Heat dissipation device for computer

Abstract

The utility model relates to the technical field of computers, and discloses a computer heat dissipation device which comprises a case, a plurality of first heat dissipation grooves are formed in the surface of the case, a heat dissipation assembly is arranged on one side of the case and comprises a first groove, and a plurality of second heat dissipation grooves are formed in the first groove. Guide rails are symmetrically arranged on one side of the machine box, sliding grooves are formed in the guide rails on the two sides, a plurality of sliding blocks are movably connected to the guide rails on the two sides, fans are installed on the sliding blocks on the two sides, second grooves are formed in the surfaces of the fans, and magnetic stop nets are fixedly attracted to the interiors of the first grooves and the interiors of the second grooves respectively; according to the computer case, by designing the heat dissipation assembly, heat dissipation can be conducted on the interior of the computer case on the outer side of the computer case during heat dissipation of the computer case, meanwhile, dust generated during heat dissipation can be blocked, the blocked dust can be cleaned, the situation that heat dissipation of the computer case is affected by the adsorbed dust is avoided, and the heat dissipation effect of the computer case during operation is effectively improved.

Description

Technical Field

[0001] This application relates to the field of computer technology, and more particularly to a heat dissipation device for a computer. Background Art

[0002] With the development of the national economy and technology, computers have become an indispensable tool in our lives and work. A large number of integrated circuits are used in computer components. However, high temperature is the main destructive factor for integrated circuits; it is mainly reflected in the hazards of semiconductor electronic components in the computer and the hazards to cathode ray tubes. In a high-temperature environment, the internal system of the computer runs slowly, accelerating the loss of the computer, causing the computer to age prematurely or even become scrapped. The high temperature inside the computer mainly comes from the inside of the computer, or rather, the inside of the integrated circuit. Currently, the existing computers generally use internal fans to dissipate heat from the components, but a large amount of dust will be adsorbed on the filter during heat dissipation, which will affect the heat dissipation effect. Therefore, a heat dissipation device for a computer is proposed to solve the problems described in the above background art.

[0003] The above information disclosed in this background art is only used to increase the understanding of the background art of this application. Therefore, it may include prior art that is not known to those of ordinary skill in the art. Summary of the Utility Model

[0004] In order to solve the problem that the adsorbed dust will affect the heat dissipation effect of the computer, this application provides a heat dissipation device for a computer.

[0005] A heat dissipation device for a computer provided by this application adopts the following technical solution:

[0006] A heat dissipation device for a computer includes a chassis. A plurality of first heat dissipation slots are opened on the surface of the chassis. A heat dissipation component is provided on one side of the chassis. The heat dissipation component includes a first groove which is opened on one side of the chassis. A plurality of second heat dissipation slots are opened inside the first groove. Guide rails are symmetrically provided on one side of the chassis. Sliding grooves are opened on both guide rails. A plurality of sliders are movably connected to both guide rails. A blower is installed on both sliders. A second groove is opened on the surface of the blower. Magnetic adsorption nets are respectively adsorbed and fixed inside the first groove and the second groove.

[0007] Preferably, the first groove is arranged between the two guide rails, and the two guide rails are vertically arranged on one side of the chassis.

[0008] Preferably, limit plates are fixedly connected to the bottom ends of both guide rails, and the sliders are movably clamped on the sliding grooves.

[0009] Preferably, the two guide rails are fixed to the chassis by a plurality of bolts, and the blower is horizontally arranged on the sliders.

[0010] Preferably, the fan is arranged outside a plurality of second heat dissipation grooves.

[0011] In summary, the present application includes the following beneficial technical effects:

[0012] By designing the heat dissipation component, when the computer case dissipates heat; the primary heat dissipation is carried out through the first heat dissipation groove, and then the slider at the rear side of the fan is clamped inside the sliding grooves on both sides of the guide rails, so that the fan is installed outside a plurality of second heat dissipation grooves. The fan is started, and the high-temperature air inside the case is discharged through the fan. At the same time, the low-temperature air outside can also enter the case. Meanwhile, the magnetic dust screen blocks the dust during heat dissipation; subsequently, by disassembling the fan and removing the magnetic dust screens inside the first groove and the second groove, the magnetic dust screens are cleaned; compared with the prior art, this design can dissipate heat inside the case outside the case, and at the same time can block the dust during heat dissipation, and can also clean the blocked dust, avoiding the adsorbed dust from affecting the heat dissipation of the case, and effectively improving the heat dissipation effect during the operation of the case. Description of the Drawings

[0013] Figure 1 is a schematic diagram of the overall structure of the device in the embodiment of the application;

[0014] Figure 2 is a schematic side view structure diagram of the device in the embodiment of the application;

[0015] Figure 3 is a schematic rear view structure diagram of the device in the embodiment of the application.

[0016] Description of the reference numerals: 1, case; 2, first heat dissipation groove; 3, heat dissipation component; 4, first groove; 5, second heat dissipation groove; 6, guide rail; 7, sliding groove; 8, limiting plate; 9, bolt; 10, slider; 11, fan; 12, second groove; 13, magnetic dust screen. Detailed Description of the Invention

[0017] The following further describes the present application in detail with reference to Figure 1 —3.

[0018] The embodiment of the present application discloses a heat dissipation device for a computer. Referring to Figure 1 , a heat dissipation device for a computer is used for heat dissipation during the operation of the computer, which is convenient for improving the performance of the computer. It includes a case 1, through which it is convenient to install various components of the computer. A plurality of first heat dissipation grooves 2 are opened on the surface of the case 1, and a dust screen is arranged inside the first heat dissipation grooves 2. Through the first heat dissipation grooves 2, it is convenient for the components inside the case 1 to dissipate heat during operation. A heat dissipation component 3 is arranged on one side of the case 1, and the case 1 is dissipated heat through the heat dissipation component 3, thereby further improving the heat dissipation effect during the operation of the components inside the case 1;

[0019] During use, initial heat dissipation is carried out through multiple first heat dissipation grooves 2 on the surface of the chassis 1, and at the same time, the chassis 1 is further cooled by the heat dissipation component 3, thereby further improving the heat dissipation effect when the internal components of the chassis 1 are operating.

[0020] Referring to Figures 2-3 , the heat dissipation component 3 includes a first groove 4 opened on one side of the chassis 1. A plurality of second heat dissipation grooves 5 are opened inside the first groove 4. Through the plurality of second heat dissipation grooves 5, it is convenient for the components inside the chassis 1 to dissipate heat. Guide rails 6 are symmetrically arranged on one side of the chassis 1. The first groove 4 is arranged between the two guide rails 6. The two guide rails 6 are vertically arranged on one side of the chassis 1. Sliding grooves 7 are opened on the two guide rails 6. Limiting plates 8 are fixedly connected to the bottom ends of the two guide rails 6. The two guide rails 6 are fixed to the chassis 1 through a plurality of bolts 9. A plurality of sliders 10 are movably connected to the two guide rails 6. The sliders 10 are movably clamped in the sliding grooves 7, so that the sliders 10 can move inside the sliding grooves 7 on the guide rails 6, thus facilitating the subsequent removal of the fan 11. A fan 11 is installed on the two sliders 10. The fan 11 is horizontally arranged on the slider 10. The fan 11 is arranged outside the plurality of second heat dissipation grooves 5. Through the fan 11, it is convenient to discharge the high-temperature air inside the chassis 1, and at the same time, it can also make the low-temperature air outside enter the chassis 1. A second groove 12 is opened on the surface of the fan 11. Magnetic adsorption nets 13 are respectively adsorbed and fixed inside the first groove 4 and the second groove 12; through the magnetic adsorption nets 13, it is convenient to block the dust during heat dissipation, and at the same time, by disassembling and cleaning the magnetic adsorption nets 13, it is convenient to improve the heat dissipation effect; at the idle place of this device, all the above-mentioned electrical components, which refer to power elements, electrical components, and the adapted controllers and power supplies, are connected through wires. For the specific connection means, refer to the following working principle for the sequence of operations of each electrical component to complete the electrical connection. The detailed connection means are well-known techniques in this field;

[0021] During use, the slider 10 behind the fan 11 is clamped inside the sliding grooves 7 on the two guide rails 6, so that the fan 11 is installed outside the plurality of second heat dissipation grooves 5. Then the fan 11 is started. Through the fan 11, the high-temperature air inside the chassis 1 is discharged, and at the same time, the low-temperature air outside can also enter the chassis 1. At the same time, the magnetic adsorption net 13 blocks the dust during heat dissipation; subsequently, by disassembling the fan 11, the magnetic adsorption nets 13 inside the first groove 4 and the second groove 12 are removed, and the magnetic adsorption nets 13 are cleaned to avoid the adsorbed dust affecting the heat dissipation effect.

[0022] The implementation principle of a heat dissipation device for a computer in an embodiment of the present application is as follows: During use, preliminary heat dissipation is carried out through a plurality of first heat dissipation slots 2 on the surface of the chassis 1. Then, the slider 10 at the rear of the fan 11 is snapped into the chute 7 on the two side guide rails 6, so that the fan 11 is installed outside a plurality of second heat dissipation slots 5. The fan 11 is started, and the high-temperature air inside the chassis 1 is discharged through the fan 11. At the same time, the low-temperature air outside can also enter the chassis 1. Meanwhile, the dust during heat dissipation is blocked by the magnetic attraction dust screen 13. Subsequently, by disassembling the fan 11 and removing the magnetic attraction dust screen 13 inside the first groove 4 and the second groove 12, the magnetic attraction dust screen 13 is cleaned to prevent the adsorbed dust from affecting the heat dissipation effect.

[0023] Finally, several points should be noted: First, in the description of the present application, it should be noted that unless otherwise specified and limited, the terms "installation", "connection", and "coupling" should be understood in a broad sense. It can be a mechanical connection or an electrical connection, or it can be the communication inside two components. It can be directly connected. The terms "upper", "lower", "left", "right", etc. are only used to represent the relative position relationship. When the absolute position of the object being described changes, the relative position relationship may change.

[0024] Second: In the attached drawings of the disclosed embodiments of the present utility model, only the structures related to the disclosed embodiments of the present disclosure are involved. For other structures, reference can be made to the general design. Without conflict, the same embodiment and different embodiments of the present utility model can be combined with each other.

[0025] Finally: The above are only the preferred embodiments of the present utility model and are not used to limit the present utility model. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present utility model shall be included within the protection scope of the present utility model.

[0026] The above are all the preferred embodiments of the present application and do not limit the protection scope of the present application accordingly. Therefore, all equivalent changes made according to the structure, shape, and principle of the present application shall be covered within the protection scope of the present application.

Claims

1. A heat dissipation device for a computer, comprising a chassis (1), characterized in that: A plurality of first heat dissipation grooves (2) are formed on the surface of the chassis (1). A heat dissipation component (3) is provided on one side of the chassis (1). The heat dissipation component (3) includes a first groove (4) which is formed on one side of the chassis (1). A plurality of second heat dissipation grooves (5) are formed inside the first groove (4). Guide rails (6) are symmetrically provided on one side of the chassis (1). Sliding grooves (7) are formed on both sides of the guide rails (6). A plurality of sliders (10) are movably connected to both sides of the guide rails (6). A fan (11) is installed on both sides of the sliders (10). A second groove (12) is formed on the surface of the fan (11). Magnetic adsorption nets (13) are respectively adsorbed and fixed inside the first groove (4) and the second groove (12).

2. A heat dissipation device for a computer according to claim 1, characterized in that: The first groove (4) is arranged between the guide rails (6) on both sides, and the guide rails (6) on both sides are vertically arranged on one side of the chassis (1).

3. A heat dissipation device for a computer according to claim 1, characterized in that: Limit plates (8) are fixedly connected to the bottom ends of the guide rails (6) on both sides, and the sliders (10) are movably clamped on the sliding grooves (7).

4. A heat dissipation device for a computer according to claim 1, characterized in that: The guide rails (6) on both sides are fixed to the chassis (1) through a plurality of bolts (9), and the fan (11) is horizontally arranged on the sliders (10).

5. A heat dissipation device for a computer according to claim 1, characterized in that: The fan (11) is arranged outside a plurality of second heat dissipation grooves (5).

Images