Circuit board and electronic equipment
Through the design of the double-layer core board structure, the high manufacturing cost problem caused by high-density chip pins is solved, efficient manufacturing and lightweight circuit board design is realized, and signal transmission efficiency and space utilization are improved.
Patent Information
- Application Number
- CN202422146571.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-09-02
- Publication Date
- 2025-08-01
- Estimated Expiration
- 2034-09-02
AI Technical Summary
Due to the limitations of high-density chip pins, existing circuit boards have high overall process requirements and increased manufacturing costs.
Using a double-layer core plate structure, the first core plate is provided with a groove body to embed the second core plate. The second core plate carries the chip and is connected to the first core plate. The integration of the chip and the core plate is realized through the groove body, and the manufacturing is completed in the same process by the integration of the first core plate and the second core plate.
It effectively reduces manufacturing costs, improves manufacturing efficiency, improves the reliability, thinness and weight of circuit boards, and optimizes space utilization and signal transmission efficiency.
Smart Images
Figure CN223182396U_ABST
Abstract
Description
Technical Field
[0001] The present application relates to the technical field of circuit boards, and in particular, to a circuit board and an electronic device. Background Art
[0002] As a carrier for electronic components and chips, the overall layout density of a printed circuit board is ultimately determined by the pin density in the "chip" area on the printed circuit board. When the pin density of a certain / several "chips" on the printed circuit board is much higher than that of other components or chips, the pin density in this "chip" area determines the highest process type required for this printed circuit board.
[0003] It can be seen therefrom that due to the restraint of the high pin density of a certain / several "chips", even if the wiring density in other areas of the printed circuit board is low, it will still cause the process selection of the entire printed circuit board to meet the highest requirements, that is, the manufacturing process is selected according to the requirements of the area with the highest pin density, thus greatly increasing the manufacturing cost. Summary of the Invention
[0004] The present application provides a circuit board and an electronic device to solve the problem that the circuit board in the prior art is limited by the high-density "chip" pins, resulting in relatively high overall process requirements and thus high manufacturing costs.
[0005] To solve the above technical problems, a technical solution adopted by the present application is: providing a circuit board, wherein the circuit board includes: a first core board, a groove is provided on a first side surface of the first core board; a second core board, disposed in the groove, a first pad is provided on a side surface of the second core board facing away from the first core board; a chip, a second pad is provided on a side surface of the chip facing the second core board, and the second pad is connected to the first pad.
[0006] Wherein, a first circuit layer is provided inside the first core board, a second circuit layer is provided inside the second core board, and the first circuit layer is connected to the second circuit layer, so that the first circuit layer is connected to the chip through the second circuit layer, the first pad and the second pad.
[0007] Wherein, the circuit board further includes a first circuit element and a second circuit element, a first welding layer is further provided on the first side surface at an interval from the groove, the first welding layer is connected to the first circuit layer, and the first circuit element is disposed on the first welding layer; a second welding layer is further provided on a second side surface of the first core board, the second welding layer is connected to the first circuit layer, and the second circuit element is disposed on the second welding layer; wherein, the first side surface and the second side surface are opposite side surfaces.
[0008] Wherein, the first core board further includes a first insulating layer, and the first circuit layer is disposed in the first insulating layer; the second core board further includes a second insulating layer, and the second circuit layer is disposed in the second insulating layer.
[0009] Among them, the circuit board further includes two solder mask layers, which are respectively disposed on opposite side surfaces of the first core board.
[0010] Among them, the circuit board further includes an insulating filling layer. There is a gap between at least one side of the second core board and the groove wall of the groove body, and the insulating filling layer is filled in the gap.
[0011] Among them, the difference between the depth of the groove body and the thickness of the second core board is not greater than 150 microns.
[0012] Among them, the difference between the distance between the opposite groove walls of the groove body in the first direction and the length of the second core board in the first direction is not less than 30 microns and not greater than 150 microns.
[0013] Among them, the difference between the distance between the opposite groove walls of the groove body in the second direction and the length of the second core board in the second direction is not less than 30 microns and not greater than 150 microns; wherein, the first direction is perpendicular to the second direction.
[0014] To solve the above technical problems, another technical solution adopted by this application is: to provide an electronic device, among which, the electronic device includes a housing and a circuit board connected to each other; wherein, the circuit board is the circuit board described in any one of the above.
[0015] The beneficial effects of this application are: Different from the prior art, the circuit board provided by this application uses the second core board to carry the chip and realizes its connection with the first core board, effectively avoiding the higher requirements for the manufacturing process of the second core board by the high-density pins of the chip, and through the "integration" of the first core board and the second core board, it is also possible to complete the manufacturing of each chip and each core board in the same manufacturing process, so as to effectively improve the manufacturing efficiency and reduce the manufacturing cost; in addition, by using the groove body in the first core board to set the second core board, it is also beneficial to improve the reliability, thinness, and lightness of the circuit board. BRIEF DESCRIPTION OF THE DRAWINGS
[0016] In order to more clearly illustrate the technical solutions in the embodiments of this application, the following will briefly introduce the drawings required for the description of the embodiments. Obviously, the following drawings are only some embodiments of this application. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on these drawings, among which:
[0017] Figure 1 is a schematic structural diagram of an embodiment of the circuit board of this application;
[0018] Figure 2 is a schematic structural diagram of an embodiment of the electronic device of this application. DETAILED DESCRIPTION OF THE EMBODIMENTS
[0019] The following will clearly and completely describe the technical solutions in the embodiments of the present application with reference to the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all of the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present application without creative efforts belong to the scope of protection of the present application.
[0020] The terms "first", "second", and "third" in the present application are only used for descriptive purposes and cannot be construed as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, features defined with "first", "second", and "third" may explicitly or implicitly include at least one of such features. In the description of the present application, the meaning of "a plurality" is at least two, such as two, three, etc., unless otherwise specifically defined. All directional indications (such as up, down, left, right, front, back...) in the embodiments of the present application are only used to explain the relative positional relationship and movement conditions between components in a specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indications will also change accordingly. In addition, the terms "comprising" and "having" and any variations thereof are intended to cover non-exclusive inclusion. For example, a process, method, system, product, or device that includes a series of steps or units is not limited to the listed steps or units, but optionally further includes unlisted steps or units, or optionally further includes other steps or units inherent to these processes, methods, products, or devices.
[0021] Referring to "embodiments" herein means that the specific features, structures, or characteristics described in connection with the embodiments may be included in at least one embodiment of the present application. The phrase appears in various places in the specification and does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment mutually exclusive with other embodiments. Those skilled in the art will explicitly and implicitly understand that the embodiments described herein may be combined with other embodiments.
[0022] The present application will be described in detail below with reference to the accompanying drawings and embodiments.
[0023] Please refer to Figure 1 , Figure 1 which is a schematic structural diagram of an embodiment of a circuit board of the present application. In this embodiment, the circuit board 10 includes: a first core board 11, a second core board 12, and a chip 13.
[0024] It is understandable that the first core board 11 and the second core board 12 may specifically be single-layer patterned copper clad laminates, that is, circuit layers, or may include at least two layers of patterned copper clad laminates, and an insulating layer, such as a prepreg, insulating resin or pure glue-like medium, or any other reasonable insulating material layer, is laminated between every two adjacent copper clad laminates among the at least two copper clad laminates; or, the first core board 11 and the second core board 12 may specifically further include one or more of other any reasonable materials that can be used to manufacture the circuit board 10, such as copper plates, electroplated copper layers, metal conductive vias, conductive posts, heat dissipation plates, buried components, thermal conductive adhesives, etc., so as to be able to realize the pre-designed circuit logic corresponding to circuit units such as patterned copper clad laminates, metal conductive vias, and buried components. The present application does not make any limitation thereto.
[0025] Specifically, as a substrate, the first core board 11 is designed and formed with a groove (not shown in the figure) so as to be able to embed the second core board 12 by using the groove, thereby realizing a more complex circuit layout and component stacking. The first core board 11 usually contains the bottom layer wiring of the circuit and provides a basic framework for the entire circuit.
[0026] The second core board 12 is located in the groove of the first core board 11. The addition of the second core board 12 enables the design to be more three-dimensional, can increase the number of layers of the circuit board 10, and improve the space utilization rate. Moreover, at least one first pad (not shown in the figure) is provided on the side surface of the second core board 12 facing away from the first core board 11, and these first pads are used to connect other electronic components, such as the chip 13, so as to realize electrical connection and signal transmission.
[0027] The chip 13 usually integrates a large number of transistors and integrated circuits and has high-density pins, and the high-density pins correspond to high-density pads. Among them, a second pad 131 is provided on the side surface of the chip 13 facing the second core board 12. The second pad 131 is connected to the first pad on the second core board 12, usually completed by soldering or other welding techniques, ensuring a reliable electrical connection between the chip 13 and the second core board 12.
[0028] It is understandable that the second core board 12 can be specifically understood as an adapter board or an interposer, and its function is to carry multiple groups and various types of high-density chips 13 and then connect them to the first core board 11, thereby reducing the adverse effects of directly connecting the high-density pin layout of the chip 13 to the first core board 11, that is, effectively reducing the processing difficulty of the circuit board 10.
[0029] In the above solution, by using the second core board 12 to carry the chip 13 and connecting it to the first core board 11, it effectively avoids the higher requirements for the manufacturing process of the second core board 12 by the high-density pins of the chip 13, that is, reduces the overall processing difficulty of the circuit board 10; and through the "fusion" integration of the first core board 11 and the second core board 12, it is also possible to complete the manufacturing of each chip 13 and each core board in the same process, so as to effectively improve the manufacturing efficiency and reduce the manufacturing cost; in addition, by using the slot in the first core board 11 to set the second core board 12, it is also beneficial to improve the reliability, thinness, and lightness of the circuit board 10.
[0030] Moreover, through the slot, the stacking of the first core board 11 and the second core board 12, as well as the direct soldering connection between the chip 13 and the second core board 12, a highly integrated circuit layout is achieved, which not only optimizes the space utilization, but also may improve the signal transmission efficiency and the overall performance of the circuit. This design can be effectively used in electronic devices that require high-density integration, high-performance transmission, or specific space limitations, such as smartphones, high-speed data processing boards, etc.
[0031] In one embodiment, in addition to the slot design on the external structure of the first core board 11, a first circuit layer 111 is further provided inside the first core board 11, and the first circuit layer 111 undertakes functions such as signal transmission and power distribution. The first circuit layer 111 not only forms necessary circuit paths inside the first core board 11, but also is responsible for connecting with other components or layers to realize the designed circuit logic.
[0032] Similarly, a second circuit layer 121 is provided inside the second core board 12, and the second circuit layer 121 complements the first circuit layer 111 of the first core board 11 to jointly build the complex electrical network of the entire circuit board 10. The second core board 12 is physically and electrically connected to the first core board 11 by being embedded in the slot of the first core board 11.
[0033] And the first circuit layer 111 and the second circuit layer 121 are connected to each other by a certain method, such as metallized vias, conductive adhesive filling, or other conductive connection technologies, ensuring that signals can be transmitted from the first core board 11 to the second core board 12, or vice versa. This design enables the circuit board 10 to achieve signal intercommunication between multiple layers.
[0034] The first pad on the second core board 12 and the second pad 131 on the chip 13 are electrically connected by soldering, ensuring the physical fixation of the chip 13 to the circuit board 10. More importantly, an electrical path is established between the chip 13 and the first and second circuit layers 121, so that the input / output signals of the chip 13 can directly pass through the second pad 131, the first pad, and further through the second circuit layer 121 and the first circuit layer 111 to realize communication and data exchange with other components on the entire circuit board 10.
[0035] Wherein, the first core board 11 further includes a first insulating layer 112, and the first circuit layer 111 is specifically formed in the first insulating layer 112; the second core board 12 further includes a second insulating layer 122, and the second circuit layer 121 is specifically formed in the second insulating layer 122.
[0036] In one embodiment, the circuit board 10 further integrates a first circuit element 141 and a second circuit element 142. On the first side of the first core board 11, a first soldering layer 1131 is further provided in the spaced slot body. The first soldering layer 1131 is directly connected to the first circuit layer 111 to provide an electrical connection point for the installation of components. The first circuit element 141 is mounted on the first soldering layer 1131 and is fixed by soldering to achieve electrical connection with the first circuit layer 111. Such a layout expands the component assembly area of the circuit board 10 and improves the component integration degree of the circuit board 10.
[0037] On the other side of the first core board 11, that is, the second side, a second soldering layer 1132 is also provided, which is also connected to the first circuit layer 111, providing a platform for the installation and electrical connection of the second circuit element 142. The second circuit element 142 is mounted on the second soldering layer 1132, and the soldering technology ensures a stable connection and signal transmission with the circuit board 10. Generally speaking, such a design enables the circuit board 10 to integrate more circuit elements through the ingenious arrangement of multi-layer structures and multiple soldering layers within a limited space, not only improving the space utilization rate but also ensuring the complexity and functionality of the circuit.
[0038] Optionally, the first circuit element 141 and the second circuit element 142 can specifically be one or more of integrated wafers, capacitor elements, resistor elements, switching tubes, power devices, magnetic cores, and ferrites, and the present application does not limit this.
[0039] In one embodiment, there is still a gap between at least one side of the second core board 12 and the slot wall of the slot body in the first core board 11, and an insulating filling layer 14 is filled in the gap to facilitate the first core board 11 to more stably fix the second core board 12 and prevent external moisture and other impurities from entering through the gap between the second core board 12 and the first core board 11, affecting the electrical stability of the circuit board 10.
[0040] Optionally, the insulating filling layer 14 can specifically be any reasonable insulating material such as resin, pure glue-based interlayer filling materials, etc., and the present application does not limit this.
[0041] Optionally, the difference between the depth of the groove in the first core board 11 and the thickness of the second core board 12 is not greater than 150 microns, so as to reduce the overall thickness of the circuit board 10 as much as possible while facilitating the chip 13 mounting requirements.
[0042] Optionally, the difference between the distance between the opposite two groove walls of the groove in the first core board 11 in the first direction and the length of the second core board 12 in the first direction is not less than 30 microns and not greater than 150 microns, so as to facilitate the setting of the second core board 12 in the groove while avoiding occupying too much circuit layout space in the first core board 11 as much as possible.
[0043] Optionally, the difference between the distance between the opposite two groove walls of the groove in the first core board 11 in the second direction and the length of the second core board 12 in the second direction is not less than 30 microns and not greater than 150 microns, so as to facilitate the setting of the second core board 12 in the groove while avoiding occupying too much circuit layout space in the first core board 11 as much as possible; wherein, the first direction is perpendicular to the second direction.
[0044] For easy understanding, the key dimensions of the second core board 12 are set as: width, denoted as Wi; length, denoted as Li; height (thickness), denoted as Hi; a corresponding controlled-depth groove is designed on the first core board 11, and the dimensions of this groove are denoted as length / L, width / W, height (controlled-depth groove depth) / H. Then the above parameters satisfy: 30μm (microns) ≤ L - Li ≤ 150μm; 30μm ≤ W - Wi ≤ 150μm; 0μm ≤ H - Hi ≤ 150μm. Among them, the value of "H - Hi" can be determined based on the overall thickness control requirements of the circuit board 10, the number of layers and thickness specifications of the first core board 11, while taking into account the function realization of the circuit board 10 and matching the thickness design of the second core board 12. This application does not make any limitations on this.
[0045] In an embodiment, solder mask layers 114 are further provided on the opposite two side surfaces of the first core board 11 to protect the internal circuits of the first core board 11.
[0046] This application also provides an electronic device. Please refer to Figure 2 , Figure 2 is a schematic structural diagram of an embodiment of the electronic device of this application. In this embodiment, the electronic device 20 includes a housing 21 and a circuit board 22 that are connected to each other.
[0047] It should be noted that the circuit board 22 described in this embodiment is the circuit board 10 as described in any one of the above, and for details, please refer to Figure 1 and the relevant text content, which will not be elaborated here.
[0048] Different from the prior art, the circuit board provided by the present application uses the second core board to carry the chip and connects it to the first core board, effectively avoiding the higher requirements for the manufacturing process of the second core board due to the high-density pins of the chip. Moreover, through the "integration" of the first core board and the second core board, the manufacturing of each chip and each core board can be completed in the same process, effectively improving the manufacturing efficiency and reducing the manufacturing cost. In addition, by using the slot in the first core board to arrange the second core board, it is also beneficial to improve the reliability, thinness, and lightness of the circuit board.
[0049] The above are only the embodiments of the present application, and do not limit the patent scope of the present application. Any equivalent structure or equivalent process transformation made by using the content of the specification and drawings of the present application, or directly or indirectly applied in other related technical fields, shall be equally included in the patent protection scope of the present application.
Claims
1. A circuit board, characterized in that, The circuit board includes: A first core board, on a first side surface of the first core board, there is a groove; A second core board, disposed in the groove, on a side surface of the second core board facing away from the first core board, there is a first pad; A chip, on a side surface of the chip facing the second core board, there is a second pad, and the second pad is connected to the first pad.
2. The circuit board according to claim 1, wherein A first circuit layer is provided inside the first core board, a second circuit layer is provided inside the second core board, and the first circuit layer is connected to the second circuit layer, so that the first circuit layer is connected to the chip through the second circuit layer, the first pad and the second pad.
3. The circuit board according to claim 2, wherein The circuit board further includes a first circuit element and a second circuit element. A first soldering layer is further provided on the first side surface at an interval from the groove, the first soldering layer is connected to the first circuit layer, and the first circuit element is disposed on the first soldering layer; A second soldering layer is further provided on a second side surface of the first core board, the second soldering layer is connected to the first circuit layer, and the second circuit element is disposed on the second soldering layer; wherein, the first side surface and the second side surface are opposite side surfaces.
4. The circuit board according to claim 3, wherein The first core board further includes a first insulating layer, and the first circuit layer is disposed in the first insulating layer; The second core board further includes a second insulating layer, and the second circuit layer is disposed in the second insulating layer.
5. The circuit board according to claim 1, wherein The circuit board further includes an insulating filling layer. There is a gap between at least one side of the second core board and the groove wall of the groove, and the insulating filling layer is filled in the gap.
6. The circuit board according to claim 1, wherein The circuit board further includes two solder mask layers, and the two solder mask layers are respectively disposed on opposite side surfaces of the first core board.
7. The circuit board according to any one of claims 1-6, wherein The difference between the depth of the groove and the thickness of the second core board is not greater than 150 microns.
8. The circuit board according to any one of claims 1-6, wherein The difference between the distance between opposite groove walls of the groove in a first direction and the length of the second core board in the first direction is not less than 30 microns and not greater than 150 microns.
9. The circuit board according to claim 8, wherein The difference between the distance between opposite groove walls of the groove in a second direction and the length of the second core board in the second direction is not less than 30 microns and not greater than 150 microns; wherein, the first direction is perpendicular to the second direction.
10. An electronic device, characterized in that, The electronic device includes a housing and a circuit board connected to each other; Wherein, the circuit board is the circuit board according to any one of claims 1-9.