4D millimeter wave radar and vehicle

Abstract

The utility model provides a 4D millimeter wave radar and a vehicle. The 4D millimeter wave radar comprises an antenna housing, a rear shell, a radio frequency substrate assembly, a shielding heat conduction plate and a signal processing substrate assembly. The antenna cover covers the rear shell, the antenna cover and the rear shell jointly form a containing space, the radio frequency substrate assembly, the shielding heat conduction plate and the signal processing substrate assembly are sequentially arranged in the containing space, and the radio frequency substrate assembly is arranged at one end close to the antenna cover. The signal processing substrate assembly comprises a first substrate and a heat conduction layer wrapping the edge of the first substrate, at least one part of the heat conduction layer makes contact with the rear shell, and at least the other part of the heat conduction layer makes contact with the shielding heat conduction plate. According to the 4D millimeter wave radar and the vehicle, the heat dissipation function of the whole radar can be enhanced, and the performance and the working stability of the whole radar can be improved.

Description

Technical Field

[0001] The present application relates to the technical field of radar equipment, and in particular to a 4D millimeter-wave radar and a vehicle. Background Art

[0002] Autonomous driving and driverless technologies are emerging in the automotive industry. Their core is accurate perception and rapid response to complex environments. Meeting this technological goal requires the integration of multiple sensor technologies to achieve high-precision, all-weather environmental perception. Among numerous sensors, 4D millimeter-wave radar, with its unique technological advantages, has become a key component of autonomous driving perception.

[0003] 4D millimeter-wave radar is a new radar system based on millimeter-wave technology. It transmits and receives millimeter-wave electromagnetic waves to measure four-dimensional information about a target, including distance, speed, horizontal angle, and vertical angle, generating high-density 4D point cloud data. Compared to traditional radar, 4D millimeter-wave radar offers higher resolution, a wider field of view, and a longer detection range, enabling more precise characterization of the target's shape, position, and motion.

[0004] In the process of realizing this application, the inventors found that most of the 4D millimeter-wave radars in the existing technology have the problem of poor heat dissipation. 4D millimeter-wave radars have greater heat generation than traditional radars. If the heat dissipation performance of the 4D millimeter-wave radar is poor, it will have a certain impact on its measurement speed and accuracy. Summary of the Invention

[0005] Based on this, the present application provides a 4D millimeter-wave radar and a vehicle to improve the problem of poor heat dissipation performance in the prior art.

[0006] To achieve the above objectives, the technical solution of the embodiment of the present application is implemented as follows:

[0007] On the one hand, an embodiment of the present application provides a 4D millimeter-wave radar, comprising a radome, a rear shell, a radio frequency substrate assembly, a shielding and heat-conducting plate, and a signal processing substrate assembly; the radome is disposed on the rear shell and together with the rear shell forms a receiving space; the radio frequency substrate assembly, the shielding and heat-conducting plate, and the signal processing substrate assembly are sequentially disposed within the receiving space, with the radio frequency substrate assembly disposed at one end near the radome;

[0008] The signal processing substrate assembly includes a first substrate and a heat-conducting layer covering an edge of the first substrate. At least a portion of the heat-conducting layer contacts the rear shell, and at least another portion contacts the shielding heat-conducting plate.

[0009] In one embodiment, the edges of the first substrate are completely covered with the heat-conducting layer, and a protruding pressure strip structure is provided at the corresponding positions of the shielding heat-conducting plate and the heat-conducting layer, and the pressure strip structure is used to directly contact the heat-conducting layer.

[0010] In one embodiment, the heat-conducting layer is made of a heat-conducting material.

[0011] In one embodiment, a region of the first substrate enclosed within the heat-conducting layer is provided with a plurality of copper-plated holes, and two ends of the copper layer within the copper-plated holes are in contact with the heat-conducting layer respectively.

[0012] In one embodiment, the RF substrate assembly includes a second substrate and a RF chip disposed on the second substrate; first bosses are respectively provided at corresponding positions of the shielding heat conducting plate and the RF chip, and a first heat conducting portion is provided between the first boss and the RF chip.

[0013] In one embodiment, a shielding cover is provided on the radio frequency chip, and an avoidance groove is provided on the inner wall of the antenna cover, and the avoidance groove is used to partially accommodate the shielding cover.

[0014] In one embodiment, mounting slots are respectively provided at opposite ends of the outer surface of the rear shell, and the mounting slots are used to fix the 4D millimeter-wave radar at the location to be installed; and a plurality of inwardly recessed heat dissipation slots are provided at the bottom of the mounting slots, and the heat dissipation slots are used to increase the heat dissipation area.

[0015] In one embodiment, a signal processing chip is further provided on the first substrate, a second boss corresponding to the position of the signal processing chip is provided in the rear shell, and a second heat conducting portion is provided between the second boss and the signal processing chip.

[0016] In one embodiment, a first annular groove is provided inwardly concave at one end of the side wall of the antenna cover close to the rear shell, and the first annular groove is formed by a first protruding portion on the inner side and a second protruding portion on the outer side;

[0017] A second annular groove is provided on the side wall of the rear shell at one end close to the antenna cover, and the second annular groove is formed by the third protrusion on the inner side and the fourth protrusion on the outer side;

[0018] The second annular groove is arranged corresponding to the first protrusion, and the fourth protrusion is arranged corresponding to the first annular groove, and after the fourth protrusion is inserted into the first annular groove, it is sealed with the first annular groove by a sealant; a plurality of wedge-shaped blocks are arranged at intervals on the inner side wall of the first protrusion, and the wedge-shaped blocks are used to be inserted into the second annular groove and force the first protrusion to abut against the fourth protrusion to close the gap between the first protrusion and the fourth protrusion.

[0019] On the other hand, an embodiment of the present application provides a vehicle, comprising a vehicle body and the 4D millimeter-wave radar as described above, wherein the 4D millimeter-wave radar is installed on the vehicle body.

[0020] The present application has at least the following beneficial effects: The 4D millimeter-wave radar provided in the embodiment of the present application has a heat-conducting layer coated on the first substrate of the signal processing substrate assembly. The heat-conducting layer is in contact with the rear shell and the shielding heat-conducting plate respectively, so that the heat of the shielding heat-conducting plate can be transferred to the rear shell through the heat-conducting layer, thereby dissipating heat through the rear shell. The shielding heat-conducting plate can export the heat inside the 4D millimeter-wave radar, thereby effectively improving the heat dissipation performance of the 4D millimeter-wave radar and helping to improve the overall performance of the 4D millimeter-wave radar. The vehicle provided in the embodiment of the present application includes the above-mentioned 4D millimeter-wave radar, and therefore also has the above-mentioned beneficial effects. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 This is a schematic diagram of the overall structure of the radome side of the 4D millimeter-wave radar according to an embodiment of the present application.

[0022] Figure 2 This is a schematic diagram of the overall structure of the rear shell side of the 4D millimeter-wave radar according to an embodiment of the present application.

[0023] Figure 3 This is a schematic diagram of the decomposed structure of the 4D millimeter-wave radar from one perspective of an embodiment of the present application.

[0024] Figure 4 This is a schematic diagram of the decomposition structure of the 4D millimeter-wave radar from another perspective of an embodiment of the present application.

[0025] Figure 5 This is a schematic diagram of the exploded structure of the signal processing substrate assembly according to an embodiment of the present application.

[0026] Figure 6 This is a partial cross-sectional structural schematic diagram of a signal processing substrate assembly according to an embodiment of the present application.

[0027] Figure 7 This is a schematic cross-sectional structural diagram of a 4D millimeter-wave radar according to an embodiment of the present application.

[0028] Figure 8This is a schematic structural diagram of the antenna cover according to an embodiment of the present application.

[0029] Figure 9 Schematic diagram of the internal structure of the rear shell of an embodiment of the present application.

[0030] Figure 10 for Figure 7 An enlarged schematic diagram of the structure at point A (the figure does not show the state in which the first protrusion is pushed and deformed by the wedge-shaped portion).

[0031] Figure 11 Schematic diagram of the external structure of the rear shell of an embodiment of the present application.

[0032] The meanings of the reference numerals in the accompanying drawings are as follows:

[0033] 1. Radome; 11. Step; 12. Avoidance groove; 13. Front cover; 14. Front cover side wall; 141. First protrusion; 142. First annular groove; 143. Second protrusion; 144. Wedge-shaped block; 1441. Main body; 1442. Wedge-shaped portion;

[0034] 2. Rear housing; 21. Mounting slot; 211. Heat dissipation slot; 22. Horizontal heat dissipation fins; 23. Vertical heat dissipation fins; 24. Fan mounting hole; 25. Second boss; 26. Second heat conduction portion; 27. Rear cover; 271. Process slot; 28. Rear cover sidewall; 281. Third protrusion; 282. Second annular groove; 283. Fourth protrusion; 29. Fixing hole; 210. Connection hole;

[0035] 3. RF substrate assembly; 31. Shielding cover; 32. Second substrate; 33. RF chip; 34. Plug;

[0036] 4. Shielding heat conducting plate; 41. First boss; 42. Via hole; 43. Layering structure; 44. First heat conducting portion;

[0037] 5. Signal processing substrate assembly; 51. Thermal conductive layer; 52. First substrate; 53. Inter-board connector socket; 54. Substrate hole; 55. Signal processing chip; 56. Copper plate hole; 561. Copper layer;

[0038] 6. Sealant;

[0039] 7. External connector; 71. Pin pin;

[0040] 8. Connectors. DETAILED DESCRIPTION

[0041] The technical solution of this application is further elaborated in detail below with reference to the accompanying drawings and specific embodiments.

[0042] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by those skilled in the art to which this application pertains. The terms used herein in the specification of this application are intended only to describe specific embodiments and are not intended to limit the implementation of this application. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.

[0043] In the description of this application, it should be understood that the terms "center," "up," "down," "front," "back," "left," "right," "vertical," "horizontal," "top," "bottom," "inside," "outside," and the like, indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings and are intended only to facilitate the description of this application and simplify the description. They do not indicate or imply that the devices or elements referred to must have a specific orientation, be constructed, or operate in a specific orientation. Therefore, they should not be construed as limiting this application. In the description of this application, unless otherwise specified, "plurality" means two or more.

[0044] In the description of this application, it should be noted that, unless otherwise expressly specified or limited, the terms "mounted," "connected," and "connected" should be understood broadly. For example, they can refer to fixed connections, detachable connections, or integral connections; they can refer to direct connections, indirect connections through an intermediate medium, or internal communication between two components. Those skilled in the art will understand the specific meanings of the above terms in this application based on the specific circumstances.

[0045] The 4D millimeter-wave radar in the embodiment of the present application measures four-dimensional information such as the distance, speed, horizontal angle and vertical angle of the target by transmitting and receiving millimeter-wave electromagnetic waves, forming high-density 4D point cloud data, which can assist vehicles such as cars to achieve autonomous driving.

[0046] Specifically, if Figures 1 to 3 As shown, the 4D millimeter-wave radar includes an antenna cover 1, a rear shell 2, a radio frequency substrate assembly 3, a shielding heat conducting plate 4 and a signal processing substrate assembly 5; the antenna cover 1 is covered on the rear shell 2 and forms a receiving space together with the rear shell 2, and the radio frequency substrate assembly 3, the shielding heat conducting plate 4 and the signal processing substrate assembly 5 are arranged in the receiving space in sequence, and the radio frequency substrate assembly 3 is arranged at one end close to the antenna cover 1.

[0047] like Figure 4 As shown, the signal processing substrate assembly 5 includes a first substrate 52 and a heat conducting layer 51 wrapped around the edge of the first substrate 52. At least a portion of the heat conducting layer 51 contacts the rear housing 2, and at least another portion contacts the shielding heat conducting plate 4. Specifically, as shown Figure 5As shown, in this embodiment, the edges of the first substrate 52 are all covered with a heat-conducting layer 51, that is, the cross-section of the heat-conducting layer 51 is C-shaped, and it covers a full circle along the edge of the first substrate 52. Of course, in other embodiments, multiple segmented heat-conducting layers 51 can be provided as needed, that is, the heat-conducting layer 51 equivalent to a full circle is spaced and segmented in the middle. The heat-conducting layer 51 is made of a heat-conducting material, such as a layer of copper, or other high-thermal-conductivity material layer that is easy to combine with the first substrate 52. The two ends of the heat-conducting layer 51 are respectively located on the side of the first substrate 52 close to the rear shell 2 and the side close to the shielding heat-conducting plate 4, and the middle part connects the two ends so that the heat at one end can be conducted to the other end, so as to facilitate heat conduction. As shown Figure 6 As shown, in order to further enhance the heat conduction capability of the signal processing substrate, a number of copper-plated holes 56 can be provided on the first substrate 52. Specifically, they can be provided in the area where the first substrate 52 is covered by the heat-conducting layer 51. The two ends of the copper layer 561 in the copper-plated hole 56 can respectively contact the two ends of the heat-conducting layer 51 (the copper-plated hole 56 is opened along the thickness direction of the first substrate 52 and passes through the first substrate 52) to further enhance the heat conduction capability and help dissipate heat. An inter-board connector socket 53 is also welded on the first substrate 52 for transmitting power and signals to the RF substrate assembly 3. The first substrate 52 is fixed on the rear shell 2, and one end of the heat-conducting layer 51 is in direct contact with the rear shell 2, and the other end is in direct contact with the shielding heat-conducting plate 4, so that the heat on the shielding heat-conducting plate 4 can be conducted to the rear shell 2, so that it can be dissipated from the rear shell 2. As shown Figure 4 As shown, a signal processing chip 55 and other heat-generating components are also provided on the first substrate 52 . The signal processing chip 55 may be, for example, an FPGA chip.

[0048] Specifically, if Figure 3As shown, the RF substrate assembly 3 of this embodiment includes a second substrate 32, and a RF chip 33 and an antenna (not shown) respectively arranged on the second substrate 32. The antenna is used to receive and transmit radar signals. The specific number of antennas can be set according to specific needs, and all antennas are connected to the RF chip 33. This embodiment specifically provides four RF chips 33, three of which are arranged in the same row, and the other is arranged in a separate row. The RF chip 33 will generate heat and electromagnetic waves when working, so the RF chip 33 needs to be heat-dissipated, and at the same time, it needs to be electromagnetically shielded. Specifically, a shielding cover 31 can be provided on the RF chip 33 to shield the electromagnetic waves. The material selected for the shielding cover 31 can be, for example, aluminum alloy or nickel silver, which can be formed by a sheet metal stamping die, which is suitable for mass production and cost reduction. After the aluminum alloy material is formed by a mold, it can be subjected to a surface gold plating process so that the shielding cover 31 can be welded to the second substrate 32. There are two shielding covers 31 in this embodiment, one large cover is set on the three RF chips 33 in the same row, and the other small cover is set on the RF chip 33 in a separate row. The second substrate 32 can be detachably fixed to the rear shell 2 by screws or other connecting parts. The corresponding welding area and solder mask area need to be reserved on the second substrate 32 around the RF chip 33. The shielding cover 31 is sintered and fixed to the second substrate 32 by soldering or other methods. Figure 4 As shown, a plug 34 is welded at a position corresponding to the second substrate 32 and the inter-board connector socket 53 for plugging into the inter-board connector socket 53 .

[0049] like Figure 3 and Figure 4As shown, a shielded heat conducting plate 4 is provided between the RF substrate assembly 3 and the signal processing substrate assembly 5. The shielded heat conducting plate 4 can be made of a metal material that is conducive to heat conduction. For example, it can be stamped from an aluminum plate. By stamping the aluminum plate with a mold, the dimensional accuracy of the shielded heat conducting plate 4 product can be guaranteed while reducing the cost of product processing. The shielded heat conducting plate 4 can isolate the signal processing substrate assembly 5 and the RF substrate assembly 3, play the role of electromagnetic shielding, and avoid mutual interference between the two. A first boss 41 is provided at the corresponding position of the shielded heat conducting plate 4 and the heating elements such as the RF chip 33. A first heat conducting part 44 is provided between the first boss 41 and the RF chip 33. The first heat conducting part 44 can be, for example, thermal grease, a thermal gasket, or a thermal gel. The first boss 41 is in close contact with the heating elements on the second substrate 32 through the first heat conducting part 44, which can effectively reduce thermal resistance. Since the second substrate 32 is fixed to the housing on all sides and is suspended in the middle, the second substrate 32 may be a PCB, for example. However, the thermal conductivity of a printed circuit board is generally low, which is not conducive to heat conduction and dissipation. By providing the first boss 41 and the first heat conducting portion 44, the heating element on the second substrate 32 is in close contact with the shielded heat conducting plate 4. The shielded heat conducting plate 4 is used for heat conduction, which clears the heat conduction path of the heating element on the second substrate 32, ensures the normal operation of the element, and extends its service life. Figure 4 and Figure 7 As shown, the shielding heat conducting plate 4 and the heat conducting layer 51 are provided with a protruding pressure strip structure 43 at the corresponding position. The pressure strip structure 43 is used to directly contact the heat conducting layer 51, and the pressure strip structure 43 is detachably connected to the first substrate 52 by screws and other connecting parts. The pressure strip structure 43 can ensure that the shielding heat conducting plate 4 and the heat conducting layer 51 are tightly attached, so that heat can be more easily transferred to the rear shell 2 through the heat conducting layer 51 for heat dissipation. Figure 3 、 Figure 4 and Figure 7 As shown, through holes 42 are provided at corresponding positions of the heat-shielding plate 4 and the inter-board connector socket 53 , and the plug 34 passes through the through holes 42 and is plugged into the inter-board connector socket 53 to achieve power and signal transmission.

[0050] like Figure 4 and Figure 8 As shown, the radome 1 is generally made of a material that has good high-frequency millimeter wave transmittance, is low-priced, and is easy to mold, such as PBT (polybutylene terephthalate). The inner surface of the radome 1 is provided with avoidance grooves 12 at the positions corresponding to the shielding cover 31. The avoidance grooves 12 are formed by the inner surface of the radome 1 being recessed inward. The avoidance grooves 12 can partially accommodate the shielding cover 31. This design can reduce the size of the entire radar in the thickness direction, which can ensure that the shielding cover 31 can be installed while ensuring that the distance between the antenna and the radome 1 meets the transmission requirements of electromagnetic waves. Figure 8As shown, the antenna cover 1 of this embodiment is a rectangular cover structure, including a front cover 13 and a front cover side wall 14 arranged around the edge of the front cover 13. The front cover side wall 14 has a first inwardly recessed annular groove 142 at one end near the rear shell 2. The first annular groove 142 is formed by an inner first protrusion 141 and an outer second protrusion 143 (i.e., the first annular groove 142 is sandwiched between the two protrusions). A plurality of wedge-shaped blocks 144 are provided on the inner side wall of the first protrusion 141. For example, one wedge-shaped block 144 can be provided on each of the four inner side walls of the first protrusion 141 of the front cover side wall 14, for a total of four wedge-shaped blocks 144. Preferably, three wedge-shaped blocks 144 can be provided on each inner side wall of the first protrusion 141 in each direction, with the three wedge-shaped blocks 144 located at both ends and the middle of the inner side wall. Alternatively, more wedge-shaped blocks 144 may be provided on the inner sidewall of the first protrusion 141 in each direction, and the specific number is not limited. Figure 3 and Figure 7 As shown, a step 11 is provided at the connection between the front cover 13 and the front cover side wall 14 of the antenna cover 1, that is, the outer wall surface of the end where the front cover side wall 14 is connected to the front cover 13 is concave relative to the outer wall surface of the front cover 13. The purpose of this design is to ensure that the overall wall thickness of the antenna cover 1 is similar, so as to facilitate the molding of the antenna cover 1 by the mold.

[0051] like Figure 9 As shown, the rear housing 2 of this embodiment has a box-like structure with a rectangular cross-section. To facilitate heat dissipation, the rear housing 2 can be made of a metal material, such as a die-cast aluminum alloy. The rear housing 2 includes a rear cover 27 and a rear cover sidewall 28 surrounding the edge of the rear cover 27. The rear cover sidewall 28 has an inwardly recessed second annular groove 282 at one end near the radome 1. The second annular groove 282 is formed by an inner third protrusion 281 and an outer fourth protrusion 283.

[0052] The height of the front cover side wall 14 is smaller than that of the rear cover side wall 28. The second annular groove 282 is provided corresponding to the first protrusion 141, and the fourth protrusion 283 is provided corresponding to the first annular groove 142. Figure 7 and Figure 10 As shown, when the antenna cover 1 and the back shell 2 are assembled, the wedge-shaped block 144 and the first protrusion 141 are used to insert into the second annular groove 282, and the third protrusion 281 is used to insert into the first annular groove 142. An air cavity is left between the end of the third protrusion 281 and the bottom of the first annular groove 142, and a sealant 6 is installed in the air cavity. The sealant 6 is used to seal and fix the antenna cover 1 and the back shell 2.

[0053] Specifically, if Figure 8As shown, the wedge-shaped block 144 includes a main body 1441 and a wedge-shaped portion 1442. The wedge-shaped portion 1442 is located at one end near the rear housing 2. The inclined surface of the wedge-shaped portion 1442 is located near the third protrusion 281, which is used to avoid the third protrusion 281 when entering the second annular groove 282, thereby facilitating the entry of the wedge-shaped block 144 into the second annular groove 282. The main body 1441 is used to squeeze the first protrusion 141 when inserted into the second annular groove 282, thereby forcing the first protrusion 141 to abut against the fourth protrusion 283, thereby closing the gap between the first protrusion 141 and the fourth protrusion 283. The closed gap here refers to the abutment of at least the entire circumference of the lower portion of the first protrusion 141 with the fourth protrusion 283, forming a circumferential seal to prevent the sealant 6 from entering the second annular groove 282.

[0054] Sealant 6 is pre-applied to the air cavity. Once the radome 1 and rear housing 2 are assembled and attached, the sealant 6 is trapped within the air cavity. After drying in the shade, the sealant adheres to the radome 1 and rear housing 2, sealing them. When the wedge-shaped block 144 is inserted into the second annular groove 282, it compresses the first protrusion 141, causing it to deform outward and contact the fourth protrusion 283, preventing the sealant 6 from flowing into the device.

[0055] like Figure 9 As shown, a circle of process grooves 271 are provided along the circumferential direction on the inner side of the third protrusion 281 of the rear shell 2. The process grooves 271 are reserved during the die-casting of the rear shell 2. The process grooves 271 are provided to ensure balanced heat dissipation of each part of the aluminum alloy die-casting during the molding process. Figure 3 and Figure 9 As shown, the inner wall of the rear cover 27 of the rear shell 2 is provided with a second boss 25 at the position corresponding to the position of the signal processing chip 55, and a second heat conducting part 26 is provided between the second boss 25 and the signal processing chip 55. The second heat conducting part 26 can be, for example, thermal grease, thermal pad or thermal gel. Figure 1 and Figure 11 As shown, mounting slots 21 are respectively provided at the opposite ends of the outer surface of the rear shell 2, and the mounting slots 21 are used to fix the 4D millimeter-wave radar to the place to be installed. The bottom of the mounting slot 21 is provided with a plurality of inwardly recessed heat dissipation slots 211, and the heat dissipation slots 211 are used to increase the heat dissipation area. In this embodiment, the mounting slots 21 are provided at both ends of the length direction of the rear shell 2. In certain installation environments, the entire 4D millimeter-wave radar can be installed by simply inserting the entire machine into the user's installation piece through the mounting slots 21 on both sides, which is very convenient. A connecting hole 210 is also provided on the outer wall of the rear shell 2 away from the antenna cover 1. The connecting hole 210 is used to install a connector 8. The connector 8 is also used to fix the 4D millimeter-wave radar to the place to be installed. According to the actual situation of the place to be installed, you can choose to use the connector 8 or the mounting slot 21 to install the 4D millimeter-wave radar. The connector 8 can be, for example, a stud or a bolt. As Figure 2 As shown, several heat dissipation fins are also provided on the outer wall of the rear housing 2 to increase the heat dissipation area. The heat dissipation fins include transverse heat dissipation fins 22 and longitudinal heat dissipation fins 23. The transverse heat dissipation fins 22 extend along the width of the rear housing 2, with the root of each fin at both ends of the lengthwise direction flush with the outer edge of the rear housing 2. The longitudinal ends of each fin, away from the radome 1, are tapered inward and smoothly rounded. The longitudinal heat dissipation fins 23 are provided near both ends of the lengthwise direction of the rear housing 2. The longitudinal heat dissipation fins 23 extend along the lengthwise direction of the rear housing 2, with rounded tips. The rounded or inward tapered, smooth transition of the heat dissipation fins not only improves the appearance but also reduces wear on the heat dissipation fins. Longitudinal heat dissipation fins 23 are also provided at both ends of the transverse heat dissipation fins 22, further increasing the heat dissipation area of the rear housing 2. Fan mounting holes 24 are also provided on the outer wall of the rear housing 2 to facilitate quick installation of a heat dissipation fan, such as during equipment testing.

[0056] like Figure 3 and Figure 9 As shown, the rear cover 27 of the rear housing 2 also has a fixing hole 29 for mounting the external connector 7. To ensure the overall sealing and waterproof performance of the device, a sealing ring can be installed between the external connector 7 and the rear housing 2. The external connector 7 is located on the side of the rear housing 2 away from the antenna cover 1 and is fixed to the outer wall of the rear housing 2 using screws and other fasteners. During installation, the external connector 7 is first fixed to the rear housing 2. The pins 71 of the external connector 7 are then inserted through the substrate holes 54 provided in the first substrate 52 and soldered to the first substrate 52 for power and signal transmission.

[0057] The assembly steps of the 4D millimeter wave radar product of this application are as follows:

[0058] Product assembly is divided into electronic device assembly and structural component assembly. First, the RF substrate assembly 3 and the signal processing substrate assembly are assembled. The RF substrate assembly 3 requires the RF chip 33, plug 34, and other components to be assembled on the second substrate 32. The shielding cover 31 and other resistor components on the board are then soldered on. Similarly, the signal processing substrate requires the FPGA chip and other heat-generating components, the inter-board connector 53, and other resistor components to be soldered on the first substrate 52.

[0059] Next is the assembly of the structural parts: first, prepare the back shell 2, and paste the second heat conducting part 26 on the second boss 25 inside the back shell 2 according to the size. Then place the signal processing substrate inside the back shell 2, pass the external connector 7 from the back of the shell, and pass its pin 71 through the substrate hole 54, tighten it with fasteners such as screws, and then fix the signal processing substrate with a clamp to weld the pin 71 of the external connector 7. After welding the pin 71, take out the clamp, put in the shielded heat conducting plate 4, tighten the shielded heat conducting plate 4 with fasteners such as screws, and then paste the first heat conducting part 44 on the first boss 41 of the shielded heat conducting plate 4. Then install the RF substrate assembly 3, first align the inter-board connector socket 53 and the plug 34, then press the inter-board connector socket 53 and the plug 34, and tighten them with fasteners such as screws. Finally, install the radome 1. Take the sealant 6 and evenly apply it to the bottom of the first annular groove 142 between the first protrusion 141 and the second protrusion 143. Then, snap it onto the rear housing 2 and wait for the sealant 6 to solidify. If the device malfunctions or requires repair or disassembly, use a heat gun to evenly heat the sealant 6. Once the sealant 6 softens, remove the radome 1 to access internal components.

[0060] An embodiment of the present application also provides a vehicle, comprising a vehicle body and the above-mentioned 4D millimeter-wave radar, wherein the 4D millimeter-wave radar is installed on the vehicle body.

[0061] The 4D millimeter-wave radar provided in the embodiment of the present application has a simple and reasonable overall structure, is easy to install and disassemble, and is conducive to heat dissipation and miniaturization of the radar. The avoidance groove is provided inside the radome, which is also conducive to reducing the weight of the entire machine. The installation method between the radome and the rear shell is ingenious and convenient, and improves the waterproof performance of the entire radar. It can effectively prevent external water from entering the interior of the radar, thereby protecting the internal electronic components and preventing problems such as short circuits and rust. The 4D millimeter-wave radar in the embodiment of the present application can improve the heat dissipation performance of the entire machine in many aspects through reasonable structural design, which is conducive to improving the performance and working stability of the radar.

[0062] It should be noted that, in this document, the terms "comprises," "includes," or any other variations thereof are intended to encompass non-exclusive inclusion, such that a process, method, article, or apparatus comprising a series of elements includes not only those elements but also other elements not explicitly listed, or elements inherent to such process, method, article, or apparatus. In the absence of further limitations, an element defined by the phrase "comprising a ..." does not exclude the presence of other identical elements in the process, method, article, or apparatus comprising the element.

[0063] The above description is merely a specific embodiment of the present application, but the scope of protection of the present application is not limited thereto. Any modifications or substitutions that can be easily conceived by a person skilled in the art within the technical scope disclosed in the present application should be included in the scope of protection of the present application. Therefore, the scope of protection of the present application should be based on the scope of protection of the claims.

Claims

1. A 4D millimeter wave radar, characterized in that: The invention comprises an antenna cover (1), a rear shell (2), a radio frequency substrate assembly (3), a shielding heat conducting plate (4) and a signal processing substrate assembly (5); the antenna cover (1) is arranged on the rear shell (2) and forms a receiving space together with the rear shell (2); the radio frequency substrate assembly (3), the shielding heat conducting plate (4) and the signal processing substrate assembly (5) are arranged in sequence in the receiving space, and the radio frequency substrate assembly (3) is arranged at one end close to the antenna cover (1); The signal processing substrate assembly (5) comprises a first substrate (52) and a heat-conducting layer (51) wrapped around the edge of the first substrate (52); at least a portion of the heat-conducting layer (51) contacts the rear shell (2), and at least another portion contacts the shielding heat-conducting plate (4).

2. The 4D millimeter wave radar according to claim 1, wherein The edges of the first substrate (52) are completely covered with the heat-conducting layer (51), and a protruding layer structure (43) is provided at the corresponding position of the shielding heat-conducting plate (4) and the heat-conducting layer (51), and the layer structure (43) is used to directly contact the heat-conducting layer (51).

3. The 4D millimeter wave radar according to claim 1, wherein: The heat-conducting layer (51) is made of a heat-conducting material.

4. The 4D millimeter wave radar according to claim 1, wherein A plurality of copper sinking holes (56) are provided in the area where the first substrate (52) is enclosed in the heat conducting layer (51), and both ends of the copper layer (561) in the copper sinking holes (56) are in contact with the heat conducting layer (51) respectively.

5. The 4D millimeter wave radar according to claim 1, wherein: The radio frequency substrate assembly (3) comprises a second substrate (32) and a radio frequency chip (33) arranged on the second substrate (32); the shielding heat conducting plate (4) and the radio frequency chip (33) are respectively provided with first bosses (41) at corresponding positions, and a first heat conducting portion (44) is provided between the first bosses (41) and the radio frequency chip (33).

6. The 4D millimeter wave radar according to claim 5, characterized in that A shielding cover (31) is provided on the radio frequency chip (33), and an avoidance groove (12) is provided on the inner wall of the antenna cover (1), and the avoidance groove (12) is used to partially accommodate the shielding cover (31).

7. The 4D millimeter wave radar according to claim 1, wherein: Mounting slots (21) are respectively provided at opposite ends of the outer surface of the rear shell (2), and the mounting slots (21) are used to fix the 4D millimeter wave radar at a location to be installed; and a plurality of inwardly recessed heat dissipation slots (211) are provided at the bottom of the mounting slots (21), and the heat dissipation slots (211) are used to increase the heat dissipation area.

8. The 4D millimeter wave radar according to claim 2, wherein: A signal processing chip (55) is also provided on the first substrate (52), a second boss (25) corresponding to the position of the signal processing chip (55) is provided in the rear shell (2), and a second heat conducting portion (26) is provided between the second boss (25) and the signal processing chip (55).

9. The 4D millimeter wave radar according to claim 1, wherein: A first annular groove (142) is provided on the side wall of the antenna cover (1) at one end close to the rear shell (2), and the first annular groove (142) is formed by a first protruding portion (141) on the inner side and a second protruding portion (143) on the outer side. A second annular groove (282) is provided on one end of the side wall of the rear shell (2) close to the antenna cover (1) and is recessed inwards, and the second annular groove (282) is formed by an inner third protrusion (281) and an outer fourth protrusion (283); The second annular groove (282) is arranged corresponding to the first protrusion (141), and the fourth protrusion (283) is arranged corresponding to the first annular groove (142). After the fourth protrusion (283) is inserted into the first annular groove (142), it is sealed with the first annular groove (142) by a sealant (6); a plurality of wedge-shaped blocks (144) are arranged at intervals on the inner side wall of the first protrusion (141), and the wedge-shaped blocks (144) are used to be inserted into the second annular groove (282) and force the first protrusion (141) to abut against the fourth protrusion (283) to close the gap between the first protrusion (141) and the fourth protrusion (283).

10. A vehicle, characterized in that: It comprises a vehicle body and the 4D millimeter wave radar according to any one of claims 1 to 9, wherein the 4D millimeter wave radar is installed on the vehicle body.

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