Heat dissipation structure of COB lamp strip

Abstract

The utility model discloses a heat dissipation structure of a COB lamp strip, and particularly relates to the technical field of COB lamp strips, the heat dissipation structure comprises a first flexible substrate and a second flexible substrate, square rings arranged in a linear array are arranged between the first flexible substrate and the second flexible substrate, the top of the first flexible substrate is symmetrically provided with liquid holes communicated with the inner sides of the corresponding square rings, and the liquid holes are communicated with the inner sides of the corresponding square rings. Fluorescent glue adheres to the main lamp sheets which are arranged on the top of the first flexible substrate in a linear array mode, and the fluorescent glue is arranged in the square ring along the liquid holes. According to the heat dissipation structure of the COB lamp strip, the fluorescent glue is in contact with the main lamp sheet, the first flexible substrate and the second flexible substrate, when the main lamp sheet emits light and dissipates heat, heat of the main lamp sheet is transmitted to the fluorescent glue at the moment, then heat of the fluorescent glue is transmitted to the first flexible substrate and the second flexible substrate, and the heat dissipation effect of the COB lamp strip is improved. The first flexible substrate and the second flexible substrate are used for diffusing heat of the fluorescent glue at the same time, so that the diffusion effect is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of COB light strips, and more specifically to a heat dissipation structure of a COB light strip. Background Art

[0002] A COB light strip is an LED light strip manufactured using COB technology, which has the characteristics of high-density packaging, high luminous efficiency, color consistency, and flexible installation, and can thus adapt to various installation environments and requirements.

[0003] According to the patent publication number CN219674002U, publication date: September 12, 2023, a COB light strip and a COB light bar are disclosed. It has the advantages of high single-point power and high luminous efficiency; the packaging process uses COB small chips. Compared with the large chips such as 3030 and 2835 used in traditional light strips, it can avoid the chip damage phenomenon easily caused by repeated bending during use, and improve the anti-bending ability of the light strip. Encapsulation is carried out using a hydrophobic diffusion glue to improve the waterproofness of the light strip. This light strip can be used alone in a naked form or installed in a conventional profile aluminum to be assembled into a rigid light bar, with convenient installation and strong substitutability.

[0004] In the prior art including the above patent, in currently common COB light strips, the lamp chips are mostly located on one side of the flexible substrate. This single-layer flexible substrate structure is simple and easy to produce. However, for the lamp chips on the flexible substrate, the main heat dissipation channels of the lamp chips are through thermal radiation and heat conduction on the flexible substrate, and then through the heat diffusion of the flexible substrate to accelerate the heat dissipation of the lamp chips. However, during the use of the COB light strip, the flexible substrate can absorb limited heat, and most of the heat will accumulate near the lamp chips. Prolonged use will accelerate the aging of the lamp chips, thereby reducing the service life of the COB light strip. Summary of the Utility Model

[0005] The purpose of the utility model is to provide a heat dissipation structure of a COB light strip, which can accelerate the heat diffusion of the lamp chips, thereby improving the service life of the COB light strip.

[0006] To achieve the above purpose, the utility model provides the following technical solution: A heat dissipation structure of a COB light strip includes a first flexible substrate and a second flexible substrate, and a square ring arranged in a linear array is provided between the first flexible substrate and the second flexible substrate. Liquid holes communicating with the inner sides of the corresponding square rings are symmetrically opened at the top of the first flexible substrate. A fluorescent glue is adhered to the main lamp chips arranged in a linear array on the top of the first flexible substrate, and the fluorescent glue is arranged in the square ring along the liquid holes.

[0007] Preferably, conductive copper sheets are symmetrically and fixedly installed at the top of the first flexible substrate, and the fluorescent glue is adhered to the conductive copper sheets.

[0008] Preferably, side holes communicating with the inner sides of the corresponding square rings are symmetrically formed at the top of the first flexible substrate, and the conductive copper sheets are covered on the side holes.

[0009] Preferably, a flow channel is provided between every two of the square rings.

[0010] Preferably, the first flexible substrate and the second flexible substrate are aluminum substrates respectively.

[0011] Preferably, an insulating board is provided between the conductive copper sheet and the first flexible substrate, and a die bonding adhesive is provided between the first flexible substrate and the main lamp chip.

[0012] In the above technical solution, a heat dissipation structure of a COB light strip provided by the present utility model has the following beneficial effects: by using the square rings and the first flexible substrate and the second flexible substrate, when the fluorescent glue is filled into the square rings along the liquid holes, at this time, the fluorescent glue contacts the main lamp chip, the first flexible substrate and the second flexible substrate respectively. When the main lamp chip emits light and dissipates heat, the heat of the main lamp chip is transferred to the fluorescent glue, and then the heat of the fluorescent glue is transferred to the first flexible substrate and the second flexible substrate respectively. Then, the first flexible substrate and the second flexible substrate are used to simultaneously diffuse the heat of the fluorescent glue. At the same time, the fluorescent glue also plays a certain connecting effect on the first flexible substrate and the second flexible substrate. By jointly dissipating heat through the first flexible substrate and the second flexible substrate, the diffusion effect of the fluorescent glue absorbing the heat of the main lamp chip is improved. Description of the Drawings

[0013] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the following will briefly introduce the drawings required to be used in the embodiments. Obviously, the drawings described below are only some embodiments recorded in the present utility model. For those of ordinary skill in the art, other drawings can also be obtained according to these drawings.

[0014] Figure 1 It is a schematic diagram of the overall structure provided by an embodiment of the present utility model;

[0015] Figure 2 It is a schematic diagram of the overall sectional structure provided by an embodiment of the present utility model;

[0016] <� Figure 3 It is a schematic diagram of the sectional structure of the first flexible substrate provided by an embodiment of the present utility model;

[0017] Figure 4 It is provided by an embodiment of the present utility model Figure 2 The enlarged structure schematic diagram at A in the figure.

[0018] Description of the reference numerals:

[0019] 1. First flexible substrate; 2. Conductive copper sheet; 3. Fluorescent glue; 4. Second flexible substrate; 5. Square ring; 6. Main lamp sheet; 11. Liquid hole; 12. Side hole; 21. Insulating plate; 41. Flow channel; 61. Die bonding glue; 62. Bonding wire. Detailed implementation manner

[0020] In order to enable those skilled in the art to better understand the technical solution of the present utility model, the present utility model will be further introduced in detail below in conjunction with the accompanying drawings.

[0021] As shown in Figures 1-4 A heat dissipation structure of a COB lamp strip includes a first flexible substrate 1 and a second flexible substrate 4, and a square ring 5 arranged in a linear array is provided between the first flexible substrate 1 and the second flexible substrate 4. Liquid holes 11 communicating with the inner side of the corresponding square ring 5 are symmetrically opened at the top of the first flexible substrate 1. A fluorescent glue 3 is adhered to the main lamp sheet 6 arranged in a linear array on the top of the first flexible substrate 1, and the fluorescent glue 3 is arranged in the square ring 5 along the liquid holes 11. By using the square ring 5 and the first flexible substrate 1 and the second flexible substrate 4, when the fluorescent glue 3 is filled into the square ring 5 along the liquid holes 11, at this time, the fluorescent glue 3 is in contact with the main lamp sheet 6, the first flexible substrate 1 and the second flexible substrate 4 respectively. When the main lamp sheet 6 emits light and dissipates heat, the heat of the main lamp sheet 6 is transferred to the fluorescent glue 3, and then the heat of the fluorescent glue 3 is transferred to the first flexible substrate 1 and the second flexible substrate 4 respectively. Then, the first flexible substrate 1 and the second flexible substrate 4 are used to simultaneously diffuse the heat of the fluorescent glue 3. At the same time, the fluorescent glue 3 also plays a certain connecting effect on the first flexible substrate 1 and the second flexible substrate 4. Through the common heat dissipation of the first flexible substrate 1 and the second flexible substrate 4, the diffusion effect of the fluorescent glue 3 absorbing the heat of the main lamp sheet 6 is improved.

[0022] Specifically, the square ring 5 is fixedly installed on the first flexible substrate 1 and the second flexible substrate 4.

[0023] As a further technical solution provided by the present utility model, conductive copper sheets 2 are symmetrically and fixedly installed on the top of the first flexible substrate 1, and the fluorescent glue 3 is adhered to the conductive copper sheets 2.

[0024] Specifically, as shown in Figure 2 and Figure 4 One ends of the bonding wires 62 symmetrically and fixedly installed on the main lamp sheet 6 are respectively fixedly installed on the conductive copper sheets 2, and the fluorescent glue 3 is adhered to a part of the conductive copper sheets 2. Therefore, when the main lamp sheet 6 emits light and generates heat, part of the heat absorbed by the fluorescent glue 3 can be transferred to the conductive copper sheets 2, and then the conductive copper sheets 2 are used to further accelerate the heat diffusion of the fluorescent glue 3.

[0025] Furthermore, side holes 12 communicating with the inner sides of the corresponding square rings 5 are symmetrically opened on the top of the first flexible substrate 1 , and the conductive copper sheet 2 is covered on the side holes 12 .

[0026] Specifically, such as Figure 3 and Figure 4 As shown, the conductive copper sheet 2 is covered on the side hole 12, and the fluorescent glue 3 is filled in the side hole 12 and adhered to the conductive copper sheet 2, so that the fluorescent glue 3 is located at the top and bottom of the conductive copper sheet 2, so as to better transfer the heat of the fluorescent glue 3 to the conductive copper sheet 2 for heat diffusion.

[0027] Furthermore, a flow channel 41 is provided between every two square rings 5 .

[0028] Specifically, such as Figure 1 As shown, a flow channel 41 is provided between every two square rings 5 . The flow channel 41 facilitates air circulation to remove heat from the first flexible substrate 1 and the second flexible substrate 4 .

[0029] Furthermore, the first flexible substrate 1 and the second flexible substrate 4 are aluminum substrates respectively.

[0030] Specifically, the aluminum substrate can better absorb the heat from the fluorescent glue 3 through its flexibility and thermal conductivity, thereby indirectly absorbing the heat generated by the main light sheet 6 .

[0031] Furthermore, an insulating plate 21 is provided between the conductive copper sheet 2 and the first flexible substrate 1 , and a die-bonding adhesive 61 is provided between the first flexible substrate 1 and the main light panel 6 .

[0032] Specifically, the insulating plate 21 is used to avoid short circuit between the conductive copper sheet 2 and the first flexible substrate 1 . Meanwhile, the die-bonding adhesive 61 can fix the main light sheet 6 while transferring the heat of the main light sheet 6 to the first flexible substrate 1 .

[0033] Working Principle: By utilizing the square ring 5 and the first and second flexible substrates 1 and 4, when the fluorescent glue 3 is filled into the square ring 5 along the liquid hole 11, the fluorescent glue 3 contacts the main light sheet 6, the first and second flexible substrates 1 and 4, respectively. When the main light sheet 6 emits light and dissipates heat, the heat from the main light sheet 6 is transferred to the fluorescent glue 3, which is then transferred to the first and second flexible substrates 1 and 4, respectively. The first and second flexible substrates 1 and 4 simultaneously diffuse the heat from the fluorescent glue 3. The fluorescent glue 3 also acts as a connection between the first and second flexible substrates 1 and 4, dissipating heat through the first and second flexible substrates 1 and 4, thereby enhancing the diffusion effect of the heat absorbed by the fluorescent glue 3 from the main light sheet 6. The flow channel 41 facilitates air circulation to remove heat from the first and second flexible substrates 1 and 4.

[0034] The above description is merely illustrative of certain exemplary embodiments of the present invention. It goes without saying that those skilled in the art will be able to modify the described embodiments in various ways without departing from the spirit and scope of the present invention. Therefore, the above drawings and description are illustrative in nature and should not be construed as limiting the scope of protection of the claims of the present invention.

Claims

1. A heat dissipation structure for a COB light strip, characterized in that It includes a first flexible substrate (1) and a second flexible substrate (4), and a square ring (5) arranged in a linear array is provided between the first flexible substrate (1) and the second flexible substrate (4). Liquid holes (11) communicating with the inner sides of the corresponding square rings (5) are symmetrically formed at the top of the first flexible substrate (1). A main lamp sheet (6) arranged in a linear array is adhered with a fluorescent glue (3) on the top of the first flexible substrate (1), and the fluorescent glue (3) is arranged in the square ring (5) along the liquid holes (11).

2. The heat dissipation structure of a COB light strip according to claim 1, wherein, Conductive copper sheets (2) are symmetrically and fixedly installed at the top of the first flexible substrate (1), and the fluorescent glue (3) is adhered to the conductive copper sheets (2).

3. The heat dissipation structure of a COB light strip according to claim 2, characterized in that, Side holes (12) communicating with the inner sides of the corresponding square rings (5) are symmetrically formed at the top of the first flexible substrate (1), and the conductive copper sheets (2) cover the side holes (12).

4. The heat dissipation structure of a COB light strip according to claim 1, characterized in that, A flow channel (41) is provided between every two of the square rings (5).

5. The heat dissipation structure of a COB light strip according to claim 1, characterized in that, The first flexible substrate (1) and the second flexible substrate (4) are respectively aluminum substrates.

6. The heat dissipation structure of a COB light strip according to claim 2, characterized in that, An insulating plate (21) is provided between the conductive copper sheets (2) and the first flexible substrate (1), and an epoxy die attach (61) is provided between the first flexible substrate (1) and the main lamp sheet (6).

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