Automatic tool setting and calibrating device of silicon wafer slicing machine
By designing an automatic blade setting and calibration device on the silicon wafer slicing machine that features water spray cooling, air drying, and rapid heat dissipation, the problem of excessive temperature caused by blade friction was solved, thus achieving silicon wafer protection and automation of the slicing process.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-04-23
- Publication Date
- 2026-04-07
AI Technical Summary
Existing silicon wafer slicing machines generate a lot of heat during the slicing process due to blade friction, which can lead to excessively high temperatures and damage to the silicon wafers.
An automatic blade setting and calibration device was designed, including components such as a spray frame, atomizing nozzle, flow pump, exhaust fan, and semiconductor cooling chip. By spraying water to cool down, air drying, and rapid heat dissipation, the device avoids excessive blade temperature and simultaneously achieves automatic blade setting and calibration.
It effectively reduces blade temperature, avoids silicon wafer damage, and improves the automation and accuracy of the slicing process.
Smart Images
Figure CN224089337U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to photovoltaic industry technical field, specifically, relate to a kind of automatic tool setting and calibration device of silicon wafer slicing machine. BACKGROUND
[0002] Silicon wafer is made of high-purity single crystal silicon or polycrystalline silicon as raw material, and it is the core base material of semiconductor devices, integrated circuits and photovoltaic cells. Silicon wafer slicing machine is a key equipment in the semiconductor and photovoltaic industry, mainly used for cutting single crystal silicon rod into thin slices to provide basic materials for subsequent processes.
[0003] However, the existing silicon wafer slicing machine generates a large amount of heat after slicing due to friction of the blade, and high temperature can damage the silicon wafer. Therefore, it is necessary to design an automatic tool setting and calibration device for silicon wafer slicing machine. SUMMARY
[0004] The utility model aims at providing an automatic tool setting and calibration device for silicon wafer slicing machine, which solves the problem of high temperature damage to the silicon wafer caused by friction of the blade during use in related technology.
[0005] The technical solution of the utility model is as follows:
[0006] An automatic tool setting and calibration device for silicon wafer slicing machine includes a base, a support plate is welded to one end of the top of the base, and an electric push rod is screwed to the top of both sides of the support plate. A top plate is provided above the top of the base, and the extension end of the electric push rod is screwed and fixed to the bottom end surface of the top plate. A sliding groove is formed in the bottom end surface of the top plate, and a sliding block is slidably installed in the sliding groove. A cutting frame is screwed to the bottom end surface of the sliding block, and a blade is provided at the bottom of the cutting frame. First supports are screwed to the outer walls of both ends of the sliding block, and a spray frame is screwed to one side of the first support. A plurality of atomizing nozzles are equidistantly provided on the outer wall of the spray frame. A cooling seat is screwed to the top end surface of the top plate, and a water bucket is placed on the top of the cooling seat. A water diversion pump is screwed to the bottom of the water bucket, and a water delivery pipe is inserted into the output end of the water diversion pump. The other end of the water delivery pipe is inserted into one spray frame in communication. An air outlet frame is screwed to the other side of the first support. An air extractor is screwed to the top end surface of the top plate, and a wind delivery pipe is inserted into the output end of the air extractor. The other end of the wind delivery pipe is inserted into one air outlet frame in communication.
[0007] Preferably, a first communication pipe is inserted into the other spray frame, and the other end of the first communication pipe is inserted into the water delivery pipe in communication. A second communication pipe is inserted into the other air outlet frame, and the other end of the second communication pipe is inserted into the wind delivery pipe in communication.
[0008] Preferably, the cooling seat and the water bucket are made of stainless steel material, the inner wall of the cooling seat is glued with a semiconductor refrigeration sheet on the top, and the semiconductor refrigeration sheet is screwed with a heat dissipation frame, the heat dissipation frame is screwed with a heat dissipation fan, and the outer wall of the cooling seat is provided with a heat dissipation opening on both sides.
[0009] Preferably, the first screw rod is arranged in the chute, one end of the first screw rod is inserted into the inner wall of the chute, one end of the top plate is screwed with a stepping motor, the other end of the first screw rod penetrates through the top plate and is fixedly connected with the output end of the stepping motor, and the supporting plate is screwed with a controller.
[0010] Preferably, the first screw rod is arranged in the chute, one end of the first screw rod is inserted into the inner wall of the chute, one end of the top plate is screwed with a stepping motor, the other end of the first screw rod penetrates through the top plate and is fixedly connected with the output end of the stepping motor, and the supporting plate is screwed with a controller.
[0011] Preferably, the first screw rod is arranged in the chute, one end of the first screw rod is inserted into the inner wall of the chute, one end of the top plate is screwed with a stepping motor, the other end of the first screw rod penetrates through the top plate and is fixedly connected with the output end of the stepping motor, and the supporting plate is screwed with a controller.
[0012] Preferably, the first screw rod is arranged in the chute, one end of the first screw rod is inserted into the inner wall of the chute, one end of the top plate is screwed with a stepping motor, the other end of the first screw rod penetrates through the top plate and is fixedly connected with the output end of the stepping motor, and the supporting plate is screwed with a controller.
[0013] Preferably, the first screw rod is arranged in the chute, one end of the first screw rod is inserted into the inner wall of the chute, one end of the top plate is screwed with a stepping motor, the other end of the first screw rod penetrates through the top plate and is fixedly connected with the output end of the stepping motor, and the supporting plate is screwed with a controller.
[0014] The utility model discloses beneficial effect:
[0015] Through the flow guide pump, the water pipe and the first communication pipe, the water in the water bucket can be transported to the spray frame, and sprayed through the atomizing nozzle, so that the blade can be wetted, the air sucked by the air extractor can be sent to the air outlet frame through the air conveying pipe and the second communication pipe and blown out, so that the blade can be dried, the position of the cooling seat can be quickly reduced through the semiconductor refrigeration sheet, and the water temperature in the water bucket can be reduced through the heat conduction of the cooling seat, so that the cooling effect is improved, and the damage of the silicon wafer caused by the too high temperature of the blade is avoided.
[0016] By placing the silicon rod on the base, the second support can be moved inward by driving the electric telescopic rod to retract through the controller, the silicon rod can be located directly below the blade by using the two clamping plates to push and clamp the silicon rod, the automatic tool setting effect can be realized, the spring telescopic rod will retract under pressure, thereby improving the clamping effect, the second limiting plate can be moved in the moving groove by rotating the hand lever to push the second screw, the silicon rod can be clamped and fixed by using the first limiting plate and the second limiting plate, and the silicon rod is prevented from loosening during slicing, the automatic tool setting and position calibration during the slicing process of the silicon rod are realized, and convenience is provided for the slicing work of the silicon wafer. BRIEF DESCRIPTION OF DRAWINGS
[0017] The utility model will be explained in further detail below in combination with the drawings and specific embodiments.
[0018] Figure 1 It is the whole isometric view of the utility model;
[0019] Figure 2 It is the whole bottom structure schematic view of the utility model;
[0020] Figure 3 It is the whole structure schematic view of the utility model;
[0021] Figure 4 It is the whole sectional view of the utility model;
[0022] Figure 5 It is Figure 1 The structure enlarged view of A place.
[0023] In the drawing: 1, base; 2, support plate; 3, electric push rod; 4, top plate; 5, sliding groove; 6, sliding block; 7, cutting frame; 8, blade; 9, first support; 10, spray frame; 11, atomizing nozzle; 12, cooling seat; 13, water bucket; 14, flow guide pump; 15, water delivery pipe; 16, air outlet frame; 17, air extractor; 18, air delivery pipe; 19, first communication pipe; 20, second communication pipe; 21, semiconductor refrigeration sheet; 22, heat dissipation frame; 23, heat dissipation fan; 24, heat dissipation port; 25, first screw; 26, stepping motor; 27, controller; 28, electric telescopic rod; 29, second support; 30, spring telescopic rod; 31, clamping plate; 32, lifting groove; 33, elastic rope; 34, first limiting plate; 35, moving groove; 36, second limiting plate; 37, return spring; 38, second screw; 39, hand lever; 40, drive motor. DETAILED DESCRIPTION
[0024] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments of the present application, all the other embodiments obtained by those skilled in the art without creative labor are within the scope of protection of the present application.
[0025] As Figures 1-5As shown, the embodiment proposes an automatic tool setting and calibration device for a silicon wafer slicing machine, which comprises a base 1, the top end of the base 1 is welded with a support plate 2, and the top of the support plate 2 is screwed with an electric push rod 3 on both sides, the top of the base 1 is provided with a top plate 4, and the telescopic end of the electric push rod 3 is screwed and fixed with the bottom end face of the top plate 4, the bottom end face of the top plate 4 is provided with a sliding groove 5, and the inside of the sliding groove 5 is slidably installed with a sliding block 6, the bottom end face of the sliding block 6 is screwed with a cutting frame 7, and the bottom of the cutting frame 7 is provided with a blade 8, the outer wall of both ends of the sliding block 6 is screwed with a first support 9, and one side of the first support 9 is screwed with a spray frame 10, a plurality of atomizing nozzles 11 are equidistantly provided on the outer wall of the spray frame 10, the top end face of the top plate 4 is screwed with a cooling seat 12, and the top of the cooling seat 12 is placed with a water bucket 13, the bottom of the water bucket 13 is screwed with a flow guide pump 14, and the output end of the flow guide pump 14 is inserted with a water delivery pipe 15, the other end of the water delivery pipe 15 is inserted and communicated with one spray frame 10, the other side of the first support 9 is screwed with an air outlet frame 16, the top end face of the top plate 4 is screwed with an air extractor 17, and the output end of the air extractor 17 is inserted with a wind delivery pipe 18, the other end of the wind delivery pipe 18 is inserted and communicated with one air outlet frame 16, the other spray frame 10 is inserted with a first communication pipe 19, and the other end of the first communication pipe 19 is inserted and communicated with the water delivery pipe 15, the other air outlet frame 16 is inserted with a second communication pipe 20, and the other end of the second communication pipe 20 is inserted and communicated with the wind delivery pipe 18, the water in the water delivery pipe 15 can be simultaneously delivered into the two spray frames 10 by using the first communication pipe 19, the air in the wind delivery pipe 18 can be simultaneously delivered into the two air outlet frames 16 by using the second communication pipe 20, the cooling seat 12 and the water bucket 13 are both made of stainless steel material, the top of the inner wall of the cooling seat 12 is glued with a semiconductor refrigeration piece 21, and the semiconductor refrigeration piece 21 is screwed with a heat dissipation frame 22, the heat dissipation frame 22 is screwed with a heat dissipation fan 23, the outer wall of both sides of the cooling seat 12 is provided with a heat dissipation opening 24, the position of the cooling seat 12 can be quickly reduced by the semiconductor refrigeration piece 21, and the water temperature in the water bucket 13 can be reduced by using the heat conduction of the cooling seat 12, the heat of the semiconductor refrigeration piece 21 can be dissipated by using the heat dissipation frame 22 and the heat dissipation fan 23, the ventilation of the cooling seat 12 can be improved by the heat dissipation opening 24, which is convenient for heat dissipation, the inside of the sliding groove 5 is provided with a first screw rod 25, one end of the first screw rod 25 is inserted with the inner wall of the sliding groove 5, one end of the outer wall of the top plate 4 is screwed with a stepping motor 26, the other end of the first screw rod 25 is inserted through the top plate 4 and fixedly connected with the output end of the stepping motor 26, the support plate 2 is screwed with a controller 27, the sliding block 6 can be moved in the sliding groove 5 by driving the first screw rod 25 by the stepping motor 26, thereby adjusting the position of the blade 8, a pair of electric telescopic rods 28 are screwed on the sliding block 6, the telescopic end of the electric telescopic rod 28 is screwed with a second support 29, the bottom of the second support 29 is screwed with a spring telescopic rod 30, the outside of one side of the second support 29 is provided with a clamping plate 31, the distance between the two clamping plates 31 can be adjusted by the electric telescopic rod 28, when the clamping plate 31 clamps the silicon rod,The spring telescopic rod 30 is contracted under pressure, thereby improving the clamping effect. The outer wall of the clamping plate 31 is provided with a lifting groove 32, and the telescopic end of the spring telescopic rod 30 is slidingly installed in the lifting groove 32. The inner wall top of the lifting groove 32 is screwed with an elastic rope 33, and the other end of the elastic rope 33 is screwed and fixed with the telescopic end of the spring telescopic rod 30. The other end of the top of the base 1 is welded with a first limiting plate 34. The top end surface of the base 1 is provided with a moving groove 35, and the moving groove 35 is slidingly installed with a second limiting plate 36. The inside of the moving groove 35 is screwed with a return spring 37, and the other end of the return spring 37 is screwed and fixed with the bottom of the second limiting plate 36. The second limiting plate 36 is screwed with a second screw rod 38, and one end of the second screw rod 38 is in contact with the outer wall of the second limiting plate 36. The other end of the second screw rod 38 is screwed with a hand lever 39. By shaking the hand lever 39, the second screw rod 38 can drive the second limiting plate 36 to move in the moving groove 35. The first limiting plate 34 and the second limiting plate 36 can clamp and fix the silicon rod, so that the silicon rod does not loosen during slicing. Reverse shaking of the hand lever 39 makes the second screw rod 38 separate from the second limiting plate 36. The tension generated by the return spring 37 makes the second limiting plate 36 reset. The side of the cutting frame 7 is screwed with a driving motor 40, and the output end of the driving motor 40 is screwed and fixed with the blade 8. The driving motor 40 is used to drive the blade 8 to rotate.
[0026] The electric push rod 3, the flow guide pump 14, the air extractor 17, the semiconductor refrigeration sheet 21, the heat dissipation fan 23, the controller 27 and the electric telescopic rod 28 used in the embodiment are all existing mature technologies, so specific description will not be made below. When used, the silicon rod is placed on the base 1, the electric telescopic rod 28 is driven to retract by the controller 27, the second support 29 can be driven to move inward, the silicon rod can be pushed and clamped by the two clamping plates 31 and located directly below the blade 8, the effect of automatic tool setting can be realized, the spring telescopic rod 30 will be retracted under pressure, thereby improving the clamping effect, the second screw rod 38 can drive the second limiting plate 36 to move in the moving groove 35 by shaking the hand lever 39, the silicon rod can be clamped and fixed by the first limiting plate 34 and the second limiting plate 36, so as to avoid loosening of the silicon rod during slicing, the top plate 4 is driven to move downward by the electric push rod 3 driven by the controller 27, and the driving motor 40 is started synchronously, so that the blade 8 can cut the silicon rod to realize the slicing effect. During the downward movement of the top plate 4, the spring telescopic rod 30 can move in the clamping plate 31, the slider 6 can move in the sliding groove 5 by driving the first screw rod 25 by the stepping motor 26, thereby adjusting the position of the blade 8, when the slicing is finished, the water in the water bucket 13 can be sent to the spray frame 10 by the flow guide pump 14, the water delivery pipe 15 and the first communication pipe 19, and sprayed out by the atomizing nozzle 11, so as to wet the blade 8, the air extracted by the air extractor 17 can be sent to the air outlet frame 16 by the air delivery pipe 18 and the second communication pipe 20 and blown out, so as to dry the blade 8, the position of the cooling seat 12 can be quickly lowered by the semiconductor refrigeration sheet 21, and the water temperature in the water bucket 13 can be lowered by heat conduction of the cooling seat 12, thereby improving the cooling effect, the heat of the semiconductor refrigeration sheet 21 can be dissipated by the heat dissipation frame 22 and the heat dissipation fan 23, and the ventilation of the cooling seat 12 can be improved by the heat dissipation port 24, thereby facilitating heat dissipation.
[0027] The above is only a preferred embodiment of the present application, and is not intended to limit the present application. Any modification, equivalent replacement, improvement, etc. made within the spirit and principles of the present application shall be included in the protection scope of the present application.
Claims
1. An automatic tool setting and calibration device for a silicon wafer slicing machine, comprising a base (1), characterized in that, A support plate (2) is welded to one end of the top of the base (1), and electric push rods (3) are screwed to both sides of the top of the support plate (2). A top plate (4) is provided above the top of the base (1), and the telescopic end of the electric push rod (3) is screwed to the bottom end face of the top plate (4). A sliding groove (5) is provided on the bottom end face of the top plate (4), and a slider (6) is slidably installed inside the sliding groove (5). A cutting frame (7) is screwed to the bottom end face of the slider (6), and a blade (8) is provided at the bottom of the cutting frame (7). A first bracket (9) is screwed to the outer walls of both ends of the slider (6), and a spray frame (10) is screwed to one side of the first bracket (9). The outer wall of the spray frame (10) A plurality of atomizing nozzles (11) are provided at equal intervals. A cooling seat (12) is screwed to the top end face of the top plate (4), and a water bucket (13) is placed on the top of the cooling seat (12). A flow pump (14) is screwed to the bottom of the water bucket (13), and a water pipe (15) is inserted into the output end of the flow pump (14). The other end of the water pipe (15) is inserted into a spray frame (10). An air outlet frame (16) is screwed to the other side of the first bracket (9). An exhaust fan (17) is screwed to the top end face of the top plate (4), and an air pipe (18) is inserted into the output end of the exhaust fan (17). The other end of the air pipe (18) is inserted into an air outlet frame (16).
2. The automatic tool setting and calibration device for a silicon wafer slicing machine according to claim 1, characterized in that, Another spray frame (10) is connected to a first connecting pipe (19), and the other end of the first connecting pipe (19) is connected to a water supply pipe (15). Another air outlet frame (16) is connected to a second connecting pipe (20), and the other end of the second connecting pipe (20) is connected to an air supply pipe (18).
3. The automatic tool setting and calibration device for a silicon wafer slicing machine according to claim 1, characterized in that, The cooling base (12) and the water bucket (13) are both made of stainless steel. A semiconductor cooling chip (21) is glued to the top of the inner wall of the cooling base (12), and a heat sink (22) is screwed onto the semiconductor cooling chip (21). A heat sink fan (23) is screwed onto the heat sink (22), and heat dissipation vents (24) are opened on both sides of the outer wall of the cooling base (12).
4. The automatic tool setting and calibration device for a silicon wafer slicing machine according to claim 1, characterized in that, The slide (5) is provided with a first screw (25) inside, and one end of the first screw (25) is inserted into the inner wall of the slide (5). A stepper motor (26) is screwed onto the outer wall of one end of the top plate (4), and the other end of the first screw (25) passes through the top plate (4) and is fixedly connected to the output end of the stepper motor (26). A controller (27) is screwed onto the support plate (2).
5. The automatic tool setting and calibration device for a silicon wafer slicing machine according to claim 1, characterized in that, A pair of electric telescopic rods (28) are screwed onto the slider (6), and a second bracket (29) is screwed onto the telescopic end of the electric telescopic rod (28). A spring telescopic rod (30) is screwed onto one bottom end of the second bracket (29), and a clamping plate (31) is provided on the outside of one side of the second bracket (29).
6. The automatic tool setting and calibration device for a silicon wafer slicing machine according to claim 5, characterized in that, The outer wall of the clamp (31) is provided with a lifting groove (32), and the telescopic end of the spring telescopic rod (30) is slidably installed in the lifting groove (32). An elastic rope (33) is screwed to the top of the inner wall of the lifting groove (32), and the other end of the elastic rope (33) is screwed to the telescopic end of the spring telescopic rod (30).
7. The automatic tool setting and calibration device for a silicon wafer slicing machine according to claim 1, characterized in that, A first limiting plate (34) is welded to the other end of the top of the base (1). A moving groove (35) is opened on the top end face of the base (1), and a second limiting plate (36) is slidably installed on the moving groove (35). A return spring (37) is screwed into the inside of the moving groove (35), and the other end of the return spring (37) is screwed to the bottom of the second limiting plate (36). A second screw (38) is installed on the support plate (2) by thread, and one end of the second screw (38) is in contact with the outer wall of the second limiting plate (36). A hand crank (39) is screwed to the other end of the second screw (38).
8. The automatic tool setting and calibration device for a silicon wafer slicing machine according to claim 1, characterized in that, A drive motor (40) is screwed to one side of the cutting frame (7), and the output end of the drive motor (40) is screwed to the blade (8).