Cooling device

Abstract

The utility model provides a cooling device which comprises a cabinet body, the cabinet body is provided with a cavity and an opening, the opening is communicated with the cavity, the cavity is provided with a refrigeration cavity and a heat dissipation cavity which are sequentially distributed in the vertical direction, the cabinet body comprises a cover plate, the cover plate is movably arranged at the opening, and the cover plate can open or close the opening; the refrigeration assembly is arranged in the cavity and comprises a semiconductor refrigeration plate, the semiconductor refrigeration plate is provided with a heat absorption end and a heat dissipation end which are oppositely arranged, the semiconductor refrigeration plate is located in the cabinet body and divides a refrigeration cavity and a heat dissipation cavity, the heat absorption end is located in the refrigeration cavity, and the heat dissipation end is located in the heat dissipation cavity; the heat absorption end can absorb heat of an article and transmit the heat to the heat dissipation end. By means of the technical scheme, the problems that in the prior art, a refrigerating device is complex in structure and low in cooling efficiency can be solved.

Description

Technical Field

[0001] The utility model relates to the technical field of cooling, and particularly relates to a cooling device. Background Art

[0002] The cooling of experimental samples refers to the process of rapidly reducing the experimental samples from a high-temperature environment to a preset temperature, which is mainly applied to experimental research in multiple fields such as chemistry, materials, physics, and biology.

[0003] In the prior art, there are also various refrigeration methods for laboratory cooling boxes and cooling cabinets for cooling coal experimental samples, including air-cooling devices, water-cooling devices, compression refrigeration devices, etc. However, these methods often require a large amount of refrigerant, not only with low efficiency but also high refrigeration costs. At the same time, the system structure is relatively complex, the operation and disassembly are cumbersome, and the later maintenance cost is also high. Summary of the Utility Model

[0004] The utility model provides a cooling device to solve the problems of complex structure and low cooling efficiency of the refrigeration device in the prior art.

[0005] The utility model provides a cooling device, which includes: a cabinet body, the cabinet body has a cavity and an opening, the opening is communicated with the cavity, the cavity has a refrigeration cavity and a heat dissipation cavity sequentially distributed in the vertical direction, the cabinet body includes a cover plate, the cover plate is movably arranged at the opening, and the cover plate can open or close the opening; a refrigeration component, arranged in the cavity, the refrigeration component includes a semiconductor refrigeration plate, the semiconductor refrigeration plate has an endothermic end and a heat dissipation end arranged oppositely, the semiconductor refrigeration plate is located in the cabinet body and separates the refrigeration cavity and the heat dissipation cavity, the endothermic end is located in the refrigeration cavity, the heat dissipation end is located in the heat dissipation cavity, and the endothermic end can absorb the heat of an article and transfer the heat to the heat dissipation end.

[0006] Further, there are multiple semiconductor refrigeration plates, the refrigeration component further includes a support frame, the support frame has a plurality of accommodation areas, the semiconductor refrigeration plates are located in the accommodation areas, the plurality of accommodation areas are arranged in one-to-one correspondence with the plurality of semiconductor refrigeration plates, and the support frame is arranged in the cavity and fixedly connected to the cabinet body.

[0007] Further, a boss is annularly arranged at the bottom of the accommodation area, the boss is located inside the accommodation area, and the semiconductor refrigeration plate is located on the boss.

[0008] Further, the cabinet body has a top plate and a bottom plate arranged oppositely, the bottom plate has heat dissipation holes, the heat dissipation holes are communicated with the heat dissipation cavity, the heat dissipation cavity is communicated with the outside through the heat dissipation holes, the top plate has an air outlet, the air outlet is communicated with the refrigeration cavity, the cabinet body is provided with an air inlet, the air inlet is communicated with the refrigeration cavity, and the refrigeration cavity is communicated with the outside through the air inlet and the air outlet.

[0009] Further, the cooling device further includes a blower and a mounting bracket. The mounting bracket is disposed on the top plate, the blower is disposed on the mounting bracket, at least a part of the mounting bracket is located above the air outlet, and the blower is disposed corresponding to the air outlet.

[0010] Further, the mounting bracket includes a mounting base and two legs. The legs have a connecting section and a supporting section arranged in sequence. The connecting section is fixedly connected to the top plate, the supporting section is fixedly connected to the mounting base, the two legs are oppositely arranged on the mounting base, and the blower is disposed on the mounting base.

[0011] Further, the cover plate includes a sliding plate. Two sliding rails are disposed on the cabinet body, and the two sliding rails are correspondingly arranged on both sides of the sliding plate. The two ends of the sliding plate are respectively movably disposed in the two sliding rails to open or close the opening.

[0012] Further, the cover plate further includes a fixing plate. The fixing plate is located above the sliding plate. Two grooves are correspondingly arranged on two adjacent side walls of the cover plate. The extending direction of the grooves is the same as the extending direction of the sliding rails. The two ends of the fixing plate are respectively in snap-fit connection with the two grooves.

[0013] Further, the cabinet body further includes a back plate and two side plates. The back plate, the cover plate and the two side plates are disposed between the top plate and the bottom plate. The back plate, the cover plate and the two side plates are arranged along the edge of the bottom plate. The side plates are disposed between the cover plate and the back plate. The top plate, the bottom plate, the cover plate and the two side plates form a cavity. The side plate has a side wall and a bent section arranged in sequence in the front-back direction. The bent section extends towards the cover plate, and the bent section has a groove.

[0014] Further, a wire groove is further disposed on the top plate, and a wire binding buckle is disposed in the wire groove. The wire groove and the wire binding buckle cooperate to fix the cables in the cooling device.

[0015] Applying the technical solution of the present utility model, the cavity has a refrigeration cavity and a heat dissipation cavity which are sequentially distributed in the vertical direction. The semiconductor refrigeration plate is located in the cabinet body and separates the refrigeration cavity and the heat dissipation cavity. In this way, through the semiconductor refrigeration plate, the two chambers of the refrigeration cavity and the heat dissipation cavity are relatively independent, and it is possible to avoid the mixing disorder of the airflows with different heats in different chambers, which affects the refrigeration effect of the refrigeration cavity or the heat dissipation effect of the heat dissipation cavity. The heat absorption end is located in the refrigeration cavity, and the heat dissipation end is located in the heat dissipation cavity. The heat absorption end can absorb the heat of the article and transfer the heat to the heat dissipation end. The above setting has a simple structure, and there is no need to additionally set a separation component, and the disassembly and replacement are convenient. And in this solution, the article is directly placed on the heat absorption end to directly cool the article, and at the same time, the semiconductor refrigeration plate can also cool the air in the refrigeration cavity, improving the refrigeration effect and refrigeration efficiency of the refrigeration component. Description of the Drawings

[0016] The attached drawings forming a part of this application are used to provide a further understanding of the present utility model. The schematic embodiments of the present utility model and their descriptions are used to explain the present utility model and do not constitute an improper limitation to the present utility model. In the drawings:

[0017] Figure 1 The structural schematic diagram of the cooling device provided by the present utility model is shown.

[0018] Among them, the above-mentioned drawings include the following reference numerals:

[0019] 10, cabinet; 101, cavity;

[0020] 1011, refrigeration chamber; 1012, heat dissipation chamber;

[0021] 12, top plate; 121, air outlet; 122, wire groove;

[0022] 13, bottom plate;

[0023] 14, slide rail;

[0024] 15, cover plate;

[0025] 151, sliding plate; 152, fixing plate;

[0026] 16, back plate;

[0027] 17, side plate; 171, bent section;

[0028] 20, refrigeration component;

[0029] 21, semiconductor refrigeration plate; 22, support frame;

[0030] 30, mounting rack;

[0031] 31, mounting seat;

[0032] 32, support leg; 321, connecting section; 322, supporting section;

[0033] 40, support member;

[0034] 41, fan switch; 42, main switch; 43, fan adjustment knob. Detailed implementation manners

[0035] Next, the technical solutions in the embodiments of the present utility model will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present utility model. Obviously, the described embodiments are only a part of the embodiments of the present utility model, rather than all the embodiments. The following description of at least one exemplary embodiment is actually only illustrative and in no way limits the present utility model and its application or use. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present utility model without creative efforts belong to the scope of protection of the present utility model.

[0036] As Figure 1 shown, an embodiment of the present utility model provides a cooling device, which includes: a cabinet body 10 and a refrigeration component 20. Among them, the cabinet body 10 has a cavity 101 and an opening, the opening is communicated with the cavity 101, the cavity 101 has a refrigeration chamber 1011 and a heat dissipation chamber 1012 that are sequentially distributed in the vertical direction, the cabinet body 10 includes a cover plate 15, the cover plate 15 is movably arranged at the opening, and the cover plate 15 can open or close the opening. The refrigeration component 20 is arranged in the cavity 101, the refrigeration component 20 includes a semiconductor refrigeration plate 21, the semiconductor refrigeration plate 21 has an endothermic end and a heat dissipation end arranged oppositely, the semiconductor refrigeration plate 21 is located in the cabinet body 10 and separates the refrigeration chamber 1011 and the heat dissipation chamber 1012, the endothermic end is located in the refrigeration chamber 1011, the heat dissipation end is located in the heat dissipation chamber 1012, and the endothermic end can absorb the heat of the article and transfer the heat to the heat dissipation end. Among them, the specific position of the opening is not limited. In this embodiment, the opening is arranged on the side wall of the cabinet body 10 and corresponds to the semiconductor refrigeration plate 21, so the operation is convenient.

[0037] Applying the technical solution of the present utility model, the cavity has a refrigeration chamber 1011 and a heat dissipation chamber 1012 that are sequentially distributed in the vertical direction, and the semiconductor refrigeration plate 21 is located in the cabinet body and separates the refrigeration chamber 1011 and the heat dissipation chamber 1012. In this way, through the semiconductor refrigeration plate 21, the two chambers of the refrigeration chamber 1011 and the heat dissipation chamber 1012 are relatively independent, and it is possible to avoid the mixing and disorder of the airflows with different heats in different chambers from affecting the refrigeration effect of the refrigeration chamber 1011 or the heat dissipation effect of the heat dissipation chamber 1012. The endothermic end is located in the refrigeration chamber 1011, the heat dissipation end is located in the heat dissipation chamber 1012, and the endothermic end can absorb the heat of the article and transfer the heat to the heat dissipation end. Using the semiconductor refrigeration plate 21 for refrigeration does not require refrigerants, saves costs, and has less noise. The above settings have a simple structure and do not require additional separation components, and are convenient for disassembly and replacement. And in this solution, the article is directly placed on the endothermic end of the semiconductor refrigeration plate 21 to directly cool the article. The article is in direct contact with the endothermic end, and the cooling effect is good and the cooling rate is relatively fast. At the same time, the semiconductor refrigeration plate 21 can also cool the air in the refrigeration chamber 1011, improving the refrigeration effect and refrigeration efficiency of the refrigeration component.

[0038] Among them, an interface is provided on the semiconductor refrigeration plate 21, and a power socket is provided on the cabinet body 10. The external power supply is connected to the interface on the semiconductor refrigeration plate 21 to be energized. After the power is turned on, electron-hole pairs will be generated near one end of the semiconductor refrigeration plate 21, the internal energy decreases, the temperature drops, and heat is absorbed from the outside, forming the heat absorption end of the semiconductor refrigeration plate 21. At the other end, due to the recombination of electron-hole pairs, the internal energy increases, the temperature rises, and heat is released to the environment, forming the heat dissipation end of the semiconductor refrigeration plate 21. Among them, the temperature of the heat absorption end can reach -20°C to -10°C.

[0039] In this embodiment, the item to be cooled is a coal experimental sample. In other embodiments, the item can also be any sample that needs to be cooled.

[0040] Furthermore, there are multiple semiconductor refrigeration plates 21, and the refrigeration assembly 20 further includes a support frame 22. The support frame 22 has multiple accommodation areas, and the semiconductor refrigeration plates 21 are located in the accommodation areas. The multiple accommodation areas are arranged in one-to-one correspondence with the multiple semiconductor refrigeration plates 21. The support frame 22 is arranged in the cavity 101 and fixedly connected to the cabinet body 10. By setting the support frame 22, stable support can be provided for the semiconductor refrigeration plates 21, and at the same time, the stable placement of the items can be ensured. At the same time, the one-to-one correspondence between the accommodation areas and the semiconductor refrigeration plates 21 enables the multiple semiconductor refrigeration plates 21 to be placed in an orderly manner, which can improve the space utilization rate of the refrigeration assembly, and avoid the stacking of multiple semiconductor refrigeration plates 21 or the waste of space due to too far a distance, resulting in poor cooling effect. Among them, the support frame 22 is made of stainless steel plate.

[0041] Specifically, the support frame 22 is composed of a frame and multiple support bars that are cross-arranged inside the frame. The frame and the multiple support bars cooperate to form multiple accommodation areas. The support frame 22 is fixedly connected to the inner wall of the cabinet body 10 by screws.

[0042] In this application, the number of the semiconductor refrigeration plates 21 is not limited, and can be set to 2, 3, 5, etc., and can be selected according to the actual refrigeration requirements. In this embodiment, the semiconductor refrigeration plates 21 are set to 4 and are connected in series.

[0043] Among them, a convex platform is annularly arranged at the bottom of the accommodation area. The convex platform is located inside the accommodation area, and the semiconductor refrigeration plate 21 is located on the convex platform. Such a structure is simple. The semiconductor refrigeration plate 21 can be directly placed on the convex platform of the corresponding accommodation area, which is convenient for the installation and replacement of the semiconductor refrigeration plate 21. There is no need to additionally set fasteners to fix the semiconductor refrigeration plate 21 on the support frame 22, which simplifies the number of components and the complexity of disassembly and assembly. At the same time, damage to the semiconductor refrigeration plate 21 can also be avoided.

[0044] Specifically, the cabinet body 10 has a top plate 12 and a bottom plate 13 which are oppositely arranged. The bottom plate 13 is provided with heat dissipation holes, and the heat dissipation holes are communicated with the heat dissipation cavity 1012. The heat dissipation cavity 1012 is communicated with the outside through the heat dissipation holes. The top plate 12 is provided with an air outlet 121, and the air outlet 121 is communicated with the refrigeration cavity 1011. An air inlet is arranged on the cabinet body 10, and the air inlet is communicated with the refrigeration cavity 1011. The refrigeration cavity 1011 is communicated with the outside through the air inlet and the air outlet 121. Through the above settings, the air flow in the refrigeration cavity 1011 can form a cycle with the outside air, which can accelerate the flow of cold air in the refrigeration cavity 1011, make the temperature in the refrigeration cavity 1011 more balanced, and avoid local overheating. At the same time, it can accelerate the discharge of hot air, shorten the cooling cycle of the refrigeration cavity 1011, and improve the refrigeration effect and efficiency of the refrigeration cavity 1011.

[0045] In the present application, the position of the air inlet is not limited, as long as it is correspondingly arranged on the side wall of the refrigeration cavity 1011. In this embodiment, the air inlet is arranged on the top plate 12. In other embodiments, the air inlet is arranged on the side wall of the cabinet body 10.

[0046] Among them, the bottom plate 13 has a certain height in the vertical direction, so that it is convenient for hot air to dissipate from the bottom of the cabinet body 10.

[0047] In the present application, the specific structure and quantity of the heat dissipation holes are not limited, as long as the heat dissipation cavity 1012 can be communicated with the outside to achieve heat dissipation. In this embodiment, the bottom plate 13 is a mesh heat dissipation structure, which has good heat dissipation effect and low cost.

[0048] Furthermore, the cooling device further includes a fan and a mounting bracket 30. The mounting bracket 30 is arranged on the top plate 12, the fan is arranged on the mounting bracket 30, at least part of the mounting bracket 30 is located above the air outlet 121, and the fan is correspondingly arranged with the air outlet 121. Through the setting of the fan, the circulation rate of the air flow in the refrigeration cavity 1011 can be accelerated, and the refrigeration effect of the refrigeration cavity 1011 is further improved.

[0049] Specifically, the mounting bracket 30 includes a mounting base 31 and two legs 32. The legs 32 have a connecting section 321 and a supporting section 322 which are arranged in sequence. The connecting section 321 is fixedly connected with the top plate 12, the supporting section 322 is fixedly connected with the mounting base 31, the two legs 32 are oppositely arranged on the mounting base 31, and the fan is arranged on the mounting base 31. In this way, an installation space can be reserved for the fan between the legs 32 and the air outlet 121, avoiding the fan occupying the space in the cavity 101. At the same time, the gap between the legs 32 and the air outlet 121 can accelerate the flow rate of the fluid. Among them, the connecting section 321 and the top plate 12 can be connected by welding. The supporting section 322 and the mounting base 31 are fixedly connected by fasteners.

[0050] Among them, the fan is fixed on the installation end cover, and the installation of the fan is completed by covering the installation end cover on the installation seat 31. Specifically, the fan can be set as a small axial flow fan or a centrifugal fan.

[0051] In this solution, the cover plate 15 includes a sliding plate 151. There are two sliding rails 14 provided on the cabinet body 10, and the two sliding rails 14 are correspondingly arranged on both sides of the sliding plate 151. The two ends of the sliding plate 151 are respectively movably arranged in the two sliding rails 14 to open or close the opening. Through the arrangement of the sliding rails 14, the convenience of opening and closing the sliding plate 151 is improved, and the operation is convenient. And the sliding plate 151 is arranged to be slidably connected with the cabinet body 10, with a simple structure. When opened, it does not occupy extra space and avoids interference with staff or other equipment. Specifically, the sliding rails 14 extend in the vertical direction, and the sliding plate 151 realizes sliding in the vertical direction through the sliding rails 14.

[0052] Among them, a moving component, such as a ball or a pulley, can be arranged between the sliding plate 151 and the sliding rail 14. This is prior art and will not be elaborated here.

[0053] Specifically, the cover plate 15 further includes a fixing plate 152. The fixing plate 152 is located above the sliding plate 151. Two grooves are correspondingly arranged on two adjacent side walls of the cover plate 15, and the extending direction of the grooves is the same as that of the sliding rails 14. The two ends of the fixing plate 152 are respectively engaged with the two grooves. With such an arrangement, the area of the sliding plate 151 can be reduced. In this way, when the sliding plate 151 slides upward through the sliding rails 14 to open the opening, the top of the sliding plate 151 will not exceed the top plate 12 by too much distance, thus facilitating the upward and downward sliding of the sliding plate 151.

[0054] In this application, the sliding rails 14 and the grooves are arranged front and back. When the sliding plate 151 is closed, it can cooperate with the fixing plate 152 to completely cover the opening.

[0055] Specifically, both the sliding plate 151 and the fixing plate 152 are made of transparent explosion-proof glass. In this way, the cover plate 15 can prevent the explosion impact inside the cabinet body 10, effectively protecting the personal safety of the staff. At the same time, the situation inside the cavity 101 can be observed from the outside.

[0056] Furthermore, the cabinet body 10 further includes a back panel 16 and two side panels 17. The back panel 16, the cover plate 15, and the two side panels 17 are disposed between the top plate 12 and the bottom plate 13. The back panel 16, the cover plate 15, and the two side panels 17 are arranged along the edge of the bottom plate 13. The side panel 17 is disposed between the cover plate 15 and the back panel 16. The top plate 12, the bottom plate 13, the cover plate 15, and the two side panels 17 form a cavity 101. The side panel 17 has a side wall and a bending section 171 arranged in sequence in the front-back direction. The bending section 171 extends toward the cover plate 15, and the bending section 171 has a groove. With such an arrangement, there is no need to additionally process a groove on the cabinet body 10, reducing the number of components and making the structure of the cooling device simpler.

[0057] Among them, the back panel 16, the side panel 17, and the top plate 12 are all made of steel plates, and the inner sides are all coated with insulating and heat-insulating materials. The types of insulating and heat-insulating materials can be set as resin, expander, or acid source to ensure that the cabinet body 10 has strong hardness, high wear resistance, fire protection, and insulation performance to ensure the safety of the experimental process.

[0058] Specifically, a wire groove 122 is further provided on the top plate 12, and a wire bundling buckle is arranged in the wire groove 122. The wire groove 122 and the wire bundling buckle cooperate to fix the cables in the cooling device. This can avoid electrical accidents caused by the chaotic winding of the cables inside the cooling device.

[0059] Among them, the cabinet body 10 further includes two support members 40. The support member 40 is fixedly connected to the bending section 171. The slide rail 14 is disposed on one side of the support member 40 facing the sliding plate 151. The extending direction of the support member 40 is the same as that of the slide rail 14. A control button is further provided on the support member 40. The control button is electrically connected to each electrical component in the cooling device to control the operation of the cooling device.

[0060] As Figure 1 shown, a fan switch 41, a main switch 42, and a fan adjustment knob 43 are provided on the support member 40. The fan switch 41 and the fan adjustment knob 43 are electrically connected to the fan. The fan switch 41 controls the on / off of the fan, and the fan adjustment knob 43 controls the wind speed of the fan. The main switch 42 is electrically connected to the interface on the semiconductor refrigeration plate 21 to control the opening and closing of the semiconductor refrigeration plate 21.

[0061] It should be noted that the terms used herein are only for describing specific embodiments and are not intended to limit the exemplary embodiments according to the present application. As used herein, unless the context clearly indicates otherwise, the singular form is also intended to include the plural form. In addition, it should be understood that when the terms "comprise" and / or "include" are used in this specification, they indicate the presence of features, steps, operations, devices, components, and / or their combinations.

[0062] Unless otherwise specifically stated, the relative arrangements, numerical expressions, and numerical values of the components and steps set forth in these embodiments do not limit the scope of the present invention. At the same time, it should be understood that, for the sake of convenience of description, the dimensions of the various parts shown in the drawings are not drawn in actual proportional relationship. Technologies, methods, and devices known to those of ordinary skill in the relevant art may not be discussed in detail, but where appropriate, the said technologies, methods, and devices should be regarded as part of the description. In all the examples shown and discussed here, any specific values should be construed as merely exemplary and not as a limitation. Therefore, other examples of the exemplary embodiments may have different values. It should be noted that like reference numerals and letters denote like items in the following drawings, and thus, once an item is defined in one drawing, further discussion thereof is not required in subsequent drawings.

[0063] In the description of the present invention, it should be understood that the orientation or positional relationship indicated by orientation terms such as "front, rear, upper, lower, left, right", "lateral, vertical, perpendicular, horizontal", and "top, bottom", etc. is usually based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present invention and simplifying the description. Without contrary description, these orientation terms do not indicate and imply that the device or element referred to must have a specific orientation or be constructed and operated in a specific orientation, and thus should not be construed as limiting the protection scope of the present invention; the orientation terms "inside, outside" refer to the inside and outside relative to the contour of each component itself.

[0064] For the convenience of description, spatial relative terms such as "above...", "over...", "on the upper surface of...", "above" etc. can be used here to describe the spatial positional relationship of a device or feature shown in the drawings with other devices or features. It should be understood that the spatial relative terms are intended to include different orientations in use or operation in addition to the orientation depicted in the drawings of the device. For example, if the device in the drawing is inverted, the device described as "above other devices or structures" or "over other devices or structures" will then be positioned "below other devices or structures" or "under other devices or structures". Thus, the exemplary term "above" can include both the orientations of "above" and "below". The device can also be positioned in other different ways (rotated 90 degrees or in other orientations), and corresponding interpretations should be made for the spatial relative descriptions used here.

[0065] In addition, it should be noted that the use of terms such as "first", "second", etc. to limit components is only for the convenience of differentiating the corresponding components. Without additional statement, the above terms have no special meaning, and thus should not be construed as limiting the protection scope of the present invention.

[0066] The above are only the preferred embodiments of the present utility model and are not intended to limit the present utility model. For those skilled in the art, the present utility model may have various modifications and changes. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present utility model shall be included within the protection scope of the present utility model.

Claims

1. A cooling device, characterized in that, The cooling device includes: A cabinet (10), the cabinet (10) having a cavity (101) and an opening, the opening communicating with the cavity (101), the cavity (101) having a refrigeration chamber (1011) and a heat dissipation chamber (1012) sequentially distributed in the vertical direction, the cabinet (10) including a cover plate (15), the cover plate (15) being movably arranged at the opening, and the cover plate (15) being capable of opening or closing the opening; A refrigeration component (20), arranged in the cavity (101), the refrigeration component (20) including a thermoelectric cooler (21), the thermoelectric cooler (21) having an endothermic end and a heat dissipation end arranged opposite to each other, the thermoelectric cooler (21) being located inside the cabinet (10) and separating the refrigeration chamber (1011) and the heat dissipation chamber (1012), the endothermic end being located in the refrigeration chamber (1011), the heat dissipation end being located in the heat dissipation chamber (1012), and the endothermic end being capable of absorbing the heat of an article and transferring the heat to the heat dissipation end.

2. The cooling device according to claim 1, wherein There are a plurality of the thermoelectric coolers (21), the refrigeration component (20) further including a support frame (22), the support frame (22) having a plurality of accommodation areas, the thermoelectric coolers (21) being located in the accommodation areas, the plurality of accommodation areas being arranged in one-to-one correspondence with the plurality of thermoelectric coolers (21), and the support frame (22) being arranged in the cavity (101) and fixedly connected to the cabinet (10).

3. The cooling device according to claim 2, wherein A boss is annularly arranged at the bottom of the accommodation area, the boss being located inside the accommodation area, and the thermoelectric cooler (21) being located on the boss.

4. The cooling device according to claim 3, wherein The cabinet (10) has a top plate (12) and a bottom plate (13) arranged opposite to each other, the bottom plate (13) having heat dissipation holes, the heat dissipation holes communicating with the heat dissipation chamber (1012), the heat dissipation chamber (1012) communicating with the outside through the heat dissipation holes, the top plate (12) having an air outlet (121), the air outlet (121) communicating with the refrigeration chamber (1011), an air inlet being arranged on the cabinet (10), the air inlet communicating with the refrigeration chamber (1011), and the refrigeration chamber (1011) communicating with the outside through the air inlet and the air outlet (121).

5. The cooling device according to claim 4, wherein The cooling device further includes a blower and a mounting frame (30), the mounting frame (30) being arranged on the top plate (12), the blower being arranged on the mounting frame (30), at least part of the mounting frame (30) being located above the air outlet (121), and the blower being arranged corresponding to the air outlet (121).

6. The cooling device according to claim 5, wherein The mounting bracket (30) includes a mounting base (31) and two legs (32). The legs (32) have a connecting section (321) and a supporting section (322) arranged in sequence. The connecting section (321) is fixedly connected to the top plate (12), and the supporting section (322) is fixedly connected to the mounting base (31). The two legs (32) are oppositely arranged on the mounting base (31), and the blower is arranged on the mounting base (31).

7. The cooling device according to claim 4, wherein The cover plate (15) includes a sliding plate (151). Two sliding rails (14) are arranged on the cabinet body (10). The two sliding rails (14) are correspondingly arranged on both sides of the sliding plate (151). The two ends of the sliding plate (151) are respectively movably arranged in the two sliding rails (14) to open or close the opening.

8. The cooling device according to claim 7, wherein The cover plate (15) further includes a fixing plate (152). The fixing plate (152) is located above the sliding plate (151). Two grooves are correspondingly arranged on two adjacent side walls of the cover plate (15). The extending direction of the grooves is the same as the extending direction of the sliding rails (14). The two ends of the fixing plate (152) are respectively clamped and matched with the two grooves.

9. The cooling device according to claim 8, wherein The cabinet body (10) further includes a back plate (16) and two side plates (17). The back plate (16), the cover plate (15) and the two side plates (17) are arranged between the top plate (12) and the bottom plate (13). The back plate (16), the cover plate (15) and the two side plates (17) are arranged along the edge of the bottom plate (13). The side plates (17) are arranged between the cover plate (15) and the back plate (16). The top plate (12), the bottom plate (13), the cover plate (15) and the two side plates (17) form the cavity (101). The side plates (17) have the side wall and a bending section (171) arranged in sequence along the front-back direction. The bending section (171) extends towards the cover plate (15), and the bending section (171) has the groove.

10. The cooling device according to claim 4, wherein A wire routing groove (122) is further arranged on the top plate (12). A wire bundling buckle is arranged in the wire routing groove (122). The wire routing groove (122) and the wire bundling buckle cooperate to fix the cables in the cooling device.

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