Airborne phased array satellite communication terminal

By decomposing the phased array antenna into a sub-array and using plug-in connections and liquid-cooled heat dissipation, the problem of high complexity in the design of traditional phased array antennas is solved, flexible design and efficient heat dissipation are achieved, and the development cycle and cost are reduced.

CN223182146UActive Publication Date: 2025-08-01YANGZHOU KEMING SEMICON LIGHTING IND TECH RES INST CO LTD
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Patent Information

Application Number
CN202422469078.X
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-10-12
Publication Date
2025-08-01
Estimated Expiration
2034-10-12

AI Technical Summary

Technical Problem

The design of traditional phased array antennas is complex and difficult to manufacture and debug, resulting in extended development cycles and delayed project progress.

Method used

The phased array design based on sub-array expansion is adopted, and the antenna array is decomposed into multiple relatively simple sub-arrays, each sub-array is independently designed and optimized, and then a complete phased array antenna is formed through reasonable combinations. The plug-in connector is used to reduce interconnected cables, and a liquid-cooled plate is used to improve heat dissipation efficiency.

Benefits of technology

Reduces design complexity and calculation volume, improves design flexibility, reduces the risk of overall design failure, simplifies maintenance and repair processes, and reduces labor intensity and costs.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model belongs to the technical field of satellite communication, and provides an airborne phased array satellite communication terminal, which comprises a wave control board, a heat dissipation unit, a plurality of antenna sub-arrays and a wave beam control chip, and is characterized in that the heat dissipation unit is arranged on the wave control board; the antenna sub-arrays are arranged on the heat dissipation unit at intervals, each antenna sub-array comprises a radio frequency board, radiation units and amplitude-phase multifunctional chips, the radiation units are arranged on the outer surface of the radio frequency board at intervals, the amplitude-phase multifunctional chips are arranged on the inner surface of the radio frequency board at intervals, and every four radiation units are connected with one amplitude-phase multifunctional chip; the wave beam control chip is arranged on the inner surface of the wave control board, and the wave beam control chip is connected with the amplitude-phase multifunctional chip. According to the phased array design based on sub-array expansion, a complex antenna array is decomposed into a plurality of sub-arrays, so that the design complexity and the calculation amount are reduced; each sub-array can be independently designed and optimized, and then a complete phased-array antenna is expanded through reasonable combination, so that the design flexibility is improved.
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Description

Technical Field

[0001] The utility model relates to the technical field of satellite communication, and particularly relates to an airborne phased array satellite communication terminal. Background Art

[0002] As an important means of modern communication, satellite communication plays an important role in military, civilian and other fields. Especially in recent years, with the rapid development of satellite communication systems such as low-earth orbit and high-throughput, satellite communication terminals have received increasing attention. The phased array antenna is one of the core components of satellite communication terminals. The phased array antenna is developed from the array antenna, and mainly relies on phase changes to realize the movement or scanning of the antenna beam pointing in space, also known as the electronically scanned array (ESA) antenna. During the scanning process, the entire radar does not need to perform mechanical movements like the radar using a common array antenna or a parabolic antenna. Therefore, the beam pointing is rapid and flexible, and multi-beam parallel operation can be achieved, making the radar have strong adaptive capabilities.

[0003] The traditional design of phased array antennas usually adopts an integral design concept. From the layout of antenna elements to the synthesis of the entire array, complex electromagnetic calculations and optimizations are required.

[0004] This method not only has a large amount of calculation, but also requires extremely high professional knowledge and experience of designers. And due to the complexity and uncertainty of the entire design process, problems such as the antenna performance not meeting the expected indicators, insufficient beam pointing accuracy, too high sidelobe level, and insufficient bandwidth may occur. Once problems occur in the design process, it is often necessary to re-perform the overall design, resulting in an extended development cycle, which not only consumes a large amount of time and resources, but also delays the project progress. There are also many inconveniences during the debugging process. Due to the large scale of the array surface and the high debugging difficulty, it often takes many repetitions to achieve the ideal performance. Content of the Utility Model

[0005] Aiming at the defects in the prior art, the utility model provides an airborne phased array satellite communication terminal to solve the problems of high structural complexity, large manufacturing process and debugging difficulty caused by the integral method of the current phased array antenna.

[0006] An airborne phased array satellite communication terminal provided by the utility model includes:

[0007] A wave control board;

[0008] A heat dissipation unit, arranged on the wave control board;

[0009] A plurality of antenna sub - arrays are arranged at intervals above the heat dissipation unit; each antenna sub - array includes a radio frequency board, radiation units, and an amplitude - phase multifunctional chip. The radiation units are arranged at intervals on the outer surface of the radio frequency board, and the amplitude - phase multifunctional chip is arranged at intervals on the inner surface of the radio frequency board. Every four of the radiation units are connected to one amplitude - phase multifunctional chip;

[0010] A beam control chip is arranged on the inner surface of the wave control board, and the beam control chip is connected to the amplitude - phase multifunctional chip.

[0011] As can be seen from the above technical solutions, an airborne phased - array satellite communication terminal provided by the present utility model is based on a phased - array design with sub - array expansion. The complex antenna array is decomposed into multiple relatively simple sub - arrays, greatly reducing the complexity of design and the amount of calculation; each sub - array can be independently designed and optimized, and then expanded into a complete phased - array antenna through reasonable combination, which not only improves the flexibility of design but also reduces the risk of overall design failure caused by local problems.

[0012] Optionally, each antenna sub - array further includes a radio frequency connector and a low - frequency connector. The radio frequency connector is used to connect the amplitude - phase multifunctional chip and the beam control chip to transmit radio frequency signals, and the low - frequency connector is used to connect the amplitude - phase multifunctional chip and the beam control chip to transmit power supply and control signals.

[0013] Optionally, a power control interface and a radio frequency interface are further arranged below the wave control board.

[0014] Optionally, the radio frequency connector and the low - frequency connector are plug - in connectors. The antenna sub - array and the wave control board are connected by plug - in radio frequency and low - frequency connectors, reducing the interconnection cables and the size of the device.

[0015] Optionally, the heat dissipation unit is a liquid - cooled plate, and liquid - cooling pipelines are arranged inside the liquid - cooled plate. By arranging the liquid - cooled plate between two plates and designing liquid - cooling pipelines inside the liquid - cooled plate to quickly transfer heat, the heat dissipation efficiency of the antenna can be improved.

[0016] Adopting the above technical solutions, the present application has the following technical effects:

[0017] A phased - array satellite communication terminal provided by the present utility model is based on a phased - array design with sub - array expansion. The complex antenna array is decomposed into multiple relatively simple sub - arrays, reducing the complexity of design and the amount of calculation; each sub - array can be independently designed and optimized, and then expanded into a complete phased - array antenna through reasonable combination, which not only improves the flexibility of design but also reduces the risk of overall design failure caused by local problems. Description of the Drawings

[0018] To more clearly illustrate the specific embodiments of the present utility model or the technical solutions in the prior art, the following will briefly introduce the drawings required for the description of the specific embodiments or the prior art. In all the drawings, similar elements or parts are generally identified by similar reference numerals. In the drawings, the elements or parts do not necessarily draw to actual scale.

[0019] Figure 1 Schematic diagram of the airborne phased array satellite communication terminal provided by the embodiment of the present utility model;

[0020] Figure 2 Top view of the antenna sub-array provided by the embodiment of the present utility model.

[0021] Reference numerals:

[0022] 1 - Wave control board; 2 - Heat dissipation unit; 3 - Antenna sub-array; 31 - RF board; 32 - Radiation unit; 33 - Amplitude-phase multi-functional chip; 34 - RF connector; 35 - Low-frequency connector; 4 - Beam control chip; 5 - RF interface; 6 - Power control interface. Specific embodiments

[0023] The following will combine the drawings to describe in detail the embodiments of the technical solutions of the present utility model. The following embodiments are only used to more clearly illustrate the technical solutions of the present utility model, so they are only examples and cannot be used to limit the protection scope of the present utility model.

[0024] It should be noted that unless otherwise specified, the technical terms or scientific terms used in this application should have the ordinary meaning understood by those skilled in the art to which the present utility model belongs.

[0025] In this application, unless otherwise clearly defined and limited, the terms "installed", "connected", "connected", "fixed" and other terms should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or integrated; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the internal communication of two elements or the interaction relationship between two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present utility model can be understood according to specific circumstances.

[0026] In this application, unless otherwise expressly specified or limited, when a first feature is "above" or "below" a second feature, it may mean that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Furthermore, when a first feature is "above," "above," or "above" a second feature, it may mean that the first feature is directly above or diagonally above the second feature, or simply means that the first feature is at a higher level than the second feature. When a first feature is "below," "below," or "below" a second feature, it may mean that the first feature is directly below or diagonally below the second feature, or simply means that the first feature is at a lower level than the second feature.

[0027] like Figure 1-2 As shown, this embodiment provides an airborne phased array satellite communication terminal, including a wave control board 1, a heat dissipation unit 2, a plurality of antenna sub-arrays 3 and a beam control chip 4, the heat dissipation unit 2 is arranged on the wave control board 1; the antenna sub-arrays 3 are arranged at intervals on the heat dissipation unit 2, the antenna sub-arrays 3 include a radio frequency board 31, radiation units 32 and an amplitude and phase multifunctional chip 33, the radiation units 32 are arranged at intervals on the outer surface of the radio frequency board 31, the amplitude and phase multifunctional chip 33 are arranged at intervals on the inner surface of the radio frequency board 31, and every four radiation units 32 are connected to the amplitude and phase multifunctional chip 33; the beam control chip 4 is arranged on the inner surface of the wave control board 1, and the beam control chip 4 is connected to the amplitude and phase multifunctional chip 33.

[0028] This embodiment, based on a phased array design with subarray expansion, decomposes a complex antenna array into multiple subarrays. Design iterations can be performed by splicing and combining subarrays based on requirements such as the overall antenna dimensions, EIRP, G / T value, output intermediate frequency, and signal level. Only partial adaptive changes are required, reducing labor intensity. Furthermore, the array surface is easy to maintain and repair, requiring only the replacement of damaged subarrays. This facilitates maintenance and reduces costs.

[0029] The beam control chip 4 and the plurality of amplitude and phase multifunctional chips 33 are correspondingly connected and are configured specifically according to the size of the entire array.

[0030] The RF board 31 is the core component of the phased array antenna. Its complex structure makes design and processing difficult, leading to a long production cycle. New printed circuit board designs require extensive modeling and simulation, and there's a certain probability that performance indicators won't meet requirements before production begins, leading to construction delays or project failure. The subarray expansion and splicing solution allows for the rapid formation of a new array surface using multiple relatively simple subarrays. This allows the array surface and the entire device to meet universal, serialized, and modular requirements. The subarrays maintain a stable technical state, minimizing production, processing, and debugging workloads. The beam control software and the entire device can be reused, requiring only partial adaptation for different models, reducing labor intensity.

[0031] See also Figure 1, the antenna sub-array 3 further includes a radio frequency connector 34 and a low-frequency connector 35. The radio frequency connector 34 is used to connect the amplitude-phase multi-functional chip 33 and the beam control chip 4 to transmit radio frequency signals, and the low-frequency connector 35 is used to connect the amplitude-phase multi-functional chip 33 and the beam control chip 4 to transmit power and control signals. Among them, the radio frequency connector 34 and the low-frequency connector 35 are plug-in connectors. Each antenna sub-array 3 is provided with a radio frequency connector 34 and a low-frequency connector 35. Due to the harsh environmental requirements in the airborne application scenario and the need to minimize the impact on the effective area of the antenna, the antenna sub-array 3 and the beam control board 1 are connected using high-reliability plug-in radio frequency and low-frequency connectors, reducing the interconnection cables and minimizing the device size.

[0032] As Figure 1 shown, a power control interface 6 and a radio frequency interface 5 are further provided under the beam control board 1 for external connection.

[0033] In the description of the present invention, a large number of specific details are set forth. However, it is understood that the embodiments of the present invention may be practiced without these specific details. In some instances, well-known methods, structures, and technologies are not shown in detail so as not to obscure the understanding of this specification.

[0034] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention and are not intended to limit them. Although the present invention has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that they can still modify the technical solutions described in the foregoing embodiments, or perform equivalent replacements for some or all of the technical features. These modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present invention, and they should all be covered by the scope of the claims and the specification of the present invention.

Claims

1. An airborne phased array satellite communication terminal, characterized in that Comprising: Wave control board; Heat dissipation unit, disposed on the wave control board; A plurality of antenna sub-arrays, spaced apart and disposed on the heat dissipation unit; The antenna sub-array includes a radio frequency board, a radiation unit, and an amplitude-phase multi-functional chip. The radiation units are spaced apart and disposed on the outer surface of the radio frequency board, and the amplitude-phase multi-functional chips are spaced apart and disposed on the inner surface of the radio frequency board. Every four of the radiation units are connected to one amplitude-phase multi-functional chip; Beam control chip, disposed on the inner surface of the wave control board, and the beam control chip is connected to the amplitude-phase multi-functional chip.

2. The airborne phased array satellite communication terminal according to claim 1, wherein The antenna sub-array further includes a radio frequency connector and a low-frequency connector. The radio frequency connector is used to connect the amplitude-phase multi-functional chip and the beam control chip to transmit radio frequency signals, and the low-frequency connector is used to connect the amplitude-phase multi-functional chip and the beam control chip to transmit power and control signals.

3. The airborne phased array satellite communication terminal according to claim 2, wherein A power control interface and a radio frequency interface are further disposed under the wave control board.

4. The airborne phased array satellite communication terminal according to claim 2, wherein The radio frequency connector and the low-frequency connector are plug-in connectors.

5. The airborne phased array satellite communication terminal according to claim 1, characterized in that, The heat dissipation unit is a liquid cooling plate, and a liquid cooling pipeline is disposed inside the liquid cooling plate.