wall of the sleeve. A connecting plate is arranged on the rod wall of the sleeve rod through a length adjusting mechanism. A vertical rod is fixedly penetrated at the end of the moving plate, and the moving plate is rotatably sleeved at the lower end of the outer wall of the vertical rod.

[0010] Preferably, the length adjusting mechanism includes an adjusting screw rod which is rotationally engaged with the end of the connecting plate, and a slider is sleeved on the rod wall in a threaded manner. The slider is fixedly connected with the sleeve rod, and two symmetrically arranged guiding telescopic rods are fixedly arranged between the slider and the connecting plate.

[0011] Preferably, the positioning mechanism includes two symmetrically arranged insertion blocks. A plurality of spaced positioning grooves are formed in the top of the rotating plate. The sleeve is located in the positioning groove. Two symmetrically arranged insertion slots are formed in the inner wall of the positioning groove. Grooves are formed on both sides of the sleeve. The two insertion blocks are respectively located in the two grooves and inserted into the insertion slots. Push plates are fixedly arranged on the closer sides of the two insertion blocks. Springs are fixedly arranged between the push plates and the inner walls of the grooves.

[0012] Preferably, the push plate is U-shaped and its upper end passes through the groove and extends to the outside.

[0013] Furthermore, a through hole for the movable plate to pass through is formed in the upper side part of the frame.

[0014] Preferably, a strip-shaped groove for the glue spraying pipe to pass through is formed in the bottom of the upper end of the frame.

[0015] In the above technical solution, the technical effects and advantages provided by the present utility model are as follows:

[0016] 1. In the present utility model, through the provided frame, placing table, movable plate, vertical rod, support plate, motor, rotating plate, positioning groove, sleeve, sleeve rod, length adjusting mechanism, positioning mechanism, connecting plate and vertical rod, the length of the connecting plate can be adjusted, and the lateral movement range of the movable plate can be adjusted according to the lengths of different chips, so that the glue spraying range of the glue spraying head matches the chip specifications, ensuring the glue spraying and encapsulation effect of the chips.

[0017] 2. In the present utility model, through the provided frame, through hole and strip-shaped groove, the movement of the movable plate can be guided and supported, and at the same time, the UV glue can be stably sprayed outwards when the glue spraying pipe moves laterally. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the following will briefly introduce the drawings required to be used in the embodiments. Obviously, the drawings described below are only some embodiments recorded in the present utility model. For those of ordinary skill in the art, other drawings can also be obtained based on these drawings.

[0019] Figure 1 is a schematic structural diagram of the present utility model;

[0020] Figure 2For the present utility model Figure 1 Schematic enlarged view of part A;

[0021] Figure 3 For the present utility model Figure 2 Schematic enlarged view of part B;

[0022] Figure 4 Schematic three - dimensional structure view of the rotating plate of the present utility model.

[0023] Explanation of reference numerals in the drawings:

[0024] 1. Frame; 2. Placing table; 3. Moving plate; 4. Glue spraying pipe; 5. Glue spraying head; 6. Support plate; 7. Motor; 8. Rotating plate; 9. Sleeve; 10. Sleeve rod; 11. Connecting plate; 12. Vertical rod; 13. Adjusting screw; 14. Slide block; 15. Guiding telescopic rod; 16. Insert block; 17. Positioning groove; 18. Pushing plate; 19. Spring. Specific embodiments

[0025] In order to enable those skilled in the art to better understand the technical solution of the present utility model, the present utility model will be further introduced in detail below in conjunction with the accompanying drawings.

[0026] An embodiment of the present utility model discloses a UV glue encapsulation device for chips.

[0027] Embodiment 1

[0028] The present utility model provides a UV glue encapsulation device for chips as shown in Figures 1-4 which includes a frame 1 and a placing table 2 fixedly arranged at the lower end inside the frame 1. A cavity is formed inside the upper end of the frame 1, and a moving plate 3 is slidably penetrated. A through - hole for the moving plate 3 to penetrate is formed at the side part of the upper end of the frame 1. A glue spraying pipe 4 is fixedly penetrated inside the moving plate 3, and a glue spraying head 5 is communicated and arranged at the bottom of the glue spraying pipe 4. A strip - shaped groove for the glue spraying pipe 4 to penetrate is formed at the bottom of the upper end of the frame 1;

[0029] A support plate 6 is fixedly arranged at the upper end outer wall of the frame 1, a motor 7 is fixedly arranged at the bottom of the support plate 6, the end of the output shaft of the motor 7 penetrates through the support plate 6 and a rotating plate 8 is fixedly arranged. A sleeve 9 is arranged inside the rotating plate 8 through a positioning mechanism, a sleeve rod 10 is slidably penetrated inside the inner wall of the sleeve 9, a connecting plate 11 is arranged on the rod wall of the sleeve rod 10 through a length adjusting mechanism, a vertical rod 12 is fixedly penetrated at the end of the moving plate 3, and the moving plate 3 is rotatably sleeved at the lower end outer wall of the vertical rod 12;

[0030] The length adjusting mechanism includes an adjusting screw 13 which is rotationally matched with the end of the connecting plate 11, and a slide block 14 is threadedly sleeved on the rod wall. The slide block 14 is fixedly connected with the sleeve rod 10, and two symmetrically arranged guiding telescopic rods 15 are fixedly arranged between the slide block 14 and the connecting plate 11.

[0031] Before the chip packaging work is carried out, the chip is placed on the placement table 2. At this time, the length specification of the chip can be determined. Subsequently, the adjusting screw 13 is rotated, so that the adjusting screw 13 drives the slider 14 to move stably horizontally under the support of the two guiding telescopic rods 15, and the positions of the sleeve 9 and the sleeve rod 10 are determined. Subsequently, under the setting of the positioning mechanism, the sleeve 9 is connected to the rotating plate 8. Then, the glue spraying pipe 4 is connected to an external glue conveying device, so that the UV glue can be sprayed out through the glue spraying pipe 4 and the glue spraying head 5. Immediately, the motor 7 is started, so that the motor 7 drives the rotating plate 8 to rotate, and the rotating plate 8 pulls the connecting plate 11 through the sleeve 9 and the sleeve rod 10. Through the rotational cooperation of the connecting plate 11 and the vertical rod 12, the moving plate 3 can be pulled to move horizontally back and forth under the support of the through hole. At this time, the glue spraying head 5 can move horizontally, so that the glue quickly covers the outside of the chip to complete the packaging work. When the length specifications of the chips are different, the length of the connecting plate 11 can be adjusted, and the horizontal moving distance of the moving plate 3 can be adjusted, so as to adjust the glue spraying range of the glue spraying head 5, thereby completing an effective and comprehensive glue spraying and packaging work.

[0032] Embodiment 2

[0033] On the basis of Embodiment 1, in order to determine the position of the connecting plate 11 after the length of the connecting plate 11 is determined, as Figures 2-4 shown, the positioning mechanism includes two symmetrically arranged insertion blocks 16. A plurality of spaced positioning grooves 17 are formed at the top of the rotating plate 8. The sleeve 9 is located in the positioning groove 17. Two symmetrically arranged insertion slots are formed on the inner wall of the positioning groove 17. Grooves are formed on both sides of the sleeve 9. The two insertion blocks 16 are respectively located in the two grooves and inserted into the insertion slots. Push plates 18 are fixedly arranged on the closer sides of the two insertion blocks 16. Springs 19 are fixedly arranged between the push plates 18 and the inner walls of the grooves. The push plates 18 are U-shaped and the upper ends penetrate through the grooves and extend to the outside.

[0034] Before adjusting the length of the connecting plate 11, the push plate 18 is pressed, so that the sleeve 10 moves away from the rotating plate 8 and can move horizontally along with the slider 14. After the length of the connecting plate 11 is adjusted, the sleeve 9 is inserted into the positioning groove 17 at the corresponding position, and the two push plates 18 are released. At this time, under the push of the spring 19, the push plate 18 drives the insertion block 16 to insert into the insertion slot, thereby completing the connection between the sleeve 9 and the rotating plate 8, so that when the rotating plate 8 rotates, it can drive the connecting plate 11 to swing and stably drive the moving plate 3 during the moving process.

[0035] Only some exemplary embodiments of the present utility model are described by way of illustration. Without doubt, for those of ordinary skill in the art, the described embodiments can be modified in various different ways without departing from the spirit and scope of the present utility model. Therefore, the above drawings and description are illustrative in nature and should not be construed as limiting the scope of protection of the claims of the present utility model.

Claims

1. A UV glue encapsulation device for a chip, comprising a frame (1) and a placement table (2) fixedly arranged at the lower end inside the frame (1), characterized in that, A cavity is formed inside the upper end of the frame (1), and a moving plate (3) is slidably inserted therein. A glue spraying pipe (4) is fixedly inserted inside the moving plate (3), and a glue spraying head (5) is communicated with the bottom of the glue spraying pipe (4). A support plate (6) is fixedly arranged on the outer wall of the upper end of the frame (1). A motor (7) is fixedly arranged at the bottom of the support plate (6). The end of the output shaft of the motor (7) penetrates through the support plate (6) and is fixedly provided with a rotating plate (8). A sleeve (9) is arranged inside the rotating plate (8) through a positioning mechanism. A sleeve rod (10) is slidably inserted into the inner wall of the sleeve (9). A connecting plate (11) is arranged on the rod wall of the sleeve rod (10) through a length adjusting mechanism. A vertical rod (12) is fixedly inserted at the end of the moving plate (3), and the moving plate (3) is rotatably sleeved on the outer wall of the lower end of the vertical rod (12).

2. The UV glue encapsulation device for chips according to claim 1, characterized in that, The length adjusting mechanism includes an adjusting screw rod (13). The adjusting screw rod (13) is rotatably matched with the end of the connecting plate (11), and a sliding block (14) is sleeved on the rod wall in a threaded manner. The sliding block (14) is fixedly connected with the sleeve rod (10). Two symmetrically arranged guiding telescopic rods (15) are fixedly arranged between the sliding block (14) and the connecting plate (11).

3. The UV glue encapsulation device for chips according to claim 1, characterized in that, The positioning mechanism includes two symmetrically arranged insertion blocks (16). A plurality of spaced positioning grooves (17) are formed at the top of the rotating plate (8). The sleeve (9) is located in the positioning grooves (17). Two symmetrically arranged insertion slots are formed in the inner wall of the positioning grooves (17). Grooves are formed on both sides of the sleeve (9). The two insertion blocks (16) are respectively located in the two grooves and inserted into the insertion slots. A push plate (18) is fixedly arranged on one side of the two insertion blocks (16) close to each other. A spring (19) is fixedly arranged between the push plate (18) and the inner wall of the groove.

4. The UV glue encapsulation device for chips according to claim 3, characterized in that, The push plate (18) is arranged in a U shape, and the upper end penetrates through the groove and extends to the outside.

5. The UV glue encapsulation device for chips according to claim 1, characterized in that, A through hole for the moving plate (3) to pass through is formed in the side part of the upper end of the frame (1).

6. The UV glue encapsulation device for chips according to claim 1, characterized in that, A strip-shaped groove for the glue spraying pipe (4) to pass through is formed at the bottom of the upper end of the frame (1).

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