Infrared thermal imaging equipment

Abstract

The utility model provides infrared thermal imaging equipment. The infrared thermal imaging equipment comprises a main processing unit and a data acquisition unit electrically connected with the main processing unit, the data acquisition unit comprises an infrared module used for acquiring infrared image data and a temperature data set corresponding to the infrared image data; the depth sensor is used for collecting a corresponding depth data set; and the main processing unit corrects the temperature data set through the depth data set, and applies the corrected temperature data set to image data for display. Wherein the infrared thermal imaging equipment adopts a multi-sensor data acquisition unit consisting of an infrared module and a depth sensor, so that data support is provided for correcting a temperature data set by using a depth data set, the data accuracy of a temperature field can be improved, and the application requirement of a temperature measurement scene with a higher temperature measurement precision requirement can be conveniently met.

Description

Technical Field

[0001] The present application relates to the technical field of infrared imaging products, and in particular to an infrared thermal imaging device. Background Art

[0002] Infrared thermal imaging uses photoelectric technology to detect infrared signals in specific wavelengths, which are emitted by objects and converted into images that can be visually discerned by humans. Currently, infrared thermal imaging technology is widely used in infrastructure construction, urban management, industrial production, traffic control, resource exploration, inspection and quarantine, and fire protection and security due to its advantages such as long range, high concealment, strong penetration, all-weather operation, resistance to strong light interference, and ability to identify hidden targets.

[0003] However, currently known infrared thermal imaging devices only calculate the temperature field of all imaging objects in the same image based on a certain target distance. They cannot effectively measure the distance between all imaging objects and the thermal imaging device, nor can they reflect the distance differences of the measured targets in the image due to the three-dimensional characteristics. As a result, the temperature field data in the image is not accurate enough, which limits the application of infrared thermal imaging devices in temperature measurement scenarios in different fields, especially the application needs of temperature measurement scenarios with higher temperature measurement accuracy requirements. Utility Model Content

[0004] In order to solve the existing technical problems, the present application provides an infrared thermal imaging device with higher accuracy of temperature field data in the image and capable of meeting the application requirements of temperature measurement scenarios with higher temperature measurement accuracy requirements.

[0005] The embodiment of the present application provides an infrared thermal imaging device, comprising a main processing unit and a data acquisition unit electrically connected to the main processing unit;

[0006] The data acquisition unit includes:

[0007] an infrared module, configured to collect infrared image data and a temperature data set corresponding to the infrared image data; and

[0008] Depth sensor, used to collect corresponding depth data sets;

[0009] The main processing unit corrects the temperature dataset using the depth dataset and applies the corrected temperature dataset to image data for display; and / or, the main processing unit reconstructs the image data using the depth dataset to obtain three-dimensional image data.

[0010] Optionally, the infrared thermal imaging device also includes a visible light module for collecting corresponding visible light image data.

[0011] Optionally, the infrared thermal imaging device includes a main shell, and the infrared module and the visible light module are integrated into the main shell.

[0012] Optionally, the depth sensor includes a point cloud sensor.

[0013] Optionally, the point cloud sensor is selected from one of the following: a TOF sensor, a laser ranging sensor, and a radar ranging sensor.

[0014] Optionally, the infrared thermal imaging device further includes a display screen provided on the main housing; the display screen is fixedly provided on the main housing; or the display screen is relatively rotatably provided on the main housing.

[0015] Optionally, the infrared thermal imaging device further includes a visible light and depth data acquisition device; the visible light and depth data acquisition device is integrated with the infrared module and includes a visible light detector and the depth sensor.

[0016] Optionally, the visible light and depth data acquisition device is selected from one of the following: a TOF camera, a structured light camera, and a stereo vision camera.

[0017] Optionally, the infrared thermal imaging device further includes a low-light module for collecting corresponding low-light image data.

[0018] Optionally, the infrared module is selected from one of the following: a short-wave infrared module, a medium-wave infrared module, and a long-wave infrared module.

[0019] Optionally, the infrared module is selected from one of the following: a cooling infrared module and a non-cooling infrared module.

[0020] Optionally, the infrared thermal imaging device further includes a mode selection unit electrically connected to the main processing unit; the mode selection unit switches the current display mode according to the mode selection operation; in different display modes, the temperature data set is respectively applied to different image data for display.

[0021] Optionally, the infrared thermal imaging device further includes a communication module; the main processing unit is connected to the terminal device for communication via the communication module, and applies the corrected temperature data set to image data and sends it to the terminal device for display.

[0022] Optionally, the main processing unit is a multi-processor module composed of a central processing unit, an image processor and a digital chip processor.

[0023] Optionally, the infrared thermal imaging device is a handheld infrared device.

[0024] In the above embodiment, the infrared thermal imaging device includes an infrared module and a depth sensor. When collecting infrared image data and a temperature data set corresponding to the infrared image data, the corresponding depth data set is collected through the depth sensor. The depth data set includes the shooting distances of all imaging targets in the image. The temperature data set of the synchronously collected infrared image data is corrected using the depth data set. The temperature differences of target objects at different shooting distances in the infrared image data can be adjusted, thereby improving the accuracy of the temperature data of each target object in the image. In this way, the accuracy of the temperature field data in the image can be improved, which is convenient for meeting the application requirements of temperature measurement scenarios with higher temperature measurement accuracy requirements; the depth data set can also be used to reconstruct the image data to obtain three-dimensional image data, and the temperature value of the imaging target displayed in the three-dimensional image data can make the temperature data display more intuitive. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] Figure 1 Schematic diagram of the structure of the infrared thermal imaging device in the first embodiment.

[0026] Figure 2 Schematic diagram of the structure of the infrared thermal imaging device in the second embodiment.

[0027] Figure 3 Schematic diagram of the structure of the infrared thermal imaging device in the third embodiment.

[0028] Figure 4 Schematic diagram of the structure of the infrared thermal imaging device in the fourth embodiment.

[0029] Figure 5 Schematic diagram of the structure of the infrared thermal imaging device in the fifth embodiment.

[0030] Figure 6 Schematic diagram of the structure of the infrared thermal imaging device in the sixth embodiment.

[0031] Component Symbol Description:

[0032] Main processing unit 10, central processing unit 11, digital chip processor 12, data acquisition unit 20, infrared module 21, infrared detector 210, infrared objective lens 213, image processor 215, visible light module 22, visible light detector 220, depth camera 221, visible light objective lens 223, depth sensor 23, low-light module 24, main shell 31, main body 32, display screen 33. DETAILED DESCRIPTION

[0033] The technical solution of the present invention is further described in detail below with reference to the accompanying drawings and specific embodiments.

[0034] In order to make the purpose, technical solutions and advantages of this application clearer, the application will be further described in detail below with reference to the accompanying drawings. The described embodiments should not be regarded as limiting this application. All other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of this application.

[0035] In the following description, the expression "some embodiments" is involved, which describes a subset of all possible embodiments. It should be noted that "some embodiments" may be the same subset or different subsets of all possible embodiments, and may be combined with each other without conflict.

[0036] It should also be noted that when an element is referred to as being "fixed to" another element, it may be directly on the other element or there may be an intermediate element. When an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be an intermediate element at the same time. The terms "vertical", "horizontal", "inner", "outer", "left", "right" and similar expressions used herein are only for illustrative purposes in conjunction with the embodiments of the accompanying drawings and do not represent the only implementation methods.

[0037] See also Figure 1 , an infrared thermal imaging device according to one embodiment, includes a main processing unit 10 and a data acquisition unit 20 electrically connected to the main processing unit 10. The data acquisition unit 20 includes an infrared module 21 and a depth sensor 23. The infrared module 21 is used to acquire infrared image data and a temperature dataset corresponding to the infrared image data; the depth sensor 23 is used to acquire a corresponding depth dataset. The main processing unit 10 corrects the temperature dataset using the depth dataset and applies the corrected temperature dataset to the image data for display.

[0038] Infrared thermal imaging equipment includes various devices that utilize infrared radiation detection technology to convert an object's temperature distribution image into a visual image through signal processing and photoelectric conversion. These include handheld infrared thermal imagers, mobile phone thermal imagers, thermal imaging cameras, red thermal imaging temperature measurement cameras, dual-spectrum thermal imaging cameras, temperature measurement cameras, and explosion-proof infrared thermal imaging thermometers, which are widely used in various fields such as power temperature measurement, floor heating leak detection, fault detection, security monitoring, and fire prevention. In the embodiments of this application, infrared thermal imaging equipment primarily refers to handheld infrared devices used for industrial inspection.

[0039] Among them, the depth data includes the shooting distance of all imaging targets in the image. The main processing unit 10 uses the depth data set to correct the temperature data set. It can be compensated by determining the linear proportion according to the shooting distance of different imaging targets by measuring the temperature difference caused by the known distance difference; or those skilled in the art can use the known data compensation method to correct the temperature data set under the guidance of the technical concept of this application. That is, the present invention aims to provide an infrared thermal imaging device with a multi-sensor data acquisition unit 20 that can synchronously acquire infrared image data and its corresponding temperature data set, and the corresponding depth data set, so as to provide data support for optimizing the correction algorithm that can subsequently use the depth data set to correct the temperature data set. However, the purpose of the present invention is not to improve the correction algorithm itself.

[0040] Optionally, the main processing unit 10 further includes reconstructing the image data using the depth data set to obtain three-dimensional image data. By performing three-dimensional reconstruction using the depth data set, temperature data can be applied to the three-dimensional image data for display, thereby achieving more intuitive temperature display and temperature measurement. It should be noted that the process of performing three-dimensional reconstruction of the image data using the depth data to obtain three-dimensional image data can be implemented using known algorithms, and this application does not impose any restrictions on this.

[0041] Optionally, the main processing unit 10 may respectively use the depth data set to correct the temperature data set and perform three-dimensional reconstruction on the image data, and apply the corrected temperature data set to the three-dimensional image data obtained by the three-dimensional reconstruction for display.

[0042] In the above embodiment, the infrared thermal imaging device includes an infrared module 21 and a depth sensor 23. When the infrared image data and the temperature data set corresponding to the infrared image data are collected by the infrared module 21, the corresponding depth data set is collected by the depth sensor 23. The depth data includes the shooting distance of all imaging targets in the image. The depth data set is used to correct the temperature data corresponding to each imaging target in the synchronously collected infrared image data. The temperature difference of the target object caused by the shooting distance difference in the infrared image data can be compensated, thereby improving the accuracy of the temperature data of each target object in the image. In this way, the accuracy of the temperature field data in the image can be improved, which is convenient for meeting the application requirements of temperature measurement scenarios with higher temperature measurement accuracy requirements.

[0043] See also Figure 2The infrared thermal imaging device includes a visible light module 22 for collecting corresponding visible light image data. In this embodiment, the depth dataset and visible light image data can be collected synchronously or asynchronously. While the infrared thermal imaging device collects infrared image data and corresponding temperature datasets and visible light image data through the infrared module 21 and the visible light module 22, the depth sensor 23 collects the depth dataset corresponding to the visible light image data. This provides more application forms for the subsequent application of the corrected temperature dataset to image data for display.

[0044] See also Figure 3 In some embodiments, an infrared thermal imaging device includes a main housing 31, with an infrared module 21 and a visible light module 22 integrally disposed within the main housing 31. The infrared module 21 can be a known accessory module adapted for various imaging devices for capturing infrared images, and the visible light module 22 can be a known accessory module adapted for various imaging devices for capturing visible light images. The infrared module 21 and the visible light module 22 serve as the primary components of the data acquisition unit 20 in the infrared thermal imaging device. Selecting known standard accessory modules helps improve the maintainability and reliability of the infrared thermal imaging device. In one optional specific example, the infrared module 21 includes an infrared objective lens 213 disposed in front of the main housing 31, an infrared detector 210 disposed behind the infrared objective lens 213, and an image processor 215 electrically connected to the infrared detector 210. The visible light module 22 includes a visible light objective lens 223 disposed in front of the main housing 31 and a visible light detector 220 disposed behind the visible light objective lens 223. The image processor 215 and the visible light detector 220 are usually electrically connected to the processor in the main processing unit 10. The processor processes the electrical signal converted by the visible light detector 220 to form a corresponding image, and fuses the visible light image and the infrared image according to the requirements of image display.

[0045] Optionally, the depth sensor 23 can be selected from an independent product dedicated to measuring the distance information of an object. Among them, the depth sensor mainly includes a point cloud sensor, which refers to a sensor that measures a set of point data on the appearance surface of the imaging target, and can be divided into a heat dissipation type point cloud sensor and an array type point cloud sensor. Currently, the mainstream point cloud sensors include TOF (Time-of-Flight) sensors, laser ranging sensors, and radar ranging sensors. In this embodiment, the infrared thermal imaging device can be equipped with known modular accessories, such as the depth sensor 23, the infrared module 21, and the visible light module 22, which are integrated and arranged in the main shell 31 to form the main body of the infrared thermal imaging device, which can simplify the design and assembly of the infrared thermal imaging device.

[0046] Optionally, the infrared thermal imaging device further includes a display screen 33 disposed on the main housing 31; the display screen 33 may be fixedly disposed on the main housing 31; or the display screen 33 may be rotatably disposed on the main housing 31. The infrared thermal imaging device includes the display screen 33, which allows the temperature field, after temperature data correction, to be directly applied to the currently captured image data for display. The display screen 33 may be configured to flip relative to the main housing 31, allowing the user to adjust the angle of the display screen 33 as needed for real-time viewing during image capture.

[0047] See also Figure 4 In some embodiments, the infrared thermal imaging device includes a visible light and depth data acquisition device; the visible light and depth data acquisition device is integrated with the infrared module 21 and primarily includes a visible light detector 220 and the depth sensor 23. The infrared module 21 may include a body 32 and an infrared imaging assembly disposed within the body 32. In one optional embodiment, the infrared imaging assembly includes an infrared objective lens 213 disposed in front of the body 32, an infrared detector 210 disposed behind the infrared objective lens 213, and an image processor 215 electrically connected to the infrared detector 210. The visible light and depth data acquisition device is integrated with the infrared module 21. It should be noted that the visible light image data and the depth data set corresponding to the visible light image data can be acquired using known modular products. Here, the visible light and depth data acquisition device refers to a known modular product capable of simultaneously acquiring depth data corresponding to each imaging target within the imaging field of view while acquiring visible light image data, such as a depth camera 221 capable of measuring the shooting distance of objects in the imaging scene. In this embodiment, the infrared thermal imaging device can be formed by combining the currently known infrared products with only a single infrared image data acquisition function with known modular products, such as visible light and depth data acquisition devices, to form the main body of the infrared thermal imaging device with temperature data correction according to the embodiment of the present application, thereby simplifying the design and assembly of the infrared thermal imaging device. The visible light and depth data acquisition device includes a display screen 33, and the main processing unit 10 applies the corrected temperature data set to the image data for display on the display screen 33. The infrared thermal imaging device can be a display screen 33 that multiplexes the visible light and depth data acquisition devices. For currently known infrared products that only have a single infrared image data acquisition function and do not have a display screen 33, they can be upgraded by selecting a depth camera 221 that includes a display screen 33 to obtain the infrared thermal imaging device with temperature data correction according to the embodiment of the present application.

[0048] In some embodiments, the visible light and depth data acquisition device is selected from one of the following: a TOF camera, a structured light camera, and a stereo vision camera. A TOF (Time of Flight) camera uses the time-of-flight method to acquire depth data, calculating the distance to an object by measuring the time of flight of light. The camera emits processed light, measures the time it takes for the light to reflect back from an object, and calculates the distance using the known speed of light and the wavelength of the modulated light. A structured light camera uses structured light to acquire depth data, using an invisible laser of a specific wavelength as a light source to project a beam of coded information onto an object. An algorithm calculates the distortion of the returned coded pattern to obtain the object's position and depth information. A binocular stereo vision camera uses stereo vision to acquire depth data, using the principle of parallax to acquire two images of the object from different positions using an imaging device. Three-dimensional information about the object is obtained by calculating the positional deviation between corresponding points in the images. As a known modular product, the visible light and depth data acquisition device facilitates upgrading existing infrared products that only have single-infrared image data acquisition capabilities.

[0049] See also Figure 5 In some embodiments, the infrared thermal imaging device further includes a low-light module 24 for collecting corresponding low-light image data. Low-light refers to a general term for faint light such as moonlight, starlight, and atmospheric glow that exists at night. When the infrared thermal imaging device collects infrared image data and a corresponding temperature dataset via the infrared module 21, the low-light module 24 collects the corresponding low-light image data, and the depth sensor 23 collects the corresponding depth dataset. This provides more application options for the subsequent application of the corrected temperature dataset to image data for display.

[0050] Optionally, the infrared module 21 can be selected from one of the following: a short-wave infrared module, a medium-wave infrared module, and a long-wave infrared module. Short-wave, medium-wave, and long-wave refer to a band range in the infrared spectrum, respectively. Infrared products of different band ranges can adapt to the characteristics of different application fields. The short-wave infrared band is characterized by a short wavelength, such as between 1.4 microns and 3 microns, and the corresponding energy is higher, and is commonly used in fields such as medicine. The medium-wave infrared band usually refers to 3 microns to 8 microns, and is commonly used in fields such as astronomy and military. The long-wave infrared band usually refers to 8 microns to 14 microns, and is commonly used in product fields such as night vision equipment, thermal imagers, and security monitoring systems. In this embodiment, the infrared module 21 in the infrared thermal imaging device can select various known infrared imaging modules of any band, which can be used to correct the temperature field in the infrared image using the synchronously collected depth data set to improve the accuracy of the temperature data of each imaging target in the image.

[0051] Optionally, the infrared module 21 is selected from one of the following: a cooled infrared module and a non-cooled infrared module. Among them, the cooled infrared module refers to a module that requires a low-temperature refrigeration device to reduce the temperature of the imaging detector so that it can operate at an extremely low temperature, thereby improving sensitivity, accuracy and detection temperature range. The non-cooled infrared module does not require a low-temperature refrigeration device, and its power consumption is higher than that of the cooled infrared module, and its lifespan is longer. Usually, medium-wave infrared modules and long-wave infrared modules will choose a cooled infrared detector that includes a low-temperature refrigeration device. In this embodiment, the infrared module 21 in the infrared thermal imaging device can select various known cooled infrared imaging modules or non-cooled infrared imaging modules, all of which can be used to correct the temperature field in the infrared image using the synchronously acquired depth data set to improve the accuracy of the temperature data of each imaging target in the image.

[0052] In some embodiments, the infrared thermal imaging device further includes a mode selection unit electrically connected to the main processing unit 10; the mode selection unit switches the current display mode according to the mode selection operation; in different display modes, the temperature data set is applied to different image data for display. The different image data can be one of the following: separate infrared image data, separate visible light image data, separate low-light image data, fused image data of infrared image data and visible light image data, fused image data of infrared image data and low-light image data, and fused image data of visible light image data, infrared image data, and low-light image data. Correspondingly, the display module includes an infrared mode for applying the corrected temperature data set to infrared image data for display, a visible light mode for applying the corrected temperature data set to visible light image data for display, a low-light mode for applying the corrected temperature data set to low-light image data for display, a fusion mode for applying the corrected temperature data set to dual-light fusion image data fused with infrared image data and visible light image data for display, and the like. The mode selection unit can be a control panel provided on the outside of the infrared thermal imaging device, and the control panel provides one or more buttons for the user to select the current display mode; it is understandable that the mode selection unit can be various known forms that can be operated by the user to switch the display mode, and this application does not limit this. In an embodiment of the present application, the infrared thermal imaging device uses the synchronous acquisition of depth data to correct the temperature data that the infrared imaging relies on while collecting image data. The corrected temperature data can more accurately correspond to the temperature value at each temperature measurement point of each imaging target in the image. The temperature value can be applied only to the visible light image for display (i.e., visible light mode), only to the infrared image for display (i.e., infrared mode), only to the low-light image for display (i.e., low-light mode), or to the dual-light fusion image fused by the visible light image and the infrared image (i.e., fusion mode). It should be noted that the fusion mode can be further divided into multiple modes to correspond to the fusion of different combinations of visible light images, infrared images, and low-light images. The user can select the current display mode of the infrared thermal imaging device according to the needs of the actual application.

[0053] In some embodiments, the infrared thermal imaging device further includes a communication module; the main processing unit 10 communicates with a terminal device via the communication module, applies the corrected temperature data set to the image data, and transmits the corrected temperature data set to the terminal device for display. In this embodiment, the infrared thermal imaging device can establish a communication connection with a terminal device, such as a mobile phone terminal, and transmit the real-time collected image data and temperature data set to the terminal device for display, allowing the user to view the data directly on the mobile phone in real time.

[0054] In some embodiments, see Figure 6The main processing unit 10 is a multi-processor module composed of a central processing unit 11, an image processor 215, and a digital chip processor 12. The main processing unit 10 uses a high-performance multi-processor module composed of the central processing unit 11, the image processor 215, and the digital chip processor 12. It can provide computing hardware resources to support the infrared thermal imaging device's processing of real-time acquired image data and correction of temperature data, thereby improving computing efficiency.

[0055] The above are only specific embodiments of the present application, but the scope of protection of the present application is not limited thereto. Any changes or substitutions that can be easily conceived by a person skilled in the art within the technical scope disclosed in this application should be included in the scope of protection of the present application. Therefore, the scope of protection of the present application should be based on the scope of protection of the claims.

Claims

1. An infrared thermal imaging device, characterized in that: It includes a main processing unit and a data acquisition unit electrically connected to the main processing unit; The data acquisition unit includes: an infrared module, configured to collect infrared image data and a temperature data set corresponding to the infrared image data; and Depth sensor, used to collect corresponding depth data sets; The main processing unit corrects the temperature dataset using the depth dataset and applies the corrected temperature dataset to image data for display; and / or, the main processing unit reconstructs the image data using the depth dataset to obtain three-dimensional image data.

2. The infrared thermal imaging device according to claim 1, characterized in that: It also includes a visible light module for collecting corresponding visible light image data.

3. The infrared thermal imaging device according to claim 2, characterized in that: The infrared thermal imaging device comprises a main shell, and the infrared module and the visible light module are integratedly arranged in the main shell.

4. The infrared thermal imaging device according to claim 3, characterized in that: The depth sensor includes a point cloud sensor.

5. The infrared thermal imaging device according to claim 4, characterized in that: The point cloud sensor is selected from one of the following: a TOF sensor, a laser ranging sensor, and a radar ranging sensor.

6. The infrared thermal imaging device according to claim 3, characterized in that: Also includes a display screen provided on the main housing; The display screen is fixedly mounted on the main housing; or, the display screen is relatively rotatably mounted on the main housing.

7. The infrared thermal imaging device according to claim 1, characterized in that: The infrared thermal imaging device also includes visible light and depth data acquisition equipment; The visible light and depth data acquisition device is integrated with the infrared module and includes a visible light detector and the depth sensor.

8. The infrared thermal imaging device according to claim 7, characterized in that: The visible light and depth data acquisition device is selected from one of the following: a TOF camera, a structured light camera, and a stereo vision camera.

9. The infrared thermal imaging device according to claim 1, characterized in that: It also includes a low-light module for collecting corresponding low-light image data.

10. The infrared thermal imaging device according to any one of claims 1 to 9, characterized in that: The infrared module is selected from one of the following: Short-wave infrared module, medium-wave infrared module, and long-wave infrared module.

11. The infrared thermal imaging device according to any one of claims 1 to 9, characterized in that: The infrared module is selected from one of the following: a cooling infrared module and a non-cooling infrared module.

12. The infrared thermal imaging device according to claim 1, characterized in that: The infrared thermal imaging device further includes a mode selection unit electrically connected to the main processing unit; The mode selection unit switches the current display mode according to the mode selection operation; in different display modes, the temperature data set is respectively applied to different image data for display.

13. The infrared thermal imaging device according to claim 1, characterized in that: The infrared thermal imaging device also includes a communication module; The main processing unit is connected to the terminal device for communication via the communication module, and applies the corrected temperature data set to image data and sends it to the terminal device for display.

14. The infrared thermal imaging device according to claim 1, characterized in that: The main processing unit is a multi-processor module composed of a central processing unit, an image processor and a digital chip processor.

15. The infrared thermal imaging device according to claim 1, characterized in that: The infrared thermal imaging device is a handheld infrared device.

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