Double-sided wafer scribing machine for chip processing

Abstract

The utility model provides a double-sided wafer scribing machine for chip processing, and belongs to the technical field of chip processing equipment, the double-sided wafer scribing machine comprises a scribing machine body and a cleaning assembly, the cleaning assembly comprises a motor fixedly connected to the upper surface of the scribing machine body through a support, the output end of the motor is fixedly connected with a first rotating shaft, and the output end of the first rotating shaft is fixedly connected with a second rotating shaft. The first rotating shaft is rotationally connected to the inner top face of the scribing machine body through a bearing in a penetrating mode, the bottom end of the first rotating shaft is fixedly connected with blowing fan blades and a dust removal mechanism, and the dust removal mechanism comprises a transmission assembly and a dust removal assembly. By arranging the cleaning assembly, dust and impurities attached to the interior of the machine body can be cleaned without manual work, and by arranging the dust removal mechanism, the dust and the impurities in the machine body are removed through power of the cleaning assembly, so that cleaning operation is more convenient, rapid and efficient.

Description

Technical Field

[0001] The utility model relates to the technical field of chip processing equipment, in particular to a double-sided wafer dicing machine for chip processing. Background Art

[0002] The dicing machine is one of the key equipment used in semiconductor manufacturing. It is mainly used to cut the semiconductor chips on the wafer according to the predetermined dividing lines during the semiconductor manufacturing process. The purpose of cutting is to separate the chips into individual particles along the aligned positions, making them independent chips for subsequent packaging and testing. It is widely used in integrated circuit manufacturing, microelectronics packaging, optical device manufacturing and other fields.

[0003] After searching, the patent document with publication number CN216325857U discloses a double-sided wafer dicing machine for chip processing, including a dicing machine body, a sliding block is arranged in the dicing machine body, the sliding block is slidably arranged in the dicing machine body through a driving member connected to the sliding member, the sliding member is fixed on the side wall of the dicing machine body and can drive the driving member to move horizontally, the driving member is slidably arranged in the dicing machine body and connected to the sliding member, a first motor is arranged on the sliding member, and a fixed block is fixed on the output shaft of the first motor. The utility model can process both sides of the workpiece.

[0004] The above-mentioned prior art often has the following problems when used:

[0005] After the existing double-sided wafer dicing machine for chip processing is put into use, in order to ensure that the dicing machine maintains optimal performance during normal use, we need to regularly maintain and clean the equipment. At the same time, for the quality of subsequent processing, we also need to keep the interior clean. However, these steps are too cumbersome and inefficient to perform manually, so corresponding processing measures are needed. Utility Model Content

[0006] In view of the deficiencies in the prior art, the utility model provides a double-sided wafer dicing machine for chip processing.

[0007] The embodiment of the present invention provides a double-sided wafer dicing machine for chip processing, comprising:

[0008] Dicing machine body;

[0009] A cleaning assembly, the cleaning assembly comprising a motor fixedly connected to the upper surface of the dicing machine body through a bracket, the output end of the motor fixedly connected to a first rotating shaft, the first rotating shaft rotatably connected to the top surface of the dicing machine body through a bearing, and a blower fan blade fixedly connected to the bottom end of the first rotating shaft;

[0010] The dust removal mechanism includes a transmission component and a dust removal component.

[0011] Furthermore, the transmission assembly includes a fixed plate fixedly connected to the side wall of the dicing machine body, a No. 2 rotating shaft is provided on the side of the dicing machine body, the No. 2 rotating shaft is rotatably connected to the bottom surface of the fixed plate through a bearing, the No. 1 rotating shaft is circumferentially fixedly connected to a driving wheel, the No. 2 rotating shaft is circumferentially fixedly connected to a driven wheel, and a belt is wrapped around the driving wheel and the driven wheel.

[0012] Furthermore, the dust removal assembly includes a through groove provided on the side wall of the dicing machine body, a cylinder is slidably connected in the through groove, a No. 3 rotating shaft is provided in the cylinder, the No. 3 rotating shaft is rotatably connected to the side wall of the cylinder through a bearing, the bottom end of the No. 2 rotating shaft is fixedly connected to the No. 1 bevel gear, the circumference of the No. 3 rotating shaft is fixedly connected to the No. 2 bevel gear, the No. 1 bevel gear is meshed with the No. 2 bevel gear, and the No. 3 rotating shaft is fixedly connected to an exhaust fan blade at one end away from the No. 2 rotating shaft.

[0013] Furthermore, a plurality of ventilation holes are equidistantly provided on the upper surface of the dicing machine body, and the plurality of ventilation holes are all arranged around the first rotating shaft.

[0014] Furthermore, a plurality of air outlet holes are equidistantly provided on the side wall of the cylinder, and a filter is provided inside the cylinder.

[0015] Furthermore, the diameter of the driving wheel is larger than the diameter of the driven wheel.

[0016] Compared with the prior art, the present invention has the following beneficial effects:

[0017] The utility model provides a cleaning component, which can clean the dust and impurities attached to the inside of the machine body without manual work. The dust removal mechanism is provided in combination with the cleaning component, and the power of the cleaning component is utilized to remove the internal dust and impurities, making the cleaning operation more convenient and efficient while reducing power output and usage costs. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 It is a schematic diagram of the three-dimensional structure analysis of a double-sided wafer dicing machine for chip processing described in an embodiment of the present utility model.

[0019] Figure 2 This is a schematic diagram of the three-dimensional structure analysis from another perspective of a double-sided wafer dicing machine for chip processing described in an embodiment of the present utility model.

[0020] Figure 3 It is a schematic diagram of the three-dimensional structure of a double-sided wafer dicing machine for chip processing described in an embodiment of the present utility model.

[0021] In the above drawings: 1 dicing machine body, 2 motor, 3 No. 1 rotating shaft, 4 blowing fan blades, 5 fixing plate, 6 No. 2 rotating shaft, 7 driving wheel, 8 driven wheel, 9 cylinder, 10 No. 3 rotating shaft, 11 No. 1 bevel gear, 12 No. 2 bevel gear, 13 exhaust fan blades. DETAILED DESCRIPTION

[0022] The technical solution of the present invention is further described below with reference to the accompanying drawings and embodiments.

[0023] like Figure 1-Figure 3 As shown, the embodiment of the present invention provides a double-sided wafer dicing machine for chip processing, comprising:

[0024] The dicing machine body 1 and the cleaning assembly include a motor 2 fixedly connected to the upper surface of the dicing machine body 1 through a bracket, the output end of the motor 2 is fixedly connected to the No. 1 rotating shaft 3, the No. 1 rotating shaft 3 is rotatably connected to the top surface of the dicing machine body 1 through a bearing, and the bottom end of the No. 1 rotating shaft 3 is fixedly connected to a blowing fan blade 4. A plurality of ventilation holes are equidistantly provided on the upper surface of the dicing machine body 1, and the plurality of ventilation holes are arranged around the No. 1 rotating shaft 3 to ensure the normal operation of the cleaning assembly;

[0025] The dust removal mechanism includes a transmission assembly and a dust removal assembly. The transmission assembly includes a fixed plate 5 fixedly connected to the side wall of the dicing machine body 1. A second rotating shaft 6 is provided on the side of the dicing machine body 1. The second rotating shaft 6 is rotatably connected to the bottom surface of the fixed plate 5 through a bearing. The circumference of the No. 1 rotating shaft 3 is fixedly connected to a driving wheel 7. The circumference of the No. 2 rotating shaft 6 is fixedly connected to a driven wheel 8. A belt is wound between the driving wheel 7 and the driven wheel 8. The dust removal assembly includes a through groove provided on the side wall of the dicing machine body 1. A cylinder 9 is slidably connected in the through groove. A No. 3 rotating shaft 10 is provided in the cylinder 9. The No. 3 rotating shaft 10 is penetrated by a bearing It is rotatably connected to the side wall of the cylinder 9, the bottom end of the No. 2 rotating shaft 6 is fixedly connected to the No. 1 bevel gear 11, the circumference of the No. 3 rotating shaft 10 is fixedly connected to the No. 2 bevel gear 12, the No. 1 bevel gear 11 is meshed with the No. 2 bevel gear 12, and the No. 3 rotating shaft 10 is fixedly connected to the exhaust fan blade 13 at one end away from the No. 2 rotating shaft 6. A plurality of air outlet holes are equidistantly provided on the side wall of the cylinder 9, and a filter is provided in the cylinder 9. The filter is used to filter the extracted air, thereby completing the removal of dust and impurities inside the dicing machine body 1. The diameter of the driving wheel 7 is larger than the diameter of the driven wheel 8, so that there is a larger transmission ratio between the two, thereby improving the dust removal efficiency.

[0026] The detailed working process of this utility model is as follows:

[0027] During use, when the dicing machine body 1 is finished and the interior needs to be cleaned, the motor 2 is started, and the motor 2 drives the first rotating shaft 3 to rotate, thereby driving the blower blades 4 to rotate, generating wind force to clean the interior of the dicing machine body 1;

[0028] When the No. 1 rotating shaft 3 rotates, it drives the driving wheel 7 to rotate, and then drives the driven wheel 8 and the No. 2 rotating shaft 6 to rotate through the transmission of the belt. The rotation of the No. 2 rotating shaft 6 drives the No. 1 bevel gear 11 to rotate, and then drives the No. 2 bevel gear 12 and the No. 3 rotating shaft 10 to rotate through the meshing transmission. The rotation of the No. 3 rotating shaft 10 drives the exhaust fan blades 13 to rotate, extracting the gas inside the dicing machine body 1, and the gas is discharged through the air outlet. The dust and impurities are filtered out by the filter and left behind. In conjunction with the cleaning component, the internal dust and impurities can be processed, making the cleaning operation more convenient and efficient, while also reducing power output and usage costs.

[0029] Finally, it should be noted that the above embodiments are only used to illustrate the technical solution of the utility model and are not limiting. Although the utility model is described in detail with reference to the preferred embodiments, ordinary technicians in this field should understand that the technical solution of the utility model can be modified or replaced by equivalents without departing from the purpose and scope of the technical solution of the utility model, which should be included in the scope of the claims of the utility model.

Claims

1. A double-sided wafer dicing machine for chip processing, characterized in that: include: Slicing machine body (1); A cleaning assembly, the cleaning assembly comprising a motor (2) fixedly connected to the upper surface of the dicing machine body (1) through a bracket, the output end of the motor (2) being fixedly connected to a first rotating shaft (3), the first rotating shaft (3) being rotatably connected to the inner top surface of the dicing machine body (1) through a bearing, and a blowing fan blade (4) being fixedly connected to the bottom end of the first rotating shaft (3); The dust removal mechanism includes a transmission component and a dust removal component.

2. A double-sided wafer dicing machine for chip processing according to claim 1, characterized in that: in: The transmission assembly includes a fixed plate (5) fixedly connected to the side wall of the dicing machine body (1); a second rotating shaft (6) is provided on the side of the dicing machine body (1); the second rotating shaft (6) is rotatably connected to the bottom surface of the fixed plate (5) through a bearing; the first rotating shaft (3) is circumferentially fixedly connected to a driving wheel (7); the second rotating shaft (6) is circumferentially fixedly connected to a driven wheel (8); a belt is wound between the driving wheel (7) and the driven wheel (8).

3. A double-sided wafer dicing machine for chip processing according to claim 2, characterized in that: in: The dust removal assembly includes a through groove provided on the side wall of the dicing machine body (1), a cylinder (9) is slidably connected in the through groove, a third rotating shaft (10) is provided in the cylinder (9), the third rotating shaft (10) is rotatably connected to the side wall of the cylinder (9) through a bearing, the bottom end of the second rotating shaft (6) is fixedly connected to the first bevel gear (11), the circumference of the third rotating shaft (10) is fixedly connected to the second bevel gear (12), the first bevel gear (11) is meshed with the second bevel gear (12), and the end of the third rotating shaft (10) away from the second rotating shaft (6) is fixedly connected to an exhaust fan blade (13).

4. A double-sided wafer dicing machine for chip processing according to claim 1, characterized in that: in: The upper surface of the dicing machine body (1) is provided with a plurality of ventilation holes at equal intervals, and the plurality of ventilation holes are all arranged around the first rotating shaft (3).

5. A double-sided wafer dicing machine for chip processing according to claim 3, characterized in that: in: The side wall of the cylinder (9) is provided with a plurality of air outlet holes at equal intervals, and a filter is provided inside the cylinder (9).

6. A double-sided wafer dicing machine for chip processing according to claim 2, characterized in that: in: The diameter of the driving wheel (7) is larger than the diameter of the driven wheel (8).

Images