LED lamp bead bonding wire structure and light-emitting equipment

Abstract

The utility model provides an LED lamp bead bonding wire structure and light-emitting equipment. The LED lamp bead bonding wire structure comprises a support cup. The plurality of LED wafers are arranged on the upper surface in the bracket cup in an array form; the two LED brackets are arranged on the upper surface in the bracket cup; the plurality of chips are correspondingly arranged on the plurality of LED wafers; the plurality of chips are mutually connected through the plurality of connecting lines, and two ends of one connecting line are respectively welded on the upper surface of the LED support through the line pasting arc sections and are connected on one chip through the spherical connecting sections. According to the utility model, the line sticking arc section at one end of the connecting line is welded on the surface of the LED bracket, so that the connecting line and the surface of the LED bracket are connected more stably, and the spherical connecting section at one end of the connecting line is connected to the chip, so that the connection between the LED bracket and the chip is more stable, and the pulling force of the connecting line is improved; and the stability of connection between the chips can be improved, so that the cold and hot impact resistance of the product can be further improved.

Description

Technical Field

[0001] The utility model relates to the technical field of LED lamp beads, in particular to a wire bonding structure of an LED lamp bead and a lighting device. Background Art

[0002] The anti-thermal shock performance of an LED lamp bead is one of the indicators for evaluating the reliability performance of the LED lamp bead. During the actual use of the product, due to the influence of high and low temperature environments, thermal expansion and contraction will occur inside the LED product. The stronger the anti-thermal shock performance of the LED product, the smaller the failure probability of the LED product.

[0003] In the prior art, increasing the wire diameter of the wire can improve the anti-thermal shock performance of the product, but it will increase the material cost. Especially for LED lamp bead products using alloy wires with a high gold content, for each increase in the wire diameter, the cost increase ratio will also increase. For some chip products with small-sized PADs, it is not universal. The thicker the wire diameter, the larger the solder ball formed, which is likely to press the PN junction, resulting in chip short circuit. When using silicone with better anti-thermal shock performance, it is often achieved by adjusting the hardness of the glue. However, when the hardness of the silicone is adjusted, the anti-sulfuration performance and other performances of the silicone will be relatively reduced. Summary of the Utility Model

[0004] Based on this, the purpose of the present utility model is to provide a wire bonding structure of an LED lamp bead and a lighting device to at least solve the deficiencies in the above prior art.

[0005] In a first aspect, the present utility model provides a wire bonding structure of an LED lamp bead, including:

[0006] A bracket cup;

[0007] A plurality of LED wafers, arranged on the upper surface inside the bracket cup in an array;

[0008] Two LED brackets, arranged on the upper surface inside the bracket cup;

[0009] A plurality of chips, correspondingly arranged on the plurality of LED wafers;

[0010] A plurality of connecting wires, the plurality of chips are connected to each other through the plurality of connecting wires, and both ends of one of the connecting wires are respectively welded to the upper surface of the LED bracket through a wire-attaching arc segment and connected to one of the chips through a spherical connecting segment;

[0011] Wherein, the wire-attaching arc segment at one end of the connecting wire is used for the pulling force of the connecting wire on the LED bracket, and the spherical connecting segment at the other end of the connecting wire is used to enhance the pulling force of the connecting wire on the chip.

[0012] Compared with the prior art, the beneficial effects of the present utility model are as follows: By welding the wire-attaching arc segment at one end of the connecting wire to the surface of the LED bracket, the connection between the connecting wire and the surface of the LED bracket is made more stable, effectively improving the anti-thermal shock performance of the product. And by connecting the spherical connection segment at one end of the connecting wire to the chip, the connection between the LED bracket and the chip is made more stable, improving the pulling force of the connecting wire and also enhancing the stability of the connection between the chips, thereby further improving the anti-thermal shock performance of the product.

[0013] Further, the connecting wire is an L-shaped arc connecting wire, and several chips are connected by several L-shaped arc connecting wires. One end of one L-shaped arc connecting wire is welded to the upper surface of the LED bracket through the wire-attaching arc segment, and the other end of the L-shaped arc connecting wire is connected to one of the chips through the spherical connection segment.

[0014] Further, the L-shaped arc connecting wire includes a first straight connecting segment and a first vertical segment. One end of the first straight connecting segment is welded to the upper surface of the LED bracket through the wire-attaching arc segment, the other end of the first straight connecting segment is connected to one end of the first vertical segment, and the other end of the first vertical segment is connected to the chip through the spherical connection segment.

[0015] Further, the connecting wire is a J-shaped arc connecting wire, and several chips are connected by several J-shaped arc connecting wires. One end of one J-shaped arc connecting wire is welded to the upper surface of the LED bracket through the wire-attaching arc segment, and the other end of the J-shaped arc connecting wire is connected to one of the chips through the spherical connection segment.

[0016] Further, the J-shaped arc connecting wire includes a second straight connecting segment, a bending segment, and a second vertical segment. One end of the second straight connecting segment is welded to the upper surface of the LED bracket through the wire-attaching arc segment, the other end of the second straight connecting segment is connected to one end of the bending segment, the other end of the bending segment is connected to one end of the second vertical segment, and the other end of the second vertical segment is connected to the chip through the spherical connection segment.

[0017] Further, the angle between the bending segment and the second vertical segment is 120° - 140°.

[0018] Further, the height of the connecting wire is 110μm - 150μm.

[0019] In the second aspect, the present utility model also provides a lighting device, including the LED lamp bead wire bonding structure as described above. Description of the Drawings

[0020] Figure 1Structural schematic diagram of the wire bonding structure of the LED lamp bead in the first embodiment of the present utility model;

[0021] Figure 2 Structural schematic diagram of the connection structure of the connecting wire of the wire bonding structure of the LED lamp bead in the first embodiment of the present utility model;

[0022] Figure 3 Structural schematic diagram of the wire bonding structure of the LED lamp bead in the second embodiment of the present utility model;

[0023] Figure 4 Structural schematic diagram of the connection structure of the connecting wire of the wire bonding structure of the LED lamp bead in the second embodiment of the present utility model.

[0024] Description of main component symbols:

[0025] 10. Bracket cup;

[0026] 20. LED chip;

[0027] 30. LED bracket;

[0028] 40. Chip;

[0029] 50. Connecting wire; 51. L-line arc connecting wire; 511. First straight connecting segment; 512. First vertical segment; 52. J-line arc connecting wire; 521. Second straight connecting segment; 522. Bending segment; 523. Second vertical segment;

[0030] 61. Wire-attaching arc segment; 62. Spherical connecting segment.

[0031] The following specific embodiments will further illustrate the present utility model in conjunction with the above-mentioned drawings. Specific embodiments

[0032] For the convenience of understanding the present utility model, the present utility model will be described more comprehensively below with reference to the relevant drawings. Several embodiments of the present utility model are given in the drawings. However, the present utility model can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the disclosure of the present utility model more thorough and comprehensive.

[0033] It should be noted that when an element is referred to as being "fixed on" another element, it can be directly on the other element or there may also be an intermediate element. When an element is considered to be "connected" to another element, it can be directly connected to the other element or there may be an intermediate element at the same time. The terms "vertical", "horizontal", "left", "right" and similar expressions used herein are for illustrative purposes only.

[0034] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the technical field to which this utility model belongs. The terms used in the description of this utility model herein are for the purpose of describing specific embodiments only and are not intended to limit the utility model. The term "and / or" used herein includes any and all combinations of one or more of the related listed items.

[0035] Embodiment 1

[0036] Please refer to Figures 1 to 2 , which shows the wire bonding structure of the LED lamp bead in the first embodiment of this utility model, including a bracket cup 10, an LED chip 20, an LED bracket 30, a chip 40, and a connecting wire 50.

[0037] There are several groups of the LED chips 20. In this embodiment, there is one group of the LED chips 20, and the LED chips 20 are arranged on the upper surface inside the bracket cup 10. There are two groups of the LED brackets 30, and both groups of the LED brackets 30 are arranged on the upper surface inside the bracket cup 10. There are several groups of the chips 40, and several groups of the chips 40 are correspondingly arranged on several of the LED chips 20. There are several groups of the connecting wires 50, and several of the chips 40 are interconnected through several of the connecting wires 50. And both ends of one of the connecting wires 50 are welded to the upper surface of the LED bracket 30 through a wire bonding arc segment 61 and are connected to one of the chips 40 through a spherical connection segment 62.

[0038] It should be noted that in this embodiment, there are two groups of the chips 40, which are arranged on the upper surface of the chip 20, and the height of the connecting wire 50 is 110 μm. One end of the connecting wire 50 is connected to the LED bracket 30 through the wire bonding arc segment 61, and the other end of the connecting wire 50 is connected to the chip 40 through the spherical connection segment 62, so that the connection between the LED bracket 30 and the chip 40 is more stable, and further the stress of silicone and the like on the wire caused by the cold and heat impact on the lamp bead can be reduced, and the cold impact resistance of the product can be improved.

[0039] Specifically, in this embodiment, the connecting wire 50 is an L-shaped arc connecting wire 51. A plurality of the chips 40 are connected by a plurality of the L-shaped arc connecting wires 51. One end of one of the L-shaped arc connecting wires 51 is welded to the upper surface of the LED bracket 30 through the wire-attaching arc segment 61, and the other end of the L-shaped arc connecting wire 51 is connected to one of the chips 40 through the spherical connecting segment 62. The L-shaped arc connecting wire 51 includes a first straight connecting segment 511 and a first vertical segment 512. One end of the first straight connecting segment 511 is welded to the upper surface of the LED bracket 30 through the wire-attaching arc segment 61. The other end of the first straight connecting segment 511 is connected to one end of the first vertical segment 512, and the other end of the first vertical segment 512 is connected to the chip 40 through the spherical connecting segment 62.

[0040] It can be understood that by increasing the first straight connecting segment 511, the wire-attaching arc segment 61 can be attached to the plane of the LED bracket 30, thereby increasing the pulling force that can be withstood by the cold punching impact when the first straight connecting segment 511 is connected to the surface of the LED bracket 30. It is worth noting that the L-shaped arc connecting wire 51 is commonly used for relatively small chips.

[0041] Embodiment Two

[0042] Please refer to Figures 3 to 4 , which shows the LED lamp bead wire bonding structure in the second embodiment of the present invention. The difference between the LED lamp bead wire bonding structure in this embodiment and the LED lamp bead wire bonding structure in the first embodiment is as follows:

[0043] There are three groups of the LED wafers 20. The height of the connecting wire 50 is 150 μm, and the connecting wire 50 is a J-shaped arc connecting wire 52. A plurality of the chips 40 are connected by a plurality of the J-shaped arc connecting wires 52. One end of one of the J-shaped arc connecting wires 52 is welded to the upper surface of the LED bracket 30 through the wire-attaching arc segment 61, and the other end of the J-shaped arc connecting wire 52 is connected to one of the chips 40 through the spherical connecting segment 62. The J-shaped arc connecting wire 52 includes a second straight connecting segment 521, a bending segment 522, and a second vertical segment 523. One end of the second straight connecting segment 521 is welded to the upper surface of the LED bracket 30 through the wire-attaching arc segment 61. The other end of the second straight connecting segment 521 is connected to one end of the bending segment 522, the other end of the bending segment 522 is connected to one end of the second vertical segment 523, and the other end of the second vertical segment 523 is connected to the chip 40 through the spherical connecting segment 62. The angle between the bending segment 522 and the second vertical segment 523 is 120° - 140°.

[0044] It can be understood that the wire-attaching arc segment 61 at one end of the second straight connecting segment 521 is welded to the upper surface of the LED bracket 30, while the other end of the second straight connecting segment 521 is connected to one end of the bending segment 522, making the connection line 50 more firmly connected to the LED bracket 30. And it is connected to the chip 40 through the spherical connecting segment 62 at the other end of the second vertical segment 523, so that the connection line 50 firmly connects the LED bracket 30 and the chip 40, thereby effectively improving the cold impact resistance of the product.

[0045] It is worth noting that since there is a certain angle between the bending segment 522 and the second vertical segment 523, in this embodiment, the angle between the bending segment 522 and the second vertical segment 523 is 130°, so that the retractable space after the lamp beads are potted is larger than that of other wire arcs, thus avoiding the wire arc stretching caused by the thermal expansion and contraction of the encapsulation glue, and further improving the reliability and lifespan of the LED lamp beads. And the J-wire arc connecting line 52 is usually applied to relatively large chips.

[0046] In addition, the present utility model also proposes a lighting device, including the LED lamp bead wire bonding structure in the above embodiment.

[0047] In summary, for the LED lamp bead wire bonding structure in the above embodiment of the present utility model, the wire-attaching arc segment 61 at one end of the connection line 50 is welded to the surface of the LED bracket 30, so that the connection between the connection line 50 and the surface of the LED bracket 30 is more firm, effectively improving the thermal shock resistance of the product. And by connecting the spherical connecting segment 61 at one end of the connection line 50 to the chip 40, the connection between the LED bracket 30 and the chip 40 is made more firm, improving the pulling force of the connection line, and also enhancing the stability of the connection between the chips 40, thereby further improving the thermal shock resistance of the product.

[0048] In the description of this specification, the descriptions with reference to terms such as "one embodiment", "some embodiments", "example", "specific example", or "some examples" mean that the specific features, structures, materials, or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the present utility model. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described can be combined in a suitable manner in any one or more embodiments or examples.

[0049] The above-described embodiments merely represent several implementation manners of the present utility model. The description thereof is relatively specific and detailed, but it should not be construed as a limitation to the scope of the patent of the present utility model. It should be noted that for those of ordinary skill in the art, without departing from the concept of the present utility model, several modifications and improvements can still be made, and these all fall within the protection scope of the present utility model. Therefore, the protection scope of the patent of the present utility model shall be subject to the appended claims.

Claims

1. An LED lamp bead wire bonding structure, characterized in that, Comprising: Bracket cup; A plurality of LED wafers, arranged on the upper surface inside the bracket cup in an array; Two LED brackets, arranged on the upper surface inside the bracket cup; A plurality of chips, correspondingly arranged on the plurality of LED wafers; A plurality of connecting lines, the plurality of chips are interconnected by the plurality of connecting lines, and both ends of one of the connecting lines are respectively welded to the upper surface of the LED bracket through a wire-attaching arc segment and connected to one of the chips through a spherical connecting segment; Wherein, the wire-attaching arc segment at one end of the connecting line is used for the pulling force of the connecting line on the LED bracket, and the spherical connecting segment at the other end of the connecting line is used for enhancing the pulling force of the connecting line on the chip.

2. The LED lamp bead wire bonding structure according to claim 1, wherein, The connecting line is an L-shaped arc connecting line, and the plurality of chips are connected by the plurality of L-shaped arc connecting lines. One end of one of the L-shaped arc connecting lines is welded to the upper surface of the LED bracket through the wire-attaching arc segment, and the other end of the L-shaped arc connecting line is connected to one of the chips through the spherical connecting segment.

3. The wire bonding structure of the LED lamp bead according to claim 2, wherein, The L-shaped arc connecting line includes a first straight connecting segment and a first vertical segment. One end of the first straight connecting segment is welded to the upper surface of the LED bracket through the wire-attaching arc segment, the other end of the first straight connecting segment is connected to one end of the first vertical segment, and the other end of the first vertical segment is connected to the chip through the spherical connecting segment.

4. The wire bonding structure of the LED lamp bead according to claim 1, characterized in that, The connecting line is a J-shaped arc connecting line, and the plurality of chips are connected by the plurality of J-shaped arc connecting lines. One end of one of the J-shaped arc connecting lines is welded to the upper surface of the LED bracket through the wire-attaching arc segment, and the other end of the J-shaped arc connecting line is connected to one of the chips through the spherical connecting segment.

5. The wire bonding structure of the LED lamp bead according to claim 4, characterized in that, The J-shaped arc connecting line includes a second straight connecting segment, a bent segment and a second vertical segment. One end of the second straight connecting segment is welded to the upper surface of the LED bracket through the wire-attaching arc segment, the other end of the second straight connecting segment is connected to one end of the bent segment, the other end of the bent segment is connected to one end of the second vertical segment, and the other end of the second vertical segment is connected to the chip through the spherical connecting segment.

6. The wire bonding structure of the LED lamp bead according to claim 5, wherein, The angle between the bent segment and the second vertical segment is 120°-140°.

7. The wire bonding structure of the LED lamp bead according to claim 1, wherein The height of the connecting line is 110μm to 150μm.

8. A light-emitting device, characterized in that, Including the LED lamp bead wire bonding structure according to any one of claims 1 to 7.

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