Feeding machine with substrate warping detection function

Abstract

The utility model provides a feeding machine with a substrate warping detection function, and belongs to the field of semiconductors. The feeding machine with the substrate warping detection function comprises a conveying mechanism. And the height detection device is installed on the conveying mechanism and used for measuring the thickness of the substrate assembly in the longitudinal direction and outputting measurement data. And the control equipment is connected to the conveying mechanism and the height detection device and is used for receiving the measurement data, analyzing and judging the measurement data and outputting a control instruction to the conveying mechanism. According to the utility model, the height detection device is arranged, so that the thickness of the substrate assembly can be detected, and the condition of material mixing can be avoided. Meanwhile, whether the substrate assembly is warped or not can be judged. Therefore, the problem that welding fails during welding due to the fact that the substrate assembly is not installed well can be avoided. The influence on the welding process is avoided, and the product quality is also improved.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductors, and particularly relates to a loading machine with a function of detecting substrate warpage. Background Art

[0002] Chip reflow soldering is a common soldering process used in electronic manufacturing and electronic assembly. It is mainly used to assemble chips onto circuit boards. The name "reflow soldering" comes from two main steps in the soldering process: hot air "reflow" and cooling. Preparation: First, the chip is attached to the designated position on the substrate. In this step, an adhesive is usually used for temporary bonding. Heating stage: The entire substrate with the chips attached is placed in a reflow soldering furnace, which usually includes multiple independently controlled heating zones. In the heating stage, the heating wire temperature blows heat onto the product through a fan, causing the solder balls inside the chip to reach the melting point. After the solder balls melt, they are soldered to the substrate. Cooling stage: The substrate is transported to a cooler area, and the solder joints are solidified to complete the solidification. The flip-chip bonding process includes processes such as chip bonding, loading, reflow soldering, and unloading. In the prior art, in the loading process step, a substrate with a carrier is usually transferred to a chip mounter through a loading machine with a function of detecting substrate warpage. The chip mounter completes chip bonding, and then it is transferred to the reflow soldering for soldering.

[0003] With the continuous evolution of advanced packaging technologies, the industry trend is gradually towards achieving more complex heterogeneous integration, carrying larger-scale packaging carriers, manufacturing thinner chips, and meeting more innovative packaging requirements. In this context, the bonding accuracy and stability requirements for packaging technologies such as chiplet, 2.5D, and 3D are becoming increasingly strict. However, when the chip is in reflow soldering, the circuit board carrying the electronic components is fixed through a carrier and a pressure plate. When the carrier is connected to the pressure plate, a card slot is set on the surface of the carrier, and a clamping block is set on one side of the pressure plate. The carrier and the pressure plate are fixedly connected by clamping the clamping block into the card slot. However, when the clamping block fails to be inserted into the card slot, it is easy to cause the pressure plate to warp, resulting in the pressure plate falling back during chip bonding, leading to chip soldering failure problems, and further affecting the bonding process and final quality of the product. When using the existing loading machine with a function of detecting substrate warpage to transport the substrate assembly, it is necessary to manually judge whether the substrate assembly is installed in place. However, human misoperation or human judgment errors will also cause the problem that the substrate assembly is not assembled in place.

[0004] It should be noted that the information disclosed in the background art part of this utility model is only intended to deepen the understanding of the general background technology of this utility model, and should not be regarded as an admission or any form of suggestion that this information constitutes the prior art known to those skilled in the art. Summary of the Utility Model

[0005] The purpose of the present utility model is to provide a loading machine with a function of detecting the warping of a substrate, so as to solve the problem of the warping of the pressing plate caused by the unassembled substrate.

[0006] To solve the above technical problems, the present utility model provides a loading machine with a function of detecting the warping of a substrate, including:

[0007] A conveying mechanism for conveying a substrate assembly;

[0008] A height detection device installed on the conveying mechanism for measuring the thickness of the substrate assembly in the longitudinal direction and outputting measurement data;

[0009] A control device connected to the conveying mechanism and the height detection device for receiving the measurement data, analyzing and judging the measurement data, and outputting a control instruction to the conveying mechanism.

[0010] Preferably, a plurality of the height detection devices are provided, and the plurality of height detection devices are distributed along the moving direction of the substrate assembly.

[0011] Preferably, the plurality of height detection devices are distributed along one side of the conveying mechanism.

[0012] Preferably, the plurality of height detection devices are distributed along both sides of the conveying mechanism.

[0013] Preferably, the substrate assembly includes:

[0014] A substrate;

[0015] A carrier for carrying the substrate;

[0016] A pressing plate clamped with the carrier to limit the substrate between the pressing plate and the carrier.

[0017] Preferably, the loading machine with a function of detecting the warping of a substrate further includes:

[0018] A placement box provided with several layers for placing the substrate assembly;

[0019] A placement table for carrying the placement box;

[0020] A lifting device connected to the placement table for driving the placement table to move in the longitudinal direction, and the longitudinal direction is perpendicular to the moving direction of the substrate assembly.

[0021] Preferably, the placement box includes a moving part and a placement part, and a plurality of placement parts are provided for carrying the substrate assembly, and the plurality of placement parts are arranged along the longitudinal direction of the moving part.

[0022] Preferably, the loading machine with a function of detecting the warping of a substrate further includes:

[0023] A pushing mechanism, which is slidably connected to the placing box, and the reciprocating movement direction of the pushing mechanism is the same as the movement direction of the substrate assembly.

[0024] Preferably, the control device includes a judgment module, which is used to compare the data measured by the height detection device with the preset thickness data of the substrate assembly, or the judgment module is used to compare and judge the magnitudes of the data measured by the height detection device multiple times.

[0025] Preferably, the loading machine with the function of detecting substrate warping further includes:

[0026] An indicator light, which is connected to the control device and is used to receive the signal output by the control device. When the data measured by the height detection device is inconsistent with the preset thickness data of the substrate assembly, or when the data measured by the height detection device multiple times is inconsistent, the indicator light lights up and gives an alarm.

[0027] Compared with the prior art, the loading machine with the function of detecting substrate warping of the present invention has the following advantages:

[0028] By setting a height detection device, the present invention can detect the thickness of the substrate assembly, and the control device can compare the measured data with the preset thickness data of the substrate assembly. Or, the control device compares and judges the magnitudes of the data measured multiple times. If the data measured multiple times is inconsistent, it means that the substrate assembly is abnormal. This can not only avoid the situation of material mixing. At the same time, it can also judge whether the substrate assembly has warping problems. Thereby, it can avoid the problem of welding failure caused by improper installation of the substrate assembly. It avoids affecting the welding process and improves the product quality. Description of the Drawings

[0029] Figure 1 is a schematic structural diagram of a substrate assembly in an embodiment of the present invention;

[0030] Figure 2 is a schematic structural diagram of a loading machine with the function of detecting substrate warping in an embodiment of the present invention;

[0031] In the figure,

[0032] 1 - carrier; 2 - substrate;

[0033] 3 - pressing plate; 4 - substrate assembly;

[0034] [[ID=3८]]5 - placing box; 6 - lifting device;

[0035] [[ID=५१]]7 - pushing mechanism; 8 - conveying mechanism;

[0036] 9 - first height detector; 10 - second height detector;

[0037] 11 - Discharge inductor; 12 - Indicator light;

[0038] 13 - Placement table. Detailed implementation manner

[0039] To make the objectives, advantages, and features of the present utility model clearer, the following further elaborates on the feeding machine with the function of detecting substrate warping proposed by the present utility model in conjunction with the accompanying drawings and specific embodiments. It should be noted that the accompanying drawings are all in a very simplified form and use non-precise scales, only for conveniently and clearly assisting in explaining the objectives of the embodiments of the present utility model. It should be understood that the drawings in the specification do not necessarily show the specific structure of the present utility model in proportion, and the illustrative features used to explain certain principles of the present utility model in the drawings of the specification will also adopt a slightly simplified drawing method. The specific design features of the present utility model disclosed herein, such as specific dimensions, directions, positions, and shapes, will be partially determined by the specific application and usage environment. Also, in the following described embodiments, sometimes the same reference numerals are used commonly between different drawings to represent the same part or parts with the same function, and the repeated description thereof is omitted. In this specification, similar reference numerals and letters are used to represent similar items. Therefore, once an item is defined in one drawing, it does not need to be further discussed in subsequent drawings.

[0040] In addition, the terms "first" and "second" are only used for descriptive purposes and cannot be construed as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, the features defined with "first" and "second" may explicitly or implicitly include at least one of such features. In the description of the present utility model, the meaning of "a plurality" is at least two, such as two, three, etc., unless otherwise specifically and clearly defined.

[0041] In the description of this specification, the description referring to terms such as "one embodiment", "some embodiments", "example", "specific example", or "some examples" means that the specific features, structures, materials, or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the present utility model. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described can be combined in a suitable manner in any one or more embodiments or examples. In addition, without contradiction, those skilled in the art can combine and combine the different embodiments or examples described in this specification and the features of different embodiments or examples.

[0042] The core idea of the present utility model is to provide a loading machine with the function of detecting substrate warpage, which can measure the thickness of the substrate assembly 4, so as to detect whether the substrate 2 is assembled properly, and avoid the problem of warpage of the substrate assembly 4.

[0043] To achieve the above idea, the present utility model provides a loading machine with the function of detecting substrate warpage. Refer Figures 1 to 2 to a specific implementation manner of a loading machine with the function of detecting substrate warpage disclosed herein. The loading machine with the function of detecting substrate warpage includes: a conveying mechanism 8 for conveying the substrate assembly 4. A height detection device is installed on the conveying mechanism 8 for measuring the thickness of the substrate assembly 4 in the longitudinal direction (i.e., Figure 2 the direction where the arrow a is located in the figure) and outputting the measurement data. A control device (not labeled in the figure) is connected to the conveying mechanism 8 and the height detection device for receiving the measurement data, analyzing and judging the measurement data, and outputting a control instruction to the conveying mechanism 8.

[0044] Among them, refer Figure 1 to the figure, the substrate assembly 4 includes a carrier 1, a substrate 2, and a pressing plate 3. The carrier 1 is used for carrying the substrate 2. The pressing plate 3 is clamped with the carrier 1 to limit the substrate 2 between the pressing plate 3 and the carrier 1. The substrate 2 is an incoming substrate. For a traditional loading machine with the function of detecting substrate warpage, when the carrier 1 is connected to the pressing plate 3, by setting a slot (not shown in the figure) on the surface of the carrier 1 and a clamping block (not shown in the figure) on one side of the pressing plate 3, and clamping the clamping block with the slot, the fixed connection between the carrier 1 and the pressing plate 3 is realized. Thereby, the substrate 2 can be better compacted, reducing the warpage caused by the substrate 2 itself and avoiding affecting the bonding quality. However, when the carrier 1 and the pressing plate 3 are not assembled in place, that is, when the clamping block is not inserted into the slot, it is easy to cause the pressing plate 3 to warp, resulting in the pressing plate 3 falling back during chip bonding, leading to the problem of chip soldering failure, and further affecting the bonding process and final quality of the product. By manually judging whether the substrate 2 is assembled properly, due to human misjudgment or misoperation, it is easy to cause the problem of warpage of the substrate assembly 4. Therefore, it will cause quality problems such as soldering failure of the chip during reflow soldering.

[0045] However, for the loading machine with the function of detecting the warping of the substrate provided in this embodiment, due to the setting of the height detection device, the thickness of the substrate assembly 4 can be detected, and the control device can compare the measured data with the preset thickness data of the substrate assembly 4. Or, the control device compares and judges the magnitudes of the data measured multiple times. If the data measured multiple times are inconsistent, it indicates that the substrate assembly 4 is abnormal. This can not only avoid the situation of material mixing. At the same time, it can also judge whether the substrate assembly 4 has warping problems. Thus, it can avoid the problem of welding failure when welding the substrate assembly 4. It can avoid affecting the welding process and improve the product quality.

[0046] Among them, the conveying mechanism 8 can be a belt conveyor. And the driving device of the belt conveyor is a servo motor, and the servo motor is electrically connected to the control device to achieve automatic control of the belt conveyor. The conveying mechanism 8 can also be an electric guide rail conveying mechanism. As long as it can convey the substrate assembly 4 from the placement table 13 to the reflow soldering equipment for loading. In this embodiment, it is preferred that the conveying mechanism 8 is a belt conveyor. It should be noted that both the belt conveyor and the electric guide rail conveying mechanism are prior arts, and for those skilled in the art, they are already familiar with their specific structural principles, and thus will not be elaborated in detail here.

[0047] The height detection device can be a height detector. In this embodiment, one or more height detectors can be installed. When multiple height detection devices are provided, the multiple height detection devices are distributed along the moving direction of the substrate assembly 4 (i.e., Figure 2 the direction of the arrow b in the figure). The multiple height detection devices are distributed along one side of the conveying mechanism 8. The multiple height detection devices are distributed along both sides of the conveying mechanism 8. The height detection device is fixedly installed on the installation frame of the conveying mechanism 8 and does not move with the conveying mechanism 8. Preferably, two height detectors are installed, the first height detector 9 and the second height detector 10. And the first height detector 9 and the second height detector 10 are symmetrically distributed on both sides of the conveying mechanism 8. The height detection device is used to measure the thickness of the substrate assembly 4 in the longitudinal direction (i.e., Figure 2 the direction of the arrow a in the figure) and output the measured data.

[0048] Among them, the control device can be a controller, a single-chip microcomputer, etc. In this embodiment, preferably, the control device is a controller, and the controller is a PLC controller. The control device can set thickness parameters based on the thickness of the substrate assembly 4. The control device includes a judgment module, and the judgment module is used to compare the data measured by the height detection device with the preset thickness data of the substrate assembly 4, or the judgment module is used to compare and judge the magnitudes of the data measured by the height detection device multiple times. The controller receives the measurement data of the height detection device and compares the measurement data with the set thickness parameters. If the measurement data is inconsistent with the set thickness parameters, it indicates that there is an abnormality in the substrate assembly 4 and adjustment is required. Or, the controller compares and judges the magnitudes of the data measured by the height detector multiple times. If the data measured multiple times is inconsistent, it indicates that there is an abnormality in the substrate assembly 4 and adjustment is required. The height detector can be electrically connected to the controller. The height detector transmits the collected data to the controller through an electrical signal. After analysis and judgment by the controller, a control instruction is issued.

[0049] Exemplarily, the loading machine with the function of detecting substrate warpage further includes: a placement table 13, a placement box 5, a lifting device 6, and a pushing mechanism 7. The placement box 5 is provided with several layers for placing the substrate assembly 4. The placement box 5 includes a moving part and a placement part. There are several placement parts for carrying the substrate assembly 4. The placement parts are evenly arranged along the longitudinal direction of the moving part. Both the moving part and the placement part can be plate-shaped structures. The placement part can also be a box-shaped structure, and along the direction in which the moving component moves, both sides of the box-shaped structure are open, so as to facilitate pushing the substrate assembly 4 out of the placement part. The placement table 13 is used to carry the placement box 5. The placement table 13 can be made of materials such as stainless steel and plastic. And the placement table 13 can be of any shape.

[0050] The lifting device 6 is connected to the placement table 13 and is used to drive the placement table 13 to move up and down in the longitudinal direction, and the longitudinal direction is perpendicular to the direction in which the substrate assembly 4 moves. The pushing mechanism 7 is arranged on the installation ground on one side of the placement table 13, and the pushing mechanism 7 is slidably connected to the placement part. The reciprocating movement direction of the pushing mechanism 7 is the same as the movement direction of the substrate assembly 4. The lifting device 6 drives the placement table 13 to move in the longitudinal direction so that the substrate assembly 4 is on the same horizontal plane as the conveying mechanism 8 and the pushing mechanism 7. When the pushing mechanism 7 pushes the substrate assembly 4 to move, the substrate assembly 4 can be pushed to the conveying mechanism 8, and the conveying mechanism 8 conveys the substrate assembly 4 forward, so that feeding of the substrate assembly 4 can be realized.

[0051] The lifting device 6 therein can be devices such as an electric telescopic rod or a screw jack. In this embodiment, preferably, the lifting device 6 is a screw jack. And the driving device of the screw jack is electrically connected to the controller to realize the automatic control of the screw jack by the controller. The pushing mechanism 7 can be devices such as an electric telescopic rod or a hydraulic telescopic rod. The driving device of the pushing mechanism 7 is also electrically connected to the controller to realize the automatic control of the pushing mechanism 7 by the controller. It should be noted that both the lifting device 6 and the pushing mechanism 7 adopt existing technologies. Therefore, for those skilled in the art, they are already familiar with their specific structures and principles. At the same time, the automatic control process of the controller with the lifting device 6 and the pushing mechanism 7 is also well-known.

[0052] Furthermore, the loading machine with the function of detecting substrate warpage further includes an indicator light 12 and a discharge sensor 11. Both the indicator light 12 and the discharge sensor 11 are connected to the controller. The indicator light 12 and the discharge sensor 11 can be electrically connected to the controller. When the data measured by the height detection device is inconsistent with the preset thickness data of the substrate assembly 4, or when the data measured by the height detection device is inconsistent multiple times, the indicator light 12 lights up and gives an alarm. That is, when the controller determines that there is an abnormality in the substrate assembly 4, the controller sends an alarm instruction to the indicator light 12, and the indicator light 12 lights up. When the controller determines that the substrate assembly 4 is normal, the substrate assembly 4 is conveyed out by the conveying mechanism 8 for loading. And when the substrate assembly 4 passes through the discharge sensor 11, the discharge sensor 11 can transmit the sensed discharge signal to the controller.

[0053] When using the loading machine with the function of detecting substrate warpage for loading, first, the substrate assembly 4 is placed in the placement box 5. Then, the controller controls the lifting device 6 to drive the placement table 13 and the placement box 5 to move downward in the longitudinal direction so that the substrate assembly 4 and the pushing mechanism 7 are on the same horizontal plane. The controller controls the pushing mechanism 7 to push the substrate assembly 4 to move, and the substrate assembly 4 is sent to the conveying mechanism 8. During the process of the conveying mechanism 8 driving the substrate assembly 4 to move, the first height detector 9 and the second height detector 10 transmit the measured thickness data of each part of the substrate assembly 4 to the controller. The controller analyzes and judges the transmitted data. If the thickness of the substrate assembly 4 is normal, that is, the substrate assembly 4 is assembled in place, the discharge sensor 11 transmits the sensed signal to the controller. If the thickness of the substrate assembly 4 is abnormal, that is, the substrate assembly 4 is not assembled in place, the controller outputs a control signal, the conveying mechanism 8 stops conveying, the indicator light 12 lights up and gives an alarm. At this time, the staff needs to check and make manual adjustments.

[0054] In summary, the above embodiments have described in detail different configurations of the loading machine with the function of detecting the warping of the substrate. Of course, the above description is only a description of the preferred embodiments of the present invention, and does not limit the scope of the present invention in any way. The present invention includes but is not limited to the configurations listed in the above embodiments. Those skilled in the art can draw inferences from one instance to another based on the content of the above embodiments. Any changes and modifications made by ordinary technicians in the field of the present invention according to the above disclosure are within the protection scope of the claims.

Claims

1. A loading machine with the function of detecting the warping of a substrate, characterized in that, Including: A conveying mechanism for conveying a substrate assembly; A height detection device installed on the conveying mechanism for measuring the thickness of the substrate assembly in the longitudinal direction and outputting measurement data; A control device connected to the conveying mechanism and the height detection device for receiving the measurement data, analyzing and judging the measurement data, and outputting a control instruction to the conveying mechanism.

2. The loading machine with the function of detecting the warping of the substrate according to claim 1, characterized in that, A plurality of the height detection devices are provided, and the plurality of height detection devices are distributed along the moving direction of the substrate assembly.

3. The loading machine with the function of detecting the warping of the substrate according to claim 2, characterized in that, The plurality of height detection devices are distributed along one side of the conveying mechanism.

4. The feeding machine with the function of detecting the warping of the substrate according to claim 2, characterized in that, The plurality of height detection devices are distributed along both sides of the conveying mechanism.

5. The loading machine with the function of detecting the warping of the substrate according to claim 1, characterized in that, The substrate assembly includes: A substrate; A carrier for carrying the substrate; A pressing plate clamped to the carrier to limit the substrate between the pressing plate and the carrier.

6. The loading machine with the function of detecting the warping of the substrate according to claim 1, wherein, The loading machine with the function of detecting substrate warpage further includes: A placement box provided with several layers for placing the substrate assemblies; A placement table for carrying the placement box; A lifting device connected to the placement table for driving the placement table to move in the longitudinal direction, and the longitudinal direction is perpendicular to the moving direction of the substrate assembly.

7. The loading machine with the function of detecting the warping of the substrate according to claim 6, characterized in that, The placement box includes a moving part and a plurality of placement parts for carrying the substrate assemblies, and the plurality of placement parts are arranged along the longitudinal direction of the moving part.

8. The loading machine with the function of detecting the warping of the substrate according to claim 6, wherein, The loading machine with the function of detecting substrate warpage further includes: A pushing mechanism slidably connected to the placement box, and the reciprocating moving direction of the pushing mechanism is the same as the moving direction of the substrate assembly.

9. The loading machine with the function of detecting the warping of the substrate according to claim 1, wherein, The control device includes a judgment module for comparing the data measured by the height detection device with the preset thickness data of the substrate assembly, or the judgment module is used for comparing and judging the magnitudes of the data measured by the height detection device multiple times.

10. The loading machine with the function of detecting the warping of the substrate according to claim 9, characterized in that, The loading machine with the function of detecting substrate warpage further includes: An indicator light connected to the control device for receiving the signal output by the control device. When the data measured by the height detection device is inconsistent with the preset thickness data of the substrate assembly, or when the data measured by the height detection device multiple times is inconsistent, the indicator light lights up and gives an alarm.

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