Equipment heat dissipation cabin and energy storage system

Abstract

The utility model relates to an equipment heat dissipation cabin and an energy storage system, the equipment heat dissipation cabin is used for placing electronic devices, the equipment heat dissipation cabin comprises a cabin body, a condenser and a fan set, and the cabin body is provided with an air inlet and an air outlet; the electronic device is arranged in the cabin body, and the condenser is arranged on the cabin body; the fan unit is configured to guide airflow flowing into the cabin body through the air inlet to flow out through the air outlet; the electronic device and the condenser are both located on the flowing path of the airflow. The problems that an equipment heat dissipation cabin liquid cooling heat dissipation scheme is low in energy utilization rate and low in energy density can be solved.

Description

Technical Field

[0001] This application relates to the technical field of energy storage, and particularly to a device heat dissipation cabin and an energy storage system. Background Art

[0002] The liquid cooling system has gradually become the mainstream heat dissipation solution in the energy storage field due to its high heat dissipation efficiency. However, the traditional device heat dissipation cabin has the problem of low energy utilization rate of the liquid cooling heat dissipation solution. Summary of the Utility Model

[0003] Based on this, it is necessary to provide a device heat dissipation cabin and an energy storage system for the problem of low energy utilization rate of the liquid cooling heat dissipation solution of the device heat dissipation cabin.

[0004] According to one aspect of the present application, there is provided a device heat dissipation cabin for placing electronic devices, and the device heat dissipation cabin includes:

[0005] A cabin body provided with an air inlet and an air outlet;

[0006] A condenser disposed on the cabin body; and

[0007] A fan group configured to guide the air flow flowing into the cabin body through the air inlet to flow out through the air outlet;

[0008] Wherein, the electronic devices are disposed in the cabin body, and both the electronic devices and the condenser are located on the air flow path.

[0009] In some disclosures, along the air flow direction, the condenser and the electronic devices are arranged in sequence, or the electronic devices and the condenser are arranged in sequence.

[0010] In some disclosures, the cabin body is enclosed by a plurality of wall surfaces facing different directions. The cabin body includes a bottom wall and a top wall oppositely arranged in a first direction, and side walls connected between the bottom wall and the top wall and oppositely arranged in a second direction; wherein, the first direction intersects with the second direction; the air inlet is provided on one of the wall surfaces, and the air outlet is provided on another wall surface; the wall surface includes: one or a combination of the bottom wall, the top wall and the side walls.

[0011] In some disclosures, when the condenser and the electronic devices are arranged in sequence along the air flow direction, at least part of the orthographic projection of the condenser on the plane where the air inlet is located covers the air inlet, and a heat dissipation channel communicating with the air inlet is provided on the condenser.

[0012] In some disclosures, when the electronic device and the condenser are arranged in sequence along the air flow direction, at least a part of the orthographic projection of the condenser on the plane where the air outlet is located covers the air outlet, and a heat dissipation channel communicating with the air outlet is provided on the condenser.

[0013] In some disclosures, the equipment heat dissipation compartment further includes a fan. When the condenser and the electronic device are arranged in sequence along the air flow direction, the installation positions of the fan include: at the air inlet, at least partially embedded in the air inlet, between the air inlet and the condenser, between the condenser and the electronic device, between the electronic device and the air outlet, at the air outlet, at least partially embedded in the air outlet, or a combination of these positions; or

[0014] When the electronic device and the condenser are arranged in sequence along the air flow direction, the installation positions of the fan include: at the air inlet, at least partially embedded in the air inlet, between the air inlet and the electronic device, between the electronic device and the condenser, between the condenser and the air outlet, at the air outlet, at least partially embedded in the air outlet, or a combination of these positions.

[0015] In some disclosures, the equipment heat dissipation compartment further includes a first temperature sensor arranged in the compartment body, and a controller connected to the first temperature sensor and the fan group.

[0016] In some disclosures, the equipment heat dissipation compartment further includes a plurality of diversion air plates arranged at intervals along a first direction; each of the diversion air plates is provided with the electronic device;

[0017] Alternatively, the equipment heat dissipation compartment has a unit compartment for accommodating a cooling unit, and the cooling unit is used to drive a cooling medium to flow through the condenser.

[0018] In some disclosures, a return air fan is arranged in the compartment body, and the return air fan is configured to introduce the air flow flowing out of the air outlet into the compartment body.

[0019] According to a second aspect of the present application, an energy storage system is provided, including a battery compartment and the above-mentioned equipment heat dissipation compartment. Wherein, a battery and a radiator for dissipating heat from the battery are accommodated in the battery compartment; the cooling unit is used to exchange heat between the radiator and the condenser.

[0020] For the equipment heat dissipation compartment provided by the present application, by arranging the electronic device in the compartment body, the fan group drives the air flow to flow into the compartment body through the air inlet and discharges it out of the compartment body through the air outlet. The process of the air flow guided by the fan group passing through the condenser and the electronic device realizes the cooling of the fan group and the electronic device. In this way, the coupling of the condenser heat dissipation and the electronic device heat dissipation is realized, thereby realizing the multi-stage utilization of energy and improving the energy utilization rate. Description of the Drawings

[0021] Figure 1 Shows a schematic internal structure diagram of the equipment heat dissipation compartment in one disclosure of the present application.

[0022] Figure 2 Shows Figure 1 a schematic internal structure diagram of the equipment heat dissipation compartment from another perspective in

[0023] Figure 3 Shows a schematic internal structure diagram of the equipment heat dissipation compartment in another disclosure of the present application.

[0024] Figure 4 Shows a schematic internal structure diagram of the equipment heat dissipation compartment in yet another disclosure of the present application.

[0025] Figure 5 Shows a schematic internal structure diagram of the equipment heat dissipation compartment in still another disclosure of the present application.

[0026] Figure 6 Shows a schematic internal structure diagram of the equipment heat dissipation compartment in another additional disclosure of the present application.

[0027] Figure 7 Shows a schematic internal structure diagram of the equipment heat dissipation compartment in yet another additional disclosure of the present application.

[0028] Explanation of the reference numerals in the attached drawings:

[0029] 1. Equipment heat dissipation compartment;

[0030] 10. Compartment body; 11. Bottom wall; 12. Top wall; 13. Side wall; 14. Flow guiding air baffle; 15. Compartment; 101. Air inlet; 102. Air outlet;

[0031] 20. Electronic device;

[0032] 31. Condenser; 32. Cooling unit;

[0033] 40. Fan unit; 41. Inlet air fan; 42. Outlet air fan;

[0034] 51. Electric louver; 52. Return air fan;

[0035] 61. Battery compartment outlet pipe; 62. Battery compartment inlet pipe;

[0036] X. First direction. Detailed implementation manners

[0037] To make the above objects, features, and advantages of the present application more apparent and understandable, the following provides a detailed description of the specific implementation manners of the present application in conjunction with the accompanying drawings. Many specific details are set forth in the following description to facilitate a thorough understanding of the present application. However, the present application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar improvements without departing from the connotation of the present application. Therefore, the present application is not limited by the specific disclosure below.

[0038] In the description of the present application, it should be understood that if terms such as "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. appear, the orientation or positional relationship indicated by these terms is based on the orientation or positional relationship shown in the accompanying drawings. These are only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, it should not be construed as a limitation to the present application.

[0039] In addition, if terms such as "first" and "second" appear, these terms are only for descriptive purposes and should not be construed as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, features defined with "first" and "second" may explicitly or implicitly include at least one of such features. In the description of the present application, if the term "plurality" appears, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise specifically defined.

[0040] In the present application, unless otherwise clearly specified and limited, if terms such as "install", "connect", "join", "fix", etc. appear, these terms should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or integrated; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the communication inside two elements or the interaction relationship between two elements, unless otherwise clearly limited. For those of ordinary skill in the art, the specific meanings of the above terms in the present application can be understood according to specific circumstances.

[0041] In this application, unless otherwise clearly specified and defined, when a first feature is described as being "on" or "under" a second feature or similar descriptions, it may mean that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Moreover, the first feature being "above", "over" and "on top of" the second feature may be that the first feature is directly above or obliquely above the second feature, or merely indicates that the first feature has a higher horizontal height than the second feature. The first feature being "under", "beneath" and "underneath" the second feature may be that the first feature is directly below or obliquely below the second feature, or merely indicates that the first feature has a lower horizontal height than the second feature.

[0042] It should be noted that if an element is referred to as being "fixed to" or "disposed on" another element, it can be directly on the other element or there may also be an intermediate element. If an element is considered to be "connected to" another element, it can be directly connected to the other element or there may be an intermediate element at the same time. If any, the terms "vertical", "horizontal", "up", "down", "left", "right" and similar expressions used in this application are only for the purpose of illustration and do not represent the only implementation.

[0043] For the sake of easy understanding, the present disclosure is described by taking a liquid cooling system as an example. In this case, the cooling unit is a chiller, and the chiller, radiator and condenser are connected in series to form a loop. The radiator can be arranged in the battery compartment with the battery to absorb heat from the battery. After the radiator absorbs heat, the internal coolant temperature rises. The chiller drives the heated coolant into the condenser, and after dissipating heat in the condenser, the cooled coolant returns to the radiator again. In this case, the loop structure is simple and the cost is low.

[0044] Furthermore, the cooling unit may include devices such as a heat exchanger, a compressor, etc.; the compressor, the cold side pipeline of the heat exchanger, and the condenser are connected in series to form a first loop; the hot side pipeline of the heat exchanger and the radiator are connected in series to form a second loop; the heat exchanger couples the heat from the radiator into the first loop, and the compressor drives the vaporized phase change medium in the evaporator to the condenser to be liquefied, thereby realizing heat dissipation for the battery. In this case, the cooling medium in the second loop is not directly connected to the condenser, which can improve safety.

[0045] Of course, the cooling medium in the loop can be a liquid coolant or a phase change heat dissipation medium; the radiator can be a cold plate or a submerged oil cylinder.

[0046] The liquid cooling system has the advantages of high heat dissipation efficiency and high system energy density, and has gradually become the mainstream heat dissipation solution in the energy storage field. In the liquid cooling system, the chiller and the radiator are connected through a cooling pipeline to form a liquid cooling loop. A cooling medium is arranged in the liquid cooling loop, and the heat is taken away by the circulation of the cooling medium in the liquid cooling loop, so as to achieve the effect of cooling the battery and enable the battery to work within a suitable temperature range.

[0047] However, the traditional liquid cooling heat dissipation solution usually adopts an integrated chiller, and both the refrigeration cycle and the coolant heat exchange are completed within the chiller. Based on this, the chiller and electrical components (such as DC / DC converters, power conversion systems (PCS)) need to dissipate heat independently, resulting in low energy utilization efficiency and a large size of the equipment heat dissipation compartment.

[0048] To solve the above problems, the present application provides an equipment heat dissipation compartment. By coupling the heat dissipation structures of multiple modules, for example, coupling the heat dissipation of the chiller and the heat dissipation of electronic devices, within one heat dissipation cycle, multiple modules can make more full use of the same amount of cooling capacity for heat dissipation, realizing multi-stage utilization of energy and improving the energy utilization efficiency. At the same time, the size of the equipment heat dissipation compartment is reduced, thereby improving the energy density.

[0049] Figure 1 The internal structure schematic diagram of the equipment heat dissipation compartment in one disclosure of the present application is shown. Figure 2 Shown is Figure 1 The internal structure schematic diagram of the equipment heat dissipation compartment from another perspective in Figure 3 The internal structure schematic diagram of the equipment heat dissipation compartment in another disclosure of the present application is shown. Figure 4 The internal structure schematic diagram of the equipment heat dissipation compartment in another disclosure of the present application is shown.

[0050] Referring to Figure 1 and Figure 2 Taking the equipment heat dissipation compartment 1 provided in one disclosure of the present application as an example, where the equipment heat dissipation compartment 1 is a hexahedron structure, the equipment heat dissipation compartment 1 is used to place electronic devices 20. The equipment heat dissipation compartment 1 includes a cabin body 10, a condenser 31, and a fan group 40. The cabin body 10 is provided with an air inlet 101 and an air outlet 102 to realize the air exchange between the inside and the outside of the cabin body 10. The electronic devices 20 are arranged inside the cabin body 10, the condenser 31 is arranged on the cabin body 10, and the fan group 40 is configured to guide the air flow flowing into the cabin body 10 through the air inlet 101 to flow out through the air outlet 102. Among them, the electronic devices 20 are arranged inside the cabin body 10, and both the electronic devices 20 and the condenser 31 are located on the air flow path.

[0051] For example, continuing to refer to Figure 1 and Figure 2, when air enters the cabin 10 through the air inlet 101 and is discharged from the cabin 10 through the air outlet 102, it first passes through the condenser 31 and then through the electronic device 20. In this way, the fan unit 40 first cools the hot air in the condenser 31 and then cools the electronic device 20, realizing the cooling of the electronic device 20 and the condenser 31.

[0052] For another example, referring to Figure 3 and Figure 4 , when air enters the cabin 10 through the air inlet 101 and is discharged from the cabin 10 through the air outlet 102, it first passes through the electronic device 20 and then through the condenser 31. In this way, the fan unit 40 first cools the electronic device 20 and then cools the hot air in the condenser 31.

[0053] It can be understood that when the air flow guided by the fan unit 40 is at a relatively low temperature after flowing out of the air outlet 102, this part of the air flow can be recycled, thereby improving the utilization rate of cooling capacity. In this way, the recycled air can be directed into the cabin 10 to make the air temperature in the cabin 10 lower, so as to more efficiently dissipate heat from the electronic device 20.

[0054] Based on this, for the equipment heat dissipation cabin 1 provided in the present application, by arranging the electronic device 20 in the cabin 10 and using the fan unit 40 to drive the air flow to flow into the cabin 10 through the air inlet 101 and be discharged from the cabin 10 through the air outlet 102, the process in which the air flow guided by the fan unit 40 passes through the condenser 31 and the electronic device 20 realizes the cooling of the fan unit 40 and the electronic device 20. In this way, the coupling of heat dissipation of the condenser 31 and heat dissipation of the electronic device 20 is realized, thereby realizing the multi-stage utilization of energy and improving the utilization rate of energy. At the same time, the size of the equipment heat dissipation cabin 1 is reduced, thereby improving the energy storage density.

[0055] Compared with the structure of the traditional equipment heat dissipation cabin 1, the structure of the equipment heat dissipation cabin 1 provided in the present application can effectively reduce the amount of dust intrusion, extend the dust cleaning cycle, and reduce the after-sales operation and maintenance cost. At the same time, after the cabin where the condenser 31 is located and the electrical cabin where the electronic device 20 is located are combined into one cabin, the number of fans used can be reduced, and the noise of the entire equipment heat dissipation cabin 1 can be reduced.

[0056] Referring to Figure 1 and Figure 2 , in some disclosures, the condenser 31 and the electronic device 20 are arranged in sequence along the gas flow direction.

[0057] That is to say, the electronic device 20 is located downstream of the condenser 31 in the air flow path. Optionally, the condenser 31 is arranged between the air inlet 101 and the electronic device 20, so that the air flow flowing into the cabin 10 through the air inlet 101 flows through the electronic device 20 after heat exchange through the condenser 31. Based on this, the fan unit 40 guides the air flow entering the cabin 10 to pass through the condenser 31 and the electronic device 20 in sequence, that is, the fan unit 40 first cools the condenser 31, and the condenser 31 is used to cool the battery. Therefore, this solution can preferentially meet the heat dissipation requirements on the battery side.

[0058] Furthermore, considering that the temperature limit of the electrical cabin where the electronic device 20 is located is relatively high, and combining with the need to preferentially meet the heat dissipation on the battery side, the start and stop times of the fan unit 40 can be controlled according to the battery temperature and the temperature of the electronic device 20. For example, when the detected temperature is higher than the threshold, the fan unit 40 is turned on, thereby extending the service life of the fan unit 40.

[0059] Refer to Figure 3 and Figure 4 , in some other disclosures, along the gas flow direction, the electronic device 20 and the condenser 31 are arranged in sequence.

[0060] That is to say, the electronic device 20 is located upstream of the condenser 31 in the air flow path. Optionally, the condenser 31 is arranged between the air outlet 102 and the electronic device 20, so that the air flow flowing through the electronic device 20 flows out through the air outlet 102 after heat exchange through the condenser 31. Based on this, the fan unit 40 guides the air flow entering the cabin 10 to pass through the electronic device 20 and the condenser 31 in sequence, that is, the fan unit 40 first cools the electronic device 20 and then cools the condenser 31.

[0061] Refer to Figure 1 and Figure 2 , in some disclosures, the cabin 10 is enclosed by a plurality of wall surfaces facing different directions. The cabin 10 includes a bottom wall 11 and a top wall 12 that are oppositely arranged along a first direction, and side walls 13 that are connected between the bottom wall 11 and the top wall 12 and are oppositely arranged along a second direction, wherein the first direction intersects the second direction. The air inlet 101 is arranged on one of the wall surfaces, and the air outlet 102 is arranged on another wall surface. The wall surface includes one or a combination of the bottom wall 11, the top wall 12, and the side walls 13. The side walls 13, the bottom wall 11, and the top wall 12 are combined to form a cabin 10 with a rectangular cross-section and longitudinal section, which is convenient for the overall layout of multiple equipment heat dissipation cabins 1.

[0062] Furthermore, the air inlet 101 may be located on the side wall 13, and the air outlet 102 may be located on the top wall 12. This allows the air inlet 101 and the air outlet 102 to be located farther apart, so that air entering the cabin 10 through the air inlet 101 must first pass through a larger space within the cabin 10 before being discharged from the cabin 10 through the air outlet 102. This allows the airflow introduced by the fan unit 40 to more fully contact the electronic components 20 and condenser 31 within the cabin 10, thereby improving heat exchange efficiency. Furthermore, since the air inlet 101 and the air outlet 102 are located on the side wall 13 and the top wall 12, respectively, convection currents can be generated between the air inlet 101 and the air outlet 102, thereby improving air circulation efficiency.

[0063] Alternatively, the air inlet 101 and the air outlet 102 are both provided on two relatively parallel wall surfaces of the side wall 13. Figure 7 With reference to the orientation of the embodiment shown, the air inlet 101 is arranged on the left wall surface, and the air outlet 102 is arranged on the right wall surface.

[0064] In an optional disclosure, at least a portion of the orthographic projection of the condenser 31 on the plane where the air inlet 101 is located covers the air inlet 101. The condenser 31 is provided with a heat dissipation channel connected to the air inlet 101. For example, the condenser 31 includes a plurality of heat dissipation fins, and the heat dissipation channel is formed between two adjacent heat dissipation fins.

[0065] “At least part of the orthographic projection of the condenser 31 on the plane where the air inlet 101 is located covers the air inlet 101” can be, for example Figure 1 、 Figure 2 and Figure 6 As shown, when the condenser 31 and the electronic device 20 are arranged sequentially along the airflow direction, at least a portion of the orthographic projection of the condenser 31 on the plane where the air inlet 101 is located covers the air inlet 101. For example, the condenser 31 is installed on the inner side of the side wall 13 where the air inlet 101 is located. For another example, the condenser 31 is installed on the outer side of the side wall 13 where the air inlet 101 is located, and at least a portion of the orthographic projection of the condenser 31 on the plane where the air inlet 101 is located covers the air inlet 101. For another example, at least a portion of the condenser 31 is embedded in the side wall 13 where the air inlet 101 is located.

[0066] In this way, after air enters the cabin 10 through the air inlet 101, it can quickly cool the condenser 31, that is, the condenser 31 is preferentially cooled quickly. This layout solution can prioritize the heat dissipation requirements on the battery side. At the same time, because the temperature limit of the electronic device 20 is higher than the temperature limit of the battery, the fan start and stop time can be controlled according to the battery temperature and the temperature of the electronic device 20. For example, the fan will be turned on when the temperature exceeds the threshold, thereby increasing the fan life.

[0067] Exemplarily, when the condenser 31 is installed inside the side wall 13 provided with the air inlet 101, the condenser 31 can be directly installed on the inner surface of the side wall 13, or indirectly installed on the inner surface of the side wall 13 through other mounting brackets.

[0068] "At least part of the orthographic projection of the condenser 31 on the plane where the air inlet 101 is located covers the air inlet 101" can also be, for example, Figure 4 As shown, when the electronic device 20 and the condenser 31 are arranged in sequence along the air flow direction, at least part of the orthographic projection of the condenser 31 on the plane where the air inlet 101 is located covers the air inlet 101. For example, the condenser 31 is installed inside the side wall 13 opposite to the air inlet 101. In this way, after the air enters the cabin 10 through the air inlet 101, it first passes through the electronic device 20 and exchanges heat with the electronic device 20, then passes through the condenser 31 and exchanges heat with the condenser 31, and finally is discharged through the air outlet 102, realizing the sequential cooling of the electronic device 20 and the condenser 31. Compared with the scheme of installing the condenser 31 inside the top wall 12, the heat exchange area of this layout scheme is increased to a large extent. Therefore, this layout scheme is applicable to scenarios where the temperature control accuracy requirement for the electronic device 20 is relatively high and the cooling capacity margin of the condenser 31 is not sufficient.

[0069] Please refer to Figure 3 , in another disclosure, at least part of the orthographic projection of the condenser 31 on the plane where the air outlet 102 is located covers the air outlet 102.

[0070] For example, the condenser 31 is installed inside the top wall 12, and at least part of the orthographic projection of the condenser 31 on the plane where the air outlet 102 is located covers the air outlet 102. In this way, after the air enters the cabin 10 through the air inlet 101, it first passes through the electronic device 20 and exchanges heat with the electronic device 20, then passes through the condenser 31 and exchanges heat with the condenser 31, and finally is discharged through the air outlet 102, realizing the sequential cooling of the electronic device 20 and the condenser 31. This layout scheme is applicable to scenarios where the temperature control accuracy requirement for the electronic device 20 is relatively high and the cooling capacity of the condenser 31 is relatively sufficient.

[0071] Combined with Figures 2 - 4 , since the layout of the electronic device 20 and the condenser 31 is relatively flexible, it can be flexibly configured according to the customer's usage requirements and the project site environment, fully realizing the multi-level utilization of energy.

[0072] In some disclosures, when the condenser 31 and the electronic device 20 are arranged in sequence along the air flow direction, the installation positions of the fan include: at the air inlet 101, at least partially embedded in the air inlet 101, between the air inlet 101 and the condenser 31, between the condenser 31 and the electronic device 20, between the electronic device 20 and the air outlet 102, at the air outlet 102, or at least partially embedded in the air outlet 102, or a combination of these positions.

[0073] It is possible that the fan unit 40 includes a fan, and at least part of the fan is embedded in the air inlet 101 (not shown in the figure).

[0074] It is also possible that the fan unit 40 includes a fan, such as Figure 2 As shown, along the gas flow direction, the condenser 31, the fan, and the electronic device 20 are arranged in sequence. The fan can be the intake fan 41 or the exhaust fan 42. Specifically, in the embodiment as shown in Figure 2 As shown, the fan is the intake fan 41. Along the gas flow direction, the condenser 31, the intake fan 41, and the electronic device 20 are arranged in sequence. The gas flow direction is first from left to right and then from bottom to top, and the condenser 31, the intake fan 41, and the electronic device 20 are arranged in sequence from left to right.

[0075] In this way, the condenser 31 is located upstream of the intake fan 41, so that the intake fan 41 can preferentially and quickly take away the heat of the condenser 31. And the intake fan 41 is located upstream of the electronic device 20 along the air flow path. Based on this, by arranging the intake fan 41 on the air intake side of the electronic device 20, the outside air can enter the cabin 10 more quickly, thereby improving the cooling efficiency of the electronic device 20.

[0076] In the present disclosure, when the condenser 31 is installed inside the side wall 13 where the air inlet 101 is provided, the condenser 31 can be located between the air inlet 101 and the intake fan 41, so that the air entering the cabin 10 through the air inlet 101 can more efficiently cool the condenser 31. At least part of the intake fan 41 can also be embedded in the air inlet 101.

[0077] It is also possible that along the gas flow direction, the fan, the condenser 31, and the electronic device 20 are arranged in sequence. The fan can be the intake fan 41 or the exhaust fan 42. Specifically, in the embodiment as shown in Figure 6 As shown, the fan is the intake fan 41. Along the gas flow direction, the intake fan 41, the condenser 31, and the electronic device 20 are arranged in sequence. The intake fan 41 is located between the air inlet 101 and the condenser 31. The gas flow direction is first from left to right and then from bottom to top, and the air inlet 101, the intake fan 41, the condenser 31, and the electronic device 20 are arranged in sequence from left to right.

[0078] Of course, the present application is not limited to this. In some disclosures, it may be that, along the gas flow direction, the condenser 31, the electronic device 20, and the fan are arranged in sequence. The fan can be the intake fan 41 or the exhaust fan 42. By way of example, the fan is the exhaust fan 42. That is to say, along the gas flow direction, the condenser 31, the electronic device 20, and the exhaust fan 42 are arranged in sequence. In this way, the exhaust fan 42 is located downstream of the electronic device 20 along the air flow path. Based on this, by arranging the exhaust fan 42 on the air outlet side of the electronic device 20, the air after heat exchange with the electronic device 20 can be discharged out of the cabin 10 more quickly, thereby making the heat exchange cycle process more efficient.

[0079] In some other disclosures, when the electronic device 20 and the condenser 31 are arranged in sequence along the air flow direction, the installation positions of the fan include: at the air inlet 101, at least partially embedded in the air inlet 101, between the air inlet 101 and the electronic device 20, between the electronic device 20 and the condenser 31, between the condenser 31 and the air outlet 102, at the air outlet 102, or at least partially embedded in the air outlet 102, or a combination of these positions.

[0080] It may be that, along the gas flow direction, the fan, the electronic device 20, and the condenser 31 are arranged in sequence. The fan can be the intake fan 41 or the exhaust fan 42. Specifically, in the embodiment shown in Figure 4 the fan is the intake fan 41. Along the gas flow direction, the intake fan 41, the electronic device 20, and the condenser 31 are arranged in sequence. The gas flow direction is first from left to right and then from bottom to top, and the intake fan 41, the electronic device 20, and the condenser 31 are arranged in sequence from left to right.

[0081] It may also be that, along the gas flow direction, the electronic device 20, the fan, and the condenser 31 are arranged in sequence. The fan can be the intake fan 41 or the exhaust fan 42. Specifically, in the embodiment shown in Figure 7 the fan is the exhaust fan 42. Along the gas flow direction, the electronic device 20, the exhaust fan 42, and the condenser 31 are arranged in sequence. In this way, the condenser 31 is located downstream of the intake fan 41, and the electronic device 20 is located upstream of the intake fan 41, so that the intake fan 41 can preferentially and quickly take away the heat of the electronic device 20.

[0082] It may further be that, along the gas flow direction, the electronic device 20, the condenser 31, and the fan are arranged in sequence. By way of example, the fan is the exhaust fan 42. That is to say, along the gas flow direction, the electronic device 20, the condenser 31, and the exhaust fan 42 are arranged in sequence. In this way, along the air flow path, the condenser 31 is located upstream of the exhaust fan 42. In this way, the exhaust fan 42 can quickly discharge the hot air after heat exchange with the condenser 31.

[0083] Of course, the present application is not limited thereto, and at least part of the blower can also be embedded in the air outlet 102. Exemplarily, the blower is the air outlet blower 42, and at least part of the air outlet blower 42 can be embedded in the air outlet 102.

[0084] It can be understood that the blower group 40 can include two blowers at different positions. For example, one blower is arranged at the air inlet 101, and the other blower is arranged at the air outlet 102. Specifically, the blower group 40 can simultaneously include the air inlet blower 41 and the air outlet blower 42, and the air inlet blower 41 is arranged at the air inlet 101, and the air outlet blower 42 is arranged at the air outlet 102, thereby improving the air inlet efficiency and the air outlet efficiency, and thus improving the overall cooling efficiency. Among them, the number of the air inlet blower 41 and the air outlet blower 42 can be the same or different.

[0085] Optionally, when the blower group 40 includes the air inlet blower 41 and / or the air outlet blower 42, the condenser 31 can be installed on the side wall 13 of the cabin 10, or can also be installed on the top wall 12 of the cabin 10.

[0086] Of course, the present application is not limited thereto. Two blowers at different positions can also be arranged at the air inlet 101, at least partially embedded in the air inlet 101, between the air inlet 101 and the electronic device 20, between the electronic device 20 and the condenser 31, between the condenser 31 and the air outlet 102, at the air outlet 102, and at least partially embedded in the air outlet 102. Other combinations other than the combination of these two positions at the air inlet 101 and the air outlet 102 will not be enumerated one by one here.

[0087] Furthermore, when the condenser 31 is installed on the side wall 13, it can be specifically installed on the side of the side wall 13 where the air inlet 101 is provided, or can also be installed on the side of the side wall 13 opposite to the air inlet 101.

[0088] In some disclosures, the equipment heat dissipation cabin 1 further includes a first temperature sensor (not shown in the figure) arranged in the cabin 10, and a controller (not shown in the figure) connected to the first temperature sensor and the blower group 40. In this way, the battery temperature and the temperature of the electronic device 20 can be detected, and the start and stop times of the blower can be controlled according to the detection results. For example, when the detected temperature is higher than the threshold, the corresponding blower is turned on, and when the detected temperature is lower than another threshold, the corresponding blower is turned off.

[0089] Refer to Figure 1 and Figure 2, in some disclosures, the equipment heat dissipation compartment 1 further includes a plurality of diversion air plates 14 arranged at intervals in the first direction X. Electronic devices 20 are arranged on the surface of each diversion air plate 14. The cooling unit 32 is used to drive the cooling medium to flow through the condenser 31. Exemplarily, the first direction X is parallel to the vertical direction. In this way, the flow path is optimized, the mutual influence between the flow fields of each inlet air fan 41 can be effectively weakened, and the heat dissipation efficiency is improved. Of course, the electronic devices 20 can also be arranged on the lower surface of the diversion air plate 14. In order to further improve the power density of the equipment, the electronic devices 20 can be arranged on both the upper and lower surfaces of the diversion air plate 14. Optionally, a plurality of electronic devices 20 are arranged above each diversion air plate 14. The fan group 40 includes a plurality of inlet air fan groups arranged in the first direction X. Each inlet air fan group includes a plurality of inlet air fans 41 arranged in one-to-one correspondence with the electronic devices 20 located above the same diversion air plate 14. In this way, a plurality of inlet air fans 41 intake air simultaneously, improving the air intake efficiency, thereby improving the cooling efficiency of the electronic devices 20. Among them, the first direction X is parallel to the vertical direction or has an error angle relative to the vertical direction.

[0090] Optionally, a plurality of outlet air fans 42 are provided on the top wall 12 of the compartment 10. The number of outlet air fans 42 can be the same as or different from the number of inlet air fans 41 to coordinate the heat exchange effect and the air outlet efficiency.

[0091] Exemplarily, the equipment heat dissipation compartment 1 includes eight inlet air fans 41. The eight inlet air fans 41 are arranged in rows in the horizontal direction and in columns in the vertical direction. There are two inlet air fans 41 in each row and four inlet air fans 41 in each column. Correspondingly, a plurality of electronic devices 20 are also arranged in rows in the horizontal direction and in columns in the vertical direction. There are two groups of electronic devices 20 in each row and four groups of electronic devices 20 in each column. Among them, each group of electronic devices 20 can be one or more electronic devices 20. Compared with the prior art, eight fans of the same model are integrated and arranged, which is convenient for management.

[0092] In some disclosures, the compartment 10 includes at least two mutually isolated compartments 15. The cooling unit 32 further includes an evaporator connected to the condenser 31. The evaporator and the electronic devices 20 are located in different compartments 15. In this way, the heat of the evaporator can be effectively prevented from affecting the electronic devices 20.

[0093] Figure 5 The internal structure schematic diagram of the equipment heat dissipation compartment in another disclosure of the present application is shown. [[ID=]15]

[0094] Refer to Figure 5 , in some disclosures, a return air structure is provided in the compartment 10, for example, at the top, to reuse the external cold source. Optionally, the return air structure includes a return air fan 52. The return air fan 52 is configured to introduce the air flow flowing out of the air outlet 102 into the compartment 10 to improve the energy utilization rate.

[0095] Optionally, the return air structure includes an electric louver 51, an air duct, and a return air fan 52. By reading the top outlet air temperature and the temperature information of the electronic device 20, the ventilation rate of the electric louver 51 and the opening or closing of the return air fan 52 are controlled. This return air structure is designed inside the cabin body 10, does not affect the overall height of the equipment heat dissipation cabin 1, and meets the sea transportation standard.

[0096] The return air fan 52 can be turned on as needed. For example, when the top outlet air temperature is less than the first preset value and when the temperature of the electronic device 20 is greater than the second preset value (the first preset value is less than the second preset value, and the second preset value can be set according to the highest operating temperature of the electrical device 20), the return air fan 52 can be turned on. Then, the cold air from the outside flows into the cabin body 10 through the air outlet 102, flows through the electric louver 51 and the return air fan 52, and then flows toward the electronic device 20 inside the cabin body 10, so as to better dissipate heat from the electronic device 20 and improve the energy utilization rate at the same time.

[0097] The present disclosure also provides an energy storage system, including the equipment heat dissipation cabin 1 disclosed above and a battery cabin. The battery cabin is located on one side of the equipment heat dissipation cabin 1. The battery cabin houses a battery and a radiator for dissipating heat from the battery. Among them, the cooling unit 32 is used to exchange heat between the radiator and the condenser 31.

[0098] It can be that the cooling unit 32, the radiator, and the condenser 31 are connected in series to form a loop. The radiator is used to absorb heat from the battery. After the radiator absorbs heat, the coolant inside it heats up. The cooling unit 32 drives the heated coolant into the condenser 31. After dissipating heat in the condenser 31, the cooled coolant returns to the radiator again. In this way, the cooling unit 32 can be used to cool the battery.

[0099] It can also be that the cooling unit 32 includes a heat exchanger, a compressor, a water pump, a throttle valve, etc. The evaporator, the compressor, the water pump, the throttle valve, and the condenser 31 are connected to form a refrigeration cycle loop to achieve a refrigeration cycle. Among them, the heat exchanger is provided with a first heat exchange channel connected to the condenser 31 and a second heat exchange channel connected to the radiator and capable of exchanging heat with the first heat exchange channel. Specifically, one end of the second heat exchange channel is connected to one end of the radiator through the battery cabin outlet water pipe 61, and the other end of the radiator is connected to the other end of the second heat exchange channel through the battery cabin inlet water pipe 62. In this way, the cooling unit 32 can also be used to cool the battery.

[0100] In some disclosures, the equipment heat dissipation cabin 1 has a unit cabin for accommodating the cooling unit 32. The cooling unit 32 is used to drive the cooling medium to flow through the condenser 31. In this way, the cooling unit 32 can be arranged inside the cabin body 10. For example, the cooling unit 32 can be arranged on the bottom wall 11 of the cabin body 10, so as to facilitate the layout of each component and pipeline.

[0101] Of course, the present application is not limited thereto. In some other disclosures, the cooling unit 32 may also be disposed outside the cabin 10.

[0102] Optionally, the cabin 10 includes a first compartment and a second compartment arranged along a first direction. The electronic devices are arranged in the first compartment, and the evaporator is arranged in the second compartment. In this way, the heat of the evaporator can be effectively prevented from interacting with the electronic devices 20.

[0103] Furthermore, the compartments 15 of the cabin 10 are isolated by partition boards, and heat insulation layers are provided on the partition boards. For example, when the evaporator is located in the bottommost compartment 15, a heat insulation layer can be provided on the bottommost partition board, realizing heat insulation between the compartment 15 where the evaporator is located and the compartment 15 where the electronic devices 20 are located, while saving materials and reducing costs.

[0104] Optionally, the partition board isolating the plurality of compartments 15 and the flow guiding air plate 14 may be of the same structure, thereby simplifying the structure inside the cabin 10.

[0105] Finally, it should be emphasized that the air inlet 101 and the air outlet 102 referred to in the present disclosure are only examples. The user can use the air inlet 101 as the air outlet according to actual needs, or use the air outlet 102 as the air inlet.

[0106] The technical features disclosed above can be combined arbitrarily. For the sake of brevity of description, not all possible combinations of the above-mentioned technical features in the present disclosure are described. However, as long as there is no contradiction in the combination of these technical features, it should be considered as the scope described in this specification.

[0107] The above disclosure only expresses several embodiments of the present application, and the description is relatively specific and detailed, but it should not be construed as a limitation on the scope of the patent application. It should be noted that for those of ordinary skill in the art, without departing from the concept of the present application, several modifications and improvements can still be made, and these all belong to the protection scope of the present application. Therefore, the protection scope of the patent of the present application should be subject to the appended claims.

Claims

1. A device heat dissipation chamber for placing electronic devices, characterized in that, The device heat dissipation compartment includes: A compartment body provided with an air inlet and an air outlet; A condenser disposed on the compartment body; and A fan group configured to guide the air flow flowing into the compartment body through the air inlet to flow out through the air outlet; Wherein, the electronic device is disposed in the compartment body, and both the electronic device and the condenser are located on the air flow path.

2. The device heat dissipation cabin according to claim 1, characterized in that, Along the air flow direction, the condenser and the electronic device are arranged in sequence, or the electronic device and the condenser are arranged in sequence.

3. The device heat dissipation cabin according to claim 2, characterized in that, The compartment body is enclosed by a plurality of wall surfaces facing different directions. The compartment body includes a bottom wall and a top wall oppositely arranged along a first direction, and side walls connected between the bottom wall and the top wall and oppositely arranged along a second direction; wherein, the first direction intersects with the second direction; the air inlet is disposed on one of the wall surfaces, and the air outlet is disposed on another wall surface; the wall surfaces include: one or a combination of the bottom wall, the top wall, and the side walls.

4. The device heat dissipation cabin according to claim 1, characterized in that, At least a partial orthographic projection of the condenser on the plane where the air inlet is located covers the air inlet, and a heat dissipation channel communicated with the air inlet is provided on the condenser.

5. The device heat dissipation cabin according to claim 1, characterized in that, At least a partial orthographic projection of the condenser on the plane where the air outlet is located covers the air outlet, and a heat dissipation channel communicated with the air outlet is provided on the condenser.

6. The device heat dissipation cabin according to claim 1, characterized in that, The device heat dissipation compartment further includes a fan; In the case where the condenser and the electronic device are arranged in sequence along the air flow direction, the installation positions of the fan include: at the air inlet, at least partially embedded in the air inlet, between the air inlet and the condenser, between the condenser and the electronic device, between the electronic device and the air outlet, at the air outlet, at least partially embedded in the air outlet, or a combination of these positions; or In the case where the electronic device and the condenser are arranged in sequence along the air flow direction, the installation positions of the fan include: at the air inlet, at least partially embedded in the air inlet, between the air inlet and the electronic device, between the electronic device and the condenser, between the condenser and the air outlet, at the air outlet, at least partially embedded in the air outlet, or a combination of these positions.

7. The device heat dissipation cabin according to any one of claims 1-6, characterized in that The device heat dissipation compartment further includes a first temperature sensor disposed in the compartment body, and a controller connected to the first temperature sensor and the fan group.

8. The equipment heat dissipation cabin according to any one of claims 1-6, characterized in that The device heat dissipation compartment further includes a plurality of flow guiding wind plates arranged at intervals along the first direction; each of the flow guiding wind plates is provided with the electronic device; Alternatively, the device heat dissipation compartment has a unit compartment for accommodating a cooling unit, and the cooling unit is configured to drive a cooling medium to flow through the condenser.

9. The device heat dissipation compartment according to any one of claims 1-6, characterized in that, A return air fan is disposed in the compartment body, and the return air fan is configured to guide the air flow flowing out of the air outlet into the compartment body.

10. A energy storage system, characterized in that, Including: A battery compartment and the device heat dissipation compartment according to any one of claims 1-9, wherein, The battery compartment houses a battery and a radiator for dissipating heat from the battery; The cooling unit is configured to enable heat exchange between the radiator and the condenser.

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