Stable wafer carrying platform

Abstract

The utility model discloses a stable type wafer carrying platform, which relates to the technical field of carrying platforms and comprises an iron sheet block, one surface of the iron sheet block is provided with a chip placing surface, the other surface of the iron sheet block is provided with a clamping notch, one side of the iron sheet block is provided with a support I, and the other side of the iron sheet block is provided with a support II. The utility model provides a stable wafer stage which is divided into an upper layer and a lower layer, a circular frame composed of a sinking edge and a mounting ring is used for fixing the wafer stage, sealing is further achieved through cooperation of a sealing ring and a groove, a compact whole stage is formed, one face of an iron sheet block is used for placing a chip, and the other face of the iron sheet block is used for placing a groove. Compared with the levelness adjusting mode that screws are locked through a torque wrench in the prior art, the adjustable wafer stage has the advantages that the second foldable support is arranged at the bottom of the iron sheet block and used for adjusting the horizontal position of the wafer stage, and the flatness of the wafer stage is guaranteed.

Description

Technical Field

[0001] The utility model relates to the technical field of carriers, in particular to a stable wafer carrier. Background Technique

[0002] The principle of thin film deposition technology is to place a wafer in a vacuum environment, introduce an appropriate amount of reaction gas, and use the physical changes and chemical reactions of the gas to form a solid film on the surface of the wafer.

[0003] The existing wafer carriers generally use screw fastening, and have very high requirements for the installation accuracy and flatness. A corresponding torque wrench is required during installation and it needs to be tightened according to the installation requirements. Otherwise, it will greatly affect the flatness of the wafer carrier.

[0004] Therefore, in view of this, research and improvement are carried out on the existing structural deficiencies, and a stable wafer carrier is proposed. Content of the Utility Model

[0005] The purpose of the utility model is to provide a stable wafer carrier to solve the problems put forward in the above background technique.

[0006] To achieve the above purpose, the utility model provides the following technical solution: A stable wafer carrier, including an iron sheet block, one side of the iron sheet block is provided with a chip placement surface, and the other side of the iron sheet block is provided with a clamping notch. One side of the iron sheet block is provided with a bracket one, and the other side of the iron sheet block is provided with a bracket two.

[0007] Further, the bracket two is foldable for adjusting the horizontal position of the wafer carrier.

[0008] Further, a sunken edge is integrally fixed to the outer edge part of the iron sheet block, and a groove is provided in the sunken edge.

[0009] Further, a mounting ring is buckled on the sunken edge, and the mounting ring is fixed to the reserved hole position of the sunken edge by screws.

[0010] Further, a sealing ring is provided between the mounting ring and the sunken edge, and the sealing ring is closely attached to the groove to form a seal.

[0011] Further, the circular frame formed by the upper and lower layers of the sunken edge and the mounting ring is used for fixing the wafer carrier.

[0012] Compared with the prior art, the utility model has the following beneficial effects:

[0013] 1. When the present utility model is in use, the wafer stage of this application is divided into upper and lower layers. The circular frame formed by the sunken edge and the mounting ring is used for fixing the wafer stage, and further realizes sealing through the cooperation of the sealing ring and the groove to form a tight stage integral body. One side of the iron sheet block is used for placing the chip, and the other side is provided with a foldable support two and a clamping notch for cooperating with other structures for clamping and fixing. Compared with the prior art's method of adjusting the levelness by relying on a torque wrench to lock the screws, this application adjusts the horizontal position of the wafer stage by setting a foldable support two at the bottom of the iron sheet block, ensuring the flatness of the wafer stage and improving the convenience of adjustment. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 is a schematic bottom view of the overall structure of the device of the present utility model;

[0015] Figure 2 is a schematic top view of the overall structure of the device of the present utility model;

[0016] Figure 3 is an exploded schematic view of the overall structure of the device of the present utility model.

[0017] In the figure: 1. Iron sheet block; 2. Chip placement surface; 3. Clamping notch; 4. Support one; 5. Support two; 6. Sunken edge; 7. Groove; 8. Mounting ring; 9. Sealing ring. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0018] The following further describes in detail the embodiments of the present utility model in conjunction with the drawings and embodiments. The following embodiments are used to illustrate the present utility model, but cannot be used to limit the scope of the present utility model.

[0019] As Figures 1 to 3As shown in the figure, a stable circular wafer carrier stage includes an iron sheet block 1. One side of the iron sheet block 1 is provided with a chip placement surface 2, and the other side of the iron sheet block 1 is provided with a clamping notch 3. A support one 4 is arranged on one side of the iron sheet block 1, and a support two 5 is arranged on the other side of the iron sheet block 1. The support two 5 is foldable for adjusting the horizontal position of the circular wafer carrier stage. One side of the iron sheet block 1 is used for placing chips, and the other side is provided with a foldable support two 5 and a clamping notch 3 for clamping and fixing with other structures. Compared with the prior art's method of adjusting the levelness by relying on a torque wrench to tighten screws, in this application, a foldable support two 5 is arranged at the bottom of the iron sheet block 1 to adjust the horizontal position of the circular wafer carrier stage, ensure the flatness of the circular wafer carrier stage, and improve the convenience of adjustment. The outer edge part of the iron sheet block 1 is integrally fixed with a sunken edge 6, and a groove 7 is opened in the sunken edge 6. An installation ring 8 is buckled on the sunken edge 6, and the installation ring 8 is fixed to the reserved hole positions of the sunken edge 6 by screws. A sealing ring 9 is arranged between the installation ring 8 and the sunken edge 6, and the sealing ring 9 closely adheres to the groove 7 to form a seal. The circular frame composed of the upper and lower layers of the sunken edge 6 and the installation ring 8 is used for fixing the circular wafer carrier stage. The circular wafer carrier stage in this application is divided into upper and lower layers. The circular frame composed of the sunken edge 6 and the installation ring 8 is used for fixing the circular wafer carrier stage, and further realizes sealing through the cooperation of the sealing ring 9 and the groove 7 to form a tight carrier stage as a whole.

[0020] Working principle: When using this stable circular wafer carrier stage, the circular wafer carrier stage in this application is divided into upper and lower layers. The circular frame composed of the sunken edge 6 and the installation ring 8 is used for fixing the circular wafer carrier stage, and further realizes sealing through the cooperation of the sealing ring 9 and the groove 7 to form a tight carrier stage as a whole. One side of the iron sheet block 1 is used for placing chips, and the other side is provided with a foldable support two 5 and a clamping notch 3 for clamping and fixing with other structures. Compared with the prior art's method of adjusting the levelness by relying on a torque wrench to tighten screws, in this application, a foldable support two 5 is arranged at the bottom of the iron sheet block 1 to adjust the horizontal position of the circular wafer carrier stage, ensure the flatness of the circular wafer carrier stage, and improve the convenience of adjustment.

[0021] The embodiments of the present invention are given for the purpose of illustration and description, and are not exhaustive or limit the present invention to the disclosed form. Many modifications and variations are obvious to those of ordinary skill in the art. The embodiments are selected and described to better illustrate the principles and practical applications of the present invention, and enable those of ordinary skill in the art to understand the present invention and thus design various embodiments with various modifications suitable for specific purposes.

Claims

1. A stable circular wafer carrier, comprising an iron sheet block (1), characterized in that, One side of the iron sheet block (1) is provided with a chip placement surface (2), and the other side of the iron sheet block (1) is provided with a clamping notch (3). One side of the iron sheet block (1) is provided with a first bracket (4), and the other side of the iron sheet block (1) is provided with a second bracket (5).

2. The stable wafer stage according to claim 1, wherein, The second bracket (5) is foldable for adjusting the horizontal position of the wafer stage.

3. The stable wafer stage according to claim 2, characterized in that, An integrally fixed sinking edge (6) is provided at the outer edge part of the iron sheet block (1), and a groove (7) is provided in the sinking edge (6).

4. A stable wafer stage according to claim 3, wherein, An installation ring (8) is buckled on the sinking edge (6), and the installation ring (8) is fixed to the reserved hole position of the sinking edge (6) by screws.

5. The stable wafer stage according to claim 4, wherein A sealing ring (9) is provided between the installation ring (8) and the sinking edge (6), and the sealing ring (9) is closely attached to the groove (7) to form a seal.

6. The stable wafer carrier according to claim 5, wherein, The circular frame formed by the upper and lower sinking edges (6) and the installation ring (8) is used for fixing the wafer stage.

Images