Universal reflow soldering furnace temperature testing device

Abstract

The utility model provides a general reflow soldering furnace temperature testing device, which is used for replacing a reflow soldering product to be subjected to furnace temperature testing to carry out furnace temperature testing and acquiring an equivalent furnace temperature curve of the reflow soldering product, and comprises a general tray and a plurality of PCBA (Printed Circuit Board Assembly) components, a plurality of holes are formed in the tray and are used for placing PCBA assemblies; the tray is selected from one of M types of universal trays, and the PCBA assembly is selected from N types of universal PCBA assemblies; the general trays are different in boundary dimension, hole opening position and size and used for being matched with different general PCBA assemblies. Each general PCBA assembly is welded with a plurality of components of different packaging types, and a plurality of temperature measuring assemblies are uniformly distributed on each general PCBA assembly. The temperature measuring assemblies are uniformly distributed on temperature testing points at the bottom of the component and are used for measuring the local temperature of the corresponding component; the types and the number of the general PCBA assemblies are matched with those of reflow soldering products to be subjected to furnace temperature testing, and the general PCBA assemblies are used for simulating the types and the layout of components of the PCBA assemblies.

Description

Technical Field

[0001] The utility model belongs to the field of reflow soldering furnace temperature testing, and relates to a general reflow soldering furnace temperature testing device. Background Technique

[0002] In the printed circuit board soldering industry, the reflow soldering furnace is a key device for soldering printed circuit board assemblies. Common reflow soldering furnaces contain 8 to 12 temperature zones, arranged linearly, and the temperature value of each temperature zone can be set independently. The printed circuit board assembly to be soldered flows from one side of the reflow soldering furnace to the other side to complete the automatic soldering process. Therefore, the set temperature of each temperature zone of the reflow soldering furnace directly affects the soldering quality.

[0003] To ensure the soldering quality of the product, it is necessary to ensure that the soldering temperature curve of each solder joint meets the standard requirements. Because the composition of the printed circuit board assembly is diverse, factors such as the size and shape of the printed circuit board, the size, material, and pin distribution of the components, and the component density of the printed circuit board assembly cause differences in the measured furnace temperature curves of different components of the same printed circuit board assembly, the same components of different printed circuit board assemblies, and different components of different printed circuit board assemblies under the same reflow soldering furnace temperature setting. For the situation where the difference between the measured value and the standard value is not large, the furnace temperature setting can not be changed. For the situation where the difference is large, different furnace temperature curves need to be set for different printed circuit boards.

[0004] Currently, the commonly used measurement method in the industry is to select formal products as temperature measurement tools. Although this method can measure the actual furnace temperature curve of the product, it cannot cover other products horizontally, and the more product types there are, the more tooling is required, ranging from dozens to hundreds. The storage cost and management cost of the tooling are relatively high. Content of the Utility Model

[0005] The technical problem solved by the utility model is: overcoming the deficiencies of the prior art, providing a general reflow soldering furnace temperature testing device, and solving the problem of poor versatility of the reflow soldering furnace temperature testing tooling.

[0006] The technical solution of the present utility model is as follows: A general reflow soldering furnace temperature testing device is used to replace the reflow soldering product to be tested for furnace temperature testing and obtain the equivalent furnace temperature curve of the reflow soldering product. The device includes a general tray and multiple PCBA components; there are multiple openings on the tray for placing PCBA components; the tray is selected from one of M general trays, and the PCBA components are selected from N general PCBA components; the outer dimensions of each general tray are different, and the positions and sizes of the openings are different, which are used to match different general PCBA components; multiple different package types of components are soldered on each general PCBA component, and multiple temperature measuring components are evenly distributed; the temperature measuring components are evenly distributed on the bottom temperature test points of the components to measure the local temperature of the corresponding devices; the types and quantities of the general PCBA components match those of the reflow soldering product to be tested for furnace temperature, and are used to simulate the types and layouts of the components of the PCBA components. Both M and N are greater than or equal to 1.

[0007] Preferably, the outer dimensions of the general tray include at least three specifications: 150*200mm, 220*270mm, 320*320mm.

[0008] Preferably, the dimensions of the general PCBA components include at least four specifications: 50*50mm, 40*40mm, 30*30mm, 20*30mm.

[0009] Preferably, the components on the general PCBA components include at least three sizes of chip components, and there are at least 3 chip components of each size.

[0010] Preferably, the components on the general PCBA components also include at least three sizes of QFN package devices, and there are no less than 3 QFN package devices of each size.

[0011] Preferably, the components on the general PCBA components also include at least three sizes of Sop package or QFP package devices, and there are no less than 3 Sop package or QFP package devices of each size.

[0012] Preferably, there are four types of components on the general PCBA components:

[0013] The first type of general PCBA component also includes a BGA package or LGA package device with a size of less than 20mm, the second type of general PCBA component also includes a BGA package or LGA package device with a size of 20 - 30mm, the third type of general PCBA component also includes a BGA package or LGA package device with a size of more than 30MM, and the fourth type of general PCBA component does not include a BGA package or LGA package device.

[0014] Preferably, at least one temperature test point of the first general PCBA component, the second general PCBA component, and the third general PCBA component is arranged on the central pad at the bottom of the BGA package or LGA package device.

[0015] Preferably, the periphery of the opening is provided with a step, and the general PCBA component is placed on the step.

[0016] The beneficial effects of the present utility model compared with the prior art are as follows:

[0017] (1). The general furnace temperature measurement device provided by the present utility model adopts a general design, simulates the structural characteristics of the formal product through modular assembly, and does not require the use of the formal product for testing. On the premise of meeting the furnace temperature test requirements of the formal product, the test process is simplified, and the test time cost and material cost are saved.

[0018] (2). The present utility model adopts the method of assembling a general tray and a general PCBA component, which can adapt to a variety of printed circuit board assemblies, effectively reducing the number of furnace temperature test toolings and lowering the tooling management cost.

[0019] (3). The general tray and the general PCBA component developed by the present utility model can be freely combined as needed, with strong versatility and flexible switching, and are suitable for the furnace temperature test of various printed circuit board assemblies.

[0020] (4). The present utility model can be quickly assembled. The inner wall of the opening of the general tray has a platform for supporting the general PCBA component. The general PCBA component can be placed into the opening of the corresponding size, and the assembly can be completed without borrowing any tools. Description of the Drawings

[0021] Figure 1 This is an example of the general reflow soldering furnace temperature test device according to the embodiment of the present utility model.

[0022] Figure 2 This is an example of the general tray according to the embodiment of the present utility model.

[0023] Figure 3(a) is an example of the fourth general PCBA component according to the embodiment of the present utility model.

[0024] Figure 3(b) is an example of the third general PCBA component according to the embodiment of the present utility model. Detailed Embodiments

[0025] The present utility model will be further described below in conjunction with the embodiments.

[0026] The utility model provides a general reflow soldering furnace temperature testing device, which is used to replace the reflow soldering product to be tested for furnace temperature testing and obtain the equivalent furnace temperature curve of the reflow soldering product.

[0027] As Figure 1 shown, the general reflow soldering furnace temperature testing device includes a general tray and a plurality of PCBA components; the number of PCBA components can be selected according to actual requirements. There are a plurality of openings on the tray for placing PCBA components; the tray is selected from one of M general trays, and the PCBA components are selected from N general PCBA components; the outer dimensions of each general tray are different, and the positions and sizes of the openings are different for matching different general PCBA components; a variety of components with different package types are soldered on each general PCBA component, and a plurality of temperature measuring components are evenly distributed; the temperature measuring components are evenly distributed on the bottom temperature test points of the components for measuring the local temperature of the corresponding devices; the types and quantities of the general PCBA components match the reflow soldering products to be tested for furnace temperature, and are used to simulate the types and layouts of the components of the PCBA components, and both M and N are greater than or equal to 1.

[0028] Preferably, the general tray can include a variety of outer dimensions, and the outer dimensions of the general tray include: less than 200*200 mm (including), greater than 200*200 mm and less than 300*300 mm, greater than 300*300 mm (including), with at least three specifications: 150*200 mm, 220*270 mm, 320*320 mm, and can also be customized according to the product to be tested.

[0029] Preferably, the dimensions of the general PCBA components include at least four specifications: 50*50 mm, 40*40 mm, 30*30 mm, 20*30 mm. If the size of the general tray is small, the size of the PCBA components can be appropriately reduced.

[0030] As Figure 2 shown, there are steps on the inner peripheral edges of the openings of the tray, and the general PCBA components are placed on the steps. The opening size of the general tray is the same as the outer dimension of the general PCBA component, and the general PCBA component will not shake left and right when placed in the opening. After the device is assembled, it cannot be inverted to prevent the general PCBA component from falling.

[0031] The PCBA component is the main temperature measuring unit, which includes two parts: components and temperature measuring components. The temperature measuring component can be a thermocouple. The components are soldered on the PCBA with high-lead solder. At the same time, the temperature measuring points of the temperature measuring wires are soldered at the solder joint positions of the components. A plurality of temperature measuring wires can be evenly distributed on each PCBA component, generally not exceeding 4. If the PCBA component includes bottom pad devices such as large-size BGA or BTC, 1 of the temperature measuring points of the temperature measuring wire should be soldered at the center pad of the bottom of the device.

[0032] Components can be combined in various ways according to the temperature measurement requirements of the product to be tested. The components on the general PCBA module include at least the following four types. Each type includes at least three sizes of chip components, with at least 3 chip components of each size; at least three sizes of QFN package devices, with no less than 3 QFN package devices of each size; at least three sizes of Sop package or QFP package devices, with no less than 3 Sop package or QFP package devices of each size. In particular, the first general PCBA module also includes a BGA package or LGA package device with a size of less than 20 mm, the second general PCBA module also includes a BGA package or LGA package device with a size of 20 - 30 mm, the third general PCBA module also includes a BGA package or LGA package device with a size of less than 30 mm, and the fourth general PCBA module does not include a BGA package or LGA package device. As shown in Table 1:

[0033] Table 1 General PCBA Module

[0034] The types and quantities of PCBA modules can be freely selected according to the products to be subjected to furnace temperature testing. Generally, the PCBA module is small in size and generally includes no more than 1 device with a larger size or a higher specific heat capacity.

[0035] As shown in Figure 3(a), it is an example of the fourth general PCBA module, which does not include BGA or LGA devices.

[0036] Figure 3(b) is an example of the third general PCBA module, which includes BGA / LGA with a size of 30 mm or more.

[0037] For the above-mentioned first general PCBA module, second general PCBA module, and third general PCBA module, at least one temperature test point is arranged on the central pad at the bottom of the BGA package or LGA package device.

[0038] Based on the above device, the present utility model also provides a general reflow soldering furnace temperature testing method, which includes the following steps:

[0039] S1. According to the size of the reflow soldering product to be subjected to furnace temperature testing, determine the external dimensions of the general tray; the selected general tray size should conform to 3 size categories of the general tray. When measuring the reflow soldering furnace temperature of a certain product, first select a general tray close to the product's external dimensions according to the product's external dimensions, and it is appropriate that the size difference does not exceed 50 mm.

[0040] S2. According to the size of the BGA package or LGA package device in the reflow soldering product to be subjected to furnace temperature testing, select the necessary types of general PCBA modules;

[0041] First, select the type of general PCBA components according to the size of BGA package or LGA package devices in the reflow soldering products; second, determine the quantity of the selected general PCBA components according to the size of BGA package or LGA package devices with the same size.

[0042] In this step, select the necessary general PCBA components or LGA package devices according to the types of components included in the product. Priority should be given to whether BGA-type components or LGA package devices are included. If so, necessary general PCBA components need to be selected according to the BGA size.

[0043] S3. From the general trays determined in step S1, find a general tray whose opening size and quantity are suitable for the necessary general PCBA components selected in step S2;

[0044] S4. Load the necessary general PCBA components determined in step S3 into the determined general tray;

[0045] First, place the necessary general PCBA components at the through-hole positions of the general tray. The placement position of the general PCBA components should be close to that of the product. For example, if the BGA package or LGA package device of the product is close to the center position, place the general PCBA components at the center position of the general tray, and then select similar PCBA components according to the distribution of other components and place them at the corresponding positions of the general tray.

[0046] S5. If there are still remaining openings in the selected general tray, install the fourth type of general PCBA components with corresponding sizes in the remaining openings to form a reflow soldering furnace temperature test device;

[0047] S6. Replace the actual reflow soldering product with the reflow soldering furnace temperature test device and send it into the reflow soldering furnace, flowing from one side of the reflow soldering furnace to the other side to obtain the furnace temperature curve of each temperature test point passing through each temperature zone of the reflow soldering furnace, which serves as the equivalent furnace temperature curve of the reflow soldering product.

[0048] For each necessary general PCBA component, at least one piece should be accommodated in the general tray.

[0049] The quantity of the general PCBA components with larger sizes should be arranged preferentially until the quantity of this general PCBA component on the general tray is equal to the number of BGA package or LGA package devices with the corresponding size in the reflow soldering product. Then, arrange the quantity of the remaining general PCBA components in the priority order from large to small according to the size order.

[0050] The above combination method can simulate the general structure of various products to replace the products for the furnace temperature test of reflow soldering.

[0051] Although the present utility model has been disclosed above with the preferred embodiments, it is not intended to limit the present utility model. Any person skilled in the art can make possible changes and modifications to the technical solution of the present utility model without departing from the spirit and scope of the present utility model. Therefore, all content that does not depart from the technical solution of the present utility model, any simple modifications, equivalent changes and decorations made to the above embodiments according to the technical essence of the present utility model, shall fall within the protection scope of the technical solution of the present utility model.

Claims

1. A general reflow soldering furnace temperature testing device, which is used to replace the reflow soldering product to be tested for furnace temperature testing and obtain the equivalent furnace temperature curve of the reflow soldering product, is characterized in that It includes a general tray and multiple PCBA components; there are multiple openings on the tray for placing the PCBA components; the tray is selected from one of M types of general trays, and the PCBA components are selected from N types of general PCBA components; each type of general tray has different external dimensions, opening positions and sizes for matching different general PCBA components; each type of general PCBA component is soldered with various components of different package types and is evenly distributed with multiple temperature measuring components; the temperature measuring components are evenly distributed on the bottom temperature test points of the components for measuring the local temperature of the corresponding device; the types and quantities of the general PCBA components match the reflow soldering products to be subjected to furnace temperature testing for simulating the component types and layouts of the PCBA components, and both M and N are greater than or equal to 1.

2. The general reflow soldering furnace temperature testing device according to claim 1, wherein The external dimensions of the general tray include at least three specifications: 150*200mm, 220*270mm, 320*320mm.

3. The general reflow soldering furnace temperature testing device according to claim 1, characterized in that, The dimensions of the general PCBA components include at least four specifications: 50*50mm, 40*40mm, 30*30mm, 20*30mm.

4. A general reflow soldering furnace temperature testing device according to claim 1, characterized in that, The components on the general PCBA components include at least three sizes of chip components, and there are at least 3 chip components of each size.

5. A general reflow soldering furnace temperature testing device according to claim 4, characterized in that, The components on the general PCBA components also include at least three sizes of QFN package devices, and there are no less than 3 QFN package devices of each size.

6. The general reflow soldering furnace temperature testing device according to claim 5, characterized in that The components on the general PCBA components also include at least three sizes of Sop package or QFP package devices, and there are no less than 3 Sop package or QFP package devices of each size.

7. A general reflow soldering furnace temperature testing device according to any one of claims 3 to 5, characterized in that There are four types of components on the general PCBA components: The first type of general PCBA component also includes a BGA package or LGA package device with a size of less than 20mm, the second type of general PCBA component also includes a BGA package or LGA package device with a size of 20 - 30mm, the third type of general PCBA component also includes a BGA package or LGA package device with a size of more than 30MM, and the fourth type of general PCBA component does not include a BGA package or LGA package device.

8. A general reflow soldering furnace temperature testing device according to claim 7, characterized in that, At least one of the temperature test points of the first type of general PCBA component, the second type of general PCBA component, and the third type of general PCBA component is arranged on the central pad at the bottom of the BGA package or LGA package device.

9. The general reflow soldering furnace temperature testing device according to claim 1, characterized in that Steps are provided at the four peripheral edges of the opening, and the general PCBA components are placed on the steps.

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