Laser pumping source and laser
By designing the pump body, runner and capillary structure in the laser pump source, the condensation medium circulates and absorbs heat and evaporates and condenses in the runner, solving the heat dissipation problem of high-power chips and improving the heat dissipation performance and stability of the laser pump source.
Patent Information
- Application Number
- CN202422359456.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-09-27
- Publication Date
- 2025-08-01
- Estimated Expiration
- 2034-09-27
AI Technical Summary
The existing laser pump sources cannot effectively adapt to the heat dissipation needs of high-power chips, resulting in the chip junction temperature cannot be guaranteed to be within a certain temperature range, the heat flow density increases, and the conduction and heat dissipation effect is limited.
A laser pump source is designed, including a pump body, a flow channel and a capillary tube. The flow channel is filled with condensation medium. The front runner is arranged inclined downward below the chip contact surface. The rear runner extends to the cover area. The capillary tube is arranged along the inner wall of the flow channel. The condensation medium circulates in the flow channel to absorb heat and evaporate and condense, and takes away heat through capillary reflux.
It improves the heat dissipation performance of the laser pump source, reduces the maximum junction temperature of the chip, improves the stability and heat dissipation effect of the pump source, and adapts to the heat dissipation needs of higher power chips.
Smart Images
Figure CN223181572U_ABST
Abstract
Description
Technical Field
[0001] The present application relates to the field of laser technology, and in particular to a laser pump source and a laser. Background Art
[0002] Most laser pump sources currently on the market are solid copper pump bodies. The chip heat source conducts heat through the pump body to cooling parts such as water cooling plates for heat dissipation.
[0003] However, as laser power increases, the chip generates more heat, but the chip size does not increase. This leads to an increasing heat flux density, and the chip junction temperature cannot be guaranteed to be within a certain temperature range. This is because the existing laser pump source is a solid pump body, which only has a conduction function and is difficult to achieve the purpose of cooling and temperature equalization. Moreover, as the chip heats up, the heat conducted by the pump body has a limit. Utility Model Content
[0004] The present application provides a laser pump source and a laser, aiming to solve the problem in the prior art that the laser pump source cannot adapt to the heat dissipation of high-power chips.
[0005] To achieve the above objectives, the present application proposes a laser pump source. The laser pump source comprises:
[0006] A pump body, wherein a cavity for placing a chip is formed in the pump body, and a chip contact surface for attaching the chip is provided on the bottom surface of the cavity;
[0007] a flow channel, which is provided in the housing between the chamber and the bottom of the pump body, and is filled with a condensing medium; the flow channel includes a front section flow channel and a rear section flow channel which are arranged through the length thereof, the front section flow channel being arranged obliquely downward below the chip contact surface, and the rear section flow channel extending to an area outside the coverage of the chip contact surface;
[0008] The capillary tube is arranged on the inner wall of the flow channel along the extension direction of the flow channel.
[0009] In some embodiments, there are multiple chip contact surfaces, and the multiple chip contact surfaces extend in a stepped and inclined manner, and the vertical distance from each chip contact surface to the front-end flow channel is equal.
[0010] In some embodiments, the plurality of chip contact surfaces extending in a stepped and inclined manner form a group of mounting surfaces, and each group of the mounting surfaces is provided with a corresponding flow channel.
[0011] In some embodiments, a bending angle is formed between the front section flow channel and the rear section flow channel, the rear section flow channel is horizontally designed, and the front section flow channel is inclined.
[0012] In some embodiments, a sealing groove is formed on the pump body, and at least one of the ports of the flow channel is connected to the sealing groove. The sealing groove is used to set a sealing member to seal the flow channel.
[0013] In some embodiments, there are multiple capillaries, and the capillaries are disposed on both sides and the top of the flow channel.
[0014] In some embodiments, the cross-sectional shape of the flow channel is a circular, square or waist-shaped hole design.
[0015] In some embodiments, the capillary tube and the flow channel are integrally formed; or,
[0016] The capillary is welded to the flow channel; or,
[0017] A clamping structure is provided between the capillary tube and the flow channel, and the capillary tube forms a detachable connection with the flow channel through the clamping structure.
[0018] In some embodiments, a condensation temperature of the condensation medium is lower than a junction temperature of the chip.
[0019] The present application also provides a laser, which includes a cooling element and the laser pump source as described above, wherein the pump body is arranged in contact with the cooling element.
[0020] The technical solution of the present application proposes a laser pump source. The laser pump source includes a pump body, a flow channel and a capillary tube. A chamber for chip placement is formed in the pump body, and a chip contact surface for chip bonding is provided on the bottom of the chamber. The flow channel is provided in a shell between the chamber and the bottom of the pump body and is filled with a condensing medium. The flow channel includes a front section flow channel and a rear section flow channel that are arranged through the length direction thereof. The front section flow channel is arranged obliquely downward below the chip contact surface, and the rear section flow channel extends to an area outside the coverage of the chip contact surface. The capillary tube is arranged on the inner wall of the flow channel along the extension direction of the flow channel. The technical solution of the present application is arranged by the above structure. When the laser pump source is operating, the condensing medium in the flow channel absorbs the heat generated by the chip in the front section flow channel and evaporates. The evaporated condensing medium will be squeezed into the rear section flow channel and will be re-condensed into liquid due to the temperature difference between the front section and the rear section flow channel. The liquid medium formed by condensation in the rear section flow channel will flow back to the front section flow channel under the capillary action of the capillary tube and evaporate again by absorbing heat. This cycle takes away the heat generated by the chip and improves the heat dissipation performance of the laser pump source. BRIEF DESCRIPTION OF THE DRAWINGS
[0021] To more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the following will briefly introduce the drawings required for use in the description of the embodiments or the prior art. Obviously, the drawings in the following description are only some embodiments of the present application. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on these drawings, where:
[0022] Figure 1 It is an axonometric structure schematic diagram of a laser pump source according to an embodiment of the present application;
[0023] Figure 2 It is a side view structure schematic diagram of a laser pump source according to an embodiment of the present application. Specific embodiments
[0024] The following will clearly and completely describe the technical solutions in the embodiments of the present application with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only some embodiments of the present application, rather than all embodiments. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative efforts belong to the scope of protection of the present application.
[0025] It should be noted that all directional indications (such as up, down, left, right, front, back...) in the embodiments of the present application are only used to explain the relative positional relationship and movement conditions between components in a specific posture (as shown in the drawings). If this specific posture changes, the directional indications will also change accordingly.
[0026] It should also be noted that when an element is referred to as "fixed to" or "disposed on" another element, it can be directly on the other element or there may be an intermediate element at the same time. When an element is referred to as "connected" to another element, it can be directly connected to the other element or there may be an intermediate element at the same time.
[0027] In addition, the descriptions involving "first", "second", etc. in the present application are only for descriptive purposes and cannot be understood as indicating or implying their relative importance or implicitly indicating the quantity of the indicated technical features. Thus, the features defined with "first" and "second" may explicitly or implicitly include at least one such feature. In addition, the technical solutions between various embodiments can be combined with each other, but it must be based on the ability of those of ordinary skill in the art to implement. When the combination of technical solutions results in contradictions or cannot be implemented, it should be considered that such a combination of technical solutions does not exist and is not within the scope of protection required by the present application.
[0028] Refer to Figure 1 and Figure 2As shown, the present application proposes a laser pump source 100. The laser pump source 100 includes a pump body 10, a flow channel 20, and a capillary 30. A chamber 11 for chip placement is formed in the pump body 10, and a chip contact surface 12 for chip bonding is provided on the bottom surface of the chamber 11; the flow channel 20 is opened in the shell between the chamber 11 and the bottom of the pump body 10, and is filled with a condensing medium, and the flow channel 20 includes a through front section flow channel 21 and a rear section flow channel 22, the front section flow channel 21 is arranged obliquely downward below the chip contact surface 12, and the rear section flow channel 22 extends to the area outside the coverage of the chip contact surface 12; the capillary 30 is arranged on the inner wall of the flow channel 20 along the extension direction of the length of the flow channel 20.
[0029] In the technical solution of this application, the pump body 10 is the basic structure of the pump source. It contains a chamber 11 for chip placement, providing a stable working environment for the laser chip. The bottom surface of the chamber 11 is provided with a chip contact surface 12 for chip bonding. This chip contact surface 12 ensures accurate and tight bonding of the chip, thereby effectively transferring the heat generated by the chip. The chip is a laser chip capable of generating laser light, and the chip can be fixed to the chip contact surface 12 by welding.
[0030] The flow channel 20 is opened in the shell between the chamber 11 and the bottom of the pump body 10, and is subjected to negative pressure treatment, serving as a circulation channel for the condensing medium. Among them, the condensing medium is selected from a medium with a condensation temperature lower than the junction temperature of the chip, which can be water, ethanol or propanol, etc., which can quickly absorb and take away the heat generated by the chip. Furthermore, the flow channel 20 includes a front section flow channel 21 arranged obliquely downward below the chip contact surface 12 and a rear section flow channel 22 arranged in an area outside the coverage of the chip contact surface 12, thereby providing a heat absorption area and a condensation area for the condensing medium in the flow channel 20. The specific condensing medium absorbs heat and evaporates into a gaseous state in the front section flow channel 21, and condenses into a liquid state in the rear section flow channel 22. Under normal circumstances, the pump body 10 is arranged in a manner that fits the cooling body as a whole, so that the temperature difference between the front section flow channel 21 and the rear section flow channel 22 is large, so that the gaseous condensing medium can be condensed into a liquid state in the rear section flow channel 22.
[0031] The capillary tube 30 is intended to cause the liquid medium condensed in the rear section flow channel 22 to flow back to the front section flow channel 21 through capillary action to continue absorbing the heat generated by the chip; the capillary tube 30 is preferably a tube with a small inner diameter.
[0032] Furthermore, the heat dissipation process of the laser pump source 100 provided by the technical solution of this application is:
[0033] When the laser pump source 100 is operating, the chip is energized and generates heat. The heat is conducted downward through the pump body 10 into the front-section flow channel 21. The condensation medium in the front-section flow channel 21 absorbs the heat and evaporates. The evaporated condensation medium is squeezed into the rear-section flow channel 22 due to volume expansion. Due to the temperature difference between the front and rear sections of the flow channel 20, it will re-condense into a liquid state. Further, the liquid medium formed by condensation in the rear-section flow channel 22 flows back to the front-section flow channel 21 under the capillary action of the capillary 30, absorbs heat and evaporates again, and circulates in this way to take away the heat generated by the chip.
[0034] In summary, the technical solution of the present application can improve the heat dissipation performance of the laser pump source 100, adapt to the heat dissipation requirements of higher-power chips without increasing the volume of the pump source, achieve the effect of reducing the maximum junction temperature of the chip, and enhancing the stability of the pump source.
[0035] Refer to Figure 2 As shown, in some embodiments, the number of chip contact surfaces 12 is set to be multiple. The multiple chip contact surfaces 12 extend obliquely in a stepped manner, and the vertical distance from each chip contact surface 12 to the front-section flow channel 21 is equal.
[0036] In this embodiment, there are multiple chip contact surfaces 12 and they are arranged to extend obliquely in a stepped manner. Thus, the multiple chips installed correspondingly also extend obliquely in a stepped manner. In this way, it can be ensured that the optical paths emitted by each chip do not overlap, reducing losses.
[0037] In addition, the vertical distance from each chip contact surface 12 to the front-section flow channel 21 is equal. Since the phase change point of the condensation medium is fixed under a certain pressure, in the case of equal distance, the difference in the heat absorption and dissipation effects of each chip is relatively small, which is beneficial to balancing the junction temperature difference values of multiple chips in the laser pump source 100, minimizing the maximum temperature difference of the chips, and further improving the reliability.
[0038] Among them, the multiple chip contact surfaces 12 extending obliquely in a stepped manner are a set of mounting surfaces, and corresponding flow channels 20 are provided for each set of mounting surfaces, as Figure 1 shown. In this way, the multiple chip contact surfaces 12 extending obliquely in a stepped manner are grouped, and an independent flow channel 20 is provided for each group. This is convenient for the manufacture, assembly, and maintenance of the laser pump source 100, enables the condensation medium to more effectively absorb and take away the heat generated by the chip, allows each chip to be fully cooled, and improves the performance and stability of the laser.
[0039] Furthermore, a bending angle is formed between the front-section flow channel 21 and the rear-section flow channel 22. The rear-section flow channel 22 is horizontally designed, and the front-section flow channel 21 is obliquely designed, as Figure 2As shown. In this further design, the front-section flow channel 21 is an inclined design corresponding to multiple stepwise-inclined chips. When the rear-section flow channel 22 is horizontally designed, the problem that the rear-section flow channel 22 is too long and the pump body thickness needs to be increased can be prevented, so that the volume of the original pump source can be maintained, and the further expansion of the occupied volume can be prevented.
[0040] In some embodiments, a sealing groove (not shown in the drawings) is concavely formed on the pump body 10, and at least one port of the flow channel 20 communicates with the sealing groove. The sealing groove is used to set a seal to block the flow channel 20.
[0041] In this embodiment, by providing a sealing groove on the pump body 10 and placing a seal in the groove, on the one hand, precise sealing of the port of the flow channel 20 can be achieved, so as to facilitate the formation of a negative pressure environment in the flow channel 20 and prevent the leakage of the liquid cooling medium, ensuring the stable operation of the circulating flow of the medium and the heat dissipation operation; on the other hand, by detaching the seal, it is convenient for the user to replace the liquid cooling medium and the capillary 30 in the flow channel 20. Among them, the seal can be a flexible rubber plug.
[0042] In some embodiments, the number of capillaries 30 is set to be multiple, and the multiple capillaries 30 are arranged on both sides and the top of the flow channel 20.
[0043] In this embodiment, the multiple capillaries 30 can ensure that a sufficient amount of liquid condensation medium flows back from the rear-section flow channel 22 to the front-section flow channel 21, thus ensuring the effective progress of the circulating heat dissipation. Among them, the multiple capillaries 30 are arranged on both sides and the top of the flow channel 20, and can be closer to the chip heat source above in the front-section flow channel 21, so as to better realize the endothermic evaporation process, and leave a larger contact area below, which can quickly condense the gaseous medium.
[0044] Among them, the cross-sectional shape of the flow channel 20 is designed as a circle, a square or a waist-shaped hole, and can be selected and designed according to actual needs and processing convenience.
[0045] In some embodiments, a clamping structure (not shown in the drawings) is provided between the capillary 30 and the flow channel 20, and the capillary 30 forms a detachable connection with the flow channel 20 through the clamping structure.
[0046] In this embodiment, through the setting of the clamping structure, the capillary 30 can be quickly and simply installed on the flow channel 20 or detached from the flow channel 20. Thus, different specifications, materials or damaged capillaries 30 can be easily replaced according to actual needs to adapt to different working conditions and requirements, and the adaptability of the system can be improved.
[0047] The design of the snap connection structure can be such that a clamping groove is formed on the inner wall of the flow channel 20, and the capillary tube 30 is directly clamped in the clamping groove. Moreover, the clamping of the capillary tube 30 in the clamping groove has a certain anti-seismic property, capable of resisting external impacts and vibrations and preventing detachment.
[0048] Among them, the capillary tube 30 can also be integrally formed with the flow channel 20 or disposed in the flow channel 20 by welding. The specific setting method can be selected according to the user's usage requirements.
[0049] This application also provides a laser (not shown in the drawings). The laser includes a cooling member and the laser pump source 100 as described above, and the pump body 10 is disposed in contact with the cooling member. The cooling member can be a liquid cooling plate. In this way, in the pump body 10, except for the area adjacent to the working chip being a high-temperature area, the temperature of other areas is relatively low under the action of the liquid cooling plate, so that the medium entering the subsequent flow channel 22 can be condensed into a liquid state.
[0050] The laser also adopts all the technical solutions of all the embodiments of the above laser pump source 100. Therefore, it has at least all the beneficial effects brought by the technical solutions of the above embodiments, which will not be elaborated here one by one.
[0051] The above are only partial or preferred embodiments of this application. Neither the text nor the drawings can limit the scope of protection of this application. Any equivalent structural transformation made using the content of the specification and drawings of this application under the overall concept of this application, or any direct / indirect application in other related technical fields, is included in the scope of protection of this application.
Claims
1. A laser pump source, characterized in that, include: A pump body, wherein a cavity for placing a chip is formed in the pump body, and a chip contact surface for attaching the chip is provided on the bottom surface of the cavity; a flow channel, which is provided in the housing between the chamber and the bottom of the pump body, and is filled with a condensing medium; the flow channel includes a front section flow channel and a rear section flow channel which are arranged through the length thereof, the front section flow channel being arranged obliquely downward below the chip contact surface, and the rear section flow channel extending to an area outside the coverage of the chip contact surface; The capillary tube is arranged on the inner wall of the flow channel along the extension direction of the flow channel.
2. The laser pump source according to claim 1, characterized in that, There are a plurality of chip contact surfaces, and the plurality of chip contact surfaces extend in a stepped and inclined manner, and the vertical distances from each chip contact surface to the front section flow channel are equal.
3. The laser pump source according to claim 2, characterized in that, The plurality of chip contact surfaces that are arranged in a stepped, inclined and extended manner form a group of mounting surfaces, and each group of the mounting surfaces is provided with a corresponding flow channel.
4. The laser pump source according to claim 3, characterized in that, A bending angle is formed between the front section flow channel and the rear section flow channel, the rear section flow channel is horizontally designed, and the front section flow channel is inclinedly designed.
5. The laser pump source according to claim 4, characterized in that, A sealing groove is formed on the pump body, and at least one port of the flow channel is connected to the sealing groove. The sealing groove is used to set a sealing member to seal the flow channel.
6. The laser pump source according to claim 1, wherein There are a plurality of capillaries, and the capillaries are arranged on both sides of the flow channel and on the top of the flow channel.
7. The laser pump source according to claim 6, characterized in that, The cross-sectional shape of the flow channel is a circular, square or waist-shaped hole design.
8. The laser pump source according to claim 6, characterized in that The capillary tube and the flow channel are integrally formed; or, The capillary is welded to the flow channel; or, A clamping structure is provided between the capillary tube and the flow channel, and the capillary tube forms a detachable connection with the flow channel through the clamping structure.
9. The laser pump source according to claim 1, characterized in that, The condensation temperature of the condensation medium is lower than the junction temperature of the chip.
10. A laser, characterized in that, It comprises a cooling member and the laser pump source according to any one of claims 1 to 9, wherein the pump body is arranged in contact with the cooling member.