Silicon controlled module packaging structure of contactless controller
Through the integrated packaging and thermally conductive silicone sealing design, the structural dispersion, heating and sealing problems of the contactless controller thyristor module are solved, and the module is compact, sealed, noise reduction and signal stability are achieved, and the stability of electronic components is improved.
Patent Information
- Application Number
- CN202422318030.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-09-23
- Publication Date
- 2025-08-01
- Estimated Expiration
- 2034-09-23
AI Technical Summary
The existing contactless Thyristor modules have problems such as dispersed structure, large volume, large heat generation, poor sealing, and unstable connection between PCB board and SCR chip.
The integrated packaging structure is adopted to encapsulate the conductive mechanism, connecting conductive sheet and busbar conductive sheet in the shell, and seal it with packaged thermally conductive silicone. Combined with a high-purity copper base plate and ABS shell design, it ensures that the module is compact, sealed and has excellent heat dissipation performance.
It realizes compact module structure, complete internal sealing, reduces noise, improves signal stability and heat dissipation performance, and ensures the stability of electronic components.
Smart Images

Figure CN223181126U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of thyristor modules, in particular to a thyristor module packaging structure of a contactless controller. Background Art
[0002] At present, the overhead traveling cranes in the metallurgical industry are in the stage of transformation and replacement, and the contactless controllers for overhead traveling cranes are in the accelerating development period. With the wide application of these technologies in the overhead traveling crane industry, electromagnetic AC contactors will be gradually replaced. Because the service life of electromagnetic AC contactors is relatively short, due to the dust in the use environment and the carbonization and ablation of the contacts by the arc during breaking, it will cause the adhesion of the contacts or an increase in the contact resistance and heat generation, resulting in the damage of the contacts; the action time of electromagnetic AC contactors is relatively long during frequent commutation, generally ≥100 ms, and the phenomenon of slipping hooks is likely to occur during heavy loads; for the above reasons, with the development of technology, contactless controllers with thyristors as the core components are gradually applied to the metallurgical industry to replace electromagnetic AC contactors; thyristor is the abbreviation of thyristor rectifier element, which is a high-power semiconductor device with a four-layer structure of three PN junctions, also known as thyristor (SCR).
[0003] For the existing thyristor modules of contactless controllers, firstly, the structural dispersion is particularly prominent. The setting of multiple independent housings, with a separate set of thyristors arranged in each independent housing, increases the overall volume of the module, bringing many inconveniences to subsequent control; secondly, the large number of internal components leads to a large amount of heat generation, which becomes one of the main factors threatening the stability of electronic components; furthermore, the internal sealing performance is poor, which not only makes the module vulnerable to the external environment, but also aggravates the noise problem during operation; finally, the soft wire connection method adopted between the PCB board and the SCR thyristor chip, although realizing signal transmission to a certain extent, the risk of wire detachment cannot be ignored during long-term operation. Content of the Utility Model
[0004] The purpose of the utility model is to provide a thyristor module packaging structure of a contactless controller, which is used to solve the following problems existing in the thyristor module packaging structure of the existing contactless controller: firstly, the structure is dispersed, the multi-housing design increases the volume and the control is complex; secondly, the components are dense, the heat generation is large, affecting the stability of the components; thirdly, the sealing performance is poor, vulnerable to the environment and with a large noise; fourthly, the soft wire connection between the PCB and the SCR chip is prone to detachment during long-term operation, affecting the signal stability.
[0005] To achieve the above object, the utility model provides the following technical solution: A thyristor module packaging structure of a contactless controller, including a housing, further including an insulating sheet provided on the bottom side of the inner wall of the housing, a plurality of conductive mechanisms arranged at intervals on the upper side of the insulating sheet, connecting conductive sheets respectively arranged on both sides of the conductive mechanism, a single conductive sheet arranged on the upper side of one connecting conductive sheet, a plurality of busbar conductive sheets arranged at intervals on the upper side of the other connecting conductive sheet, fastening screws respectively arranged on the upper sides of the single conductive sheet and the busbar conductive sheets, a PCB board provided on the top side of the inner wall of the housing, and packaging thermal silica gel filled in the housing. One end of the single conductive sheet and the busbar conductive sheet penetrates and extends to the upper side of the housing, and one end of the fastening screw is in threaded cooperation with the upper side of the housing; The conductive mechanism includes two branch conductive sheets arranged at intervals on the upper side of the insulating sheet, an SCR thyristor chip arranged on the upper side of the branch conductive sheet, and a bridge conductive sheet connected to the upper side of the SCR thyristor chip. One end of the bridge conductive sheet is connected to the upper side of another SCR thyristor chip. The two bridge conductive sheets are arranged at intervals. The SCR thyristor chip is connected to the PCB board through a flexible wire. The side of the branch conductive sheet away from the bridge conductive sheet is connected to the connecting conductive sheet.
[0006] Further, the housing includes a bottom plate connected to the lower side of the insulating sheet, an ABS housing arranged on the outer edge of the upper side of the bottom plate, and a plurality of grooves respectively arranged at both ends of the upper side of the ABS housing. The upper side of the PCB board is connected to the top side of the inner wall of the ABS housing. One end of the single conductive sheet and the busbar conductive sheet penetrating the upper side of the housing is arranged in the corresponding groove.
[0007] Further, an LED signal display lamp with one end connected to the PCB board is arranged on the upper side of the ABS housing.
[0008] Further, the bottom plate is made of high-purity copper.
[0009] Further, waist-shaped holes that cooperate with the fastening screws are arranged at one end of the single conductive sheet and the busbar conductive sheet penetrating the upper side of the housing.
[0010] Compared with the prior art, the beneficial effects of the utility model are as follows:
[0011] The thyristor module packaging design of this contactless controller encapsulates multiple conductive mechanisms, connecting conductive sheets, and multiple single conductive sheets and busbar conductive sheets connected thereto in the housing, forming an integrated packaging structure; This design significantly improves the compactness of the structure and greatly facilitates subsequent control operations;
[0012] By injecting encapsulating thermal conductive silicone into the housing, not only is the complete sealing inside the module achieved, effectively isolating the influence of the external environment, ensuring no noise interference during device operation, but also while ensuring the stability of the PCB board and internal flexible wires, the common fixing problems and the risk of wire detachment in traditional encapsulation are solved. In addition, the addition of thermal conductive silicone significantly improves the heat dissipation performance of the module, effectively reducing the internal temperature and playing a role in protecting internal electronic components. Description of the Drawings
[0013] Figure 1 It is a schematic structural diagram of a thyristor module encapsulation structure of a contactless controller of the present utility model;
[0014] Figure 2 It is a cross-sectional schematic diagram of a thyristor module encapsulation structure of a contactless controller of the present utility model;
[0015] Figure 3 It is a schematic internal structure diagram of a thyristor module encapsulation structure of a contactless controller of the present utility model.
[0016] In the figure: 1. ABS housing; 2. Busbar conductive sheet; 3. Fastening screw; 4. Bottom plate; 5. Single conductive sheet; 6. LED signal display lamp; 7. PCB board; 8. Insulating sheet; 9. Bridge-type conductive sheet; 10. SCR thyristor chip; 11. Encapsulating thermal conductive silicone; 12. Branch conductive sheet; 13. Connecting conductive sheet; 14. Kidney-shaped hole; 15. Groove. Detailed Embodiment
[0017] Please refer to Figures 1-3, A thyristor module packaging structure for a contactless controller, including a housing, and further including an insulating sheet 8 provided on the bottom side of the inner wall of the housing, a plurality of conductive mechanisms arranged at intervals on the upper side of the insulating sheet 8, connecting conductive sheets 13 respectively provided on both sides of the conductive mechanism, a single conductive sheet 5 provided on the upper side of one connecting conductive sheet 13, a plurality of busbar conductive sheets 2 arranged at intervals on the upper side of the other connecting conductive sheet 13, fastening screws 3 respectively provided on the upper sides of the single conductive sheet 5 and the busbar conductive sheets 2, a PCB board 7 provided on the top side of the inner wall of the housing, and a packaging thermal conductive silicone 11 filled in the housing. One end of the single conductive sheet 5 and the busbar conductive sheets 2 both penetrate and extend to the upper side of the housing, and one end of the fastening screw 3 is in threaded cooperation with the upper side of the housing; the conductive mechanism includes two branch conductive sheets 12 arranged at intervals on the upper side of the insulating sheet 8, an SCR thyristor chip 10 provided on the upper side of the branch conductive sheet 12, a bridge conductive sheet 9 welded to the upper side of the SCR thyristor chip 10. One end of the bridge conductive sheet 9 is welded to the upper side of another SCR thyristor chip 10, and the two bridge conductive sheets 9 are arranged at intervals. The SCR thyristor chip 10 is connected to the PCB board 7 through a flexible wire. The side of the branch conductive sheet 12 away from the bridge conductive sheet 9 is connected to the connecting conductive sheet 13; the external power supply is converted into a signal for controlling the SCR thyristor chip 10 through the PCB board 7. Since the SCR thyristor chip 10 is connected to the busbar conductive sheets 2 and the single conductive sheet 5, it then works normally in the external system through the on-off of the SCR thyristor chip 10; this packaging structure design adopts an integrated packaging. Inside the housing, through multiple groups of conductive mechanisms, the SCR thyristor chip 10 (corresponding to the external three-phase power supply), the PCB board 7, the branch conductive sheets 12, the bridge conductive sheets 9, the connecting conductive sheets 13, the single conductive sheet 5, and the busbar conductive sheets 2 are all packaged inside the housing of the module, making the internal structure of the whole module compact and facilitating control; when the whole module is packaged, by injecting the packaging thermal conductive silicone 11 into the housing, the inside of the whole module is in a completely sealed state, ensuring that there are no voids inside the module, no noise during normal operation, and ensuring the fixation of the PCB board and the internal flexible wires inside the module, and also solving the problems of the fixation of the PCB board and the easy detachment of the internal connecting flexible wires. Moreover, the packaging thermal conductive silicone 11 reduces the temperature inside the module to a certain extent, playing a role in protecting the electronic components inside the module.
[0018] The housing includes a bottom plate 4 adhesively fixed to the lower side of the insulating sheet 8 with a thermal conductive adhesive, an ABS housing 1 adhesively fixed to the outer edge of the upper side of the bottom plate 4 with a thermal conductive adhesive, and a plurality of grooves 15 respectively provided at both ends of the upper side of the ABS housing 1. The upper side of the PCB board 7 is connected to the top side of the inner wall of the ABS housing 1. One end of each of the single-conductor sheet 5 and the bus-bar conductor sheet 2 penetrating through the upper side of the housing is arranged in the corresponding groove 15. An opening for the single-conductor sheet 5 and the bus-bar conductor sheet 2 to penetrate through the ABS housing 1 correspondingly is provided on the upper side of the ABS housing 1. One end of the single-conductor sheet 5 and the bus-bar conductor sheet 2 passing through the ABS housing 1 is bent and coincides with the corresponding groove 15, thus facilitating subsequent external wiring. The ABS housing 1 is made of ABS material, so that even when the external environmental temperature is very high, the internal parts of the module can still work without being affected, and it can also prevent dust and moisture.
[0019] An LED signal display lamp 6 with one end connected to the PCB board 7 is provided on the upper side of the ABS housing 1. An LED signal display lamp 6 is installed on the PCB board 7. By extending the pins of the LED signal display lamp 6 to the upper surface of the ABS housing 1, there are holes on the upper surface of the ABS housing 1 for the LED signal display lamp 6 to pass through, and the state of the LED can be directly displayed. When the external power is turned on, the user can directly judge the working state of the SCR thyristor chip 10 through the state of the LED signal display lamp 6.
[0020] Since the bottom plate 4 is made of high-purity copper, the bottom plate 4 has excellent thermal expansion coefficient, ensuring that the internal structure is not damaged by expansion.
[0021] Waist-shaped holes 14 cooperating with the fastening screws 3 are provided at one end of each of the single-conductor sheet 5 and the bus-bar conductor sheet 2 penetrating through the upper side of the housing. Through the waist-shaped holes 14, the fastening screws 3 pass through the waist-shaped holes 14 and are connected to the upper surface of the ABS housing 1.
[0022] Working principle: The external power supply is converted into a signal for controlling the SCR thyristor chip 10 through the PCB board 7. Since the SCR thyristor chip 10 is connected to the busbar conductive sheet 2 and the single conductive sheet 5, it can work normally in the external system through the on-off of the SCR thyristor chip 10; The insulating sheet 8 and the bottom plate 4 are adhesively fixed with heat-conducting glue. Then, two groups of multiple branched conductive sheets 12 are welded on the upper side of the insulating sheet 8, the SCR thyristor chip 10 is welded on the branched conductive sheet 12, and the bridge conductive sheet 9 is welded on the SCR thyristor chip 10, so that the other end of the bridge conductive sheet 9 is welded to the upper side of the corresponding other SCR thyristor chip 10. After connecting in sequence, the PCB board 7 and the SCR thyristor chip 10 are connected by a flexible wire, and the ABS housing and the bottom plate 4 are adhesively fixed with heat-conducting glue. The single conductive sheet 5 and multiple busbar conductive sheets 2 pass through the openings on the ABS housing 1, and the ends of the single conductive sheet 5 and the busbar conductive sheet 2 passing through the ABS housing 1 are bent and coincide with the inner surface of the groove 15. After the entire module is encapsulated, the single conductive sheet 5 and the busbar conductive sheet 2 are fixed to the inner surface of the groove 15 by using the fastening screw 3 to facilitate later wiring with the outside. After encapsulation, the encapsulating heat-conducting silica gel 11 is injected into the housing; Furthermore, this encapsulation mechanism has the characteristics of making the internal structure of the whole module compact and convenient for control; By injecting the encapsulating heat-conducting silica gel 11, the inside of the whole module is in a completely sealed state, ensuring that there are no voids inside the module, no noise during normal operation, and ensuring the fixation of the PCB board and the internal flexible wires inside the module. It also solves the problems of the fixation of the PCB board and the easy detachment of the internal connecting flexible wires. Moreover, the encapsulating heat-conducting silica gel 11 reduces the temperature inside the module to a certain extent, plays a role in protecting the electronic components inside the module, and fixes the positions of the internal PCB board and the connecting wires, so that the wires are basically not loose or detached.
[0023] The above are only the preferred embodiments of the present invention and are not intended to limit the present invention. Any modifications, equivalent replacements, and improvements made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.
Claims
1. A thyristor module packaging structure for a contactless controller, comprising a housing, characterized in that, It further includes an insulating sheet (8) provided at the bottom side of the inner wall of the housing, a plurality of conductive mechanisms arranged at intervals on the upper side of the insulating sheet (8), connecting conductive sheets (13) respectively provided on both sides of the conductive mechanism, a single conductive sheet (5) provided on the upper side of one connecting conductive sheet (13), a plurality of busbar conductive sheets (2) arranged at intervals on the upper side of the other connecting conductive sheet (13), fastening screws (3) respectively provided on the upper sides of the single conductive sheet (5) and the busbar conductive sheets (2), a PCB board (7) provided at the top side of the inner wall of the housing, and encapsulating heat-conducting silica gel (11) filled in the housing. One end of the single conductive sheet (5) and the busbar conductive sheets (2) penetrates and extends to the upper side of the housing, and one end of the fastening screw (3) is in threaded cooperation with the upper side of the housing. The conductive mechanism includes two branch conductive sheets (12) arranged at intervals on the upper side of the insulating sheet (8), an SCR thyristor chip (10) provided on the upper side of the branch conductive sheet (12), and a bridge conductive sheet (9) connected to the upper side of the SCR thyristor chip (10). One end of the bridge conductive sheet (9) is connected to the upper side of another SCR thyristor chip (10). The two bridge conductive sheets (9) are arranged at intervals. The SCR thyristor chip (10) is connected to the PCB board (7) through a flexible wire. The side of the branch conductive sheet (12) away from the bridge conductive sheet (9) is connected to the connecting conductive sheet (13).
2. The thyristor module packaging structure of a contactless controller according to claim 1, characterized in that, The housing includes a bottom plate (4) connected to the lower side of the insulating sheet (8), an ABS housing (1) provided on the outer edge of the upper side of the bottom plate (4), and a plurality of grooves (15) respectively provided at both ends of the upper side of the ABS housing (1). The upper side of the PCB board (7) is connected to the top side of the inner wall of the ABS housing (1). One end of the single conductive sheet (5) and the busbar conductive sheets (2) penetrating through the upper side of the housing are both arranged in the corresponding grooves (15).
3. The thyristor module packaging structure of a contactless controller according to claim 2, characterized in that, An LED signal display lamp (6) with one end connected to the PCB board (7) is provided on the upper side of the ABS housing (1).
4. The thyristor module packaging structure of a contactless controller according to claim 2, characterized in that, The bottom plate (4) is made of high-purity copper.
5. The thyristor module packaging structure of a contactless controller according to claim 1, characterized in that, One end of the single conductive sheet (5) and the busbar conductive sheets (2) penetrating through the upper side of the housing are both provided with kidney-shaped holes (14) that cooperate with the fastening screws (3).