Pressurizing blowing system for wafer test
Through the coordination of the pressure control valve and the solenoid switch valve, the problem of unstable gas supply in wafer test is solved, ensuring the uniform supply of high-pressure gas, preventing discharge and ignition, and improving the safety of wafer test and product yield.
Patent Information
- Application Number
- CN202422255223.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-09-13
- Publication Date
- 2025-08-01
- Estimated Expiration
- 2034-09-13
AI Technical Summary
In the existing wafer test, the pressure-blowing system is insufficient and unstable in the initial stage, resulting in discharge and ignition, affecting product yield.
The combination of pressure control valve, solenoid switch valve, signal trigger element and program control module is adopted to ensure that uniform and stable high-pressure gas is supplied into the probe card in the initial stage, and the gas supply is quickly cut off during the wafer up and down process to prevent the wafer from being blown away.
The gas pressure stability and continuous gas supply uniformity in the initial stage of wafer testing are achieved, which prevents discharge and ignition, improves the safety and reliability of the test process, and reduces wafer damage.
Smart Images
Figure CN223180264U_ABST
Abstract
Description
Technical Field
[0001] The present application relates to the technical field of wafer testing devices, and particularly to a pressurized air blowing system for wafer testing. Background Art
[0002] It is known that during the Chip Probe test of a wafer, in order to prevent the occurrence of discharge and sparking between the wafer sheet and the probe, in the prior art, generally, a method of introducing high-pressure gas into the probe card is adopted to increase the discharge voltage of the wafer, so that the discharge voltage is higher than the voltage required for testing, and thus it is difficult to have the above-mentioned discharge and sparking phenomenon.
[0003] Specifically, a high-pressure air blowing device composed of components such as a gas supply pipeline, a valve, and an air pump is set up to blow the above-mentioned high-pressure gas into the probe card. However, the high-pressure air blowing device has the following potential defects during operation. In the initial stage of wafer testing, due to the short opening time of the valve on the gas supply pipeline and the long pipeline length, and the possible unstable loading of the factory gas supply source, the gas pressure and flow rate transported in the pipeline are both insufficient and unstable, resulting in the gas introduced into the probe card also having problems of insufficient or unstable air pressure, causing slight and short-term discharge and sparking phenomena during testing, thus damaging the wafer body and causing a decrease in product yield.
[0004] Based on this, there is an urgent need for an improved pressurized air blowing system for wafer testing, which can ensure that high-pressure gas with uniform and stable pressure can be introduced into the probe card in the initial stage of wafer testing. Summary of the Invention
[0005] In view of this, the embodiments of this specification provide a pressurized air blowing system for wafer testing, which specifically includes: a probe card; a blow air pipeline for blowing high-pressure gas into the probe card; a pressure control valve connected to the blow air pipeline for controlling the gas supply flow rate and pressure; and further includes an electromagnetic switch valve, a signal trigger element, and a program control module. Among them, the electromagnetic switch valve is connected to the blow air pipeline and is located between the pressure control valve and the probe card. The signal trigger element is configured to send a trigger signal to the program control module in response to the supply air pressure reaching the rated pressure value, and the program control module is configured to control the electromagnetic switch valve to open in response to the trigger signal.
[0006] The embodiments of this specification also provide the following technical solutions:
[0007] As a preferred embodiment, the signal trigger element includes a supply air pressure detector, and the supply air pressure detector is connected to the blow air pipeline and is located between the pressure control valve and the electromagnetic switch valve.
[0008] As a preferred embodiment, the signal triggering element includes a timer, and the timer is electrically connected to the pressure control valve.
[0009] As a preferred embodiment, it further includes a flow rate monitoring module for monitoring the gas flow rate in the blow pipe.
[0010] As a preferred embodiment, the flow rate monitoring module includes a flow rate sensor and a flow rate display. The flow rate sensor is used to detect the gas flow rate in the blow pipe, and the flow rate display is used to display the flow rate data transmitted from the flow rate sensor in real time.
[0011] As a preferred embodiment, it further includes a probe card pressure monitoring module for monitoring the gas pressure in the probe card.
[0012] As a preferred embodiment, it further includes a gas filter for filtering the high-pressure gas blown into the probe card through the blow pipe.
[0013] As a preferred embodiment, the input end of the blow pipe is connected to a gas supply source for supplying the high-pressure gas, and the output end of the blow pipe is connected to the inflation port of the probe card.
[0014] As a preferred embodiment, it further includes a probe station and a wafer positioning component provided on the probe station.
[0015] As a preferred embodiment, it further includes an installation box for installing the components of the pressurized blowing system, and the installation box is detachably installed on the probe station.
[0016] As a preferred embodiment, the installation box includes a box body and a cover plate. The box body has an upper opening and a lower opening, the cover plate is adapted to cover the upper opening, and the probe card is installed on the lower opening.
[0017] As a preferred embodiment, a guiding structure is further provided between the installation box and the probe station for guiding the movement between the separation position and the installation position.
[0018] Compared with the prior art, the beneficial effects that can be achieved by at least one of the above technical solutions adopted in the embodiments of the present specification at least include:
[0019] First, through the setting of the pressure control valve, in the initial stage of wafer testing, that is, after the wafer is loaded, gas can be supplied to the blow pipe at a set flow rate and pressure. Through the setting and cooperation of the electromagnetic switch valve, signal trigger element, and program control module, the gas with insufficient pressure and instability can be intercepted at a set position in the pipeline during the initial gas supply. After the pressure in the pipeline stabilizes at the rated working value, the signal trigger element sends a trigger signal to the program control module, and the program control module controls the electromagnetic switch valve to act in response to the trigger signal, quickly releasing high-pressure gas into the probe card to ensure that the gas entering the probe card has sufficient pressure and continuous gas supply is uniform and stable, thereby preventing the occurrence of discharge and sparking phenomena.
[0020] Secondly, due to the fast on-off ability of the electromagnetic switch valve, during the wafer loading and unloading process, when the wafer is separated from the probe, the gas supply can be quickly cut off, thus preventing the wafer from being blown away in the loading and unloading state. Brief Description of the Drawings
[0021] To more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for use in the embodiments will be briefly introduced below. Obviously, the drawings in the following description are only some embodiments of the present application. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative efforts.
[0022] Figure 1 It is a partial structural schematic diagram of Embodiment 1 of the present application;
[0023] Figure 2 It is an overall structural schematic diagram of Embodiment 1 of the present application;
[0024] Figure 3 It is a partial structural schematic diagram of Embodiment 2 of the present application;
[0025] Figure 4 It is an electrical connection schematic diagram of the pressurized blowing system in the present application.
[0026] Reference Signs:
[0027] 1. Pressure control valve; 2. Electromagnetic switch valve; 3. Flow sensor; 4. Gas filter; 5. Flow display; 6. Probe card pressure monitoring module; 7. Blow pipe; 8. Probe card; 9. Test wafer; 10. Program control module; 11. Probe station; 12. Installation box; 121. Cover plate; 13. Gas supply pressure detector; 14. Timer. Detailed Embodiments
[0028] The embodiments of the present application will be described in detail below with reference to the drawings.
[0029] The following describes the implementation manners of the present application through specific examples. Those skilled in the art can easily understand other advantages and effects of the present application from the content disclosed in this specification. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. The present application can also be implemented or applied through other different specific implementation manners. Various details in this specification can also be modified or changed based on different viewpoints and applications without departing from the spirit of the present application. It should be noted that, without conflict, the following embodiments and the features in the embodiments can be combined with each other. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative efforts belong to the scope protected by the present application.
[0030] It should be noted that the following describes various aspects of the embodiments within the scope of the appended claims. It should be obvious that the aspects described herein can be embodied in a wide variety of forms, and any specific structure and / or function described herein is illustrative only. Based on the present application, those skilled in the art should understand that one aspect described herein can be implemented independently of any other aspect, and two or more of these aspects can be combined in various ways. For example, any number and aspects described herein can be used to implement the device and / or practice the method. Additionally, this device and / or this method can be implemented using other structures and / or functionality in addition to one or more of the aspects described herein.
[0031] It should also be noted that the diagrams provided in the following embodiments only illustrate the basic concept of the present application schematically. The diagrams only show the components related to the present application and are not drawn according to the number, shape, and size of the components in actual implementation. The type, quantity, and proportion of each component in its actual implementation can be arbitrarily changed, and the component layout type may also be more complex.
[0032] Embodiment 1:
[0033] The embodiment of this specification provides a pressurized blowing system for wafer testing, aiming to solve the problems that the air supply pressure in the pressurized blowing system is insufficient and unstable in the initial stage of wafer testing. It can not only ensure that the high-pressure gas entering the probe card 8 has sufficient and stable pressure, but also prevent the wafer from being blown away during the loading and unloading process.
[0034] As Figure 1As shown in the figure, specifically, the pressurized gas blowing system includes a probe card 8 for performing probe testing on the test wafer 9; a blow gas pipeline 7 for blowing high-pressure gas into the probe card 8; a pressure control valve 1 connected to the blow gas pipeline 7 for controlling the supply gas flow rate and pressure; and further includes an electromagnetic switching valve 2, a signal triggering element, and a program control module 10. Among them, the electromagnetic switching valve 2 is connected to the blow gas pipeline 7 and is located between the pressure control valve 1 and the probe card 8. The signal triggering element is configured to send a trigger signal to the program control module 10 in response to the supply gas pressure reaching the rated pressure value. The program control module 10 is configured to control the opening of the electromagnetic switching valve 2 in response to the trigger signal.
[0035] In this embodiment, the signal triggering element includes a supply gas pressure detector 13. The supply gas pressure detector 13 is connected to the blow gas pipeline 7 and is located between the pressure control valve 1 and the electromagnetic switching valve 2. When the pressurized gas blowing system starts to supply gas, the electromagnetic switching valve 2 is initially in the closed state. The input end of the blow gas pipeline 7 is connected to the supply source of the high-pressure gas from the factory, and the output end is connected to the gas inlet of the probe card 8. At this time, the flow rate and pressure of the gas supplied into the blow gas pipeline 7 are adjusted according to the requirements of the process parameters (recipe). Then, the pressure control valve 1 is opened, and the high-pressure gas starts to be transported from the supply source into the blow gas pipeline 7. Since the electromagnetic switching valve 2 is in the closed state at this time, the gas with insufficient and unstable pressure entering the pipeline initially is intercepted at the set position in the pipeline. When the supply gas pressure detector 13 detects that the pressure in the pipeline is stable at the rated working value, it sends a trigger signal to the program control module 10. The program control module 10 controls the electromagnetic switching valve 2 to act in response to the trigger signal, quickly opens the pipeline, and releases the high-pressure gas into the probe card 8 to ensure that the gas entering the probe card 8 has sufficient pressure, and the continuous gas supply is uniform and stable, thereby preventing the occurrence of discharge and sparking phenomena.
[0036] In addition, since the electromagnetic switching valve 2 has the ability to quickly turn on and off, it can quickly cut off the gas supply when the test wafer 9 is separated from the probe during the wafer loading and unloading process, thereby preventing the wafer from being blown away in the wafer loading and unloading state.
[0037] As Figure 2 shown in the figure, in this embodiment, it further includes a flow rate monitoring module for monitoring the gas flow rate in the blow gas pipeline 7. Specifically, the flow rate monitoring module includes a flow rate sensor 3 and a flow rate display 5. Among them, the flow rate sensor 3 is used to detect the gas flow rate in the blow gas pipeline 7, and the flow rate display 5 is used to display the flow rate data transmitted from the flow rate sensor 3 in real time.
[0038] Preferably, the flow rate sensor 3 is arranged on the blow gas pipeline 7 between the electromagnetic switching valve 2 and the probe card 8 to monitor the gas flow rate after the pipeline is stabilized.
[0039] As a further extension, the flow monitoring module may further include a flow alarm. Specifically, the flow sensor 3 may be electrically connected to the input end of the program control module 10, and the flow display 5 and the flow alarm may be electrically connected to the output end of the program control module 10. On the one hand, the flow sensor 3 can transmit the detected flow data of the pipeline gas to the flow display 5 in real time for real-time display and monitoring. On the other hand, when the program determines that the detected flow data is lower than the rated working value, an alarm is given in time, so that the system can be maintained in time.
[0040] In this embodiment, a probe card pressure monitoring module 6 for monitoring the gas pressure in the probe card 8 is further included. Specifically, the probe card pressure monitoring module 6 may include a pressure sensor and a pressure display. The pressure sensor is used to detect the blowing pressure in the inner cavity of the probe card 8, and the pressure display may be electrically connected to the pressure sensor to facilitate the operator to monitor the gas pressure data in the probe card in real time. As a preference, the probe card pressure monitoring module 6 may further include a pressure alarm. When the pressure value in the probe card 8 is detected to be lower than the standard value, an alarm is used to notify the test operator.
[0041] By monitoring the flow in the blow pipe 7 and the gas pressure in the probe card 8, real-time monitoring and anti-fooling can be realized, that is, the fault point or problem point in the pressurized blowing system can be quickly identified, and then the machine operator is notified by means of alarm, etc., improving the efficiency of system maintenance.
[0042] As Figure 2 As shown, in this embodiment, the pressurized blowing system further includes a gas filter 4 for filtering the high-pressure gas blown into the probe card 8 by the blow pipe 7. Through the setting of the gas filter 4, the residual particles in the high-pressure gas are filtered in time. As a preference, the gas filter 4 adopts a detachable filter element, so that the filter element can be replaced in time to ensure the gas cleanliness and avoid scratching the wafer.
[0043] In this embodiment, a probe table 11 and a wafer positioning component arranged on the probe table 11 are further included. After the test wafer 9 is loaded, it is positioned by the wafer positioning component. As a preference, the wafer positioning component may include a positioning tray and an automatic feeding mechanism for pushing the positioning tray to move between the wafer loading position and the wafer unloading position, such as a three-axis slide table mechanism or a multi-degree-of-freedom manipulator controlled by a programmable logic controller, so as to realize the automatic control of the wafer loading and unloading process, reduce the manual operation burden, and improve the product yield.
[0044] In this embodiment, it further includes an installation box 12 for installing the components of the pressurized blowing system, and the installation box is detachably installed on the probe table. Specifically, the installation box 12 includes a box body and a cover plate 121 for shading. The box body has an upper opening and a lower opening. The cover plate 121 is adapted to cover the upper opening, and the probe card 8 is installed on the lower opening.
[0045] Preferably, a guiding structure for guiding the movement between the separation position and the installation position of the installation box and the probe table is further provided between the installation box and the probe table. For example, a guiding structure composed of a guiding pin and a guiding groove will not be elaborated here.
[0046] Through the setting of the installation box 12, the components of the pressurized blowing system inside the box can be isolated from the external environment, preventing the external environment from interfering with the pressurized blowing system and ensuring the stable and safe operation of the system. The setting of the upper opening facilitates the maintenance and repair of the components inside the box body.
[0047] To sum up, the pressurized blowing system in this embodiment realizes that at the initial stage of wafer testing, the high-pressure gas entering the probe card 8 can have sufficient and stable pressure through the mutual cooperation between the two valves of the pressure control valve 1 and the electromagnetic switch valve 2, thereby preventing the occurrence of discharge and sparking. It effectively avoids the influence of insufficient gas supply and unstable gas supply pressure at the factory end on the test end, and improves the safety and reliability of the wafer testing process.
[0048] Embodiment Two:
[0049] As shown in Figure 3 this embodiment has the same basic structure as Embodiment One. The difference between the two is that the signal triggering element in this embodiment includes a timer 14. The pressure control valve 1 is electrically connected to the timer 14. The timer 14 is adjusted according to the set process time. The process time requirement is not less than the time required for the gas pressure in the blowing pipeline 7 to stabilize at the rated working value after the pressure control valve 1 is opened. When the timing of the timer 14 reaches the process time, a trigger signal is sent to the program control module 10, and the program control module 10 controls the electromagnetic switch valve 2 to actuate and open the pipeline to release high-pressure gas into the probe card 8.
[0050] Adopting the solution of using the timer 14 as the signal triggering element in this embodiment, there is no need to additionally set a pressure detector on the pipeline and its supporting connection components, sealing components, etc. Compared with Embodiment One, it is more convenient and efficient to install while achieving the technical purpose of judging that the gas supply pressure meets the rated working value and sending a trigger signal to the program control module 10, but the judgment accuracy is slightly insufficient compared with Embodiment One. Technical personnel can make a choice according to the on-site working conditions and requirements.
[0051] In this specification, for the same or similar parts among various embodiments, reference can be made to each other. Each embodiment focuses on the differences from other embodiments. In particular, for the embodiments described later, the description is relatively simple, and for the relevant parts, reference can be made to the partial description of the foregoing embodiments.
[0052] As described above, the above are only specific embodiments of the present application, but the protection scope of the present application is not limited thereto. Any changes or substitutions that can be easily thought of by those skilled in the art within the technical scope disclosed in the present application should be covered by the protection scope of the present application. Therefore, the protection scope of the present application should be subject to the protection scope of the claims.
Claims
1. A pressurized air blowing system for wafer testing, comprising: A probe card; An air blowing pipeline for blowing high-pressure gas into the probe card; A pressure control valve connected to the air blowing pipeline for controlling the supply air flow rate and pressure; It is characterized in that it further comprises an electromagnetic switching valve, a signal triggering element and a program control module. Among them, the electromagnetic switching valve is connected to the air blowing pipeline and is located between the pressure control valve and the probe card. The signal triggering element is configured to send a triggering signal to the program control module in response to the supply air pressure reaching the rated pressure value. The program control module is configured to control the opening of the electromagnetic switching valve in response to the triggering signal.
2. The pressurized air blowing system for wafer testing according to claim 1, wherein The signal triggering element includes a supply air pressure detector, and the supply air pressure detector is connected to the air blowing pipeline and is located between the pressure control valve and the electromagnetic switching valve.
3. The pressurized air blowing system for wafer testing according to claim 1, wherein The signal triggering element includes a timer, and the timer is electrically connected to the pressure control valve.
4. The pressurized air blowing system for wafer testing according to claim 1, wherein, It further comprises a flow monitoring module for monitoring the gas flow rate in the air blowing pipeline.
5. The pressurized air blowing system for wafer testing according to claim 4, wherein The flow monitoring module includes a flow sensor and a flow display. Among them, the flow sensor is used to detect the gas flow rate in the air blowing pipeline, and the flow display is used to display the flow data transmitted from the flow sensor in real time.
6. The pressurized air blowing system for wafer testing according to claim 1, characterized in that, It further comprises a probe card pressure monitoring module for monitoring the gas pressure in the probe card.
7. The pressurized air blowing system for wafer testing according to claim 1, wherein It further comprises a gas filter for filtering the high-pressure gas blown into the probe card by the air blowing pipeline.
8. The pressurized air blowing system for wafer testing according to claim 1, characterized in that, The input end of the air blowing pipeline is connected to a gas supply source for supplying the high-pressure gas, and the output end of the air blowing pipeline is connected to the inflation port of the probe card.
9. The pressurized air blowing system for wafer testing according to any one of claims 1 to 7, characterized in that, It further comprises a probe station and a wafer positioning component arranged on the probe station.
10. The pressurized air blowing system for wafer testing according to claim 9, wherein, It further comprises an installation box for installing the components of the pressurized air blowing system, and the installation box is detachably installed on the probe station.
11. The pressurized air blowing system for wafer testing according to claim 10, wherein, The installation box includes a box body and a cover plate. The box body has an upper opening and a lower opening. The cover plate is adapted to cover the upper opening, and the probe card is installed on the lower opening.
12. The pressurized air blowing system for wafer testing according to claim 10, wherein A guiding structure for guiding the movement between the separation position and the installation position of the installation box and the probe station is further provided between the installation box and the probe station.