Electrode reduction furnace

Abstract

The utility model provides an electrode reduction furnace which comprises a main body, a bottom frame and a material receiving frame, the bottom frame and the material receiving frame are fixedly connected to the bottom end and one end of the main body respectively, and the electrode reduction furnace is characterized in that a cooling plate structure is fixedly connected to the top end of the main body and comprises an outer mounting frame and a cooling plate, and the cooling plate is mounted in the mounting outer frame in an embedded manner. The effect of conveniently guiding corrosive gas and water vapor which are guided out through a flow guide head is achieved by arranging a triangular upper flow guide table, and meanwhile, the effect of cooling the guided-out corrosive gas and water vapor is achieved by arranging an upper flow guide table of a semiconductor refrigeration plate; the effect of centralized conveying of corrosive gas and water vapor guided out by the flow guide head is achieved through a backflow pipe, and the effect of collecting condensed liquid drops is achieved through a second liquid collection box.

Description

Technical Field

[0001] The utility model relates to the field of electrodes, and more specifically, to an electrode reduction furnace. Background Art

[0002] A component in an electronic or electrical device or equipment that serves as the two terminals for inputting or outputting current in a conductive medium (solid, gas, vacuum, or electrolyte solution). The input terminal is called the anode, or positive electrode, and the output terminal is called the cathode, or negative electrode. In batteries, electrodes generally refer to the locations where redox reactions occur with the electrolyte solution. The production of electrode materials requires a firing furnace. To control the discharge temperature, a cooling zone is installed at the rear end of the furnace. As the material calcines within the furnace, corrosive gases and water vapor are generated. However, the cooling plates in existing furnaces are flat, allowing only a small area of vents to be drawn out, preventing the release of large amounts of corrosive gases and water vapor. This causes the remaining corrosive gases and water vapor to evaporate into subsequent cooling zones and adhere to the inner walls of the cooling plates, corroding multiple plates. This results in a service life of only two to three months, severely impacting the furnace's lifespan. Furthermore, the resulting rust poses a significant risk to product quality.

[0003] Therefore, the utility model proposes an electrode reduction furnace. Utility Model Content

[0004] The utility model aims to solve the technical problems raised by the above-mentioned background technology and provide an electrode reduction furnace, which can effectively discharge a large amount of corrosive gas and water vapor to the outside when in use, so as to prevent a large amount of corrosive gas and water vapor from continuing to evaporate to other subsequent cooling zones and adhering to the inner wall of the cooling plate, causing corrosion to multiple cooling plates.

[0005] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: an electrode reduction furnace, comprising a main body, a base frame and a material receiving rack, the base frame and the material receiving rack are fixedly connected to the bottom end and one end of the main body respectively, the top of the main body is fixedly connected with a cooling plate structure, the cooling plate structure comprises an external mounting frame and a cooling plate, and the cooling plate is embedded and installed inside the external mounting frame.

[0006] A further preferred solution: the cooling plate structure also includes an installation top frame fixedly connected to the top of the installation external frame, and the two inner ends of the installation top frame are respectively embedded with a guide platform installation plate and a return pipe, the inner end of the guide platform installation plate is fixedly connected to the upper guide platform, and the inner end bottom of the return pipe is fixedly connected to the second liquid collecting box.

[0007] A further preferred solution: the cooling plate structure also includes a guide cover and a guide head that are arranged on the outer side of the front of the cooling plate, and the bottom end of the guide cover is fixedly connected to the guide plate and the first liquid collecting box that are arranged in a matching manner.

[0008] A further preferred solution is: the mounting frame is arranged as a whole in a rectangular frame body, the bottom end is arranged in a rectangular open position, the bottom end corner of the mounting frame is arranged in contact with the main body surface, the mounting top frame is superimposed on the top of the mounting frame, and at the same time, an opening is provided on the surface of one end of the mounting top frame corresponding to the return pipe.

[0009] A further preferred solution: the guide cover is arranged in an inverted trapezoidal shape with an open bottom end, and the guide head is composed of a group of spherical heads and conical tube heads, and the whole is arranged in a conical head, wherein the conical tube head is located above the spherical head, and the top end of the conical tube head is inclined inward.

[0010] A further preferred solution is that the guide plate is arranged in a horizontal "L" shape as a whole, and the guide plate is arranged in an inward tilt at the bottom of the guide cover, and the first liquid collecting box is also arranged in a horizontal "L" shape along the bottom end of the guide plate.

[0011] A further preferred solution is that the guide platform mounting plate and the upper guide platform are arranged in a horizontal "Z" shape as a whole, and the upper guide platform is also located at the inner end of the mounting top frame, and is arranged in a triangular shape as a whole. At the same time, a semiconductor refrigeration plate is provided on the inner surface of the upper guide platform.

[0012] A further preferred solution: the return pipe is configured as a triangular flat tube as a whole, the inner end of which is inclined inwardly, and the inner end of the return pipe is connected to the inclined opening at the top of the guide head, and the second liquid collecting box is arranged in a horizontal strip along the inclined position of the inner end of the return pipe.

[0013] Beneficial effects:

[0014] 1. By installing the external frame, the entire cooling plate structure and the main body can be easily installed and fixed, and by installing the top frame, the return pipe can be easily installed and limited.

[0015] 2. The guide cover is used to concentrate the corrosive gas and water vapor, the guide head is used to concentrate and guide the corrosive gas and water vapor, the guide plate is used to guide the corrosive gas and water vapor, and the first liquid collecting box is used to collect the condensed droplets.

[0016] 3. The upper guide platform is set in a triangular shape to facilitate the guidance of the corrosive gas and water vapor discharged through the guide head. At the same time, the upper guide platform of the semiconductor refrigeration plate is set to cool the discharged corrosive gas and water vapor. The reflux pipe is used to centrally transport the corrosive gas and water vapor discharged from the guide head. The second liquid collecting box is used to collect the condensed droplets. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 This is a side view of the overall structure of the utility model;

[0018] Figure 2 This is an exploded view of the cooling plate structure connection of the utility model;

[0019] Figure 3 This is an exploded view of the return pipe connection structure of the utility model.

[0020] Figure 1-3 Middle: 1. Main body; 2. Base frame; 3. Material collection rack; 4. Cooling plate structure; 5. Install external frame; 6. Install top frame; 7. Cooling plate; 8. Guide cover; 9. Guide plate; 10. First liquid collecting box; 11. Guide head; 12. Guide platform mounting plate; 13. Return pipe; 14. Upper guide platform; 15. Second liquid collecting box. DETAILED DESCRIPTION

[0021] The following is a combination of the appended examples of the present invention Figure 1-Figure 3 , clearly and completely describe the technical solutions in the embodiments of the present utility model.

[0022] See also Figure 1-3 In an embodiment of the present invention, an electrode reduction furnace includes a main body 1, a base frame 2 and a material receiving rack 3. The base frame 2 and the material receiving rack 3 are respectively fixedly connected to the bottom end and one end of the main body 1. The top of the main body 1 is fixedly connected with a cooling plate structure 4. The cooling plate structure 4 includes an external mounting frame 5 and a cooling plate 7. The cooling plate 7 is embedded in the interior of the external mounting frame 5.

[0023] In the embodiment of the present utility model, the cooling plate structure 4 also includes a mounting top frame 6 fixedly connected to the top of the mounting outer frame 5, and the two ends of the inner side of the mounting top frame 6 are respectively embedded with a guide platform mounting plate 12 and a return pipe 13. The inner end of the guide platform mounting plate 12 is fixedly connected to the upper guide platform 14, and the inner end bottom of the return pipe 13 is fixedly connected to the second liquid collecting box 15. The cooling plate structure 4 also includes a guide cover 8 and a guide head 11 provided at the outer side of the front of the cooling plate 7. The bottom end of the guide cover 8 is fixedly connected to the The guide plate 9 and the first liquid collecting box 10 are arranged in a matching manner, and the mounting outer frame 5 is arranged as a whole in a rectangular frame, and the bottom end is arranged in a rectangular open position. The bottom end corner position of the mounting outer frame 5 is arranged to fit the surface of the main body 1, and the mounting top frame 6 is superimposed on the top of the mounting outer frame 5. At the same time, an opening is provided on the surface of one end of the mounting top frame 6 corresponding to the return pipe 13. By installing the outer frame 5, the effect of facilitating the installation and fixation of the entire cooling plate structure 4 and the main body 1 is achieved, and by installing the top frame 6, the installation and positioning of the return pipe 13 is facilitated.

[0024] The guide cover 8 is arranged in an inverted trapezoidal shape as a whole, and the bottom end is open. The guide head 11 is composed of a group of spherical heads and conical tube heads, and is arranged in a conical head as a whole, wherein the conical tube head is located above the spherical head, and the top of the conical tube head is tilted inward. The guide plate 9 is arranged in a horizontal "L" shape as a whole, and the guide plate 9 is tilted inward at the bottom of the guide cover 8 as a whole, and the first liquid collecting box 10 is also arranged in a horizontal "L" shape along the bottom end of the guide plate 9. The effect of concentrating corrosive gases and water vapor is achieved through the guide cover 8, and the effect of concentrating and draining out corrosive gases and water vapor is achieved through the guide head 11. The effect of guiding corrosive gases and water vapor is achieved through the guide plate 9, and the effect of collecting condensed droplets is achieved through the first liquid collecting box 10.

[0025] When using this device, the corrosive gas and water vapor are first guided upward through the inclined guide plate 9, concentrated through the guide cover 8, and then discharged through the guide head 11. During this collection process, the corrosive gas and water vapor guided through the guide plate 9 form droplets on its surface, and the droplets are concentrated along the inclined guide plate 9 into the first liquid collecting box 10.

[0026] The guide platform mounting plate 12 and the upper guide platform 14 are arranged in a horizontal "Z" shape as a whole. The upper guide platform 14 is also located at one end of the inner part of the mounting top frame 6 and is arranged in a triangular shape as a whole. At the same time, a semiconductor refrigeration plate is provided on the inner surface of the upper guide platform 14. The return pipe 13 is arranged as a whole in a triangular flat tube, and the inner end is arranged with an inwardly inclined opening, and the inner end of the return pipe 13 is connected to the inclined opening at the top of the guide head 11. The second liquid collecting box 15 is arranged in a horizontal strip shape along the inclined position of the inner end of the return pipe 13. The upper guide platform 14 is arranged in a triangular shape to facilitate the guidance of the corrosive gas and water vapor discharged through the guide head 11. At the same time, the upper guide platform 14 with the semiconductor refrigeration plate is provided to cool the discharged corrosive gas and water vapor, and the return pipe 13 is used to centrally transport the corrosive gas and water vapor discharged from the guide head 11. The second liquid collecting box 15 is used to collect the condensed droplets.

[0027] When using this device, the corrosive gas and water vapor are guided upward through the guide head 11, and then enter the return pipe 13 and are transported outside the furnace. During this process, the triangular upper guide platform 14 guides and cools the corrosive gas and water vapor. When the corrosive gas and water vapor after the cooling treatment enter the return pipe 13, they will form droplets at the opening position of the inner end of the return pipe 13. The droplets are collected by the second liquid collecting box 15. After the above-mentioned cooling treatment, the corrosive gas and water vapor can enter the external supporting purification device for purification.

[0028] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it. Although the present invention has been described in detail with reference to the above embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the above embodiments, or make equivalent replacements for some or all of the technical features therein. These modifications or replacements do not deviate the essence of the corresponding technical solutions from the scope of the technical solutions of the embodiments of the present invention, and they should all be included in the scope of the claims and description of the present invention.

Claims

1. An electrode reduction furnace, comprising a main body (1), a base frame (2) and a material receiving frame (3), wherein the base frame (2) and the material receiving frame (3) are fixedly connected to the bottom end and one end of the main body (1), respectively, and characterized in that: The top end of the main body (1) is fixedly connected to a cooling plate structure (4), the cooling plate structure (4) comprising an external mounting frame (5) and a cooling plate (7), and the cooling plate (7) is embedded and mounted inside the external mounting frame (5).

2. The electrode reduction furnace according to claim 1, characterized in that: The cooling plate structure (4) further comprises a mounting top frame (6) fixedly connected to the top of the mounting outer frame (5); a guide platform mounting plate (12) and a return pipe (13) are respectively embedded at both ends of the interior of the mounting top frame (6); the inner end of the guide platform mounting plate (12) is fixedly connected to the upper guide platform (14); and the inner end bottom of the return pipe (13) is fixedly connected to the second liquid collecting box (15).

3. The electrode reduction furnace according to claim 2, characterized in that: The cooling plate structure (4) further comprises a flow guide cover (8) and a flow guide head (11) arranged in a matching manner and located outside the front face of the cooling plate (7); the bottom end of the flow guide cover (8) is fixedly connected to a matching flow guide plate (9) and a first liquid collecting box (10).

4. The electrode reduction furnace according to claim 2, characterized in that: The mounting outer frame (5) is configured as a rectangular frame body as a whole, and the bottom end is configured as a rectangular open frame. The bottom end corner of the mounting outer frame (5) is configured to fit the surface of the main body (1). The mounting top frame (6) is superimposed on the top of the mounting outer frame (5), and an opening is configured on one end surface of the mounting top frame (6) corresponding to the return pipe (13).

5. The electrode reduction furnace according to claim 3, characterized in that: The deflector cover (8) is configured as an inverted trapezoidal closing configuration with an open bottom end. The deflector head (11) is composed of a group of spherical heads and conical tube heads, and is configured as a conical head configuration as a whole. The conical tube head is located above the spherical head, and the top end of the conical tube head is configured to be inclined inward.

6. The electrode reduction furnace according to claim 3, characterized in that: The guide plate (9) is arranged in a transverse "L" shape as a whole, and the guide plate (9) is arranged in an inwardly inclined manner at the bottom of the guide cover (8), and the first liquid collection box (10) is arranged in a transverse "L" shape along the bottom end of the guide plate (9).

7. The electrode reduction furnace according to claim 2, characterized in that: The guide platform mounting plate (12) and the upper guide platform (14) are arranged in a horizontal "Z" shape as a whole. The upper guide platform (14) is also located at one end inside the installation top frame (6) and is arranged in a triangular shape as a whole. A semiconductor refrigeration plate is arranged on the inner surface of the upper guide platform (14).

8. The electrode reduction furnace according to claim 2, characterized in that: The return pipe (13) is configured as a triangular flat pipe as a whole, with an inner end having an inwardly inclined opening, and the inner end of the return pipe (13) is connected to the inclined opening at the top of the guide head (11), and the second liquid collecting box (15) is arranged in a transverse strip shape along the inclined position of the inner end of the return pipe (13).

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