Projection device

Abstract

The utility model discloses projection equipment which comprises a machine body shell, a heat conduction fixing frame, a first heating device and a second heating device, the heat conduction fixing frame, the first heating device and the second heating device are installed in the machine body shell, and the heat conduction fixing frame is provided with a first contact part and a second contact part. The first heating device is in contact with the first contact part, the second heating device is in contact with the second contact part, and a main hollow part is arranged between the first contact part and the second contact part. The projection equipment provided by the utility model can effectively dissipate heat of a heating component and prevent heat of a relatively high-temperature component from being transferred to a relatively low-temperature component at the same time.

Description

Technical Field

[0001] The utility model relates to the technical field of projection devices, in particular to a projection device. Background Art

[0002] During the development of DLP (Digital Light Processing) projectors, the brightness has been increasing, and the power of DLP boards and boost boards has also been increasing, posing high requirements for heat dissipation. When two different heat-generating components are arranged on the same heat-conducting bracket, it is easy to cause heat to transfer to the component with lower heat generation, hindering the heat dissipation of the component with lower heat generation, and excessive heat accumulation may even affect the performance of the component.

[0003] For example, the main control board of an intelligent projector mainly consists of three parts: an Android board, a DLP board, and a boost board. Among them, the Android board has a low thermal power and the chip is not resistant to high temperatures, the DLP board has a high thermal power and the chip is not resistant to high temperatures, and the boost board has a very high thermal power and its components are resistant to high temperatures. To address the problem of high heat on the main board, the main board, boost board, and DLP board can all be attached to the same metal bracket for fixation and heat dissipation; although this method can dissipate heat from the main board, the area of high-heat components will have an impact on the low-heat chip area, which is not conducive to the chip maintaining high-performance operation. Summary of the Utility Model

[0004] To solve the above technical problems, the utility model proposes a projection device that can effectively dissipate heat from heat-generating components while preventing the heat of relatively high-temperature components from transferring to relatively low-temperature components.

[0005] To achieve the above object, the utility model adopts the following technical solutions:

[0006] The utility model discloses a projection device, including a body shell, a heat-conducting fixing bracket, a first heat-generating component, and a second heat-generating component. The heat-conducting fixing bracket, the first heat-generating component, and the second heat-generating component are installed inside the body shell. The heat-conducting fixing bracket is provided with a first contact portion and a second contact portion. The first heat-generating component is in contact with the first contact portion, the second heat-generating component is in contact with the second contact portion, and a main hollow portion is formed between the first contact portion and the second contact portion.

[0007] Preferably, the first contact portion and the second contact portion are arranged at intervals along a first direction, the main hollow portion extends along a second direction, the first direction is perpendicular to the second direction, and the center connection line of the first contact portion and the second contact portion passes through the main hollow portion.

[0008] Preferably, the main hollow portion includes a plurality of sub-hollow portions, and the plurality of sub-hollow portions are arranged at intervals along the first direction.

[0009] Preferably, the plurality of sub-hollow portions include at least one intermediate sub-hollow portion and at least one set of edge sub-hollow portion groups. Each set of edge sub-hollow portion groups includes two edge sub-hollow portions. The intermediate sub-hollow portion and the edge sub-hollow portion groups are arranged at intervals along the first direction. The intermediate sub-hollow portion extends and is opened along the second direction. First heat conduction channels are respectively formed between the edge of the heat conduction fixing frame and both ends of the intermediate sub-hollow portion along the second direction; the two edge sub-hollow portions in each set of edge sub-hollow portion groups respectively extend and are opened from opposite side edges of the heat conduction fixing frame along the second direction towards the middle, and a second heat conduction channel is formed between the two edge sub-hollow portions opposite to each other along the second direction.

[0010] Preferably, the intermediate sub-hollow portion and the edge sub-hollow portion groups are alternately opened in sequence along the first direction, and the first heat conduction channel is opposite to the edge sub-hollow portion in the first direction, and the second heat conduction channel is opposite to the intermediate sub-hollow portion in the first direction.

[0011] Preferably, the heat conduction fixing frame includes a platform base body, a bent base body and a boss. The platform base body and the bent base body are perpendicularly connected to each other. The boss is arranged on the platform base body to form the first contact portion and the second contact portion of the heat conduction fixing frame. The boss and the bent base body are located on opposite sides of the platform base body. The main hollow portion is opened on the platform base body.

[0012] Preferably, a secondary hollow portion is opened on the bent base body. The extending direction of the secondary hollow portion is perpendicular to the extending direction of the main hollow portion, and the secondary hollow portion is communicated with the main hollow portion.

[0013] Preferably, the projection device further includes a heat dissipation pipe and a first heat dissipation fin. The heat generation amount of the second heat generating device is higher than that of the first heat generating device. The first end of the heat dissipation pipe is connected to the side of the second contact portion of the heat conduction fixing frame away from the first contact portion, and the second end of the heat dissipation pipe is connected to the first heat dissipation fin.

[0014] Preferably, the projection device further includes a third heat generating device. A third contact portion in contact with the third heat generating device is provided on the heat conduction fixing frame. The heat generation amount of the third heat generating device is higher than that of the second heat generating device, and the heat generation amount of the second heat generating device is higher than that of the first heat generating device; the third contact portion and the second contact portion are located on the same side of the main hollow portion. A sub-hollow portion is opened on the heat conduction fixing frame, and the third contact portion is located in the area enclosed by the sub-hollow portion and the main hollow portion.

[0015] Preferably, the projection device further includes a second heat dissipation fin, and the second heat dissipation fin is fixedly disposed on the back surface of the heat conduction fixing frame corresponding to the third contact portion.

[0016] Compared with the prior art, the beneficial effects of the present invention are as follows: In the projection device disclosed in the present invention, when the heat conduction fixing frame conducts contact heat dissipation on the first heat generating device and the second heat generating device in the projection device, by opening a main hollow portion between the two contact portions in contact with each other to reduce the transmission cross-section, the heat of relatively high-temperature components is prevented from being transferred to relatively low-temperature components. Therefore, through the heat conduction fixing frame with the main hollow portion opened, it can not only dissipate heat from high-temperature / mid-temperature components, but also prevent the heat of high-temperature components from being transferred to mid-temperature components.

[0017] In a further aspect, the present invention also has the following beneficial effects:

[0018] (1) By arranging the first contact portion and the second contact portion at intervals along the first direction, the main hollow portion is extended and opened along the second direction perpendicular to the first direction, and the center connection line of the first contact portion and the second contact portion passes through the main hollow portion, which can make the connection cross-section between the first contact portion and the second contact portion become even smaller, and the heat transfer path become longer, so that it can be realized that: even if the heat conductivity of the heat conduction fixing frame is very good, the heat will not be quickly transferred to the opposite side of the main hollow portion.

[0019] (2) The plurality of sub-hollow portions include an intermediate sub-hollow portion and an edge sub-hollow portion arranged at intervals along the first direction, and further, the first heat conduction channel formed by the intermediate sub-hollow portion is opposite to the edge sub-hollow portion, and the second heat conduction channel formed by the edge sub-hollow portion is opposite to the intermediate sub-hollow portion, which can increase the heat conduction distance between the first contact portion and the second contact portion to a greater extent, and ensure that this distance has a smaller heat conduction cross-section, further reducing the temperature influence between the first contact portion and the second contact portion.

[0020] (3) The heat conduction fixing frame includes a platform base body and a bent base body connected perpendicular to each other. The bent base body can support the platform base body to improve the structural stability, and a secondary hollow portion communicating with the main hollow portion is also opened on the bent base body, so that a relatively large interval is formed between the two side structures of the heat conduction fixing frame, which can prevent the heat of the first contact portion and the second contact portion from being transferred to each other through the bent base body.

[0021] (4) A heat dissipation pipe and a first heat dissipation fin are connected to the side of the second contact portion on the heat-conducting fixing frame away from the first contact portion. After the heat on the side of the second contact portion on the heat-conducting fixing frame away from the first contact portion is transferred away by the heat dissipation pipe and the first heat dissipation fin, the temperature on this side will be lower than that on other areas, further making the temperature difference between the second contact portion and this side larger. The larger the temperature difference, the higher the heat conduction efficiency. As a result, the temperature on the side of the second contact portion on the heat-conducting fixing frame away from the first contact portion is lower than the temperature on the side of the second contact portion on the heat-conducting fixing frame close to the first contact portion, so that more heat can be transferred to the side of the second contact portion on the heat-conducting fixing frame away from the first contact portion.

[0022] (5) The second contact portion and the third contact portion are respectively in contact with the heating device with higher heat output. Both of them are arranged with the first contact portion separated by the main hollow portion, which can effectively prevent heat from being transferred to the first contact portion with lower temperature. Furthermore, the third contact portion that is in contact with the third heating device with the highest heat output is surrounded by hollow portions, which effectively limits the heat of the third contact portion from being transferred out of the area enclosed by the sub-hollow portions and the main hollow portion, thereby avoiding affecting the second heating device in contact with the second contact portion. Furthermore, a second heat dissipation fin is fixedly arranged on the back side corresponding to the third contact portion, which can make the third contact portion that is in contact with the third heating device with the highest heat output dissipate heat faster. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 This is a schematic diagram of the internal structure of a projection device according to a preferred embodiment of the present invention;

[0024] Figure 2 yes Figure 1 A schematic diagram of the top view of the heat conducting fixing frame of the projection equipment;

[0025] Figure 3 is a schematic top view of the heat-conducting fixing frame in a further embodiment;

[0026] Figure 4 is a schematic structural diagram of a heat-conducting fixing frame in a further embodiment;

[0027] Figure 5 is a schematic diagram of the internal structure of a projection device according to a further embodiment of the present invention;

[0028] Figure 6 yes Figure 5 An exploded diagram of the internal structure of the projection device.

[0029] Description of Figure Numbers:

[0030] 10. Heat conduction fixing bracket; 101. Platform base; 102. Bent base; 1021. Avoidance opening; 11. First contact part; 12. Second contact part; 13. Third contact part; 14. Main hollow part; 141. Intermediate sub-hollow part; 142. Edge sub-hollow part; 15. Secondary hollow part; 16. Sub-hollow part; 171. First heat conduction channel; 172. Second heat conduction channel;

[0031] 20. Main control board; 21. First heating device; 22. Second heating device;

[0032] 30. Heat dissipation pipe;

[0033] 41. First heat dissipation fin; 42. Second heat dissipation fin; 421. Thermal grease;

[0034] 51. Optical engine; 52. Fan. Detailed implementation mode

[0035] The following makes a detailed description of the implementation mode of the present utility model. It should be emphasized that the following description is merely exemplary and not intended to limit the scope and application of the present utility model.

[0036] It should be noted that when an element is referred to as "fixed to" or "disposed on" another element, it can be directly on the other element or indirectly on the other element. When an element is referred to as "connected to" another element, it can be directly connected to the other element or indirectly connected to the other element. In addition, the connection can be for fixing or for circuit / signal connection.

[0037] It should be understood that the orientation or positional relationship indicated by the terms "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the embodiments of the present utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus cannot be construed as a limitation of the present utility model.

[0038] In addition, the terms "first" and "second" are only used for descriptive purposes and cannot be construed as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, the features defined with "first" and "second" may explicitly or implicitly include one or more of such features. In the description of the embodiments of the present utility model, "a plurality" means two or more unless otherwise specifically defined.

[0039] Such as Figure 1As shown in the figure, a preferred embodiment of the present utility model discloses a projection device, which includes a body housing, a heat-conducting fixing frame 10, a first heating device 21, and a second heating device 22. The heat-conducting fixing frame 10, the first heating device 21, and the second heating device 22 are installed inside the body housing. The heat-conducting fixing frame 10 is provided with a first contact portion 11 and a second contact portion 12. The first heating device 21 is in contact with the first contact portion 11, and the second heating device 22 is in contact with the second contact portion 12. A main hollow portion 14 is formed between the first contact portion 11 and the second contact portion 12.

[0040] In a specific embodiment, the projection device further includes a bracket. The body housing is rotatably connected to the bracket. The bracket partially extends into the body housing and is fixed to the heat-conducting fixing frame 10 in the body housing to ensure the stability of the structure. Components such as an optical engine 51, a fan 52, a first heat sink fin 41, a main control board 20, and a speaker (not shown in the figure) are provided in the body housing. The heat-conducting fixing frame 10 functions to fix these components. Among them, the DMD chip of the optical engine 51 and the chips on the main control board 20 generate relatively high heat. Therefore, heat dissipation can be achieved by contacting the heat-conducting fixing frame 10 in the present application. For example, the first heating device 21 and the second heating device 22 in this embodiment are respectively chips provided on the main control board 20, and the chips are located on the side of the main control board 20 facing the heat-conducting fixing frame 10. The heat-conducting fixing frame 10 can be made of metal or other materials with high heat conduction efficiency, for example.

[0041] For the projection device proposed in the preferred embodiment of the present utility model, when using the heat-conducting fixing frame 10 to fix the components of the projection device, the cross-sectional area of heat transfer is reduced by using the method of opening a hollow portion, and the high-heat area and the low-heat area of the main control board 20 are "isolated" to achieve the effect that the high-temperature area and the low-temperature area do not affect each other on the same heat-conducting fixing frame 10.

[0042] Combined Figure 2 , the first contact portion 11 and the second contact portion 12 are arranged at intervals along a first direction, the main hollow portion 14 extends along a second direction, the first direction is perpendicular to the second direction, and the center connection line of the first contact portion 11 and the second contact portion 12 passes through the main hollow portion 14. Based on the principle of heat conduction, when the temperature at one end of the fixing material is higher than that at the other end, heat will automatically transfer from the hot end to the cold end; among them, according to the formula of Fourier's law: In the formula, ΔQ refers to the heat transferred through the cross-section ΔS along the positive x-axis direction within the time Δt, and ΔS is the cross-sectional area of the isotropic solid material in the x-axis direction. It refers to the temperature change rate of the material in the x-axis direction. The negative sign indicates that heat is transferred to the low-temperature area, and the constant λ is the thermal conductivity. Through this Fourier's law formula, it can be known that the heat transferred in the x-axis direction per unit time is proportional to the cross-sectional area of the conduction channel in this direction, that is, the smaller the cross-sectional area, the slower the heat transfer. Therefore, by arranging the first contact part 11 and the second contact part 12 at intervals in the first direction, the main hollow part 14 extends and is opened in the second direction perpendicular to the first direction, and making the center connection line of the first contact part 11 and the second contact part 12 pass through the main hollow part 14, the connection cross-section between the first contact part 11 and the second contact part 12 can be made smaller, and the heat transfer path can be made longer, so that it can be achieved that: even if the thermal conductivity of the thermal conduction fixing frame 10 is very good, the heat will not be quickly transferred to the opposite side of the main hollow part 14.

[0043] Furthermore, the first contact part 11 and the second contact part 12 can be formed in the structure of bosses respectively to raise a certain area on the thermal conduction fixing frame 10 to contact the chip, so as to avoid collisions between other electronic components on the main control board 20 and the thermal conduction fixing frame 10. Among them, the structure of the boss can be integrally formed with the thermal conduction fixing frame 10, or can be formed by a flexible thermal conductive material; among them, through the structure of the boss formed by the flexible thermal conductive material, the possibility of damage to the chip directly contacting the thermal conduction fixing frame 10 made of metal material due to the vibration of the internal structure can be further reduced; specifically, the flexible thermal conductive material is, for example, thermal conductive foam.

[0044] As Figure 3 shown, in a further embodiment, the main hollow part 14 includes a plurality of sub-hollow parts, and the plurality of sub-hollow parts are arranged at intervals in the first direction. The plurality of sub-hollow parts include a plurality of intermediate sub-hollow parts 141 and multiple groups of edge sub-hollow part groups. Each group of edge sub-hollow part groups includes two edge sub-hollow parts 142. The intermediate sub-hollow parts 141 and the edge sub-hollow part groups are arranged at intervals in the first direction. The intermediate sub-hollow parts 141 extend and are opened in the second direction. First heat conduction channels 171 are respectively formed between the edges of the thermal conduction fixing frame 10 and the two ends of the intermediate sub-hollow parts 141 in the second direction; the two edge sub-hollow parts 142 in each group of edge sub-hollow part groups extend from the opposite side edges of the thermal conduction fixing frame 10 in the second direction towards the middle, and a second heat conduction channel 172 is formed between the two edge sub-hollow parts 142 opposite to each other in the second direction. Furthermore, the intermediate sub-hollow parts 141 and the edge sub-hollow part groups are alternately opened in the first direction in sequence, and the first heat conduction channels 171 are opposite to the edge sub-hollow parts 142 in the first direction, and the second heat conduction channels 172 are opposite to the intermediate sub-hollow parts 141 in the first direction. For example Figure 3In the specific example shown, the main hollow portion 14 includes three intermediate sub-hollow portions 141 and two groups of edge sub-hollow portion groups. Specifically, the intermediate sub-hollow portions 141, two edge sub-hollow portions 142, an intermediate sub-hollow portion 141, two edge sub-hollow portions 142, and an intermediate sub-hollow portion 141 are sequentially arranged along the first direction. By setting it in this way, the heat conduction distance between the first contact portion 11 and the second contact portion 12 can be increased to a greater extent, and it is ensured that this distance has a smaller heat conduction cross-section, further reducing the temperature influence between the first contact portion 11 and the second contact portion 12.

[0045] Referring again to Figure 1 , in a further embodiment, the projection device further includes a heat dissipation pipe 30 and a first heat dissipation fin 41. The heat generation amount of the second heat generating device 22 is higher than that of the first heat generating device 21. The first end of the heat dissipation pipe 30 is connected to the side of the second contact portion 12 on the heat conduction fixing frame 10 away from the first contact portion 11, and the second end of the heat dissipation pipe 30 is connected to the first heat dissipation fin 41. After the heat on the side of the second contact portion 12 on the heat conduction fixing frame 10 away from the first contact portion 11 is transferred away through the heat dissipation pipe 30 and the first heat dissipation fin 41, the temperature of this side will be lower than that of other regions, further making the temperature difference between the second contact portion 12 and this side larger. The larger the temperature difference, the higher the heat conduction efficiency; thus, the temperature of the side of the second contact portion 12 on the heat conduction fixing frame 10 away from the first contact portion 11 is lower than the temperature of the side of the second contact portion 12 on the heat conduction fixing frame 10 close to the first contact portion 11, enabling more heat to be transferred to the side of the second contact portion 12 on the heat conduction fixing frame 10 away from the first contact portion 11.

[0046] As Figure 4 shown, in a further embodiment, the heat conduction fixing frame 10 includes a platform base 101 and a bent base 102. The platform base 101 and the bent base 102 are perpendicularly connected to each other. The structure of the boss forming the first contact portion 11 and the second contact portion 12 is arranged on the platform base 101, and the structure of the boss and the bent base 102 are located on opposite sides of the platform base 101. The main hollow portion 14 is opened on the platform base 101. The bent base 102 is used to support the platform base 101, improving the structural stability. At the same time, it can also be used as a wind guiding structure inside the projection device to block some channels and prevent hot air from flowing back. Further, a secondary hollow portion 15 is opened on the bent base 102. The secondary hollow portion 15 separates the left and right sides of the bent base 102. The extending direction of the secondary hollow portion 15 is perpendicular to the extending direction of the main hollow portion 14, and the secondary hollow portion 15 is communicated with the main hollow portion 14, so that a relatively large gap is formed between the two side structures of the heat conduction fixing frame 10, which can prevent the heat of the first contact portion 11 and the second contact portion 12 from being transferred to each other through the bent base 102.

[0047] Further, avoidance openings 1021 are also formed in the bent substrates 102 on the left and right sides for corresponding to the air outlets of the fan 52. A fan 52 is provided below the platform substrate 101, and the bent substrate 102 abuts against the air outlet side of the fan 52. The first heat dissipation fins 41 are also arranged at the bottom of the platform substrate 101 to facilitate dissipating the heat transferred from the first contact portion 11 and the second contact portion 12. Meanwhile, the heat can also be blown away by the fan 52 below the platform substrate 101.

[0048] As Figure 5 , in a further embodiment, the projection device further includes a third heat generating device. A third contact portion 13 in contact with the third heat generating device is provided on the heat conducting fixing frame 10. The heat generation amount of the third heat generating device is higher than that of the second heat generating device 22, and the heat generation amount of the second heat generating device 22 is higher than that of the first heat generating device 21. The third contact portion 13 and the second contact portion 12 are located on the same side of the main hollow portion 14. A sub-hollow portion 16 is formed on the heat conducting fixing frame 10, and the third contact portion 13 is located in the area enclosed by the sub-hollow portion 16 and the main hollow portion 14. The third heat generating device may be a chip on the main control board 20, or may also be a heat conducting tube connected to the light source of the optical engine 51. In a specific example, for example, the first contact portion 11 is a low-temperature boss, and the corresponding first heat generating device 21 in contact with the low-temperature boss is an Android board, the second contact portion 12 is a high-temperature boss, and the corresponding second heat generating device 22 in contact with the high-temperature boss is a DLP board, and the third contact portion 13 is an extra-high-temperature boss, and the corresponding third heat generating device in contact with the extra-high-temperature boss is a boost board. Among them, the DLP board and the boost board respectively contacted by the second contact portion 12 and the third contact portion 13 are both high heat sources, and they are arranged with the first contact portion 11 separated by the main hollow portion 14, which can effectively prevent heat from being transferred to the relatively low-temperature first contact portion 11. Among them, there are hollow portions around the third contact portion 13 contacted by the third heat generating device with the highest heat generation amount, so as to effectively limit the heat transfer of the third contact portion 13 out of the area enclosed by the sub-hollow portion 16 and the main hollow portion 14 and avoid affecting the second heat generating device in contact with the second contact portion 12.

[0049] As Figure 6 , further, the projection device further includes second heat dissipation fins 42, and the second heat dissipation fins 42 are fixedly arranged on the back surface of the heat conducting fixing frame 10 corresponding to the third contact portion 13. Specifically, the second heat dissipation fins 42 are fixed on the back surface corresponding to the third contact portion 13 through heat conducting adhesive materials such as heat conducting silicone grease 421, and other areas of the second heat dissipation fins 42 are spaced from the heat conducting fixing frame 10 to avoid the heat of the third heat generating device being transferred to the second heat dissipation fins 42 and then conducted back to the heat conducting fixing frame 10. A fan 52 is provided at the bottom of the heat conducting fixing frame 10, and the second heat dissipation fins 42 are located on the air inlet side of the fan 52, which is beneficial to quickly dissipating the heat of the third heat generating device with the highest heat generation amount on the third contact portion 13.

[0050] The background part of the present utility model may include background information about the problems or environment of the present utility model, rather than the prior art described by others. Therefore, the content included in the background art section is not an admission by the applicant of the prior art.

[0051] The above content is a further detailed description of the present utility model in combination with specific / preferred embodiments, and it cannot be determined that the specific implementation of the present utility model is only limited to these descriptions. For those of ordinary skill in the technical field to which the present utility model pertains, without departing from the concept of the present utility model, several alternatives or modifications can be made to the described embodiments, and these alternative or modified forms should all be regarded as falling within the protection scope of the present utility model. In the description of this specification, the description with reference to terms such as "one embodiment", "some embodiments", "preferred embodiment", "example", "specific example", or "some examples", etc., means that the specific features, structures, materials, or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the present utility model. In this specification, the schematic expressions of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described can be combined in a suitable manner in any one or more embodiments or examples. In addition, without contradiction, those skilled in the art can combine and combine the different embodiments or examples described in this specification and the features of different embodiments or examples. Although the embodiments of the present utility model and their advantages have been described in detail, it should be understood that various changes, substitutions, and alterations can be made herein without departing from the scope defined by the appended claims.

Claims

1. A projection device, characterized in that, It includes a fuselage shell, a heat-conducting fixing frame, a first heating device and a second heating device. The heat-conducting fixing frame, the first heating device and the second heating device are installed inside the fuselage shell. The heat-conducting fixing frame is provided with a first contact part and a second contact part. The first heating device contacts the first contact part, and the second heating device contacts the second contact part. A main hollow part is formed between the first contact part and the second contact part.

2. The projection device according to claim 1, characterized in that, The first contact part and the second contact part are arranged at intervals along a first direction. The main hollow part extends along a second direction. The first direction is perpendicular to the second direction, and the center connection line of the first contact part and the second contact part passes through the main hollow part.

3. The projection device according to claim 2, characterized in that, The main hollow part includes a plurality of sub-hollow parts, and the plurality of sub-hollow parts are arranged at intervals along the first direction.

4. The projection device according to claim 3, characterized in that, The plurality of sub-hollow parts include at least one middle sub-hollow part and at least one group of edge sub-hollow part groups. Each group of edge sub-hollow part groups includes two edge sub-hollow parts. The middle sub-hollow part and the edge sub-hollow part groups are arranged at intervals along the first direction. The middle sub-hollow part extends along the second direction. First heat-conducting channels are respectively formed between the edge of the heat-conducting fixing frame and both ends of the middle sub-hollow part along the second direction. The two edge sub-hollow parts in each group of edge sub-hollow part groups respectively extend from the opposite side edges of the heat-conducting fixing frame along the second direction towards the middle, and a second heat-conducting channel is formed between the two edge sub-hollow parts opposite to each other along the second direction.

5. The projection device according to claim 4, characterized in that, The middle sub-hollow part and the edge sub-hollow part groups are alternately arranged in sequence along the first direction, and the first heat-conducting channel is opposite to the edge sub-hollow part in the first direction, and the second heat-conducting channel is opposite to the middle sub-hollow part in the first direction.

6. The projection device according to claim 1, wherein The heat-conducting fixing frame includes a platform base, a bent base and a boss. The platform base and the bent base are perpendicularly connected to each other. The boss is arranged on the platform base to form the first contact part and the second contact part of the heat-conducting fixing frame. The boss and the bent base are located on the opposite sides of the platform base, and the main hollow part is formed on the platform base.

7. The projection device according to claim 6, characterized in that, A secondary hollow part is formed on the bent base. The extending direction of the secondary hollow part is perpendicular to the extending direction of the main hollow part, and the secondary hollow part is communicated with the main hollow part.

8. The projection device according to claim 1, characterized in that, It further includes a heat dissipation pipe and a first heat dissipation fin. The heat generation amount of the second heating device is higher than that of the first heating device. The first end of the heat dissipation pipe is connected to the side of the second contact part of the heat-conducting fixing frame away from the first contact part, and the second end of the heat dissipation pipe is connected to the first heat dissipation fin.

9. The projection device according to claim 1, wherein Further included is a third heating device, and a third contact portion in contact with the third heating device is provided on the heat-conducting fixing bracket. The calorific value of the third heating device is higher than that of the second heating device, and the calorific value of the second heating device is higher than that of the first heating device. The third contact portion and the second contact portion are located on the same side of the main hollow portion. A sub-hollow portion is formed on the heat-conducting fixing bracket, and the third contact portion is located in the area enclosed by the sub-hollow portion and the main hollow portion.

10. The projection device according to claim 9, characterized in that, Further included is a second heat sink fin, and the second heat sink fin is fixedly arranged on the back surface of the heat-conducting fixing bracket corresponding to the third contact portion.

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