Water washing device for nickel and gold immersion circuit board processing

Abstract

The utility model relates to the technical field of nickel and gold immersion circuit boards, in particular to a water washing device for nickel and gold immersion circuit board processing, which comprises a cleaning box, a cleaning assembly comprises a plurality of partition bins arranged in the cleaning box, positioning frames are arranged in the partition bins, supporting plates are arranged on the outer walls of the positioning frames, through grooves are formed in the supporting plates, and the through grooves are communicated with the cleaning box. A plurality of nozzles are arranged on the outer wall of the supporting plate, a mounting frame is arranged at one end of the supporting plate, a cavity is formed in the mounting frame, a sponge hole plate is arranged on the inner wall of the cavity, a smashing wheel is arranged in the cavity, a spiral blade is arranged at one end of the smashing wheel, a connecting pipe is arranged outside the mounting frame, and the other end of the connecting pipe extends into the partition bin and is provided with a pump body. According to the circuit board cleaning device, used cleaning liquid is recycled, impurities doped in the cleaning liquid are filtered out, the recycled cleaning liquid is reused to pretreat a circuit board to be cleaned, and the cleaning effect is improved while the circuit board is prevented from being polluted by residual impurities.

Description

Technical Field

[0001] The utility model relates to the technical field of electroless nickel immersion gold circuit boards, and particularly relates to a water washing device for processing electroless nickel immersion gold circuit boards. Background Technique

[0002] Electroless nickel immersion gold is a precious metal with good electrical conductivity and thermal stability, and is widely used in circuit connectors, contacts and other parts in electronic devices. When processing electroless nickel immersion gold circuit boards, a water washing solution is used to wash the circuit boards to remove impurities on the surface of the circuit boards and improve the product quality.

[0003] However, in the current prior art, when washing electroless nickel immersion gold circuit boards, the removed impurities will adhere to the surface of the water washing solution, resulting in a reduction in the cleaning effect when the water washing solution is reused, and the impurities in the water washing solution may cause secondary pollution to the circuit boards. Content of the Utility Model

[0004] The purpose of the utility model is to provide a water washing device for processing electroless nickel immersion gold circuit boards to solve the problems put forward in the above background technique.

[0005] To achieve the above purpose, the utility model provides the following technical scheme:

[0006] A water washing device for processing electroless nickel immersion gold circuit boards includes a cleaning tank. A cleaning component for cleaning the electroless nickel immersion gold circuit boards is arranged inside the cleaning tank. The cleaning component includes a plurality of partition bins arranged inside the cleaning tank. Positioning frames are arranged inside the plurality of partition bins. Support plates are arranged on the outer walls of the positioning frames. Through grooves are arranged inside the support plates. A plurality of spray heads are arranged on the outer walls of the support plates. An installation frame is arranged at one end of the support plate. A cavity is arranged inside the installation frame. A sponge perforated plate is arranged on the inner wall of the cavity. A crushing wheel is arranged inside the cavity. A spiral blade is arranged at one end of the crushing wheel. A connecting pipe is arranged outside the installation frame. The other end of the connecting pipe extends into the partition bin and a pump body is arranged.

[0007] As a preferred scheme of the utility model, the plurality of partition bins are arranged in an array inside the cleaning tank. The positioning frame is connected to the inner wall of the partition bin through bolts. The support plate is located outside the positioning frame and is slidably connected to the positioning frame through a slide rail.

[0008] As a preferred scheme of the utility model, one end of the support plate is connected to the installation frame through bolts. The through groove communicates with the cavity inside the installation frame. One ends of the plurality of spray heads all extend into the through groove.

[0009] As a preferred solution of the utility model, the sponge perforated plate is inlaid and connected with the inner wall of the cavity. The crushing wheel is located in the cavity and is rotationally connected with the inner wall of the cavity through a bearing. One end of the crushing wheel close to the support plate extends into the through groove and is coaxially connected with the spiral blade through a coupling.

[0010] As a preferred solution of the utility model, the installation frame is embedded in the positioning groove on the inner wall of the separation bin. One end of the connecting pipe is connected with the installation frame through a sleeve, and the other end extends into other separation bins and is connected with the pump body.

[0011] As a preferred solution of the utility model, the pump body can transport the cleaning liquid in the separation bin to the support plate in the front separation bin through the connecting pipe.

[0012] Compared with the prior art, the beneficial effects of the utility model are as follows: in view of the problems raised in the background art, this application adopts a cleaning component. Through multiple separation bins, when cleaning one circuit board, other multiple circuit boards can be pre-treated. The cleaning liquid is sprayed onto the circuit board by the spray head. After cleaning, the used cleaning liquid can be recycled and transported to other separation bins to pre-treat the circuit boards to be cleaned, improving the cleaning effect. At the same time of recycling the cleaning liquid, the impurities in the cleaning liquid can be crushed and adsorbed to realize the filtration of the cleaning liquid, avoiding the pollution of the circuit board by impurities during secondary use.

[0013] The utility model realizes the recycling of the used cleaning liquid and the filtration of the impurities doped therein, and re-uses the recycled cleaning liquid to pre-treat the circuit boards to be cleaned, avoiding the pollution of the circuit board by residual impurities and improving the cleaning effect at the same time. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 is a three-dimensional view of the overall structure of the utility model;

[0015] Figure 2 is a bottom structure diagram of the support plate of the utility model;

[0016] Figure 3 is an internal cross-sectional view of the installation frame and the support plate of the utility model;

[0017] Figure 4 is an enlarged view of part A of the utility model.

[0018] In the figure: 1, cleaning box; 2, separation bin; 201, positioning frame; 3, support plate; 301, through groove; 4, spray head; 5, installation frame; 6, cavity; 601, sponge perforated plate; 602, crushing wheel; 7, spiral blade; 8, connecting pipe; 801, pump body. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0019] The technical solutions in the embodiments of the present utility model will be clearly and completely described below in conjunction with the embodiments of the present utility model. Embodiment

[0020] Please refer to Figures 1-4 , the present utility model provides a technical solution: a water washing device for processing a nickel immersion gold circuit board, including a cleaning tank 1. A cleaning component for cleaning the nickel immersion gold circuit board is arranged inside the cleaning tank 1. The cleaning component includes a plurality of partition bins 2 arranged inside the cleaning tank 1. The partition bins 2 can place a plurality of nickel immersion gold circuit boards, and pre-treat a plurality of other circuit boards when one circuit board is being cleaned. A positioning frame 201 is arranged inside each of the plurality of partition bins 2. The positioning frame 201 is used to position the angle of the support plate 3 when it moves inside the partition bin 2. A support plate 3 is arranged on the outer wall of the positioning frame 201. A through groove 301 is arranged inside the support plate 3 for the cleaning liquid to flow through the plurality of spray heads 4. A plurality of spray heads 4 are arranged on the outer wall of the support plate 3. The spray heads 4 can spray the cleaning liquid in a spraying manner onto the circuit board inside the partition bin 2 to clean the circuit board. One end of the support plate 3 is provided with a mounting frame 5. A cavity 6 is arranged inside the mounting frame 5. A sponge hole plate 601 is arranged on the inner wall of the cavity 6. There are a plurality of holes inside the sponge hole plate 601, which can absorb the broken impurities in the cleaning liquid. A crushing wheel 602 is arranged inside the cavity 6. The crushing wheel 602 can crush the impurities in the cleaning liquid. A spiral blade 7 is arranged at one end of the crushing wheel 602. When the cleaning liquid is transported to the through groove 301 through a pump body 801, the cleaning liquid can drive the crushing wheel 602 to rotate inside the cavity 6 when passing through the spiral blade 7. A connecting pipe 8 is arranged outside the mounting frame 5. The connecting pipe 8 is of a telescopic structure at one end located on the mounting frame 5, which is convenient to ensure the transportation effect of the cleaning liquid when the support plate 3 moves inside the partition bin 2. The other end of the connecting pipe 8 extends into the partition bin 2 and is provided with a pump body 801. The pump body 801 can transport the used cleaning liquid in the partition bin 2 to the support plate 3 in the previous partition bin 2 through the connecting pipe 8.

[0021] In this embodiment, all electrical components are controlled by a conventional controller.

[0022] Embodiment, please refer to Figures 1-4, a plurality of the separation bins 2 are arranged in an array in the cleaning tank 1. The positioning frame 201 is connected to the inner wall of the separation bin 2 by bolts. The support plate 3 is located outside the positioning frame 201 and is slidably connected to the positioning frame 201 through a slide rail. One end of the support plate 3 is connected to the mounting frame 5 by bolts. The through groove 301 communicates with the cavity 6 inside the mounting frame 5. One ends of a plurality of the spray heads 4 all extend into the through groove 301. The sponge perforated plate 601 is inlaid and connected to the inner wall of the cavity 6. The crushing wheel 602 is located in the cavity 6 and is rotatably connected to the inner wall of the cavity 6 through a bearing. One end of the crushing wheel 602 close to the support plate 3 extends into the through groove 301 and is coaxially connected to the spiral blade 7 through a coupling. The mounting frame 5 is embedded in the positioning groove on the inner wall of the separation bin 2. One end of the connecting pipe 8 is connected to the mounting frame 5 through a sleeve, and the other end extends into other separation bins 2 and is connected to the pump body 801. The pump body 801 can convey the cleaning liquid in the separation bin 2 to the support plate 3 in the front-end separation bin 2 through the connecting pipe 8. During use, first, the circuit board to be cleaned is placed in the separation bin 2 at the head end, and other circuit boards are placed in the remaining separation bins 2. Then, the cleaning liquid is conveyed into the mounting frame 5 in the separation bin 2 at the head end through a delivery pump and flows into the through groove 301. The cleaning liquid is sprayed on the circuit board in cooperation with a plurality of spray heads 4, and the support plate 3 is controlled by a PLC controller to move outside the positioning frame 201 so that the cleaning liquid is evenly sprayed on the circuit board; after cleaning, the remaining cleaning liquid remains in the separation bin 2, and then the pump body 801 conveys the remaining cleaning liquid through the connecting pipe 8 to the mounting frame 5 in the front-end separation bin 2 to pre-clean the circuit board in the front-end separation bin 2. At the same time, when the cleaning liquid flows through the spiral blade 7 in the mounting frame 5, the crushing wheel 602 is driven to rotate by the angle of the spiral blade 7 to crush the larger impurities in the cleaning liquid, and the impurities after crushing will be adsorbed in the holes of the sponge perforated plate 601.

[0023] The working process of the utility model is as follows: When in use, first place the circuit board to be cleaned into the partition bin 2 at the head end, and place other circuit boards into the remaining partition bins 2. Then, use a transfer pump to transport the cleaning liquid into the installation frame 5 in the head-end partition bin 2 and let it flow into the through groove 301. Cooperate with multiple spray nozzles 4 to spray the cleaning liquid onto the circuit board, and control the support plate 3 to move outside the positioning frame 201 through the PLC controller so that the cleaning liquid is evenly sprayed onto the circuit board; after cleaning, the remaining cleaning liquid remains in the partition bin 2, and then use the pump body 801 to transport the remaining cleaning liquid through the connecting pipe 8 into the installation frame 5 in the front-end partition bin 2 to pre-clean the circuit board in the front-end partition bin 2. At the same time, when the cleaning liquid flows through the spiral blade 7 in the installation frame 5, the angle of the spiral blade 7 drives the crushing wheel 602 to rotate to crush the larger impurities in the cleaning liquid, and the crushed impurities will be adsorbed in the holes of the sponge orifice plate 601. The utility model realizes the recycling of the used cleaning liquid, filters the impurities doped therein, and reuses the recycled cleaning liquid to pre-treat the circuit board to be cleaned, avoiding the pollution of the circuit board by residual impurities and improving the cleaning effect at the same time.

[0024] Although the embodiments of the present invention have been shown and described, those of ordinary skill in the art can understand that various changes, modifications, substitutions and variations can be made to these embodiments without departing from the principle and spirit of the present invention. The scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A water washing device for processing nickel immersion gold circuit boards, comprising a cleaning tank (1), wherein a cleaning assembly for cleaning nickel immersion gold circuit boards is arranged inside the cleaning tank (1), and it is characterized in that: The cleaning component includes a plurality of partition bins (2) arranged inside the cleaning tank (1). A positioning frame (201) is arranged inside each of the plurality of partition bins (2). A support plate (3) is arranged on the outer wall of the positioning frame (201). A through groove (301) is arranged inside the support plate (3). A plurality of spray nozzles (4) are arranged on the outer wall of the support plate (3). One end of the support plate (3) is provided with a mounting frame (5). A cavity (6) is arranged inside the mounting frame (5). A sponge perforated plate (601) is arranged on the inner wall of the cavity (6). A crushing wheel (602) is arranged inside the cavity (6). One end of the crushing wheel (602) is provided with a spiral blade (7). A connecting pipe (8) is arranged outside the mounting frame (5). The other end of the connecting pipe (8) extends into the partition bin (2) and is provided with a pump body (801).

2. The water washing device for processing immersion nickel and gold circuit boards according to claim 1, characterized in that: The plurality of partition bins (2) are arranged in an array inside the cleaning tank (1). The positioning frame (201) is connected to the inner wall of the partition bin (2) by bolts. The support plate (3) is located outside the positioning frame (201) and is slidably connected to the positioning frame (201) through a slide rail.

3. The water washing device for processing immersion nickel and gold circuit boards according to claim 1, wherein: One end of the support plate (3) is connected to the mounting frame (5) by bolts. The through groove (301) communicates with the cavity (6) inside the mounting frame (5). One end of each of the plurality of spray nozzles (4) extends into the through groove (301).

4. The water washing device for processing immersion nickel and gold circuit boards according to claim 1, characterized in that: The sponge perforated plate (601) is inlaid and connected to the inner wall of the cavity (6). The crushing wheel (602) is located inside the cavity (6) and is rotatably connected to the inner wall of the cavity (6) through a bearing. One end of the crushing wheel (602) close to the support plate (3) extends into the through groove (301) and is coaxially connected to the spiral blade (7) through a coupling.

5. The water washing device for processing immersion nickel and gold circuit boards according to claim 1, characterized in that: The mounting frame (5) is embedded in the positioning groove on the inner wall of the partition bin (2). One end of the connecting pipe (8) is connected to the mounting frame (5) through a sleeve, and the other end extends into other partition bins (2) and is connected to the pump body (801).

6. The water washing device for processing immersion nickel and gold circuit boards according to claim 1, wherein: The pump body (801) can transport the cleaning liquid in the partition bin (2) to the support plate (3) inside the front partition bin (2) through the connecting pipe (8).

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