Wafer box
By setting up a gas container and air duct in the wafer box, filling the chamber with clean gas to remove harmful substances, the impact of harmful substances in the semiconductor process is solved, and efficient micro-environment control is achieved.
Patent Information
- Application Number
- CN202422424194.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-10-08
- Publication Date
- 2025-08-01
- Estimated Expiration
- 2034-10-08
AI Technical Summary
With the shrinking of semiconductor process, the content of harmful substances such as acids, alkalis, organic matter and oxygen in the wafer box has become increasingly strict on the process process, and it is difficult for the existing technology to effectively remove it.
A wafer box is designed, including a box, a gas container and an airway, through which the first chamber is filled with clean gas, such as nitrogen or inert gas, to remove harmful substances and maintain a clean atmosphere of the microenvironment.
It effectively reduces the impact of harmful substances on semiconductor process processes, improves the microenvironment quality in the wafer box, and ensures process consistency and product yield.
Smart Images
Figure CN223181098U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of semiconductors, and more particularly to a wafer cassette. Background Art
[0002] With the miniaturization of semiconductor process technology, the process technology has increasingly strict requirements for the environment, especially the microenvironment inside the FOUP (Front Opening Unified Pod). Therefore, it is necessary to provide a technical solution to remove harmful substances such as acids / alkalis / organic substances / oxygen in the wafer cassette to reduce its impact on the process technology. Summary of the Utility Model
[0003] A series of simplified concepts are introduced in the summary of the utility model, which will be further described in detail in the specific implementation section. The summary of the utility model does not mean to attempt to define the key features and essential technical features of the claimed technical solution, nor does it mean to attempt to determine the protection scope of the claimed technical solution.
[0004] In view of the existing problems, the utility model provides a wafer cassette, which includes:
[0005] A cassette body, including a first chamber and a second chamber, where the first chamber is used for storing wafers;
[0006] A gas container for containing a cleaning gas, and the gas container is detachably arranged in the second chamber;
[0007] An air duct is arranged on the side wall of the first chamber; an inflation port communicating with the first chamber is arranged on the air duct;
[0008] The gas container is configured to: when communicating with the air duct, fill the first chamber with the cleaning gas through the inflation port.
[0009] In some embodiments of the present application, an air inlet is further arranged on the air duct, and the air inlet communicates with the second chamber;
[0010] A cleaning gas outlet is arranged on the gas container;
[0011] When the gas container is located in the second chamber, the position of the cleaning gas outlet corresponds to the position of the air inlet;
[0012] The gas container is configured to: when the air inlet communicates with the cleaning gas outlet, the gas container communicates with the air duct.
[0013] In some embodiments of the present application, it further includes an airway switch for switching the air inlet, and the airway switch is configured as follows:
[0014] When the air pressure in the first chamber is less than or equal to the set air pressure, the airway switch opens to connect the air inlet with the clean gas outlet;
[0015] When the air pressure in the first chamber is greater than the set air pressure, the airway switch closes to disconnect the air inlet from the clean gas outlet.
[0016] In some embodiments of the present application, the airway switch is a mercury column switch or a barometer.
[0017] In some embodiments of the present application, the set air pressure is equal to or greater than one standard atmospheric pressure.
[0018] In some embodiments of the present application, a gas container opening is provided on the box body, and the gas container opening communicates with the second chamber. The gas container is configured as follows:
[0019] It is inserted into the second chamber through the gas container opening or taken out from the second chamber.
[0020] In some embodiments of the present application, an exhaust port for discharging harmful substances is provided on the box body, and the exhaust port communicates with the first chamber.
[0021] In some embodiments of the present application, a one-way valve is provided on the exhaust port, and the one-way valve is configured to conduct unidirectionally from the first chamber to the external space.
[0022] In some embodiments of the present application, the number of the inflation ports is multiple;
[0023] A plurality of wafer grooves are further provided on the side wall of the first chamber, and each wafer groove is used to store one wafer;
[0024] Wherein, the first chamber is divided into a plurality of sub-chambers by the wafer grooves, and at least one inflation port is communicated with each sub-chamber.
[0025] In some embodiments of the present application, the clean gas includes nitrogen, inert gas or compressed dry air.
[0026] For the wafer cassette of the present utility model, when the gas container is communicated with the airway, the gas container can fill the first chamber with clean gas through the inflation port of the airway, thereby removing harmful substances in the first chamber, so that the microenvironment in the wafer cassette is always in a clean atmosphere, and reducing the influence of harmful substances on the semiconductor process. Description of the Drawings
[0027] The following drawings of the present utility model are hereby taken as a part of the present utility model for understanding the present utility model. The embodiments of the present utility model and their descriptions are shown in the drawings to explain the principles of the present utility model.
[0028] In the drawings:
[0029] Figure 1 A schematic structural diagram of a wafer cassette (the gas container is not shown) showing a specific embodiment of the present utility model;
[0030] Figure 2 A schematic structural diagram of a wafer cassette showing another specific embodiment of the present utility model;
[0031] Figure 3 A schematic structural diagram of a wafer cassette showing another specific embodiment of the present utility model.
[0032] In the drawings:
[0033] 110 cassette body;
[0034] 111 first chamber;
[0035] 1111 sub-chamber;
[0036] 112 second chamber;
[0037] 120 gas container;
[0038] 130 air duct;
[0039] 131 inflation port;
[0040] 132 intake port;
[0041] 140 air duct switch;
[0042] 150 baffle;
[0043] 160 exhaust port;
[0044] 170 valve;
[0045] 200 wafers. Specific embodiments
[0046] In the following description, numerous specific details are given to provide a more thorough understanding of the present utility model. However, it will be apparent to one of ordinary skill in the art that the present utility model may be practiced without one or more of these details. In other instances, some well-known technical features are not described to avoid obscuring the present utility model.
[0047] It should be understood that the present utility model can be implemented in different forms and should not be construed as limited to the embodiments presented herein. On the contrary, providing these embodiments will make the disclosure thorough and complete, and will fully convey the scope of the present utility model to those skilled in the art. In the drawings, for clarity, the dimensions and relative dimensions of layers and regions may be exaggerated. The same reference numerals throughout the drawings denote the same elements.
[0048] It should be understood that when an element or layer is referred to as being "on", "adjacent to", "connected to" or "coupled to" another element or layer, it can be directly on, adjacent to, connected or coupled to the other element or layer, or there may be intervening elements or layers. In contrast, when an element is referred to as being "directly on", "directly adjacent to", "directly connected to" or "directly coupled to" another element or layer, there are no intervening elements or layers. It should be understood that although the terms first, second, third, etc. may be used to describe various elements, components, regions, layers and / or parts, these elements, components, regions, layers and / or parts should not be limited by these terms. These terms are only used to distinguish one element, component, region, layer or part from another element, component, region, layer or part. Thus, the first element, component, region, layer or part discussed below may be denoted as the second element, component, region, layer or part without departing from the teachings of the present utility model.
[0049] Spatial relationship terms such as "under", "below", "lower", "beneath", "above", "upper", etc. may be used herein for convenience in describing the relationship of one element or feature to another element or feature shown in the figures. It should be understood that, in addition to the orientation shown in the figures, spatial relationship terms are intended to include different orientations of the device in use and operation. For example, if the device in the figures is flipped, then an element or feature described as "under" or "beneath" or "below" another element or feature will be oriented "on" the other element or feature. Thus, the exemplary terms "under" and "below" can include both an upper and a lower orientation. The device may be otherwise oriented (rotated 90 degrees or other orientations) and the spatial descriptors used herein are to be interpreted accordingly.
[0050] The purpose of the terms used herein is only to describe specific embodiments and is not a limitation of the present utility model. As used herein, the singular forms "a", "an" and "the" are also intended to include the plural forms unless the context clearly dictates otherwise. It should also be understood that the terms "comprising" and / or "including", when used in this specification, identify the presence of the stated features, integers, steps, operations, elements and / or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components and / or groups. As used herein, the term "and / or" includes any and all combinations of the related listed items.
[0051] In the related art, with the miniaturization of semiconductor process technology, the requirements of the process technology for the environment, especially the microenvironment inside the FOUP, are becoming more and more stringent. Therefore, it is necessary to provide a technical solution to remove the content of harmful substances such as acids / alkalies / organic substances / oxygen in the wafer cassette to reduce its impact on the process technology.
[0052] To solve at least one of the above technical problems, the present application provides a wafer cassette, which includes: a cassette body, a gas container and an air duct; wherein, the cassette body includes a first chamber and a second chamber, and the first chamber is used for storing wafers; the gas container is used for accommodating a cleaning gas and is detachably arranged in the second chamber; the air duct is arranged on the side wall of the first chamber; an air inlet communicating with the first chamber is arranged on the air duct; the gas container is configured to: when communicating with the air duct, fill the first chamber with the cleaning gas through the air inlet.
[0053] According to the wafer cassette of the present application, when the gas container communicates with the air duct, the gas container can fill the first chamber with the cleaning gas through the air inlet of the air duct, thereby removing the harmful substances in the first chamber, making the microenvironment inside the wafer cassette always in a clean atmosphere, and reducing the impact of the harmful substances on the semiconductor process technology.
[0054] To fully understand the present application, detailed steps and structures will be presented in the following description to explain the technical solution proposed by the present application. The preferred embodiments of the present application are described in detail below. However, in addition to these detailed descriptions, the present application may have other embodiments.
[0055] The following refers to Figures 1 to 3Describe a wafer cassette according to an embodiment of the present application. The wafer cassette includes: a cassette body 110, a gas container 120, and an air duct 130; wherein, the cassette body 110 includes a first chamber 111 and a second chamber 112, and the first chamber 111 is used for storing wafers 200; the gas container 120 is used for accommodating a cleaning gas and is detachably arranged in the second chamber 112; the air duct 130 is arranged on the side wall of the first chamber 111; an inflation port 131 communicating with the first chamber 111 is arranged on the air duct 130; the gas container 120 is configured to: when communicating with the air duct 130, fill the first chamber 111 with the cleaning gas through the inflation port 131.
[0056] In this embodiment, the gas container 120 is built into the wafer cassette. When the gas container 120 communicates with the air duct 130, the gas container 120 can fill the first chamber 111 with the cleaning gas through the inflation port 131 of the air duct 130, thereby removing harmful substances in the first chamber 111, keeping the microenvironment in the wafer cassette in a clean atmosphere all the time, and reducing the influence of harmful substances on the semiconductor process.
[0057] In some embodiments, as Figure 1 shown, a baffle 150 can be arranged in the wafer cassette, and the wafer cassette is divided into a first chamber 111 and a second chamber 112 by the baffle 150. Among them, the position of the baffle 150 can be set according to the size of the gas container 120, subject to the actual situation, and is not limited thereto.
[0058] In some embodiments, as Figure 1 shown, a gas container opening can be arranged on the cassette body 110, the gas container opening communicates with the second chamber 112, and the gas container 120 can be inserted into the second chamber 112 through the gas container opening or taken out of the second chamber 112. In this case, the gas container 120 is linked with the wafer cassette. After the gas container 120 is inserted into the second chamber 112 through the gas container opening, when the gas container 120 communicates with the air duct 130, the cleaning gas in the gas container 120 can be continuously filled into the first chamber 111. Of course, there can also be other detachable connection methods, which are not limited thereto.
[0059] Among them, when the gas container 120 is detachably connected to the wafer cassette, when there are abnormalities or other problems with the gas container 120 or the wafer cassette, the gas container 120 or the wafer cassette can be disassembled, replaced, maintained, upgraded, etc. For example, when the cleaning gas in the gas container 120 is insufficient, the gas container 120 can be taken out of the second chamber 112, and after filling the gas container 120 with a sufficient amount of cleaning gas, the gas container 120 can be inserted into the second chamber 112 again so that the gas container 120 can be reused.
[0060] In some embodiments, the shape of the gas container 120 may be related to the shape of the wafer cassette, for example, it may be configured as a cylindrical shape or any other suitable shape, and no limitation is imposed thereon.
[0061] In some embodiments, one or more gas injection ports 131 may be provided on the air duct 130. Taking the case where a plurality of gas injection ports 131 are provided on the air duct 130 as an example, the plurality of gas injection ports 131 are provided at different height positions of the air duct 130, so that when the gas container 120 is in communication with the air duct 130, the gas container 120 can inject a cleaning gas into the first chamber 111 through the plurality of gas injection ports 131.
[0062] Preferably, as Figure 2 shown, the number of the gas injection ports 131 is plural, and a plurality of wafer grooves are further provided on the side wall of the first chamber 111, and each wafer groove is used for storing a wafer 200. Among them, the first chamber 111 is divided into a plurality of sub-chambers 1111 by the wafer grooves, and at least one gas injection port 131 is communicated with each sub-chamber 1111. By making at least one gas injection port 131 communicate with one sub-chamber 1111, when the gas container 120 is in communication with the air duct 130, the gas container 120 can inject a cleaning gas into each sub-chamber 1111 through the plurality of gas injection ports 131 respectively, so as to remove harmful substances in each sub-chamber 1111.
[0063] In some embodiments, there are usually gaps on the wafer cassette. When the gas container 120 injects a cleaning gas into the first chamber 111 through the gas injection port 131, the harmful substances existing in the first chamber 111 can be discharged from the first chamber 111 through the gaps existing on the wafer cassette, so that the microenvironment in the wafer cassette is always in a clean atmosphere, and the influence of harmful substances on the semiconductor process is reduced.
[0064] In other embodiments, as Figure 3 shown, an exhaust port 160 for discharging harmful substances may be provided on the box body 110, and the exhaust port 160 communicates with the first chamber 111. When the gas container 120 injects a cleaning gas into the first chamber 111 through the gas injection port 131, the harmful substances existing in the first chamber 111 can be discharged from the first chamber 111 through the exhaust port 160, so that the microenvironment in the wafer cassette is always in a clean atmosphere, and the influence of harmful substances on the semiconductor process is reduced.
[0065] Among them, a valve 170, such as a switch valve, a check valve, etc., can be provided on the exhaust port 160, and there is no limitation thereto. Taking the example of providing a switch valve on the exhaust port 160, when the gas container 120 fills the first chamber 111 with a cleaning gas through the inflation port 131, the switch valve is in an open state, and the harmful substances existing in the first chamber 111 can be discharged from the first chamber 111 through the exhaust port 160; after filling the cleaning gas is completed, the switch valve can be in a closed state to prevent harmful substances from the outside from entering the first chamber 111 through the exhaust port 160. Taking the example of providing a check valve on the exhaust port 160, the check valve is configured to conduct unidirectionally from the first chamber 111 to the external space, and the check valve only allows the harmful substances in the first chamber 111 to enter the outside through the exhaust port 160, and does not allow harmful substances from the outside to enter the first chamber 111 through the exhaust port 160. Therefore, when the gas container 120 fills the first chamber 111 with a cleaning gas through the inflation port 131, the harmful substances existing in the first chamber 111 can be discharged from the first chamber 111 through the exhaust port 160, and after filling the cleaning gas is completed, there is no need to worry that harmful substances from the outside will enter the first chamber 111 through the exhaust port 160.
[0066] In some embodiments, the cleaning gas contained in the gas container 120 is in a compressed state.
[0067] When the gas container 120 is in communication with the air passage 130, the cleaning gas in the compressed state in the gas container 120 can automatically be filled into the first chamber 111 through the inflation port 131, so as to discharge the harmful substances in the first chamber 111 to the outside.
[0068] Or it can also be said that the air pressure in the gas container 120 is greater than the set air pressure. Among them, the set air pressure can be determined according to the actual situation, and there is no limitation thereto. Taking the example that the set air pressure is equal to one standard atmospheric pressure, the air pressure of the cleaning gas contained in the gas container 120 is greater than one standard atmospheric pressure. Therefore, when the gas container 120 is in communication with the air passage 130, the cleaning gas in the gas container 120 with a pressure greater than one standard atmospheric pressure can automatically be filled into the first chamber 111 through the inflation port 131 to discharge the harmful substances in the first chamber 111 to the outside.
[0069] In some embodiments, such as Figure 2As shown, an air inlet 132 is further provided on the air duct 130. The air inlet 132 communicates with the second chamber 112. A cleaning gas outlet is provided on the gas container 120. When the gas container 120 is located within the second chamber 112, the position of the cleaning gas outlet corresponds to the position of the air inlet 132. The gas container 120 is configured such that when the air inlet 132 is in communication with the cleaning gas outlet, the gas container 120 communicates with the air duct 130. Herein, the air inlet 132 may refer to the port of the air duct 130 located in the second chamber 112, or an opening provided near the end when the end of the air duct 130 located in the second chamber 112 is closed. After the gas container 120 is inserted into the second chamber 112 through the gas container opening, the cleaning gas outlet on the gas container 120 corresponds to the air inlet 132 on the air duct 130. Thus, when the air inlet 132 is in communication with the cleaning gas outlet, the gas container 120 communicates with the air duct 130. The cleaning gas outlet on the gas container 120 can supply cleaning gas into the air duct through the air inlet 132, and the supplied cleaning gas can then be filled into the first chamber 111 through the inflation port 131 to remove harmful substances in the first chamber 111.
[0070] In some embodiments, as Figure 2 shown, an air duct switch 140 for switching the air inlet 132 is further included. The air duct switch 140 can be directly provided on the air inlet 132 to switch the air inlet 132, or the air duct switch 140 may not be directly provided on the air inlet 132. When it is in the open state, there is a certain distance from the air inlet 132, and at this time, the air inlet 132 is not blocked. In the closed state, it extends to the air inlet 132 to block it. Specifically, the air duct switch 140 is configured such that when the air pressure in the first chamber 111 is less than or equal to the set air pressure, the air duct switch 140 opens to enable the air inlet 132 to communicate with the cleaning gas outlet, and further the gas container 120 communicates with the air duct 130. When the air pressure in the first chamber 111 is greater than the set air pressure, the air duct switch 140 closes to disconnect the communication between the air inlet 132 and the cleaning gas outlet, and further disconnects the communication between the gas container 120 and the air duct 130. Herein, the set air pressure is equal to or greater than one standard atmospheric pressure.
[0071] Taking the set air pressure equal to one standard atmospheric pressure as an example, when the air pressure in the first chamber 111 is less than or equal to one standard atmospheric pressure, the airway switch 140 opens to connect the gas container 120 with the airway 130. The clean gas with a pressure greater than one standard atmospheric pressure in the gas container 120 can automatically be filled into the first chamber 111 through the inflation port 131 to discharge the harmful substances in the first chamber 111 to the outside. After the inflation of the first chamber 111 is completed and the air pressure inside it is greater than one standard atmospheric pressure, the airway switch 140 closes to disconnect the connection between the gas container 120 and the airway 130, and the gas container 120 no longer fills the first chamber 111 with clean gas. At this time, since the air pressure in the first chamber 111 is greater than the standard atmospheric pressure and the air pressure in the first chamber 111 is higher than the outside air pressure, although the gas container 120 no longer fills the first chamber 111 with clean gas, it can still prevent the infiltration of harmful substances from the outside into the first chamber 111 and prevent the infiltration and pollution of harmful substances from the outside.
[0072] In some related technologies, there is a method of inflating the wafer cassette through a nitrogen cabinet or the like. However, inflating the wafer cassette through a nitrogen cabinet or the like is a non - continuous inflation method with poor automation. In this embodiment, by setting the airway switch 140 and controlling the on - off state of the airway switch 140 according to whether the air pressure in the first chamber 111 is greater than the set air pressure, as long as the air pressure in the first chamber 111 is less than or equal to the set air pressure, the gas container 120 can continuously and uninterruptedly fill the first chamber 111 with clean gas through the inflation port 131 until the airway switch 140 closes, improving the automation degree of the wafer cassette.
[0073] In some embodiments, the airway switch 140 can be a mercury column switch, a barometer, or any other suitable air pressure switch. Taking the mercury column switch as an example, when the air pressure in the first chamber 111 is less than or equal to one standard atmosphere, the length of the mercury column is not sufficient to close the mercury column switch, and the mercury column switch is in an open state to connect the gas container 120 with the airway 130. The clean gas in the gas container 120 with a pressure greater than one standard atmosphere can automatically be filled into the first chamber 111 through the inflation port 131 to discharge the harmful substances in the first chamber 111 to the outside. After the first chamber 111 is filled with gas, when the air pressure inside it is greater than one standard atmosphere, the mercury column extends to close the mercury column switch, and the mercury column switch is in a closed state to disconnect the connection between the gas container 120 and the airway 130, and the gas container 120 no longer fills the first chamber 111 with clean gas. At this time, since the air pressure in the first chamber 111 is greater than one standard atmosphere, the air pressure in the first chamber 111 is higher than the outside air pressure. Therefore, although the gas container 120 no longer fills the first chamber 111 with clean gas, it can still prevent the infiltration of harmful substances from the outside into the first chamber 111 and prevent the infiltration and pollution of harmful substances from the outside. The switch situation when taking it as a barometer can refer to the relevant description when taking it as a mercury column switch above, and will not be elaborated here.
[0074] In some embodiments, when the air pressure in the gas container 120 is less than the set air pressure, the gas container 120 can be taken out of the wafer cassette, and clean gas can be filled into the gas container 120 to make the air pressure in the gas container 120 greater than the set air pressure again. Then, the gas container 120 can be loaded into the wafer cassette again so that the gas container 120 can be reused. Specifically, a clean gas inlet can be provided on the gas container 120 to fill clean gas into the gas container 120 through the clean gas inlet; or, the clean gas inlet and the clean gas outlet can be integrated into one port, so that through the integrated port, clean gas can be filled into the gas container 120 when the air pressure is insufficient, and can also be connected to the air inlet 132 of the airway 130 to fill the first chamber 111 with clean gas when the air pressure is sufficient.
[0075] In some embodiments, the clean gas can include nitrogen, inert gas (such as argon, etc.) or compressed dry air.
[0076] Specifically, the wafer 200 is usually made of materials such as silicon. The surface of silicon is prone to react with oxygen to form an oxide layer. The chemical properties of nitrogen and inert gas are stable and not easy to chemically react with the material of the wafer 200, which can effectively prevent oxygen from contacting the surface of the wafer 200, thus avoiding the occurrence of oxidation reaction.
[0077] There are likely to be impurities in the wafer cassette, such as dust particles, water vapor, etc. These impurities may adsorb on the surface of the wafer 200, affecting the quality of the wafer 200 and subsequent processing processes. After filling the wafer cassette with pure nitrogen, inert gas or compressed dry air, the adsorption of impurities can be reduced, and the cleanliness of the surface of the wafer 200 can be maintained.
[0078] When there is water vapor in the wafer cassette, excessive humidity may cause damage to the wafer 200, such as causing corrosion on the surface of the wafer 200 or having an adverse effect during subsequent processing. The water vapor content in nitrogen, inert gas or compressed dry air is extremely low. After filling the wafer cassette with pure nitrogen, inert gas or compressed dry air, a dry environment inside the wafer cassette can be maintained, ensuring that the humidity remains at a low and stable level during the storage and transportation of the wafer 200.
[0079] During the semiconductor processing, the generation of static electricity may cause damage to the wafer 200, such as attracting dust and causing a decline in device performance. After filling the wafer cassette with pure nitrogen, inert gas or compressed dry air, the generation of static electricity can be reduced, thereby reducing the risk of damage to the wafer 200 caused by static electricity.
[0080] In all aspects of the processing of the wafer 200, a high requirement is placed on the consistency of the environmental gas composition. Nitrogen and inert gas can be evenly distributed inside the wafer cassette, enabling the wafer 200 to be in the same protective gas environment at different positions, thereby ensuring the consistency of the processing process across the entire wafer 200.
[0081] Moreover, the gas composition of nitrogen and inert gas is stable and uniform, avoiding problems such as uneven chemical reactions on the surface of the wafer 200 and uneven impurity distribution caused by changes in the gas environment, reducing process deviations, and improving the yield and quality stability of the product.
[0082] In some embodiments, the harmful substances may include particulate matter and / or harmful gases. Among them, the particulate matter may include one or more of acids, alkalis, and organic substances, or may also include other types of particulate matter that affect the process of the wafer 200, which is not limited herein; the harmful gases may include oxygen or other types of gases that affect the process of the wafer 200, which is also not limited herein.
[0083] In summary, for the wafer cassette according to the embodiments of the present application, when the gas container is in communication with the air duct, the gas container can fill the first chamber with a cleaning gas through the air inlet of the air duct, thereby removing the harmful substances in the first chamber, enabling the microenvironment inside the wafer cassette to always be in a clean atmosphere, and reducing the impact of harmful substances on the semiconductor process.
[0084] Although example embodiments have been described herein with reference to the accompanying drawings, it should be understood that the above example embodiments are merely exemplary and are not intended to limit the scope of the present application thereto. Those of ordinary skill in the art can make various changes and modifications therein without departing from the scope and spirit of the present application. All such changes and modifications are intended to be included within the scope of the present application as claimed in the appended claims.
[0085] Similarly, it should be understood that, in order to streamline the present application and assist in understanding one or more of the various aspects of the application, in the description of the exemplary embodiments of the present application, the various features of the present application are sometimes grouped together into a single embodiment, figure, or description thereof. However, the methods of the present application should not be construed as reflecting an intention that the claimed present application requires more features than are expressly recited in each claim. Rather, as reflected in the corresponding claims, the point of the application is that the corresponding technical problems can be solved with features less than all the features of a single disclosed embodiment. Thus, the claims following the detailed description are hereby expressly incorporated into the detailed description, where each claim itself serves as a separate embodiment of the present application.
[0086] In addition, those skilled in the art will appreciate that although some embodiments described herein include certain features included in other embodiments but not others, combinations of features of different embodiments are meant to be within the scope of the present application and form different embodiments. For example, in the claims, any one of the claimed embodiments can be used in any combination.
[0087] It should be noted that the above embodiments illustrate rather than limit the present application, and those skilled in the art can design alternative embodiments without departing from the scope of the appended claims. In the claims, any reference signs placed between parentheses shall not be construed as limiting the claim. The use of the words first, second, and third, etc. does not denote any order. These words can be interpreted as names.
Claims
1. A wafer cassette, characterized in that, The wafer cassette includes: A cassette body, including a first chamber and a second chamber, wherein the first chamber is used for storing wafers; A gas container for containing a cleaning gas, and the gas container is detachably arranged in the second chamber; An air duct arranged on the side wall of the first chamber; an inflation port communicating with the first chamber is arranged on the air duct; The gas container is configured to: when communicating with the air duct, fill the first chamber with the cleaning gas through the inflation port.
2. The wafer cassette according to claim 1, characterized in that, An air inlet is further arranged on the air duct, and the air inlet communicates with the second chamber; A cleaning gas outlet is arranged on the gas container; When the gas container is in the second chamber, the position of the cleaning gas outlet corresponds to the position of the air inlet; The gas container is configured to: when the air inlet communicates with the cleaning gas outlet, the gas container communicates with the air duct.
3. The wafer cassette according to claim 2, wherein, It further includes an air duct switch for switching the air inlet, and the air duct switch is configured to: When the air pressure in the first chamber is less than or equal to a set air pressure, the air duct switch opens to enable the air inlet to communicate with the cleaning gas outlet; When the air pressure in the first chamber is greater than the set air pressure, the air duct switch closes to disconnect the communication between the air inlet and the cleaning gas outlet.
4. The wafer cassette according to claim 3, characterized in that, The air duct switch is a mercury column switch or a barometer.
5. The wafer cassette according to claim 3, characterized in that, The set air pressure is equal to or greater than one standard atmosphere.
6. The wafer cassette according to claim 1, wherein, A gas container opening is arranged on the cassette body, and the gas container opening communicates with the second chamber. The gas container is configured to: Be inserted into and arranged in the second chamber or taken out from the second chamber through the gas container opening.
7. The wafer cassette according to claim 1, wherein, An exhaust port for discharging harmful substances is arranged on the cassette body, and the exhaust port communicates with the first chamber.
8. The wafer cassette according to claim 7, wherein, A one-way valve is arranged on the exhaust port, and the one-way valve is configured to conduct unidirectionally from the first chamber to the external space.
9. The wafer cassette according to claim 1, wherein, The number of the inflation ports is multiple; A plurality of wafer grooves are further arranged on the side wall of the first chamber, and each wafer groove is used for storing one wafer; Wherein, the first chamber is divided into a plurality of sub-chambers by the wafer grooves, and at least one inflation port communicates with each sub-chamber.
10. The wafer cassette according to claim 1, characterized in that, The cleaning gas includes nitrogen, inert gas or compressed dry air.