Cleaning device

Abstract

The utility model provides a cleaning device which is used for cleaning an atomizer of a plasma mass spectrometer, and the cleaning device comprises a sample container which is filled with a sample liquid; one end of the sample tube is connected with the first end of the atomizer, and the other end of the sample tube is immersed in the sample liquid in the sample container; the gas spray gun and the second end of the atomizer are arranged at an interval, and the gas spray gun is used for spraying gas to purge the second end of the atomizer, so that pollutants in the atomizer enter the sample container through the sample tube under the purging action of the gas. According to the method and the device, the residual pollutants in the atomizer are effectively removed, the interference of the residual pollutants on subsequent test results is avoided, and the accuracy and the reliability of test data are ensured.

Description

Technical Field

[0001] This application relates to the field of semiconductor technology, and particularly to a cleaning device. Background Art

[0002] Inductively coupled plasma mass spectrometry (ICP-MS) is a highly sensitive analytical technique mainly used for determining ultra-trace elements and isotope ratios. The working principle of ICP-MS is to send a solution sample into a plasma light source through an atomizer, where it vaporizes and dissociates into ionized gas at high temperature. These ions enter a low-vacuum environment through a sampling cone to form a molecular beam, and then undergo mass separation through a quadrupole mass analyzer and finally reach an ion detector.

[0003] ICP-MS is mainly applied to the testing of metal ions on the surface of wafers in the semiconductor field. During the testing process, high-concentration metal ion contamination is encountered. In particular, Fe elements will remain in the atomizer, resulting in a very high total Fe background count of the machine, and it is necessary to use hydrofluoric acid (HF) solution for flushing.

[0004] In the related art, when using hydrofluoric acid solution to flush the atomizer, due to the very thin diameter of the atomizer, pollutants are adsorbed inside the diameter and are very difficult to be washed off.

[0005] In view of the existence of the above technical problems, this application provides a new cleaning device to at least partially solve the above problems. Summary of the Utility Model

[0006] A series of simplified concepts are introduced in the Summary of the Utility Model section, which will be further described in detail in the Detailed Implementation section. The Summary of the Utility Model section of this application does not mean to attempt to define the key features and essential technical features of the claimed technical solution, nor does it mean to attempt to determine the protection scope of the claimed technical solution. [[ID=…]]

[0007] In view of the existing problems, this application provides a cleaning device for cleaning the atomizer of a plasma mass spectrometer. The cleaning device includes: <00000…]]

[0008] A sample container containing a sample liquid;

[0009] A sample tube, one end of which is connected to the first end of the atomizer, and the other end of which is immersed in the sample liquid in the sample container;

[0010] A gas spray gun, which is spaced from the second end of the atomizer and is used to spray gas to purge the second end of the atomizer, so that the pollutants in the atomizer enter the sample container through the sample tube under the purging action of the gas.

[0011] In some embodiments of the present application, a sealing film is further included. The atomizer has an argon inlet end, and the sealing film is used to block the argon inlet end.

[0012] In some embodiments of the present application, the following are further included:

[0013] An image acquisition unit for acquiring bubble data, where the bubble data includes the number of bubbles generated in the sample container within a preset time;

[0014] An analysis and processing unit, electrically connected to the image acquisition unit, for calculating the generation rate of bubbles in the sample container according to the bubble data, and calculating the purging rate of the gas spray gun according to the generation rate of the bubbles.

[0015] In some embodiments of the present application, the plasma mass spectrometer includes an inductively coupled plasma mass spectrometer.

[0016] In some embodiments of the present application, the pollutant includes iron ions.

[0017] In some embodiments of the present application, the sample liquid includes ultrapure water.

[0018] In some embodiments of the present application, the gas includes nitrogen or an inert gas.

[0019] In some embodiments of the present application, the distance between the gas spray gun and the second end of the atomizer is greater than 2 cm, the purging duration of the gas spray gun on the second end of the atomizer is greater than 10 min, and the purging pressure of the gas spray gun on the second end of the atomizer is greater than 5 bar.

[0020] In some embodiments of the present application, a cleaning liquid providing unit is further included, which is used to provide cleaning liquid to the second end of the atomizer to flush the atomizer after the purging is completed.

[0021] In some embodiments of the present application, the cleaning liquid includes hydrofluoric acid.

[0022] According to the cleaning device of the embodiments of the present application, the second end of the atomizer is purged by the gas sprayed by the gas spray gun, so that the residual pollutants in the atomizer can enter the sample liquid in the sample container through the sample tube under the purging action of the gas, thereby effectively removing the residual pollutants in the atomizer, avoiding interference with subsequent test results, and ensuring the accuracy and reliability of the test data. Description of the Drawings

[0023] The following drawings of the present application are used as part of the present application to understand the present application. The embodiments of the present application shown in the drawings and their descriptions are used to explain the principle of the present application.

[0024] Figure 1 The structural schematic diagram of a cleaning device connected to an atomizer according to an embodiment of the present application is shown.

[0025] Figure 2 The structural schematic diagram of a cleaning device connected to an atomizer according to another embodiment of the present application is shown.

[0026] Figure 3 The total iron background diagram in the atomizer after cleaning the atomizer in the related art and the present application is shown. Detailed implementation manners

[0027] In the following description, numerous specific details are given to provide a more thorough understanding of the present application. However, it is obvious to those skilled in the art that the present application may be implemented without one or more of these details. In other examples, some well-known technical features are not described to avoid confusion with the present application.

[0028] It should be understood that the present application can be implemented in different forms and should not be construed as limited to the embodiments presented herein. On the contrary, providing these embodiments will make the disclosure thorough and complete, and will fully convey the scope of the present application to those skilled in the art. In the drawings, the dimensions and relative dimensions of layers and regions may be exaggerated for clarity. The same reference numerals denote the same elements throughout.

[0029] It should be understood that when an element or layer is referred to as "on", "adjacent to", "connected to" or "coupled to" another element or layer, it can be directly on, adjacent to, connected or coupled to the other element or layer, or there may be intervening elements or layers. In contrast, when an element is referred to as "directly on", "directly adjacent to", "directly connected to" or "directly coupled to" another element or layer, there are no intervening elements or layers. It should be understood that although the terms first, second, third, etc. may be used to describe various elements, components, regions, layers and / or parts, these elements, components, regions, layers and / or parts should not be limited by these terms. These terms are only used to distinguish one element, component, region, layer or part from another element, component, region, layer or part. Thus, without departing from the teachings of the present application, the first element, component, region, layer or part discussed below may be denoted as the second element, component, region, layer or part.

[0030] Spatial relationship terms such as "under", "below", "beneath", "underneath", "above", "over", etc. may be used herein for convenience of description to describe the relationship of one element or feature shown in the figures with other elements or features. It should be understood that, in addition to the orientation shown in the figures, spatial relationship terms are also intended to include different orientations of the device in use and operation. For example, if the device in the drawings is flipped, then an element or feature described as "under other elements" or "beneath them" or "underneath them" will be oriented "above" the other elements or features. Thus, the exemplary terms "under" and "beneath" can include both an upper and a lower orientation. The device may be otherwise oriented (rotated 90 degrees or other orientations) and the spatial descriptors used herein are to be interpreted accordingly.

[0031] The purpose of the terms used herein is only to describe specific embodiments and is not a limitation of the present application. As used herein, the singular forms "a", "an" and "the" are also intended to include the plural forms unless the context clearly dictates otherwise. It should also be understood that the terms "comprising" and / or "including", when used in this specification, specify the presence of the stated features, integers, steps, operations, elements and / or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components and / or groups. As used herein, the term "and / or" includes any and all combinations of the associated listed items.

[0032] In the related art, when using a hydrofluoric acid solution to rinse an atomizer, since the tube diameter of the atomizer is very thin, pollutants are adsorbed inside the tube diameter and are very difficult to be washed off. For example, usually, it takes more than 2 hours of cleaning for the total Fe background to return to the range required by the specification (the range required by the specification is Fe Count Spec and below).

[0033] To solve at least one of the above technical problems, the present application provides a cleaning device for cleaning an atomizer of a plasma mass spectrometer. The cleaning device includes: a sample container containing a sample liquid; a sample tube, one end of the sample tube is connected to the first end of the atomizer, and the other end of the sample tube is immersed in the sample liquid in the sample container; a gas spray gun, spaced from the second end of the atomizer, for spraying gas to purge the second end of the atomizer, so that pollutants in the atomizer enter the sample container through the sample tube under the purging action of the gas.

[0034] According to the cleaning device of the present application, gas is ejected through a gas spray gun to purge the second end of the atomizer, so that the residual contaminants in the atomizer can enter the sample liquid in the sample container through the sample tube under the purging action of the gas, thereby effectively removing the residual contaminants in the atomizer, avoiding interference with subsequent test results, and ensuring the accuracy and reliability of test data.

[0035] To fully understand the present application, detailed steps and structures will be presented in the following description to illustrate the technical solutions proposed by the present application. The preferred embodiments of the present application are described in detail below. However, in addition to these detailed descriptions, the present application may have other implementation manners.

[0036] Reference is made below to Figures 1 to 2 Describe a cleaning device according to an embodiment of the present application. The cleaning device is used to clean the atomizer 200 of a plasma mass spectrometer. The cleaning device includes: a sample container 110, in which a sample liquid is contained; a sample tube 120, one end of the sample tube 120 is connected to the first end of the atomizer 200, and the other end of the sample tube 120 is immersed in the sample liquid in the sample container 110; a gas spray gun 130, which is spaced from the second end of the atomizer 200 and is used to eject gas to purge the second end of the atomizer 200, so that the contaminants in the atomizer 200 can enter the sample container 110 through the sample tube 120 under the purging action of the gas.

[0037] Specifically, during the process of testing metal ions on the surface of a wafer using a plasma mass spectrometer, high-concentration contaminants are likely to remain in the atomizer 200. In this embodiment, after the testing of metal ions on the surface of the plasma mass spectrometer wafer is completed, one end of the sample tube 120 can be connected to the first end of the atomizer 200, and the other end of the sample tube 120 can be immersed in the sample liquid in the sample container 110. Then, gas is ejected through the gas spray gun 130 spaced from the second end of the atomizer 200 to purge the second end of the atomizer 200, so that the residual contaminants in the atomizer 200 can enter the sample liquid in the sample container 110 through the sample tube 120 under the purging action of the gas, thereby effectively removing the residual contaminants in the atomizer 200, avoiding interference with subsequent test results, and ensuring the accuracy and reliability of test data.

[0038] At the same time, this cleaning method is simple to operate, has a low cost, and will not cause any damage to the plasma mass spectrometer, and has high practical value and promotional significance. In addition, by collecting the residual contaminants into the sample liquid, it is also convenient for further analysis and processing thereof in the future, providing strong support for the source analysis and control of metal ion contamination on the surface of the wafer.

[0039] In some embodiments, the plasma mass spectrometer can be an inductively coupled plasma mass spectrometer, a quadrupole plasma mass spectrometer, a high-resolution sector magnetic field plasma mass spectrometer, a time-of-flight plasma mass spectrometer, an ion trap plasma mass spectrometer, etc., and this is not limited herein.

[0040] In some embodiments, the contaminants remaining in the nebulizer 200 can include metal ions, particulate matter, organic substances, etc., and this is not limited herein.

[0041] Among them, the metal ions can include iron ions, copper ions, nickel ions, lead ions, etc., and this is also not limited herein.

[0042] In some embodiments, a cleaning liquid providing unit is further included, which is configured to provide a cleaning liquid to the second end of the nebulizer 200 to flush the nebulizer 200 after the purging is completed.

[0043] After the gas gun 130 ejects gas to purge the second end of the nebulizer 200, the nebulizer 200 can be further flushed with the cleaning liquid to further remove the contaminants remaining in the nebulizer 200.

[0044] In this embodiment, since the second end of the nebulizer 200 is purged with gas ejected by the gas gun 130 before flushing the nebulizer 200 with the cleaning liquid, only a short-time flushing with the cleaning liquid is required to effectively remove the contaminants remaining in the nebulizer 200 within a short time, so that the total background of the contaminants is restored to the range required by the specification, avoiding interference with subsequent test results and ensuring the accuracy and reliability of the test data.

[0045] Among them, the cleaning liquid can be hydrofluoric acid with a concentration of 5%, or hydrofluoric acid with any other suitable concentration or other types of cleaning liquids, and this application is not limited thereto.

[0046] Exemplarily, after the gas gun 130 ejects gas to purge the second end of the nebulizer 200, taking the example of using hydrofluoric acid with a concentration of 5% to flush the nebulizer 200 to remove the iron ions remaining in the nebulizer 200, as Figure 3As shown, first, during the purging stage, gas is ejected from the gas spray gun 130 to purge the second end of the atomizer 200 for a certain period of time. Then, it only needs to use hydrofluoric acid with a concentration of 5% to rinse the atomizer 200 for a short time, and the total background number of iron ions in the atomizer 200 can be restored to within the range required by the specification. In the related art, when directly using a hydrofluoric acid solution to rinse the atomizer 200, it takes more than 2 hours of cleaning for the total background number of iron ions in the atomizer 200 to be restored to within the range required by the specification. Compared with the prior art, this embodiment can save more than 70% of the cleaning time, has a high cleaning efficiency, and significantly improves the normal operation time of the inductively coupled plasma mass spectrometer.

[0047] In some embodiments, the sample liquid contained in the sample container 110 can be ultrapure water. Ultrapure water, also known as high-purity water, refers to water in which the conductive medium in the water is almost completely removed, and the colloidal substances, gases, and organic substances that do not dissociate in the water are also removed to a very low level. At present, there is no unified standard definition for ultrapure water, but generally speaking, its resistivity can reach 18.2 MΩ·cm (25 °C), the total organic carbon (TOC) content is extremely low, usually less than 5 ppb, and impurities such as bacteria and particles are almost zero.

[0048] Due to the extremely high purity of ultrapure water, which contains almost no impurities and metal ions, it is possible to avoid contamination of the atomizer 200 by the sample liquid itself.

[0049] Moreover, ultrapure water has good stability and does not chemically react with the residual contaminants in the atomizer 200, thus ensuring that the contaminants purged into the sample container 110 can stably exist in the sample liquid, facilitating subsequent analysis and processing.

[0050] Furthermore, ultrapure water has good fluidity and can quickly carry away the purged contaminants, improving the removal efficiency. At the same time, its good solubility also enables it to better accommodate and dilute the contaminants, reduce the concentration of the contaminants, and reduce the impact on the environment.

[0051] Finally, using ultrapure water has a relatively low cost and is easily obtainable. This makes the method highly feasible and economical in practical applications and can be widely applied in fields such as the testing of metal ions on the surface of wafers.

[0052] In some embodiments, the material of the sample container 110 is not limited. For example, it can be made of PFA plastic (perfluoroalkoxy alkane), FEP plastic (fluorinated ethylene propylene copolymer), or any other material that meets the requirements, and no limitation is imposed on this.

[0053] In some embodiments, the gas ejected from the gas spray gun 130 can include nitrogen or inert gas.

[0054] Specifically, nitrogen or inert gases have relatively stable chemical properties. During the purging process, they will not chemically react with the contaminants remaining in the atomizer 200, ensuring that the original properties of the contaminants are not changed, which is conducive to subsequent accurate analysis and treatment of the contaminants.

[0055] Moreover, nitrogen or inert gases generally do not have reactivity and will not cause corrosion or damage to the atomizer 200 itself. This helps to extend the service life of the atomizer 200 and reduce the equipment maintenance cost.

[0056] In addition, nitrogen or inert gases have good fluidity and can purge the atomizer 200 evenly, ensuring that the contaminants in all parts can be effectively removed, improving the purging effect and efficiency.

[0057] Furthermore, nitrogen or inert gases are usually non-toxic and harmless, and will not pose a threat to the health and safety of operators during use, nor will they cause environmental pollution, meeting the environmental protection requirements.

[0058] In addition, in order to ensure the removal effect of the contaminants, the purity of the gas can also be limited. Taking nitrogen purging as an example, the purity of nitrogen can be above 5N.

[0059] In some embodiments, the spacing distance between the gas spray gun 130 and the second end of the atomizer 200 is greater than a preset distance. Wherein, the preset distance can be set according to the actual situation and is not limited thereto. Exemplarily, the preset distance can be 2 cm.

[0060] By setting a certain spacing distance between the gas spray gun 130 and the second end of the atomizer 200, on the one hand, the set spacing can avoid physical damage that may be caused by the direct contact between the gas spray gun 130 and the atomizer 200. The atomizer 200 is usually relatively precise, and direct contact may cause it to deform or be damaged, affecting its normal working performance and service life, while setting the spacing can effectively protect the structural integrity of the atomizer 200. On the other hand, an appropriate spacing can provide a certain buffer space for the purging gas before it reaches the atomizer 200, so that the gas can act on the second end of the atomizer 200 more evenly. This can ensure a more comprehensive and stable purging effect, avoiding incomplete removal of residual contaminants or adverse effects on the atomizer 200 due to excessive or too small local gas pressure.

[0061] In addition, the existence of the spacing also provides a certain safety distance for the operator during the purging operation, reducing the risk of accidents caused by improper operation. At the same time, it is also convenient to observe the situation during the purging process, so as to adjust the purging parameters in time and improve the controllability and accuracy of the entire operation.

[0062] In some embodiments, the purging duration of the gas spray gun 130 on the second end of the atomizer 200 is greater than a preset duration. The preset duration can be set according to the actual situation and is not limited herein. Exemplarily, the preset duration can be 10 minutes ( Figure 3 In the purging stage is 30 minutes, which can include 10 minutes of startup and shutdown time, 10 minutes of purging duration, and 10 minutes of atomizer disassembly and assembly time).

[0063] In this embodiment, by making the purging duration of the gas spray gun 130 on the second end of the atomizer 200 greater than the preset duration, on the one hand, residual contaminants can be fully removed. For stubborn contaminants in the atomizer 200, short-term purging may not be able to completely remove them. Extending the purging time beyond the preset duration can ensure that even contaminants with strong adsorption force and hidden in the complex structure inside the atomizer 200 can gradually detach and be discharged under the continuous action of gas purging, thereby minimizing the amount of residual contaminants to provide a cleaner environment for subsequent testing and analysis. On the other hand, the thoroughness of cleaning can be improved. Longer purging time allows the gas to more fully contact all parts of the atomizer 200, including some hard-to-reach corners and crevices. This can ensure that the entire interior of the atomizer 200 can be effectively cleaned, avoiding local residues and improving the thoroughness and uniformity of cleaning.

[0064] Moreover, thoroughly removing the contaminants in the atomizer 200 can reduce the corrosion and damage of these contaminants to the internal components of the atomizer 200. In the long run, this helps to maintain the good performance of the atomizer 200, extend its service life, and reduce the equipment maintenance cost and replacement frequency.

[0065] In some embodiments, the purging pressure of the gas spray gun 130 on the second end of the atomizer 200 is greater than a preset pressure. The preset pressure can be set according to the actual situation and is not limited herein. Exemplarily, the preset pressure can be 5 bar.

[0066] In this embodiment, by making the purging pressure of the gas spray gun 130 on the second end of the atomizer 200 greater than the preset pressure, on the one hand, the purging intensity can be enhanced. The higher pressure enables the purging gas to impact the inside of the atomizer 200 with greater kinetic energy. For those contaminants tightly adhering to the inner wall of the atomizer 200 or in narrow channels, they can be more effectively stripped and pushed towards the sample tube 120, thereby improving the removal efficiency of the contaminants. In some complex atomizer 200 structures, there may be various resistance factors, such as curved channels, fine pores, etc. The larger purging pressure can better overcome these resistances, ensuring that the gas can smoothly reach all parts of the atomizer 200 and achieving a comprehensive purging effect. That is to say, high-pressure purging can more thoroughly remove the contaminants, enabling the atomizer 200 to reach a higher cleanliness standard. On the other hand, the purging time can be shortened. Due to the large pressure, the flow rate of the gas is accelerated, and the purging of the atomizer 200 can be completed in a shorter time.

[0067] In some embodiments, such as Figure 1 shown, it further includes a sealing film 140. The atomizer 200 has an argon inlet end, and the sealing film 140 is used to block the argon inlet end.

[0068] First of all, the sealing film 140 can prevent external impurities from entering. If the argon inlet end is not blocked, dust, tiny particles, and possible contaminants in the air may enter the inside of the atomizer 200 through this inlet end. After using the sealing film 140 to block it, these external impurities can be effectively blocked, keeping the inside of the atomizer 200 clean.

[0069] Secondly, the sealing film 140 can maintain the stable state inside the atomizer 200. If the argon inlet end is in an open state, when the gas spray gun 130 sprays gas to purge the second end of the atomizer 200, a part of the gas entering the atomizer 200 will be discharged from the argon inlet end, affecting the purging effect on the atomizer 200. By blocking with the sealing film 140, the relative stability inside the atomizer 200 can be maintained, enabling the gas entering the atomizer 200 to be discharged only from the first end of the atomizer 200 and purging the contaminants in the atomizer 200 into the sample liquid in the sample container 110.

[0070] Furthermore, the sealing film 140 can protect the argon inlet end. The sealing film 140 can, to a certain extent, protect the argon inlet end from physical damage, such as collision, scratching, etc. This helps to extend the service life of the argon inlet end and ensure that it can function properly when it needs to be connected to an argon gas source for work.

[0071] In some embodiments, such as Figure 2As shown, it further includes: an image acquisition unit for acquiring bubble data, where the bubble data includes the number of bubbles generated in the sample container 110 within a preset time; an analysis and processing unit electrically connected to the image acquisition unit for calculating the bubble generation rate in the sample container 110 based on the bubble data and calculating the purging rate of the gas gun 130 based on the bubble generation rate.

[0072] Among them, the image acquisition unit can be a camera, etc., and the analysis and processing unit can be a central processing unit (CPU), a graphics processing unit (GPU), a digital signal processor (DSP), a field programmable gate array (FPGA), an application specific integrated circuit (ASIC), etc., and no limitation is imposed thereon.

[0073] It can be understood that when the gas gun 130 sprays gas to purge the second end of the atomizer 200, so that the residual contaminants in the atomizer 200 enter the sample liquid in the sample container 110 through the sample tube 120 under the purging action of the gas, bubbles will be generated in the sample container 110. By observing the bubble generation rate, the purging rate of the gas gun 130 can be determined, so that when the purging rate of the gas gun 130 is too small or too large, the purging rate can be adjusted accordingly to keep the purging rate within a suitable range, thereby ensuring the purging effect on the residual contaminants in the atomizer 200.

[0074] Generally, the bubble generation rate can be directly observed by the naked eye. The bubble generation rate has a positive correlation with the purging rate of the gas gun 130. The faster the bubble generation rate, the faster the purging rate of the gas gun 130.

[0075] However, it is easy to have errors in visual observation. Therefore, in this embodiment, an image acquisition unit is set to acquire bubble data, and then the analysis and processing unit analyzes and processes the bubble data acquired by the image acquisition unit to determine the bubble generation rate in the sample container 110 and the purging rate of the gas gun 130, providing data support for the purging process of the gas gun 130 to achieve the best purging effect on the residual contaminants in the atomizer 200.

[0076] According to another aspect of the present application, a cleaning method for the atomizer 200 of a plasma mass spectrometer is provided, and this cleaning method can be implemented by using the above cleaning device. The cleaning method may include the following steps:

[0077] Step S21: Connect one end of the sample tube 120 to the first end of the atomizer 200, and immerse the other end of the sample tube 120 in the sample liquid in the sample container 110;

[0078] Step S22: Set the gas gun 130 at an interval from the second end of the atomizer 200;

[0079] In step S23, the gas spray gun 130 sprays gas to purge the second end of the atomizer 200, so that the pollutants in the atomizer 200 enter the sample container 110 through the sample tube 120 under the purging action of the gas.

[0080] In some embodiments, before step S23, it further includes the step of sealing the argon inlet end of the atomizer 200 with a sealing film 140.

[0081] In some embodiments, after step S23, it further includes the steps of collecting bubble data, calculating the rate of bubble generation in the sample container 110 based on the bubble data, and calculating the purging rate of the gas spray gun 130 based on the rate of bubble generation. Wherein, the bubble data includes the number of bubbles generated in the sample container 110 within a preset time.

[0082] In some embodiments, after step S23, it further includes the step of providing a cleaning liquid to the second end of the atomizer 200 to rinse the atomizer 200 after the purging is completed.

[0083] In some embodiments, the sample liquid includes ultrapure water.

[0084] In some embodiments, the gas includes nitrogen or an inert gas.

[0085] In some embodiments, the spacing distance between the gas spray gun 130 and the second end of the atomizer 200 is greater than a preset distance.

[0086] In some embodiments, the purging duration of the gas spray gun 130 on the second end of the atomizer 200 is greater than a preset duration.

[0087] In some embodiments, the purging pressure of the gas spray gun 130 on the second end of the atomizer 200 is greater than a preset pressure.

[0088] In some embodiments, the plasma mass spectrometer includes an inductively coupled plasma mass spectrometer.

[0089] In some embodiments, the pollutants include iron ions.

[0090] In some embodiments, the cleaning liquid includes hydrofluoric acid.

[0091] In summary, according to the cleaning device of the embodiments of the present application, the gas spray gun sprays gas to purge the second end of the atomizer, so that the residual pollutants in the atomizer can enter the sample liquid in the sample container through the sample tube under the purging action of the gas, thereby effectively removing the residual pollutants in the atomizer, avoiding interference with subsequent test results, and ensuring the accuracy and reliability of the test data.

[0092] Although example embodiments have been described herein with reference to the accompanying drawings, it should be understood that the above example embodiments are merely exemplary and are not intended to limit the scope of the present application thereto. Those of ordinary skill in the art can make various changes and modifications therein without departing from the scope and spirit of the present application. All such changes and modifications are intended to be included within the scope of the present application as claimed in the appended claims.

[0093] Similarly, it should be understood that, in order to streamline the present application and assist in understanding one or more of the various aspects of the application, in the description of the exemplary embodiments of the present application, the various features of the present application are sometimes grouped together into a single embodiment, figure, or description thereof. However, the methods of the present application should not be construed as reflecting an intention that the claimed present application requires more features than are expressly recited in each claim. Rather, as reflected by the corresponding claims, the point of the application is that the corresponding technical problems can be solved with fewer features than all the features of a single disclosed embodiment. Thus, the claims following the detailed description are hereby expressly incorporated into the detailed description, where each claim stands on its own as a separate embodiment of the present application.

[0094] In addition, those skilled in the art will appreciate that although some of the embodiments described herein include certain features included in other embodiments but not others, combinations of features of different embodiments are meant to be within the scope of the present application and form different embodiments. For example, in the claims, any one of the claimed embodiments can be used in any combination.

[0095] It should be noted that the above embodiments illustrate rather than limit the present application, and those skilled in the art can design alternative embodiments without departing from the scope of the appended claims. In the claims, any reference signs placed between parentheses shall not be construed as limiting the claim. The use of the words first, second, and third, etc. does not denote any order. These words can be interpreted as names.

Claims

1. A cleaning device, characterized in that, For cleaning the nebulizer of an inductively coupled plasma mass spectrometer, the cleaning device comprises: A sample container which contains a sample liquid; A sample tube, one end of which is connected to the first end of the nebulizer, and the other end of which is immersed in the sample liquid in the sample container; A gas spray gun which is arranged at an interval from the second end of the nebulizer and is used for spraying gas to purge the second end of the nebulizer, so that pollutants in the nebulizer enter the sample container through the sample tube under the purging action of the gas.

2. The cleaning device according to claim 1, characterized in that, It further comprises a sealing film, and the nebulizer has an argon inlet end, and the sealing film is used for sealing the argon inlet end.

3. The cleaning device according to claim 1, characterized in that It further comprises: An image acquisition unit which is used for acquiring bubble data, and the bubble data includes the number of bubbles generated in the sample container within a preset time; An analysis and processing unit which is electrically connected to the image acquisition unit and is used for calculating the generation rate of bubbles in the sample container according to the bubble data and calculating the purging rate of the gas spray gun according to the generation rate of the bubbles.

4. The cleaning device according to claim 1, characterized in that The inductively coupled plasma mass spectrometer includes an inductively coupled plasma mass spectrometer.

5. The cleaning device according to claim 1, wherein The pollutants include iron ions.

6. The cleaning device according to claim 1, wherein, The sample liquid includes ultrapure water.

7. The cleaning device according to claim 1, wherein The gas includes nitrogen or an inert gas.

8. The cleaning device according to claim 1, characterized in that, The interval distance between the gas spray gun and the second end of the nebulizer is greater than 2 cm, the purging duration of the gas spray gun for the second end of the nebulizer is greater than 10 min, and the purging pressure of the gas spray gun for the second end of the nebulizer is greater than 5 bar.

9. The cleaning device according to claim 1, characterized in that, It further comprises a cleaning liquid providing unit which is used for providing cleaning liquid to the second end of the nebulizer to rinse the nebulizer after the purging ends.

10. The cleaning device according to claim 9, characterized in that, The cleaning liquid includes hydrofluoric acid.

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