Circuit board solder mask exposure jig
By designing the anti-welding exposure fixture on the circuit board, the elastic limit and leveling mechanism are used to solve the problems of low installation efficiency of the coating board and film stamp indentation, achieving an efficient and accurate circuit board exposure process.
Patent Information
- Application Number
- CN202422429661.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-10-09
- Publication Date
- 2025-08-01
- Estimated Expiration
- 2034-10-09
AI Technical Summary
In the prior art, the circuit board has low installation and maintenance efficiency during the exposure process, resulting in high production costs and easy film printing and plate indentation.
A circuit board welding-proof exposure fixture is designed, including a base, a coating plate, a release film, an elastic limiting mechanism and a leveling mechanism. Through the cooperation of the elastic clamping component and a leveling plate, the stable contact between the coating plate and the base is ensured, and the release film is extruded through the flat plate to eliminate bubbles and gaps, and the positioning accuracy and installation efficiency of the coating plate are improved.
It improves the replacement efficiency and position accuracy of the coating board, reduces the board indentation and film marks generated by the circuit board during exposure, and reduces production costs and maintenance difficulties.
Smart Images

Figure CN223182419U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of circuit board exposure auxiliary tools, and particularly relates to a solder mask exposure jig for circuit boards. Background Art
[0002] In the process of circuit board manufacturing, the solder mask process is a very crucial link. Solder mask ink is usually coated on the entire circuit board, and then through lithography processes such as exposure and development, the areas that do not need to be soldered are exposed, while the areas that need to be soldered are covered with solder mask ink. As electronic products develop towards smaller and more precise directions, customers' requirements for the quality of circuit boards are getting higher and higher, especially in terms of the appearance quality of the solder mask layer, which includes film printing and board surface indentations.
[0003] In the current prior art, when a circuit board is exposed, the circuit board needs to be first installed on the coating plate of the exposure machine table, and then fixed by vacuum pumping. To prevent the ink from sticking to the coating plate, or to prevent the coating plate from being scratched or damaged due to uneven or burr - edged board edges of the circuit board, resulting in a decrease in the anti - adhesion performance and flatness of the coating plate and causing film printing or board surface indentations on the circuit board after exposure, a release film is usually provided between the circuit board and the coating plate. However, when installing the coating plate, the holes on it need to be aligned with the vacuum pumping holes on the exposure machine table to achieve the positioning and fixing of the coating plate. When replacing the release film, it is also necessary to pay attention to its full contact with the coating plate. The scheme of manual positioning and inspection will reduce work efficiency and is not conducive to subsequent maintenance. Summary of the Utility Model
[0004] The purpose of the utility model is to provide a solder mask exposure jig for circuit boards, aiming to solve the technical problems in the prior art, such as high production and processing costs caused by frequent replacement of coating plates, low efficiency in the installation and maintenance of coating plates, and easy generation of film printing and board surface indentations on circuit boards due to damage or scratches of coating plates.
[0005] To solve the above - mentioned technical problems, the utility model provides a solder mask exposure jig for circuit boards, which includes: a base, a coating plate for placing a circuit board is provided on the base, a release film is laid on the surface of the coating plate, an elastic limiting mechanism for fixing the coating plate and a flattening mechanism for flatly attaching the release film to the coating plate are provided on the base; the elastic limiting mechanism includes an elastic clamping component and a limiting component provided on the base, and the elastic clamping component can squeeze the coating plate and press the coating plate against the limiting component; the flattening mechanism includes a flattening plate movably provided on the base, and the flattening plate can move relative to the base and squeeze the release film.
[0006] In the above solution, the elastic clamping assembly squeezes the coating plate towards the limiting assembly, enabling the coating plate to be automatically aligned with the base while maintaining sufficient contact between the coating plate and the base, and ensuring that the surface of the coating plate always remains in an ideal plane. This is beneficial for preventing surface indentations and film printing on the circuit board during exposure due to the inclination of the coating plate surface, improving the replacement efficiency and position accuracy of the coating plate, and facilitating subsequent maintenance.
[0007] When the operator attaches the release film to the coating plate, voids or bubbles may form in some areas between the release film and the coating plate, affecting the full contact between the release film and the coating plate, as well as between the circuit board and the release film, resulting in a decrease in the flatness of the circuit board and causing surface indentations or film printing on the circuit board after exposure. When the flattening mechanism moves the flattening plate relative to the base, it can squeeze the release film, thereby effectively reducing the voids and bubbles between the release film and the coating plate, which is beneficial for reducing surface indentations and film printing generated during the exposure of the circuit board.
[0008] Preferably, the elastic clamping assembly includes a limiting shaft movably disposed on one side of the base, a clamping block connected to one end of the limiting shaft, and an elastic member sleeved on the limiting shaft and located between the clamping block and the base. The elastic member pushes the clamping block to tightly fit against the coating plate.
[0009] In the above solution, the elastic member provides a certain degree of thrust to the clamping block and pushes the clamping block towards the coating plate to ensure sufficient contact between the clamping block and the coating plate; the limiting shaft restricts the moving direction of the clamping block, enabling the clamping block to move in the direction of the elastic force provided by the elastic member, improving the utilization rate of the elastic force while reducing the loss of the thrust of the clamping block on the coating plate; comprehensively, it can be seen that the elastic clamping assembly is beneficial for improving the stability and reliability of the connection between the coating plate and the base.
[0010] Preferably, the elastic clamping assembly further includes a rotating member disposed on one side of the base. One end of the rotating member is rotatably connected to the base, and the other end is detachably connected to the base. The limiting shaft is movably disposed on the rotating member, and the rotating member can be rotated open or closed towards the outside of the base.
[0011] In the above solution, the rotating member enables the entire elastic clamping assembly to rotate relative to the base. It is equivalent to the limiting shaft being movably disposed on the rotating member, the clamping block being provided at one end of the limiting shaft close to the base, and the elastic member being disposed between the clamping block and the rotating member. When the elastic clamping assembly is rotated open from one side of the base, the coating plate can be installed on the base from this side, effectively reducing the installation difficulty of the coating plate and improving its installation efficiency, thereby facilitating subsequent maintenance.
[0012] Preferably, the limiting assembly includes a sliding part and a positioning part provided on the base, and a sliding groove and a positioning groove provided on the coated plate. The coated plate is slidably clamped on the base through the sliding groove and the sliding part, and the positioning groove and the positioning part are a matching plurality.
[0013] In the above scheme, the setting of the sliding groove and the sliding part can make the coated plate easily pushed in or pulled out of the base, realizing the convenient installation and disassembly of the coated plate, and can also make the coated plate enter the base in a fixed direction, which is beneficial to improving the positioning accuracy of the coated plate; after the coated plate enters the base in a fixed direction, it is locked by multiple matching positioning grooves and positioning parts, so that the movement of the coated plate in multiple directions is completely restricted, which is beneficial to reduce the relative movement caused by external force and further improve the positioning accuracy of the coated plate; in addition, this means that coated plates of different sizes and specifications can be designed, which is beneficial to improve flexibility.
[0014] Preferably, the leveling mechanism further includes a guide assembly, which includes a linear guide rail and a movable seat slidably mounted on the linear guide rail. The leveling plate is connected to the movable seat, and the leveling plate approaches or moves away from the base along the guide direction of the guide assembly.
[0015] In the above scheme, the guide component prevents the flattening plate from making direct contact with the base, which can prevent the need to replace the entire flattening plate or base when the sliding clamping parts between the flattening plate or the base are worn, which is beneficial to saving production and processing costs; the guiding direction of the guide component can also be adjusted according to its installation position to improve the flexibility of adjusting the moving direction of the flattening plate; the linear guide rail and the moving seat can provide more precise and stable linear motion and better load capacity, ensuring that the flattening plate maintains smooth sliding and high positioning accuracy during movement, so that it can accurately and effectively extrude the release film under low-noise operation.
[0016] Preferably, an extrusion portion is provided on the flat plate, and the extrusion portion abuts against the release film.
[0017] In the above scheme, the setting of the extrusion part enables the flattening plate to concentrate the extrusion force on the release film in this area when moving, thereby improving the extrusion effect on the release film, which is beneficial to further improve the flatness of the release film and reduce the board surface indentation or film mark caused by exposure of the circuit board.
[0018] Preferably, the flat plate is further provided with a handle.
[0019] In the above solution, the setting of the handle enables the operator to manually control the flattening plate to squeeze the release film multiple times to ensure that the gaps or bubbles between the release film and the coated plate are eliminated, which is conducive to further improving the flatness of the release film and reducing the board surface indentation or film mark caused by exposure of the circuit board.
[0020] Preferably, a plurality of groups of first adsorption holes are arranged at intervals on the base, a plurality of groups of second adsorption holes are arranged at intervals on the coating plate, and a plurality of groups of third adsorption holes are arranged at intervals on the release film. The first adsorption holes, the second adsorption holes, and the third adsorption holes are arranged opposite to each other.
[0021] In the above solution, the arrangement of the first adsorption holes, the second adsorption holes, and the third adsorption holes enables the vacuum adsorption to directly act on the circuit board placed on the release film, so that the circuit board can be stably fixed. And they are all arranged in multiple groups to adapt to different specifications of circuit boards, which can effectively improve the adaptability and reuse rate of this fixture.
[0022] Preferably, a plurality of groups of air suction holes are arranged at intervals on the release film.
[0023] In the above solution, the arrangement of the air suction holes can quickly discharge the gas in the bubbles from the air suction holes when the flat plate squeezes the release film, so as to improve the flattening efficiency and success rate. In addition, the air suction holes are arranged in multiple groups at intervals to cover the entire release film, so that the gas in the bubbles can be discharged in time when each part of the release film is squeezed, preventing the flattening from failing.
[0024] Preferably, a plurality of cut corners are arranged at intervals on the coating plate, and a tearing part extending outward from the cut corners is arranged on the release film.
[0025] In the above solution, when it is necessary to take out the coating plate in the base, the arrangement of the cut corners can make it more convenient for the operator to apply force to the coating plate and disassemble the coating plate from the base, which is beneficial to reducing the disassembly difficulty of the coating plate and improving the replacement efficiency of the coating plate; in addition, the production raw materials of the coating plate are relatively expensive, and the cut corners can also reduce the production and processing cost of the coating plate.
[0026] Compared with the prior art, the beneficial effects of the present utility model are:
[0027] The elastic limit mechanism arranged on the base can quickly install and disassemble the coating plate, and realize the automatic positioning and fixing of the coating plate; the flattening mechanism can smooth the release film, while ensuring the flatness of the release film, it can effectively maintain the full contact between the coating plate and the release film, and further ensure the full contact between the circuit board and the release film, which is beneficial to reducing the poor contact caused by the insufficient flatness of the release film during the exposure of the circuit board, and reducing the generated surface indentation and film printing. Description of the Drawings
[0028] To more clearly illustrate the specific embodiments of the present utility model or the technical solutions in the prior art, the following will briefly introduce the drawings required for the description of the specific embodiments or the prior art. Obviously, the drawings in the following description are some embodiments of the present utility model. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on these drawings.
[0029] Figure 1 It is a schematic diagram of the overall structure of a solder mask exposure fixture for a circuit board.
[0030] Figure 2 It is an exploded view of a solder mask exposure fixture for a circuit board.
[0031] Figure 3 It is an unfolded view of the overall structure when installing the coating plate.
[0032] Figure 4 For Figure 1 Partial enlarged view a of the cross-section A-A in
[0033] Figure 5 For Figure 1 Partial enlarged view b of the cross-section A-A in
[0034] Icon: 100 - base; 110 - first adsorption hole; 120 - installation groove; 200 - coating plate; 210 - second adsorption hole; 220 - cut corner; 300 - release film; 310 - third adsorption hole; 320 - suction hole; 330 - tearing part; 400 - elastic limit mechanism; 410 - elastic clamping component; 411 - limit shaft; 412 - clamping block; 413 - elastic member; 414 - rotating member; 4141 - rotating shaft; 4142 - positioning pin; 420 - limit component; 421 - sliding part; 422 - positioning part; 423 - sliding groove; 424 - positioning groove; 500 - flattening mechanism; 510 - flattening plate; 511 - extrusion part; 512 - through hole; 520 - guiding component; 521 - linear guide rail; 522 - moving seat; 530 - handle. Specific embodiments
[0035] To facilitate the understanding of the present utility model, the following will describe the present utility model more comprehensively with reference to the relevant drawings. The preferred embodiments of the present utility model are given in the drawings. However, the present utility model can be implemented in many different forms and is not limited to the embodiments described herein.
[0036] In the description of the present utility model, it should be understood that the orientation or positional relationship indicated by terms such as "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. is based on the orientation or positional relationship shown in the drawings. It is only for the convenience of describing the present utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus cannot be construed as a limitation on the present utility model.
[0037] In addition, the terms "first" and "second" are only used for descriptive purposes and cannot be construed as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, the features defined with "first" and "second" may explicitly or implicitly include one or more of such features. In the description of the present utility model, the meaning of "a plurality" is two or more unless otherwise specifically defined.
[0038] In this embodiment, please refer to Figures 1 to 5 As shown, the present utility model provides a solder mask exposure fixture for a circuit board, which includes a base 100. A coating plate 200 for placing the circuit board is provided on the base 100. A release film 300 is laid on the surface of the coating plate 200. An elastic limiting mechanism 400 for fixing the coating plate 200 and a flattening mechanism 500 for flatly attaching the release film 300 to the coating plate 200 are provided on the base 100. The elastic limiting mechanism 400 includes an elastic clamping assembly 410 and a limiting assembly 420 provided on the base 100. The elastic clamping assembly 410 can squeeze the coating plate 200 and press the coating plate 200 against the limiting assembly 420. The flattening mechanism 500 includes a flattening plate 510 movably provided on the base 100. The flattening plate 510 can move relative to the base 100 and squeeze the release film 300.
[0039] It can be understood that the elastic clamping assembly 410 squeezes the coating plate 200, that is, the elastic clamping assembly 410 restricts the movement of the coating plate 200 at least in one direction and provides a certain degree of force for the connection between the coating plate 200 and the base 100 to ensure stability and reliability, while the limiting assembly 420 restricts the remaining directions of the coating plate 200, and the two jointly lock the position of the coating plate 200. The flattening plate 510 can squeeze the release film 300. This squeezing can involve the entire area of the flattening plate 510 or only a part of the area, and the flattening plate 510 can be pressed against the release film 300.
[0040] In addition, in some embodiments, the flattening plate 510 can be manually controlled or driven by a driving member.
[0041] In one embodiment, please refer to Figures 1 to 2As shown, the elastic clamping assembly 410 includes a limiting shaft 411 movably disposed on one side of the base 100, a clamping block 412 connected to one end of the limiting shaft 411, and an elastic member 413 sleeved on the limiting shaft 411 and located between the clamping block 412 and the base 100. The elastic member 413 pushes the clamping block 412 to press and fit against the coating plate 200.
[0042] It can be understood that at this time, there are multiple situations. One situation is that the base 100 is provided with a mounting groove 120 for accommodating the coating plate 200. The coating plate 200 is arranged in the mounting groove 120, and the limiting shaft 411 movably penetrates through one side wall of the groove, and the clamping block 412 is also arranged in the groove. The elastic member 413 pushes the clamping block 412 to press and fit against the coating plate 200 along the axial direction of the limiting shaft 411. Another situation is that the base 100 is provided with a convex structure for accommodating the coating plate 200. The coating plate 200 is arranged in the convex structure, and the limiting shaft 411 movably penetrates through one side of the convex structure, and the clamping block 412 is also arranged in the convex structure. The thickness and width of the clamping block 412 do not exceed the thickness and width of the coating plate 200, but its shape and structure can evenly disperse the elastic force provided by the elastic member 413 and evenly act on the coating plate 200 to prevent the coating plate 200 from being worn too quickly due to uneven force, affecting its service life. The limiting shaft 411 itself can be detached from the clamping block 412, and when the elastic member 413 pushes the clamping block 412, the limiting shaft 411 can also limit the moving distance of the clamping block 412. Specifically, one end of the limiting shaft 411 is in threaded fit connection with the clamping block 412, and the other end extends to the outside of the base 100 and is provided with a limiting portion, and the limiting portion can abut against the base 100.
[0043] In addition, in some embodiments, the limiting shaft 411 and the elastic member 413 sleeved on the limiting shaft 411 can be multiple corresponding ones and are arranged at intervals, which can provide uniform elastic force for the clamping block 412. The elastic member 413 can specifically select elements such as compression springs and spiral springs that can achieve the above functions.
[0044] Specifically, in combination with Figure 3 As shown, the elastic clamping assembly 410 further includes a rotating member 414 disposed on one side of the base 100. One end of the rotating member 414 is rotatably connected to the base 100, and the other end is detachably connected to the base 100. The limiting shaft 411 is movably disposed on the rotating member 414, and the rotating member 414 can be rotated open or closed towards the outside of the base 100.
[0045] It can be understood that one end of the rotating member 414 is rotated through a rotating shaft 4141, and the detachable connection at the other end can adopt a positioning pin 4142; the rotating member 414 enables the entire elastic clamping assembly 410 to rotate relative to the base 100. It is equivalent to that the limiting shaft 411 is movably arranged on the rotating member 414, the clamping block 412 is arranged at one end of the limiting shaft 411 close to the base 100, and the elastic member 413 is arranged between the clamping block 412 and the rotating member 414. It is also equivalent to that one side of the aforementioned installation groove 120 or the convex structure can be opened. That is to say, one side of the position where the coating plate 200 is installed on the base 100 is replaced by the rotating member 414, and this side can be rotated and opened after replacement. After opening, the coating plate 200 can be installed on the base 100 through this side.
[0046] In addition, in some embodiments, there are two relatively arranged rotating members 414, and the two rotating members 414 are respectively arranged at both ends of one side of the base 100 and can be opened or closed relatively. At this time, the opposite ends of the two rotating members 414 can be fixed by the same positioning pin 4142; the detachable connection between the rotating member 414 and the base 100 can also be a snap connection, a bolt connection, etc.
[0047] In one embodiment, please refer to Figures 1 to 5 As shown, the limiting assembly 420 includes a sliding portion 421 and a positioning portion 422 arranged on the base 100, and a sliding groove 433 and a positioning groove 424 arranged on the coating plate 200. The coating plate 200 is slidably clamped on the base 100 through the sliding groove 433 and the sliding portion 421, and there are multiple positioning grooves 424 and positioning portions 422 that match each other.
[0048] It can be understood that the sliding portion 421 and the sliding groove 433 are provided with matching concave and convex structures, and are both arranged on opposite sides. While providing the condition for the coating plate 200 to be slidably clamped on the base 100 in one direction, it also additionally restricts the displacement of the coating plate 200 in the up and down directions, and can further make the plate surface of the coating plate 200 in an ideal plane for exposure, avoiding the generation of plate surface indentations and film prints due to the inclination of the plate surface during the exposure of the circuit board; the positioning portion 422 is a cylinder, arranged on one side of the base 100 and opposite to the elastic clamping assembly 410, and the positioning groove 424 is arranged on the coating plate 200 and is a cylindrical groove matching the positioning portion 422. When the coating plate 200 is slidably clamped into the base 100, the positioning portion 422 is inserted into the positioning groove 424.
[0049] In addition, in some embodiments, the positioning portion 422 and the positioning groove 424 can also be set to have the same concave and convex structures as the sliding portion 421 and the sliding groove 433; corresponding positioning portions 422 and positioning grooves 424 can also be arranged on the clamping block 412 and on the side of the coating plate 200 opposite to the clamping block 412.
[0050] In one embodiment, please refer to Figures 1 to 3 As shown, the flattening mechanism 500 further includes a guiding component 520. The guiding component 520 includes a linear guide rail 521 and a moving seat 522 slidably clamped on the linear guide rail 521. The flattening plate 510 is connected to the moving seat 522, and the flattening plate 510 approaches or moves away from the base 100 along the guiding direction of the guiding component 520.
[0051] It can be understood that the guiding component 520 separates the flattening plate 510 from the base 100, so that the flattening plate 510 does not come into direct contact with the base 100, and provides a stable and accurate reciprocating travel direction for the flattening plate 510. This direction is determined by the installation direction of the linear guide rail 521. Generally speaking, this direction is consistent with the installation direction of the coating plate 200 to facilitate operation by the operator; in addition, the guiding component 520 further includes a limiting member (not shown) for limiting the travel distance of the moving seat 522 along the linear guide rail 521.
[0052] Therefore, in some embodiments, the moving direction of the flattening plate 510 can form a certain angle with the installation direction of the coating plate 200.
[0053] Specifically, referring again to Figure 4 As shown, an extrusion portion 511 is provided on the flattening plate 510, and the extrusion portion 511 abuts against the release film 300.
[0054] It can be understood that a through hole 512 is provided on the flattening plate 510. The through hole 512 can expose the base 100 under the flattening plate 510, and then expose the coating plate 200 and the release film 300, so that the circuit board can be exposed without removing the flattening plate 510; the extrusion portion 511 is provided on the side of the flattening plate 510 opposite to the release film 300. The orientation of the extrusion portion 511 is perpendicular to the moving direction of the flattening plate 510, that is, perpendicular to the guiding direction of the linear guide rail 521, and is provided near the edge of the through hole 512. Rounded corners are provided on both sides of the extrusion portion 511, which can effectively extrude the release film 300 without damaging the release film 300.
[0055] In addition, in some embodiments, to ensure the effectiveness of the extrusion portion 511, multiple extrusion portions 511 can be provided, and the multiple extrusion portions 511 are spaced at intervals with the aforementioned extrusion portion 511 as a reference; the through hole 512 can also not be provided, but after the extrusion is completed, the flattening plate 510 needs to be moved away from the base 100; the cross section of the extrusion portion 511 can also be semi-circular.
[0056] More specifically, a handle 530 is further provided on the flattening plate 510.
[0057] It can be understood that the handle 530 is arranged on the side away from the base 100 and close to the elastic clamping assembly 410. This means that when the operator uses the handle 530, a force can be applied to the flat plate 510 towards the release film 300, and at the same time, the flat plate 510 can be pulled to reciprocate along the guiding direction of the guiding assembly 520, realizing multiple squeezes on the release film 300.
[0058] In addition, in some embodiments, multiple handles 530 can be provided, and the multiple handles 530 are arranged at intervals; the handle 530 can also be arranged at other positions on the flat plate 510.
[0059] In one embodiment, please refer to Figure 2 As shown, multiple groups of first adsorption holes 110 are arranged at intervals on the base 100, multiple groups of second adsorption holes 210 are arranged at intervals on the coating plate 200, and multiple groups of third adsorption holes 310 are arranged at intervals on the release film 300. The first adsorption holes 110, the second adsorption holes 210, and the third adsorption holes 310 are arranged opposite to each other.
[0060] It can be understood that the settings of the first adsorption holes 110, the second adsorption holes 210, and the third adsorption holes 310 enable the vacuum adsorption to directly act on the circuit board placed on the release film 300, so that the circuit board can be stably fixed. And they are all provided in multiple groups to adapt to different specifications of circuit boards. Their arrangement depends on the type of circuit board being processed; the apertures of the first adsorption holes 110, the second adsorption holes 210, and the third adsorption holes 310 are the same.
[0061] In addition, in some embodiments, the apertures of the first adsorption holes 110, the second adsorption holes 210, and the third adsorption holes 310 decrease in sequence.
[0062] In one embodiment, please refer to Figure 1 As shown, multiple groups of air suction holes 320 are arranged at intervals on the release film 300.
[0063] It can be understood that the multiple groups of air suction holes 320 are arranged in a concentric structure and cover the entire release film 300, enabling the gas in the bubbles to be discharged in time when each part of the release film 300 is squeezed, preventing flattening failure; the sizes of these air suction holes 320 should avoid large - scale scratches or abrasions on the coating plate 200 caused by the burrs or uneven edges of the circuit board when the circuit board slides on the release film 300.
[0064] In addition, in some embodiments, the air suction holes 320 can also be arranged in a matrix or the like.
[0065] In one embodiment, please refer to Figure 2 As shown, multiple cut - off corners 220 are arranged at intervals on the coating plate 200, and a tearing part 330 extending outward from the cut - off corners 220 is provided on the release film 300.
[0066] It can be understood that the cut corner 220 is provided at the corner of the coating plate 200, especially at the corner related to the base 100. The cut corner 220 is generally an isosceles right angle, and the coating plate 200 can be disassembled more conveniently; the tearing part 330 extends out of the coating plate 200 from these cut corners 220, and the shape is not limited, as long as it can tear the release film 300.
[0067] In addition, in some embodiments, the cut corners 220 can also be notches or openings spaced on the edge of the coating plate 200. Correspondingly, the tearing part 330 also extends out of the coating plate 200 from these notches or openings.
[0068] The specific application process of the present utility model is as follows:
[0069] Push the flat plate 510 to make it away from the base 100, remove the positioning pin 4142 of the elastic limiting component 420, rotate and open the rotating part 414. At this time, the whole elastic limiting component 420 is rotated to one side, and the elastic member 413 is stretched and does not squeeze the clamping block 412. Therefore, the coating plate 200 loses the elastic force provided by the elastic limiting component 420 and becomes removable from the side opened by the rotating part 414. Then, apply force at the cut corner 220 of the coating plate 200 to disassemble the coating plate 200 that needs to be replaced. Then, slide and insert the new coating plate 200 into the base 100 from this side. If the coating plate 200 does not need to be replaced, tear off the release film 300 along the tearing part 330, and then lay a new release film 300, paying attention to aligning the first adsorption hole 110, the second adsorption hole 210, and the third adsorption hole 310; reset the rotating part 414 again. At this time, the clamping block 412 will abut against the coating plate 200, and the elastic member 413 will be compressed and provide elastic force. Then insert the positioning pin 4142 back to completely fix the coating plate 200 on the base 100 and keep the surface of the coating plate 200 in an ideal plane; apply a downward force to the handle 530, and pull the handle 530 to make the flat plate 510 reciprocate along the guiding direction of the linear guide 521 to squeeze the release film 300 and achieve the flattening of the release film 300.
[0070] Although the embodiments of the present utility model have been shown and described, for those of ordinary skill in the art, it can be understood that various changes, modifications, substitutions, and variations can be made to these embodiments without departing from the principle and spirit of the present utility model. The scope of the present utility model is defined by the appended claims and their equivalents.
Claims
1. A solder mask exposure fixture for a circuit board, comprising a base, wherein a coating plate for placing the circuit board is provided on the base, and a release film is laid on the surface of the coating plate, characterized in that, The base is provided with an elastic limiting mechanism for fixing the coated plate, and a flattening mechanism for flatly attaching the release film to the coated plate; the elastic limiting mechanism includes an elastic clamping component and a limiting component provided on the base, the elastic clamping component can squeeze the coated plate and press the coated plate toward the limiting component; the flattening mechanism includes a flattening plate movably provided on the base, the flattening plate can move relative to the base and squeeze the release film.
2. The solder mask exposure fixture for a circuit board according to claim 1, wherein The elastic clamping assembly includes a limiting shaft movably arranged on one side of the base, a clamping block connected to one end of the limiting shaft, and an elastic member sleeved on the limiting shaft and located between the clamping block and the base, wherein the elastic member pushes the clamping block to be pressed tightly against the coating plate.
3. A solder mask exposure fixture for a circuit board according to claim 2, wherein, The elastic clamping assembly also includes a rotating member arranged on one side of the base, one end of the rotating member is rotatably connected to the base, and the other end is detachably connected to the base. The limit shaft is movably provided on the rotating member, and the rotating member can be rotated toward the outside of the base to open or close.
4. A solder mask exposure fixture for a circuit board according to claim 1, characterized in that, The limiting assembly includes a sliding portion and a positioning portion provided on the base, and a sliding groove and a positioning groove provided on the coating plate. The coating plate is slidably clamped on the base through the sliding groove and the sliding portion, and the positioning groove and the positioning portion are a plurality of matching ones.
5. A solder mask exposure fixture for a circuit board according to claim 1, characterized in that, The leveling mechanism also includes a guide assembly, which includes a linear guide rail and a movable seat slidably mounted on the linear guide rail. The leveling plate is connected to the movable seat, and the leveling plate approaches or moves away from the base along the guide direction of the guide assembly.
6. The solder mask exposure fixture for a circuit board according to claim 5, wherein The flat plate is provided with an extrusion portion, which abuts against the release film.
7. The solder mask exposure fixture for a circuit board according to claim 6, wherein The flat plate is further provided with a through hole, and the through hole is opposite to the release film.
8. A solder mask exposure fixture for a circuit board according to claim 1, characterized in that, The base is provided with a plurality of first adsorption holes at intervals, the coating plate is provided with a plurality of second adsorption holes at intervals, and the release film is provided with a plurality of third adsorption holes at intervals. The first adsorption holes, the second adsorption holes, and the third adsorption holes are arranged opposite to each other.
9. A solder mask exposure fixture for a circuit board according to claim 1, wherein A plurality of groups of air suction holes are arranged at intervals on the release film.
10. A solder mask exposure fixture for a circuit board according to claim 1, characterized in that, The coating plate is provided with a plurality of notches at intervals, and the release film is provided with a tearing portion extending toward the outside of the notches.