Fingerprint identification device, fingerprint identification assembly and electronic equipment

Abstract

The utility model relates to a fingerprint identification device, a fingerprint identification assembly and electronic equipment. In one aspect, the fingerprint recognition device includes: a circuit board including a first surface and a second surface opposite to each other; the ultrasonic sensor comprises a substrate and a transducer, the transducer is arranged on the third surface of the substrate, and one side edge part of the third surface is attached to the first surface; and a bracket supporting an attachment region of the first surface by abutting against the second surface, where the first surface is attached to the third surface at the attachment region. As a result, it is possible to reduce adverse effects of bending of the circuit board on attachment of the substrate to the circuit board.

Description

Technical Field

[0001] The present disclosure relates to the technical field of fingerprint recognition, and more particularly, to a fingerprint recognition device, a fingerprint recognition assembly, and an electronic device including the fingerprint recognition device or the fingerprint recognition assembly. Background Art

[0002] Fingerprint recognition technology is a technology that uses the uniqueness of an individual's fingerprint for identity verification, and it has been widely applied to multiple fields involving identity verification, such as the opening of usage permissions for electronic devices such as mobile phones and tablet computers, and the identity recognition for consumer payments.

[0003] As one of the main fingerprint recognition technologies, ultrasonic fingerprint recognition technology uses ultrasonic waves to detect the concave and convex textures of fingerprints, and has advantages such as high recognition accuracy and being less affected by dirt on the fingers. Summary of the Utility Model

[0004] This section provides a general overview of the present disclosure, rather than a full disclosure of the entire scope or all features of the present disclosure.

[0005] An object of the present disclosure is to provide a fingerprint recognition device, a fingerprint recognition assembly, and an electronic device that can enhance the attachment stability between an ultrasonic sensor and a circuit board.

[0006] To achieve the above object, according to one aspect of the present disclosure, there is provided a fingerprint recognition device, which includes:

[0007] A circuit board, including a first surface and a second surface opposite to each other;

[0008] An ultrasonic sensor, including a substrate and a transducer, the transducer is disposed on a third surface of the substrate, and a side edge of the third surface is attached to the first surface; and

[0009] A bracket, which supports an attachment area of the first surface by abutting against the second surface, wherein the first surface is attached to the third surface at the attachment area.

[0010] In some embodiments, the abutting area of the bracket may overlap with a first area of the second surface, wherein the bracket abuts against the second surface at the abutting area, and the first area is mirror-symmetrical to the attachment area with respect to the circuit board.

[0011] In some embodiments, the abutting area may include a first portion, the first portion overlaps with the first area, and the first portion is planar.

[0012] In some embodiments, the first portion may cover a long side of the first area, wherein the long side is farther from the transducer than the other long side of the first area.

[0013] In some embodiments, the abutting region may further include a second part adjacent to the first part, and the second part is an arcuate surface.

[0014] In some embodiments, the abutting region of the bracket may not overlap with the first region of the second surface, wherein the bracket abuts against the second surface at the abutting region, and the first region is mirror-symmetrical to the attachment region with respect to the circuit board.

[0015] In some embodiments, the bracket may include a first recess, which is arranged between the transducer and the bracket when the bracket abuts against the second surface, so as to form a gap between the transducer and the bracket.

[0016] In some embodiments, the opening of the first recess may cover the transducer when viewed in a first direction, wherein the first direction is perpendicular to the plane where the third surface is located.

[0017] In some embodiments, the fingerprint recognition device may further include a functional component for receiving signals from the ultrasonic sensor, and the functional component is arranged on the second surface.

[0018] In some embodiments, the bracket may include a second recess, which is arranged on a side of the bracket away from the ultrasonic sensor, and the second recess allows the functional component to be arranged therein.

[0019] In some embodiments, the fingerprint recognition device may further include a reinforcing member, which is arranged on the first surface, and the position of the reinforcing member corresponds to the position of the functional component to support the functional component.

[0020] In some embodiments, the bracket may extend beyond two opposite sides of the substrate, wherein each of the two sides extends along the short side direction of the attachment region.

[0021] In some embodiments, the bracket may be integrally formed.

[0022] In some embodiments, the bracket may be connected to the second surface.

[0023] In some embodiments, the side part may be the side part where the long side of the substrate is located.

[0024] In some embodiments, the substrate may be electrically connected to the circuit board at the attachment region by an anisotropic conductive film bonding method, or the substrate may be electrically connected to the circuit board by a wire bonding method on the third surface.

[0025] In some embodiments, the substrate may be electrically connected to the second surface of the circuit board by a wire bonding method on the third surface.

[0026] In some embodiments, the abutment region of the bracket may be spaced apart from the bonding interval on the second surface, where the bracket abuts against the second surface at the abutment region, and the lead is bonded to the second surface at the bonding region.

[0027] In some embodiments, the fingerprint recognition device is configured to be assembled to a button of an electronic device and assembled such that the fourth surface of the substrate is located below the button, where the fourth surface is opposite to the third surface.

[0028] In some embodiments, the fingerprint recognition device is configured to be assembled to a side of the electronic device.

[0029] According to another aspect of the present disclosure, there is provided a fingerprint recognition assembly, including:

[0030] a side frame for an electronic device; and

[0031] the fingerprint recognition device according to any one of the above embodiments,

[0032] wherein the side frame is connected to the bracket.

[0033] In some embodiments, the side frame may be integrally formed with the bracket.

[0034] According to still another aspect of the present disclosure, there is provided an electronic device, including the fingerprint recognition device according to any one of the above embodiments, or including the fingerprint recognition assembly according to any one of the above embodiments.

[0035] According to the above technical solution, by providing a bracket and enabling the bracket to support the attachment region of the first surface of the circuit board by abutting against the second surface of the circuit board, the pulling force on the attachment region caused by the bending of the circuit board can be resisted. Thus, the possibility of attachment loosening or being damaged due to the bending can be reduced, and further, the possibility of a failure in the electrical connection between the ultrasonic sensor and the circuit board can be reduced. Therefore, the adverse effects of the bending on the function and lifespan of the fingerprint recognition device can be reduced. BRIEF DESCRIPTION OF THE DRAWINGS

[0036] Through the following description with reference to the drawings, the features and advantages of the embodiments of the present disclosure will become more readily understood. The drawings are not drawn to scale, and some features may be enlarged or reduced to show details of specific components. In the drawings:

[0037] Figure 1 FIG. is a schematic perspective view of a fingerprint recognition device according to an embodiment of the present disclosure as viewed from side A.

[0038] Figure 2 is Figure 1 a schematic perspective view of the fingerprint recognition device shown in as viewed from side A'.

[0039] Figure 3 The Figure 1 schematic exploded view of the fingerprint recognition device shown in the figure from the B-side perspective.

[0040] Figure 4 The Figure 1 schematic exploded view of the fingerprint recognition device shown in the figure from the A-side perspective.

[0041] Figure 5 The Figure 1 schematic cross-sectional view of the fingerprint recognition device shown in the figure along line A-A'.

[0042] Figure 6 The Figure 1 schematic cross-sectional view of the fingerprint recognition device shown in the figure along line B-B'.

[0043] Figure 7 The Figure 1 schematic side view of the bracket of the fingerprint recognition device shown in the figure.

[0044] Figure 8 The figure schematically shows that the substrate is electrically connected to the circuit board through an anisotropic conductive film.

[0045] Figure 9 The figure schematically shows that the substrate is electrically connected to the circuit board through leads.

[0046] Figure 10 The

[0047] Figure 11 The figure shows in a partial schematic perspective view the situation where the fingerprint recognition device is arranged at the Figure 10 side border of the electronic device shown in the figure.

[0048] Figure 12 The

[0049] Figure 13 The Figure 12 schematic cross-sectional view similar to that of the fingerprint recognition device including the Figure 5 bracket shown in the figure.

[0050] Figure 14 The

[0051] Figure 15 The Figure 14 schematic exploded view of the fingerprint recognition device shown in the figure from the C-side perspective.

[0052] Figure 16 The Figure 14 schematic cross-sectional view of the fingerprint recognition device shown in the figure along line C-C'.

[0053] Figure 17 is Figure 14 a schematic cross-sectional view along line D-D' of the fingerprint recognition device shown in

[0054] Figure 18 a partial schematic cross-sectional view of an electronic device according to an embodiment of the present disclosure.

[0055] Figure 19 a partial schematic cross-sectional view of an electronic device according to another embodiment of the present disclosure.

[0056] Figure 20 a partial schematic cross-sectional view of an electronic device according to still another embodiment of the present disclosure.

[0057] In the drawings, the same or corresponding technical features or components are denoted by the same or corresponding reference numerals. Detailed Embodiments

[0058] The present disclosure will be described in detail below with reference to the accompanying drawings and by means of exemplary embodiments. It should be noted that the following detailed description of the present disclosure is for illustrative purposes only and is in no way a limitation on the present disclosure.

[0059] It should be noted that, for the sake of clarity, not all features of a specific embodiment are described and illustrated in the specification and the drawings, and, in order to avoid obscuring the technical solutions of the present disclosure with unnecessary details, only the device structures closely related to the technical solutions of the present disclosure are described and illustrated in the specification and the drawings, while other details that are not closely related to the technical content of the present disclosure and are known to those skilled in the art are omitted.

[0060] According to an embodiment of the present disclosure, a fingerprint recognition device is provided. The fingerprint recognition device includes a circuit board, an ultrasonic sensor, and a bracket. The circuit board includes a first surface and a second surface opposite to each other. The ultrasonic sensor includes a substrate and a transducer, and the transducer is disposed on a third surface of the substrate, and a side edge portion of the third surface is disposed and attached to the first surface. The bracket supports the attached area of the first surface by abutting against the second surface, wherein the first surface is attached to the third surface at the attached area.

[0061] In the embodiment of the present disclosure, by making the bracket support the attached area of the first surface by abutting against the second surface, the stability of the attachment between the ultrasonic sensor and the circuit board can be enhanced, and thereby the possibility of a failure in the electrical connection between the ultrasonic sensor and the circuit board can be reduced.

[0062] Next, Figures 1 to 17 a detailed description will be given of the fingerprint recognition device according to an embodiment of the present disclosure.

[0063] First, refer to Figures 1 to 7 , the fingerprint recognition device 1 includes an ultrasonic sensor 10, a circuit board 20, a functional component 30, and a bracket 40.

[0064] The ultrasonic sensor 10 includes a substrate 101 and a transducer 102. The substrate 101 can be, for example, rectangular as shown in Figure 1 , and can be made of glass, silicon, or other materials. The transducer 102 is arranged on the surface (referred to as the third surface) 1011 of the substrate 101, and is used to transmit ultrasonic signals and receive ultrasonic signals reflected back by the fingerprint of the detected finger.

[0065] The circuit board 20 can be a flexible printed circuit board (FPCB), or can be other types of bendable circuit boards. The circuit board 20 includes a first surface 201 and a second surface 202 opposite to each other. The ultrasonic sensor 10 and the functional component 30 are respectively arranged on the first surface 201 and the second surface 202 of the circuit board 20 (that is, the ultrasonic sensor 10 is arranged on the first surface 201, and the functional component 30 is arranged on the second surface 202), so as to realize the electrical connection and signal transmission between the ultrasonic sensor 10 and the functional component 30 via the circuit board 20.

[0066] The functional component 30 is used to receive signals from the ultrasonic sensor 10 via the circuit board 20. The functional component 30 can be, for example, an application specific integrated circuit (ASIC), which is used to receive the fingerprint electrical signal generated by the ultrasonic sensor 10 when receiving the reflected ultrasonic signal via the circuit board 20, and is used to process the received fingerprint electrical signal to obtain fingerprint information. It can be envisioned that the functional component 30 can also be a component for undertaking other functions.

[0067] In the connection between the ultrasonic sensor 10 and the circuit board 20, as shown more clearly in Figure 3 and Figure 5 , one side edge of the third surface 1011 of the substrate 101 of the ultrasonic sensor 10 is attached to the first surface 201 of the circuit board 20, and the ultrasonic sensor 10 is electrically connected to the circuit board 20 on the third surface 1011.

[0068] The attachment of this side edge of the third surface 1011 to the first surface 201 means that this side edge is attached and connected to the first surface 201, or rather, this side edge is arranged and connected to the first surface 201. Exemplarily, refer to Figure 8The third surface 1011 of the substrate 101 can be attached to the first surface 201 of the circuit board 20 by anisotropic conductive film (ACF) 110 through ACF bonding, and the substrate 101 is electrically connected to the circuit board 20 through the ACF 110. Alternatively, referring to Figure 9 The third surface 1011 of the substrate 101 can be attached to the first surface 201 of the circuit board 20 by bonding, for example, using an adhesive 111, and the substrate 101 is electrically connected to the circuit board 20 on the third surface 1011 by wire bonding using leads 120.

[0069] It should be noted that, for the sake of clarity, Figure 8 and Figure 9 In addition, for ease of understanding, the bracket 40 is omitted. Figure 8 and Figure 9 In the other drawings except FIG3 , only the situation that the ultrasonic sensor 10 and the circuit board 20 are attached and electrically connected by ACF bonding is exemplarily shown, and the ACF is omitted for clarity.

[0070] Next, the description of the bracket 40 will continue.

[0071] Reference Figures 3 to 7 The bracket 40 supports the attachment area 2011 of the first surface 201 by abutting against the second surface 202 , wherein the first surface 201 is attached to the third surface 1011 at the attachment area 2011 .

[0072] Here, the attachment area 2011 should be understood as the area where the attachment occurs. Or, from another perspective, since one side of the third surface 1011 is attached to the first surface 201, the attachment area 2011 is the area of the first surface 201 that completely overlaps with the side of the third surface 1011.

[0073] By using the bracket 40 to support the attachment area 2011 of the first surface 201, the stability of the attachment between the ultrasonic sensor 10 and the circuit board 20 can be enhanced, thereby reducing the possibility of electrical connection failure between the ultrasonic sensor 10 and the circuit board 20. This is particularly advantageous when the fingerprint recognition device 1 is mounted on the side of an electronic device.

[0074] Below, in Figures 3 to 7 Based on Figure 10 and Figure 11 , which explains this in detail.

[0075] It should be noted that for the sake of convenience and clarity, Figure 10 In the embodiment, the electronic device 100 is exemplarily shown as a mobile phone, andFigure 10 The side frame of only the electronic device is shown in a perspective view. In addition, in Figure 11 , for clarity, the bracket 40 is omitted.

[0076] As Figure 10 and Figure 11 shown, when the fingerprint recognition device 1 is disposed at the side frame 2 of the mobile phone 100, the ultrasonic sensor 10 is arranged close to the side frame 2 such that the short side direction X1 of the substrate 101 (see Figure 1 and Figure 11 ) is parallel to the direction H (see Figure 10 and Figure 11 ), where the direction H is perpendicular to the front of the mobile phone 100. In this case, restricted by the space of the mobile phone 100 in the direction H (i.e., the thickness of the mobile phone), the circuit board 20 near the attachment area 2011 needs to be bent towards the inside of the mobile phone 100, that is, bent to the right as Figure 11 shown, so that the functional component 30 is arranged deeper inside the mobile phone 100 away from the side frame 2. For example, as Figure 11 shown, the bent circuit board 20 extends in one direction such that the functional component 30 is deeper in this direction, or, as Figure 5 shown, the bent circuit board 20 is bent again such that the functional component 30 is arranged behind the ultrasonic sensor 10, that is, arranged facing the third surface 1011.

[0077] In the trend that electronic devices are designed to be thinner and thinner, the sides of the electronic devices become narrower, and the size of the fingerprint recognition device to be installed thereon also needs to be correspondingly reduced. Specifically, for example, as Figure 11 shown, the length of the short side of the substrate 101 is correspondingly reduced. This results in only a very small area on the third surface 1011 of the substrate 101 for attachment and electrical connection with the circuit board 20. In this case, the bending of the circuit board 20 near the attachment area 2011 will be particularly disadvantageous for the stability of the attachment and electrical connection. This bending will pull the attachment area 2011, possibly causing the attachment between the substrate 101 and the circuit board 20 to crack, thus resulting in attachment looseness or damage, and the looseness or damage of the attachment will in turn affect the electrical connection between the ultrasonic sensor 10 and the circuit board 20, possibly causing a failure in this electrical connection.

[0078] As Figure 5As shown more clearly in [the figure], the support of the attachment area 2011 of the bracket 40 to the first surface 201 can resist the pulling force on the attachment area 2011 caused by the bending of the circuit board 20. Thus, the possibility of attachment loosening or damage due to this bending can be reduced, thereby enhancing the stability of the attachment. Further, the enhanced attachment stability can also enhance the stability of the electrical connection between the ultrasonic sensor 10 and the circuit board 20, reducing the possibility of failure of this electrical connection. For example, in Figure 8 the case of the ACF bonding shown, the enhanced attachment stability can directly enhance the stability of the electrical connection between the ultrasonic sensor 10 and the circuit board 20. While in Figure 9 the case of the wire bonding shown, the enhanced attachment stability can enhance the stability of the connection of the wire 120 between the substrate 101 and the circuit board 20. Thus, the stability of the electrical connection between the ultrasonic sensor 10 and the circuit board 20 can be enhanced. Finally, by enhancing the attachment stability and the electrical connection stability, the adverse effects of this bending on the function and lifespan of the fingerprint recognition device 1 can be reduced.

[0079] In some embodiments, as Figure 5 shown in [the figure], the abutting area 401 of the bracket 40 and the first area 2021 of the second surface 202 may overlap. Wherein, the bracket 40 abuts against the second surface 202 at the abutting area 401, and the first area 2021 and the attachment area 2011 are mirror-symmetrical with respect to the circuit board 20.

[0080] Here, the abutting area 401 should be understood as the area where abutting occurs. In Figure 5 [the figure], the attachment area 2011 and the first area 2021 are shown as the parts of the first surface 201 and the second surface 202 between two dotted lines m and n respectively. When the abutting area 401 of the bracket 40 overlaps with the first area 2021 of the second surface 202, it means that the bracket 40 abuts against the first area 2021 to support the attachment area 2011 by supporting the first area 2021.

[0081] In this way, the support provided by the bracket 40 can directly act on the attachment area 2011, thereby being able to directly and more effectively resist the pulling force on the attachment area 2011 caused by the bending of the circuit board 20, and thus being able to more effectively reduce the adverse effects of this bending on the attachment between the substrate 101 and the circuit board 20.

[0082] It can be envisioned that, as Figure 5 and Figure 7 shown in [the figure], the abutting area 401 may include a first part 4011 ( Figure 5 the part of the abutting area 401 to the left of the dotted line n in [the figure]), the first part 4011 overlaps with the first area 2021, and the first part 4011 is planar.

[0083] In this case, the bracket 40 directly abuts against and supports the first region 2021, and the surface of the bracket 40 that supports the first region 2021 is a plane. In this way, the support provided by the bracket 40 for the first region 2021 is continuous over the entire first region 2021, making the support for the first region 2021 and thus for the attachment region 2011 more uniform and stable, so that the adverse effect of the bending of the circuit board 20 on the attachment of the substrate 101 to the circuit board 20 can be more effectively reduced.

[0084] It should be noted that here, overlap means the complete or partial coincidence of two objects in space. For example, the abutting region 401 overlapping with the first region 2021 includes: a part of the abutting region 401 covering a part of the first region 2021 (as Figure 5 shown in), the abutting region 401 being larger than and covering the first region 2021, the abutting region 401 being smaller than the first region 2021 and being covered by the first region 2021, and the abutting region 401 being equal to and covering the first region 2021.

[0085] However, in some embodiments, the abutting region 401 may also not overlap with the first region 2021. For example, reference may be made to Figure 12 and Figure 13 .

[0086] In this case, the bracket 40 does not abut against the first region 2021, but indirectly supports the attachment region 2011 by abutting against other regions of the second surface 202. For example, as Figure 12 shown in, the abutting region 401 includes a portion 4010. Correspondingly, in the case shown in Figure 13 , the portion 4010 is closest to the first region 2021 but does not overlap with the first region 2021. The bracket 40 abuts against the second region 2022 of the second surface 202 through the portion 4010, where the second region 2022 is adjacent to the first region 2021.

[0087] By supporting the second region 2022, it is also possible to resist the pulling of the attachment region 2011 caused by the bending of the circuit board 20, and thus indirect support for the attachment region 2011 can be achieved. Thereby, the adverse effect of this bending on the attachment of the substrate 101 to the circuit board 20 can also be reduced.

[0088] Next, the fingerprint recognition device 1 in which the abutting region 401 overlaps with the first region 2021 will be further described.

[0089] It can be envisioned that, as Figure 3 and Figure 4As shown more clearly in [reference], the side portion of the third surface 1011 attached to the first surface 201 is the side portion where the long side of the substrate 101 is located. That is to say, the longer side portion of the third surface 1011 is attached to the first surface 201.

[0090] However, it is also conceivable that the side portion of the third surface 1011 attached to the first surface 201 is the side portion where the short side of the substrate 101 is located. That is to say, the shorter side portion of the third surface 1011 is arranged and attached to the first surface 201.

[0091] In some embodiments, with reference to Figure 3 and Figure 5 , the first part 4011 may cover a long side 2021a of the first region 2021, wherein the long side 2021a is farther from the transducer 102 than the other long side 2021b of the first region 2021.

[0092] By making the first part 4011 of the abutting region 401 cover the long side 2021a of the first region 2021, the bracket 40 can directly support the long side 2011a of the attachment region 2011 by supporting the long side 2021a. Thus, it is possible to prevent the attachment region 2011 from cracking at its long side 2011a when the circuit board 20 bends, and therefore it is possible to more effectively prevent the loosening and damage of the attachment between the substrate 101 and the circuit board 20, and thus it is possible to more effectively reduce the adverse effect of the bending of the circuit board 20 on this attachment.

[0093] It is conceivable that the edge of the first part 4011 may be flush with the long side 2021a of the first region 2021 to just cover the long side 2021a.

[0094] It is also conceivable that the first part 4011 may extend beyond the long side 2021a to cover the long side 2021a more internally. In this way, it is possible to reduce the stress concentration caused by the bending of the circuit board 20 at the long side 2011a of the attachment region 2011, and therefore it is possible to reduce the possibility of the attachment region 2011 cracking at the long side 2011a due to this stress concentration.

[0095] In some embodiments, as shown in Figure 5 and Figure 7 , the abutting region 401 may further include a second part 4012. The second part 4012 is adjacent to the first part 4011, and the second part 4012 is an arc-shaped surface.

[0096] By making the second part 4012 adjacent to the first part 4011 and having an arc-shaped surface, the second part 4012 can provide support for the second surface 202 immediately adjacent to the first part 4011. Thereby, the stress concentration caused by the bending of the circuit board 20 at the long side 2011a of the attachment area 2011 can be reduced, and thus the possibility of the attachment area 2011 cracking from the long side 2011a due to this stress concentration can be lowered. Moreover, the arc-shaped second part 4012 can make the distribution of stress on the circuit board 20 that bends along it more uniform, thereby reducing the risk of damage to the circuit board 20 due to excessive bending angles when the circuit board 20 is bent.

[0097] It is conceivable that, as Figure 5 and Figure 7 shown, the abutment area 401 may further include a third part 4013, and the third part 4013 is also an arc-shaped surface. Similarly, the arc-shaped third part 4013 can make the distribution of stress on the circuit board 20 that bends along it again more uniform, thereby reducing the risk of damage to the circuit board 20 due to excessive bending angles when the circuit board 20 is bent.

[0098] As previously mentioned, the substrate 101 can be electrically connected to the circuit board 20 at the attachment area 2011 by means of ACF bonding, or the substrate 101 can also be electrically connected to the circuit board 20 by wire bonding on the third surface 1011, for example, electrically connected to the second surface 202 of the circuit board 20.

[0099] In the case where the substrate 101 is electrically connected to the second surface 202 by wire bonding on the third surface 1011, it is conceivable that the abutment area 401 is spaced apart from the bonding area on the second surface 202, where the wire is bonded to the second surface 202 at the bonding area.

[0100] In this way, the bracket 40 will not contact the bonding area and the wires thereon, thus having no impact on the electrical connection between the substrate 101 and the circuit board 20.

[0101] In some embodiments, as Figures 3 to 6 shown, the bracket 40 may include a first recess 402. When the bracket 40 abuts against the second surface 202, the first recess 402 is arranged between the transducer 102 and the bracket 40 to form a gap between the transducer 102 and the bracket 40.

[0102] As previously mentioned, the transducer 102 is used to transmit ultrasonic signals and receive ultrasonic signals reflected back by the fingerprint of the detected finger. However, the ultrasonic signals are emitted towards the opposite sides of the transducer 102 (i.e., Figure 5It is carried out simultaneously on the upper and lower sides of the middle transducer 102. If the bracket 40 is in direct contact with the transducer 102, in addition to possibly changing the resonance frequency originally designed for the transducer 102, it will also generate extra noise unrelated to the fingerprint signal due to the contact with the bracket, thereby interfering with the fingerprint recognition.

[0103] By forming a gap between the transducer 102 and the bracket 40, it is ensured that the resonance frequency originally designed for the transducer 102 remains unchanged and the ultrasonic signal emitted by the transducer 102 downward is not interfered by the reflected signal returned due to the bracket 40. Thus, the noise unrelated to the fingerprint signal can be reduced and the interference to the fingerprint recognition can be reduced accordingly, thereby improving the accuracy of the fingerprint recognition.

[0104] In addition, by arranging the bracket 40 on the above-mentioned side of the transducer 102, the transducer 102 and thus the ultrasonic sensor 10 can be protected from being damaged due to accidental contact from that side.

[0105] It can be conceived that, as Figure 5 shown, the opening of the first recess 402 covers the transducer 102 when observed in the first direction S, where the first direction S is perpendicular to the plane where the third surface 1011 is located.

[0106] In this case, the gap formed between the transducer 102 and the bracket 40 can cover the transducer 102 when observed in the first direction S, so that the system parameters originally designed for the transducer 102 will not be changed and cause interference, to further improve the accuracy of the fingerprint recognition.

[0107] In some embodiments, as Figures 3 to 6 shown, the bracket 40 may include a second recess 403, and the second recess 403 is arranged on the side of the bracket 40 away from the ultrasonic sensor 10, and the second recess 403 allows the functional component 30 to be arranged therein.

[0108] The second recess 403 is Figure 5 shown to be formed on the lower side of the bracket 40. In this case, the circuit board 20 that has been bent inward near the attachment area 2011 towards the interior of the electronic device can be bent again so that the functional component 30 arranged on the second surface 202 of the circuit board 20 can be arranged in the second recess 403. Thus, not only can a accommodation space be provided for the functional component 30, thereby saving the limited space inside the electronic device, but also the functional component 30 can be protected from being damaged due to accidental contact.

[0109] In some embodiments, as Figures 3 to 6As shown, the fingerprint recognition device 1 may further include a reinforcement member 50 disposed on the first surface 201, and the position of the reinforcement member 50 corresponds to the position of the functional component 30 to support the functional component 30.

[0110] That is to say, the reinforcement member 50 and the functional component 30 are respectively disposed on opposite sides of the circuit board 20, and the position of the reinforcement member 50 corresponds to the position of the functional component 30 as Figure 5 shown, or in other words, they are vertically aligned, or Figure 5 vertically opposite in the vertical direction shown in.

[0111] In this way, the reinforcement member 50 can provide support for the corresponding area of the circuit board 20 to prevent the area from bending, and thereby provide support for the functional component 30 disposed in this area of the circuit board 20 to avoid damage to the functional component 30 caused by the bending of this area of the circuit board 20.

[0112] In some embodiments, as Figure 1 shown, the bracket 40 may extend beyond two opposite sides 101b of the substrate 101, where each of the two sides 101b extends along the short side direction X2 of the attachment area 2011.

[0113] By making the bracket 40 extend beyond two opposite sides 101b of the substrate 101, the substrate 101 and thus the ultrasonic sensor 10 can be protected from both left and right sides of the substrate 101 shown in Figure 1 to prevent damage due to accidental contact.

[0114] In some embodiments, the bracket 40 may be integrally formed.

[0115] Thereby, the bracket 40 can have better structural stability, so as to provide more stable support for the attachment area 2011, and further enhance the stability of the attachment between the ultrasonic sensor 10 and the circuit board 20.

[0116] In some embodiments, the bracket 40 may be connected to the second surface 202.

[0117] For example, the bracket 40 may be connected to the second surface 202 by means of adhesion or the like. Moreover, it can be envisioned that the entire abutting area 401 of the bracket 40 is connected to the second surface 202. Thereby, the support of the bracket 40 for the attachment area 2011 can be made more stable, and thus the stability of the attachment between the ultrasonic sensor 10 and the circuit board 20 can be further enhanced.

[0118] However, it can be envisioned that the bracket 40 may not be connected to the second surface 202, but only abut against the second surface 202.

[0119] In some embodiments, with reference to Figures 14 to 17 , the fingerprint recognition device 1 is configured to be assembled to the button 60 of the electronic device, and assembled such that the fourth surface 1012 of the substrate 101 is located below the button 60, wherein the fourth surface 1012 is opposite to the third surface 1011.

[0120] The button 60 may be located at the housing of the electronic device. For example, it may be located at the side frame of a mobile phone, flush with or slightly protruding from the outer surface of the side frame for the user to press. In this way, the ultrasonic sensor 10 of the fingerprint recognition device 1 can receive the ultrasonic signal reflected by the fingerprint of the finger pressing on the button 60 to achieve the recognition of the fingerprint.

[0121] Exemplarily, the button 60 may be, for example, the power button, volume button, etc. of the electronic device.

[0122] With reference to Figure 10 and Figure 18 and Figure 19 , according to an embodiment of the present disclosure, an electronic device 100 is further provided.

[0123] The electronic device 100 includes the fingerprint recognition device 1. As Figure 18 shown, the fingerprint recognition device 1 may be disposed, for example, at the accommodation portion 21 of the side frame 2 of the electronic device 100. Alternatively, as Figure 19 shown, the fingerprint recognition device 1 may be disposed at the button 60. At this time, the button 60 may be disposed, for example, at the side frame 2 of the electronic device 100, slightly protruding from the outer surface 22 of the side frame 2, or flush with the outer surface 22.

[0124] With reference to Figure 20 , according to an embodiment of the present disclosure, a fingerprint recognition assembly 3 is further provided.

[0125] The fingerprint recognition assembly 3 includes the side frame 2'' for the electronic device 100'' and the fingerprint recognition device 1, wherein the side frame 2'' is connected to the bracket 40 of the fingerprint recognition device 1.

[0126] It is conceivable that the side frame 2'' may be connected to the bracket 40 by a fastener, or, as Figure 20 shown, the side frame 2'' may be integrally formed with the bracket 40.

[0127] In addition, as Figure 20 shown, according to an embodiment of the present disclosure, an electronic device 100'' is further provided, which includes the fingerprint recognition assembly 3.

[0128] As mentioned before, for clarity only, the electronic device in Figure 10is exemplarily shown as a mobile phone. However, by way of example and not limitation, the electronic device may also be a tablet computer, a laptop computer, an in-vehicle electronic device, or may also be a smart wearable device such as a smart watch, smart glasses, etc.

[0129] In the present disclosure, the use of terms such as "first", "second", "upper", "lower", etc. is merely for the purpose of convenience of description and should not be regarded as restrictive. In addition, although the present disclosure has been described with reference to exemplary embodiments, it should be understood that the present disclosure is not limited to the specific embodiments described and illustrated in detail herein. Without departing from the scope defined by the claims of the present disclosure, those skilled in the art can make various changes to the exemplary embodiments.

[0130] The features mentioned and / or shown in the above description of the exemplary embodiments of the present disclosure may be combined in the same or similar manner into one or more other embodiments, combined with the features in other embodiments or replace the corresponding features in other embodiments. The technical solutions obtained by such combination or replacement should also be regarded as being included within the protection scope of the present disclosure.

Claims

1. A fingerprint recognition device, characterized in that, Comprising: A circuit board, including a first surface and a second surface opposite to each other; An ultrasonic sensor, including a substrate and a transducer, the transducer being disposed on a third surface of the substrate, and a side edge portion of the third surface being attached to the first surface; And A bracket, which supports an attachment area of the first surface by abutting against the second surface, wherein the first surface is attached to the third surface at the attachment area.

2. The fingerprint recognition device according to claim 1, wherein An abutting area of the bracket overlaps with a first area of the second surface, wherein the bracket abuts against the second surface at the abutting area, and the first area and the attachment area are mirror-symmetrical with respect to the circuit board.

3. The fingerprint recognition device according to claim 2, characterized in that, The abutting area includes a first portion, the first portion overlaps with the first area, and the first portion is a plane.

4. The fingerprint recognition device according to claim 3, wherein, The first portion covers a long side of the first area, wherein the long side is farther from the transducer than the other long side of the first area.

5. The fingerprint recognition device according to claim 4, wherein, The abutting area further includes a second portion, the second portion is adjacent to the first portion, and the second portion is an arc surface.

6. The fingerprint recognition device according to claim 1, wherein An abutting area of the bracket does not overlap with a first area of the second surface, wherein the bracket abuts against the second surface at the abutting area, and the first area and the attachment area are mirror-symmetrical with respect to the circuit board.

7. The fingerprint recognition device according to claim 1, wherein The bracket includes a first recess, when the bracket abuts against the second surface, the first recess is disposed between the transducer and the bracket to form a gap between the transducer and the bracket.

8. The fingerprint recognition device according to claim 7, wherein An opening of the first recess covers the transducer when observed in a first direction, wherein the first direction is perpendicular to a plane where the third surface is located.

9. The fingerprint recognition device according to claim 1, wherein Further included is a functional component for receiving a signal from the ultrasonic sensor, the functional component being disposed on the second surface.

10. The fingerprint recognition device according to claim 9, characterized in that, The bracket includes a second recess, the second recess is disposed on a side of the bracket away from the ultrasonic sensor, and the second recess allows the functional component to be disposed therein.

11. The fingerprint recognition device according to claim 9, characterized in that, Further included is a reinforcing member, the reinforcing member is disposed on the first surface, and a position of the reinforcing member corresponds to a position of the functional component to support the functional component.

12. The fingerprint recognition device according to claim 1, characterized in that, The bracket extends beyond two opposite sides of the substrate, wherein each of the two sides extends along a short side direction of the attachment area.

13. The fingerprint recognition device according to claim 1, wherein, The bracket is integrally formed.

14. The fingerprint recognition device according to claim 1, wherein The bracket is connected to the second surface.

15. The fingerprint recognition device according to claim 1, wherein The side edge portion is a side edge portion where a long side of the substrate is located.

16. The fingerprint recognition device according to claim 1, wherein The substrate is electrically connected to the circuit board at the attachment area by an anisotropic conductive film bonding method, or the substrate is electrically connected to the circuit board by a wire bonding method on the third surface.

17. The fingerprint recognition device according to claim 1, wherein The substrate is electrically connected to the second surface of the circuit board by a wire bonding method on the third surface.

18. The fingerprint recognition device according to claim 17, wherein An abutting area of the bracket is spaced apart from a bonding area on the second surface, wherein the bracket abuts against the second surface at the abutting area, and a wire is bonded to the second surface at the bonding area.

19. The fingerprint recognition device according to claim 1, characterized in that, The fingerprint recognition device is used to be assembled to a button of an electronic device, and is assembled such that a fourth surface of the substrate is located below the button, wherein the fourth surface is opposite to the third surface.

20. The fingerprint recognition device according to claim 1, wherein The fingerprint recognition device is used to be assembled to a side surface of an electronic device.

21. A fingerprint recognition assembly, characterized in that, Comprising: A side frame for an electronic device; And The fingerprint recognition device according to any one of claims 1 to 20, wherein the side frame is connected to the bracket.

22. The fingerprint recognition assembly according to claim 21, wherein The side frame and the bracket are integrally formed.

23. An electronic device, characterized in that, Comprising the fingerprint recognition device according to any one of claims 1 to 20, or comprising the fingerprint recognition assembly according to claim 21 or 22.

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