Air-based phased array antenna

Abstract

The utility model discloses a space-based phased-array antenna, and relates to the technical field of antennas, the space-based phased-array antenna comprises a box body, the middle of the box body is provided with a cavity, and the circumferential direction of the box body is provided with a plurality of mounting surfaces; a plurality of TR antenna plates, each of the TR antenna plates is correspondingly installed on each of the installation surfaces, and the TR antenna plates are provided with TR assembly arrays; wherein the TR assembly comprises an antenna unit and a radio frequency integrated circuit, the antenna unit is coupled with the radio frequency integrated circuit, and the antenna unit and the radio frequency integrated circuit are packaged together. According to the technical scheme provided by the utility model, the volume and the quality of the space-based phased-array antenna are improved.

Description

Technical Field

[0001] The utility model relates to the technical field of antennas, and particularly relates to a spaceborne phased array antenna. Background Art

[0002] Phased array antennas are widely used to achieve long-distance and large-bandwidth data transmission. However, the existing phased array antennas have the defects of large volume and heavy mass, and cannot be applied to spaceborne platforms with limited loads. Summary of the Utility Model

[0003] The main purpose of the utility model is to propose a spaceborne phased array antenna, aiming to reduce the volume and mass of the phased array antenna.

[0004] To achieve the above purpose, the spaceborne phased array antenna proposed by the utility model includes:

[0005] A box body, with an accommodation space in the middle of the box body, and a plurality of mounting surfaces on the circumference of the box body;

[0006] A plurality of TR antenna boards, each of which is respectively mounted on each mounting surface, and a TR component array is provided on the TR antenna board; wherein,

[0007] The TR component includes an antenna unit and a radio frequency integrated circuit, the antenna unit is coupled with the radio frequency integrated circuit, and the antenna unit and the radio frequency integrated circuit are co-packaged.

[0008] In an embodiment, the antenna unit includes:

[0009] A first PCB;

[0010] A second PCB, which is stacked on the first PCB;

[0011] A radiator, which is arranged on the upper surface of the second PCB, and signal holes are provided on the radiator;

[0012] A feeding patch, which is arranged on the upper surface of the first PCB and between the first PCB and the second PCB, and the feeding patch feeds power to the radiator through the signal holes.

[0013] In an embodiment, a plurality of ground holes are provided at corresponding positions around the radiator on the second PCB, and a closed dielectric cavity is formed by the radiator, the ground holes and the feeding patch.

[0014] In an embodiment, mounting grooves are formed on the mounting surfaces, and the TR antenna boards are mounted in the mounting grooves;

[0015] A plurality of heat dissipation blocks are further provided on the bottom wall of the installation groove, and heat conduction pads are provided on the heat dissipation blocks;

[0016] A plurality of T / R chips are provided on the surface of the TR antenna board opposite to the heat dissipation blocks, and each T / R chip abuts against the corresponding heat conduction pad.

[0017] In one embodiment, a plurality of heat dissipation fins are provided on the installation surface in the areas on both sides of the installation groove.

[0018] In one embodiment, the space-based phased array antenna further includes an antenna cover, the antenna cover is fitted with the installation groove, and the TR antenna board is located between the antenna cover and the bottom wall of the installation groove.

[0019] In one embodiment, a plurality of threaded posts are further provided in the installation groove, and the TR antenna board and the antenna cover are detachably installed in the installation groove by means of screwing bolts with the threaded posts.

[0020] In one embodiment, a first opening and a second opening are respectively provided at the upper end and the lower end of the box body, and the space-based phased array antenna further includes:

[0021] A cover plate, the cover plate is installed on the first opening;

[0022] A bottom plate, the bottom plate is installed on the second opening.

[0023] In one embodiment, sealing grooves are provided in both the first opening and the second opening, and sealing rings are provided in the sealing grooves.

[0024] In one embodiment, a radio frequency interface and a power supply interface are provided on the side wall of the bottom plate, and a plurality of heat dissipation fins are provided on the outer wall of the bottom plate.

[0025] The technical solution of the present utility model is to install the TR antenna board in a box body with a cavity. The TR antenna board is provided with a TR component array. The TR component includes an antenna unit and a radio frequency integrated circuit. The antenna unit is coupled with the radio frequency integrated circuit, and the antenna unit and the radio frequency integrated circuit are co-packaged. By adopting the design of co-packaging the antenna and the radio frequency integrated circuit, AIP antenna packaging is realized. The TR antenna board integrates the functions of an antenna, a power distribution network, a power supply, and a control signal by using a multi-layer microwave substrate, significantly reducing the volume and mass of the space-based phased array antenna. Description of the Drawings

[0026] In order to more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the following will briefly introduce the drawings required for the description of the embodiments or the prior art. Obviously, the drawings in the following description are only some embodiments of the present invention. For those of ordinary skill in the art, without creative efforts, other drawings can be obtained based on the structures shown in these drawings.

[0027] Figure 1 Schematic diagram of the structure of an embodiment of the space-based phased array antenna provided by the present invention;

[0028] Figure 2 Exploded view of an embodiment of the space-based phased array antenna provided by the present invention;

[0029] Figure 3 For Figure 2 Partial enlarged view at A in

[0030] Figure 4 Schematic diagram of the structure of the box body of the space-based phased array antenna provided by the present invention;

[0031] Figure 5 Schematic diagram of the structure of the cover plate of the space-based phased array antenna provided by the present invention;

[0032] Figure 6 Schematic diagram of the structure of the bottom plate of the space-based phased array antenna provided by the present invention;

[0033] Figure 7 Schematic diagram of the structure of the TR antenna board provided by the present invention;

[0034] Figure 8 Schematic diagram of the structure of the antenna unit provided by the present invention;

[0035] Figure 9 Another schematic diagram of the structure of the TR antenna board provided by the present invention;

[0036] Figure 10 Schematic diagram of the antenna array surface and signal gain provided by the present invention;

[0037] Figure 11 Circuit diagram of the radio frequency integrated circuit provided by the present invention;

[0038] Figure 12 Schematic diagram of the antenna feeding system provided by the present invention;

[0039] Figure 13 Another schematic diagram of the structure of the TR antenna board provided by the present invention.

[0040] ……

[0041] Description of the Attached Reference Numerals:

[0042] 1. Box body; 11. Cavity; 12. Mounting surface; 121. Mounting groove; 122. Heat dissipation block; 123. Thermal conductive pad; 124. First heat sink; 125. Threaded post; 13. First opening; 14. Second opening; 2. TR antenna board; 21. TR component; 211. Antenna unit; 211a. First PCB; 211b. Second PCB; 211c. Radiator; 211d. Signal hole; 211f. Feeding patch; 211e. Ground hole; 212. Radio frequency integrated circuit; 22. T / R chip; 3. Radome; 4. Cover plate; 41. Second heat sink; 5. Bottom plate; 51. Radio frequency interface; 52. Power interface; 53. Third heat sink; 6. Sealing groove; 7. Antenna layer; 8. RFIC layer.

[0043] The realization, functional features and advantages of the present utility model will be further described in conjunction with the embodiments with reference to the accompanying drawings. Specific Embodiments

[0044] Next, the technical solutions in the embodiments of the present utility model will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present utility model. Obviously, the described embodiments are only a part of the embodiments of the present utility model, rather than all the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present utility model without creative efforts shall fall within the protection scope of the present utility model.

[0045] It should be noted that if there are directional indications (such as up, down, left, right, front, back...) involved in the embodiments of the present utility model, the directional indications are only used to explain the relative positional relationship and movement conditions between components in a specific posture. If the specific posture changes, the directional indications will also change accordingly.

[0046] In addition, if there are descriptions involving "first", "second", etc. in the embodiments of the present utility model, the descriptions of "first", "second", etc. are only for descriptive purposes and cannot be understood as indicating or implying their relative importance or implicitly indicating the quantity of the indicated technical features. Thus, the features defined with "first" and "second" may explicitly or implicitly include at least one such feature. In addition, if "and / or" or "and / or" appears throughout the text, its meaning includes three parallel solutions. Taking "A and / or B" as an example, it includes solution A, solution B, or a solution where A and B are satisfied simultaneously. In addition, the technical solutions between the embodiments can be combined with each other, but it must be based on the fact that those of ordinary skill in the art can implement them. When the combination of technical solutions is contradictory or cannot be implemented, it should be considered that such a combination of technical solutions does not exist and is not within the protection scope required by the present utility model.

[0047] The present utility model proposes an airborne phased array antenna.

[0048] Please refer to Figure 1 and Figure 2 In an embodiment of the present utility model, the airborne phased array antenna includes a box body 1 and a plurality of TR antenna boards 2.

[0049] The circumferential direction of the box body 1 has a plurality of mounting surfaces 12, and each of the TR antenna boards 2 is respectively mounted on each mounting surface 12. A receiving space is provided in the middle of the box body 1, that is, the box body 1 has a hollow structure, so that the weight of the airborne phased array antenna can be reduced, the volume of the airborne phased array antenna can be reduced, and the airborne phased array antenna can be made lightweight and miniaturized.

[0050] In some embodiments, the outer shape of the box body 1 is a polygonal structure, and four mounting surfaces 12 are evenly and symmetrically distributed within a circumferential range of 360 degrees.

[0051] Refer to Figure 2 and Figures 7 to 9 On the TR antenna board ②, a plurality of TR components 21 are provided, and the plurality of TR components 21 form a TR component 21 array. In some embodiments, 64 TR components 21 are provided on each of the TR antenna boards 2, and the 64 TR components 21 form an 8×8 uniform dot matrix to form the TR component 21 array.

[0052] In order to further realize the lightweight and miniaturization of the airborne phased array antenna, the TR antenna board 2 includes an antenna layer 7 and an RFIC layer stacked in sequence. The TR component 21 includes an antenna unit 211 and a radio frequency integrated circuit 212 (RFIC, Radio Frequency Integrated Circuit). The antenna unit 211 is located on the antenna layer 7, and the radio frequency integrated circuit 212 is located on the RFIC layer. The antenna unit 211 is coupled to the radio frequency integrated circuit 212, and the antenna unit 211 and the radio frequency integrated circuit 212 are co-packaged, reducing the number of external connections and discrete components, which helps to reduce the volume of the entire system and reduce the weight.

[0053] The radio frequency integrated circuit 212 can integrate multiple radio frequency functions, such as transmit and receive switches, power amplifiers, low noise amplifiers, phase shifters, attenuators, etc.

[0054] Refer to Figure 11 In some embodiments, the radio frequency integrated circuit 212 integrates an attenuator, a power divider, and a cavity filter.

[0055] The technical solution of the present utility model is to install the TR antenna board 2 in the box body 1 with a cavity 11, and an array of TR components 21 is provided on the TR antenna board 2. The TR component 21 includes an antenna unit 211 and a radio frequency integrated circuit 212. The antenna unit 211 is coupled with the radio frequency integrated circuit 212, and the antenna unit 211 and the radio frequency integrated circuit 212 are co-packaged. By adopting the design of co-packaging the antenna and the radio frequency integrated circuit 212, the AIP (Antenna-In-Package) antenna packaging is realized. The TR antenna board 2 is made of a multi-layer microwave substrate, integrating the functions of an antenna, a power distribution network, a power supply and a control signal, significantly reducing the volume and mass of the spaceborne phased array antenna.

[0056] See Figure 10 , the antenna array surface of the present utility model adopts the AIP packaging form, integrating analog, control and power supply circuits. The gain of the antenna unit 211 is 5 dBi, the axial gain of the array surface reaches 23 dBi, and the maximum azimuth scanning angle gain is better than 20 dBi.

[0057] See Figure 7 and Figure 8 , in an embodiment, the antenna unit 211 includes a first PCB 211a, a second PCB 211b, a radiator 211c and a feeding patch 211f. The second PCB 211b is stacked on the first PCB 211a. The radiator 211c is arranged on the upper surface of the second PCB 211b, and a signal hole 211d is provided on the radiator 211c.

[0058] The feeding patch 211f is arranged on the upper surface of the first PCB 211a and located between the first PCB 211a and the second PCB 211b. The feeding patch 211f feeds power to the radiator 211c through the signal hole 211d.

[0059] See Figure 8 , in an embodiment, in order to expand the bandwidth of the antenna, the present application uses the cavity 11 for feeding. Specifically, a plurality of ground holes 211e are provided at corresponding positions around the radiator 211c on the second PCB 211b. The radiator 211c, the ground holes 211e and the feeding patch 211f form a closed dielectric cavity 11. It should be noted that the concept of cavity 11 feeding usually appears in microwave engineering and wireless communication technologies. It refers to a way of transmitting energy from a feeder (usually a coaxial cable or a waveguide) to an antenna or other microwave components. Here, the "cavity 11" refers to a closed space with specific dimensions, which can be used to change the phase, polarization and other characteristics of electromagnetic waves.

[0060] By adopting this cavity 11 feeding design, the relative bandwidth (VSWR < 2) of the microstrip antenna in the Ka band can be extended to about 20%, that is, 3 GHz.

[0061] See Figure 2 , Figure 3 , Figure 12 and Figure 13 , in an embodiment, an installation groove 121 is formed on the installation surface 12, and a plurality of heat dissipation blocks 122 are further provided on the bottom wall of the installation groove 121, and a heat conduction pad 123 is provided on the heat dissipation block 122; the TR antenna board 2 is installed in the installation groove 121.

[0062] On the surface of the TR antenna board 2 opposite to the heat dissipation block 122, a plurality of T / R chips 22 are provided, and each T / R chip 22 abuts against the corresponding heat conduction pad 123.

[0063] In this application, a Ka-band multi-channel T / R multifunctional chip with a linear output power of about 17 dBm is adopted. Specifically, 4×4 multi-channel T / R multifunctional chips are arranged on the surface of the TR antenna board 2 opposite to the heat dissipation block 122, with a total of 64 channels. Since the system is composed of 4 planar arrays, a total of 64 multifunctional T / R chips 22 are used, with a total of 256 channels. One SP4T switch is used for switching among the four planar arrays to realize signal transmission with the channels.

[0064] See Figure 12 , the operating frequency band of the T / R chip 22 is 26.5 GHz to 29.5 GHz, and it integrates a complete 4-channel radio frequency unit, including input / output transceiver switches, power amplifiers and low-noise amplifiers, phase shift and attenuation, 4-channel power distribution and synthesis, etc.

[0065] Among them, the power distribution circuit is used to realize the mutual conversion between 1 path of signal and 4 paths.

[0066] The T / R channel is used to complete the radio frequency transceiver function, and has phase adjustment and amplitude adjustment functions. The channel contains transceiver multifunctional devices and amplitude-phase control multifunctional devices; the TR chip is in the TDD operating mode, and the transceiver switching time ≤ 500 ns.

[0067] The power divider can be realized by using a traditional Wilkinson power divider microstrip.

[0068] The SP4T switch is realized by cascading two split chips of a shelf GaAs MMIC chip.

[0069] The drive amplifier selects a shelf GaAs MMIC chip, with an operating frequency band of 6 to 18 GHz, a saturated output power of 20 dBm, and a noise figure of 6 dB.

[0070] SeeFigure 2 In one embodiment, in order to reduce weight and improve the heat dissipation capacity of the antenna, a plurality of first heat sinks 124 are provided on both sides of the mounting groove 121 on the mounting surface 12. The first heat sinks 124 are made of high thermal conductivity materials, such as aluminum alloy or copper alloy. These materials not only have good thermal conductivity, but also can effectively reduce the weight of the antenna. In order to further improve the heat dissipation effect, the surface of the heat sink can be specially treated, such as anodizing or plating, to increase the heat dissipation area and improve the heat dissipation efficiency.

[0071] In Figure 4 In another embodiment shown in

[0072] See Figure 1 and Figure 2 In one embodiment, the space-based phased array antenna further includes an antenna radome 3, the antenna radome 3 is fitted with the mounting groove 121, and the TR antenna board 2 is located between the antenna radome 3 and the bottom wall of the mounting groove 121. The antenna radome 3 can protect and support the components of the antenna.

[0073] See Figures 1 to 3 In one embodiment, a plurality of threaded posts 125 are further provided in the mounting groove 121, and the TR antenna board 2 and the antenna radome 3 are detachably mounted in the mounting groove 121 by screwing bolts with the threaded posts 125. In this way, the antenna can be easily disassembled and assembled.

[0074] See Figures 2 - 6 In one embodiment, a first opening 13 and a second opening 14 are respectively provided at the upper and lower ends of the box body 1, and the space-based phased array antenna further includes: a cover plate 4 and a bottom plate 5. A plurality of second heat sinks 41 are provided on the outer wall of the cover plate 4. The cover plate 4 is mounted on the first opening 13, and the bottom plate 5 is mounted on the second opening 14.

[0075] See Figure 4 In one embodiment, sealing grooves 6 are provided in both the first opening 13 and the second opening 14, and sealing rings are provided in the sealing grooves 6.

[0076] See Figure 6 In one embodiment, a radio frequency interface 51 and a power interface 52 are provided on the side wall of the bottom plate 5, and a plurality of third heat sinks 53 are provided on the outer wall of the bottom plate 5.

[0077] The above are only exemplary embodiments of the present utility model, and do not limit the patent scope of the present utility model accordingly. Any equivalent structural transformation made under the technical concept of the present utility model by using the content of the specification and drawings of the present utility model, or any direct / indirect application in other related technical fields, is included in the patent protection scope of the present utility model.

Claims

1. An airborne phased array antenna, characterized in that, Comprising: A box body, with a cavity in the middle of the box body, and multiple mounting surfaces on the circumference of the box body; Multiple TR antenna boards, each of which is respectively mounted on each mounting surface, and a TR component array is provided on the TR antenna board; wherein, The TR component includes an antenna unit and a radio frequency integrated circuit, the antenna unit is coupled with the radio frequency integrated circuit, and the antenna unit and the radio frequency integrated circuit are co-packaged.

2. The airborne phased array antenna according to claim 1, characterized in that, The antenna unit includes: A first PCB; A second PCB, which is stacked on the first PCB; A radiator, which is arranged on the upper surface of the second PCB, and signal holes are provided on the radiator; A feeding patch, which is arranged on the upper surface of the first PCB and between the first PCB and the second PCB, and the feeding patch feeds power to the radiator through the signal holes.

3. The airborne phased array antenna according to claim 2, wherein, Multiple ground holes are provided at corresponding positions around the radiator on the second PCB, and the radiator, the ground holes and the feeding patch form a closed dielectric cavity.

4. The airborne phased array antenna according to any one of claims 1 to 3, characterized in that, Mounting grooves are formed on the mounting surfaces, and the TR antenna boards are mounted in the mounting grooves; Multiple heat dissipation blocks are further provided on the bottom wall of the mounting grooves, and heat conduction pads are provided on the heat dissipation blocks; Multiple T / R chips are provided on the surface of the TR antenna board opposite to the heat dissipation blocks, and each T / R chip abuts against the corresponding heat conduction pad.

5. The space-based phased array antenna according to claim 4, characterized in that, Multiple first heat dissipation fins are provided on the mounting surfaces in the areas on both sides of the mounting grooves.

6. The airborne phased array antenna according to claim 4, wherein The space-based phased array antenna further includes an antenna cover, the antenna cover is fitted with the mounting groove, and the TR antenna board is located between the antenna cover and the bottom wall of the mounting groove.

7. The space-based phased array antenna according to claim 6, wherein, Multiple threaded posts are further provided in the mounting grooves, and the TR antenna boards and the antenna cover are detachably mounted in the mounting grooves by means of screwing bolts with the threaded posts.

8. The airborne phased array antenna according to claim 1, characterized in that, A first opening and a second opening are respectively provided at the upper end and the lower end of the box body, and the space-based phased array antenna further includes: A cover plate, which is mounted on the first opening, and multiple second heat dissipation fins are provided on the outer wall of the cover plate; A bottom plate, which is mounted on the second opening.

9. The airborne phased array antenna according to claim 8, characterized in that, Sealing grooves are provided in both the first opening and the second opening, and sealing rings are provided in the sealing grooves.

10. The space-based phased array antenna according to claim 8, wherein A radio frequency interface and a power interface are provided on the side wall of the bottom plate, and multiple third heat dissipation fins are provided on the outer wall of the bottom plate.

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