Wafer sawing machine
CN309793904SActive Publication Date: 2026-02-13宁波芯丰精密科技有限公司
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Patent Information
- Application Number
- CN202530365864.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Designs(China)
- Current Assignee / Owner
- Filing Date
- 2025-06-24
- Publication Date
- 2026-02-13
- Estimated Expiration
- 2040-06-24
Smart Images
Figure 000007_ABST
Abstract
1. The name of the design product: wafer dicing machine. 2. The use of the design product: used for cutting chips on wafer into independent units. 3. The design points of the design product: in shape. 4. The picture or photo that best shows the design points: perspective view 1.
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