Thermal parameter data acquisition circuit and portable equipment

Abstract

The utility model discloses a thermal parameter data acquisition circuit and portable equipment, the acquisition circuit comprises a voltage acquisition conversion module, a main processing module and a peripheral unit which are connected in sequence, and the acquisition circuit also comprises a system power supply module; the voltage acquisition and conversion module comprises a plurality of voltage acquisition and conversion units, each voltage acquisition and conversion unit comprises an ESD circuit, a passive filter circuit and an ADC conversion circuit which are connected in sequence, the input end of each ESD circuit is connected with an analog voltage input signal, and the output end of each ADC conversion circuit is connected with the main processing module; and the main processing module is used for receiving the digital voltage signal converted by the voltage acquisition and conversion module and outputting the digital voltage signal to an external unit for display. The utility model is suitable for thermal hydraulic test environment and parameter measurement characteristics, can satisfy thermal parameter data acquisition, processing, storage and display requirements, and realizes equipment integration, miniaturization, localization, high precision, high reliability and strong anti-interference capability through hardware circuit design and structural design.

Description

Technical Field

[0001] The utility model relates to the field of measurement and control technology and instruments, and in particular to a thermal parameter data acquisition circuit and a portable device. Background Art

[0002] When there are new designs or iterations of equipment or structures within a nuclear power plant, relevant thermal-hydraulic test studies must be carried out in accordance with nuclear safety regulations to ensure that the design results are reliable and the performance meets the target requirements. The test results are one of the main indicators for evaluating the design and provide data support for improvement and optimization.

[0003] In thermal-hydraulic testing, measuring thermal parameters through sensors is a crucial step throughout the test. (Thermal parameters, including temperature, flow rate, and pressure, serve as reference data in engineering thermodynamics research and directly impact the safe operation of nuclear power plants.) The data acquisition system performs analog-to-digital conversion, amplification, filtering, and storage of sensor signals, acting as the brain of the test device for real-time monitoring of its status. The thermal data acquisition system hardware used in the tests included NI and IMC data acquisition boards, both of which were imported and presented significant risks. Since there was no domestically available data acquisition equipment specifically designed for thermal parameters, universal data acquisition products were often used.

[0004] The principle of universal data collection products is as follows Figure 1 As shown, high-power electrical equipment in thermal tests can cause strong electromagnetic interference to the data acquisition system, seriously affecting data accuracy. Furthermore, pre-test wiring and debugging take a long time, the process is cumbersome, and no standardized experimental process has been formed, resulting in delayed test progress. Furthermore, existing thermal data acquisition systems are bulky and inconvenient to transport, maintain, and overhaul. Therefore, there is an urgent need for an autonomous and controllable portable thermal data acquisition system.

[0005] In view of this, this application is hereby filed. Utility Model Content

[0006] The purpose of this utility model is to provide a thermal parameter data acquisition circuit and portable equipment, which are adapted to the thermal hydraulic test environment and parameter measurement characteristics, can meet the needs of thermal parameter data acquisition, processing, storage and display, and realize equipment integration, miniaturization, localization, high precision, high reliability, and strong anti-interference ability through hardware circuit design and structural design, so as to solve the problems existing in current tests such as long wiring and debugging time, shortened test preparation cycle, and lack of independent controllable standardization of test equipment.

[0007] The utility model is achieved through the following technical solutions:

[0008] In a first aspect, the utility model provides a thermal parameter data acquisition circuit, the acquisition circuit comprising a voltage acquisition and conversion module, a main processing module and a peripheral unit connected in sequence, the acquisition circuit also comprising a system power supply module;

[0009] The voltage acquisition and conversion module includes multiple voltage acquisition and conversion units. Each voltage acquisition and conversion unit includes an ESD circuit, a passive filtering circuit, and an ADC conversion circuit connected in sequence. The input end of the ESD circuit is connected to the analog voltage input signal, and the output end of the ADC conversion circuit is connected to the main processing module.

[0010] The main processing module is used to receive the digital voltage signal converted by the voltage acquisition and conversion module and output it to the peripheral unit for display;

[0011] The system power supply module is used to supply power to the voltage acquisition and conversion module, the main processing module and the peripheral units.

[0012] Preferably, the voltage input signal is an 8-way voltage input converted from thermal parameters.

[0013] Preferably, the system power supply module includes a switching power supply unit and an LDO unit connected in sequence;

[0014] Switching power supply unit, used to convert external input 220V AC power into 12V DC power;

[0015] The LDO unit is used to convert 12V DC power into 5V and 3.3V DC power.

[0016] Preferably, the ESD circuit uses a TVS transient voltage suppression diode;

[0017] The passive filter circuit adopts a second-order low-pass passive filter, and the capacitors and resistors in the circuit form an RC bipolar oscillator.

[0018] Preferably, the ESD circuit and passive filtering circuit in the voltage acquisition and conversion unit include: TVS diode D5, resistor R18, resistor R22, resistor R24, capacitor C25, resistor R19, resistor R25 and capacitor C27; resistor R18, resistor R22, resistor R24, capacitor C25, resistor R19, resistor R25 and capacitor C27 constitute a passive filtering circuit;

[0019] The positive electrode of the TVS diode D5 is grounded, and the negative electrode is connected to the voltage input signal. The resistor R22 is connected in parallel to the two ends of the TVS diode D5; one end of the resistor R18 is connected to the resistor R22, and the other end is connected to the resistor R19; one end of the resistor R24 is connected to the resistor R22, and the other end is connected to the resistor R25; one end of the capacitor C25 is connected to the resistor R18, and the other end is connected to the resistor R24; one end of the capacitor C27 is connected to the resistor R19, and the other end is connected to R25; the common end of the capacitor C27 and the resistor R19, and the common end of the capacitor C27 and R25 are all output and connected to the ADC conversion circuit.

[0020] Preferably, the ADC conversion circuit includes an AD acquisition circuit, and the chip model used by the AD acquisition circuit is AD7606BSTZ;

[0021] AD acquisition circuit The pin is connected to a logic high level to select serial mode. In this serial mode, The pin is used as clock input, the DB7 and DB8 pins are used as data output to the main processing module STM32, and the DB15 and DB6 pins are grounded;

[0022] Connect the RANGE pin of the AD acquisition circuit to a logic high level to set the maximum ±10V input; set the 16x oversampling mode by configuring the OS2=1, OS1=0, and OS0=0 pins. That is, the hardware internally collects 16 samples and averages them to balance the two parameters of ADC conversion time and signal accuracy.

[0023] Preferably, the main processing module adopts the STM32F767 chip, which has a high main frequency of 216MHz, fast task processing speed, supports multiple communication modes, and supports multiple peripherals;

[0024] The peripheral unit includes a display circuit and various communication interfaces, including CAN communication interface, LAN communication interface and 485 communication interface; the display circuit is used to receive data transmitted by the main processor through RS232 communication; the CAN interface is used to communicate with the traditional IMC data acquisition board; the 485 communication interface is connected to the RTD module to obtain the temperature signal.

[0025] Preferably, the acquisition circuit further comprises an external trigger unit, which is used to cause the main processing module to suspend the current operation and execute a new instruction when an interrupt is triggered.

[0026] In a second aspect, the present invention further provides a portable thermal parameter data acquisition device, which includes a box structure and the above-mentioned thermal parameter data acquisition circuit, and the acquisition circuit is arranged in the box structure.

[0027] Preferably, the box structure includes a rectangular shell, one side of which is provided with a terminal block hole, a power interface, a switch and a grounding column; the other side of the shell is provided with a touch screen; the upper end of the shell is provided with a handle; and strip-shaped heat dissipation holes are opened around the shell.

[0028] Compared with the prior art, the present invention has the following advantages and beneficial effects:

[0029] This utility model provides a thermal parameter data acquisition circuit and portable device adapted to the thermal-hydraulic test environment and parameter measurement requirements, meeting the requirements for thermal parameter data acquisition, processing, storage, and display. Through hardware circuit and structural design, this device achieves integration, miniaturization, localization, high precision, high reliability, and strong anti-interference capabilities. This addresses current testing issues such as lengthy wiring and debugging times, shortened test preparation cycles, and the lack of independent control and standardization of test equipment. This utility model can be applied to any thermal-hydraulic test, achieving high-precision thermal data acquisition.

[0030] 2. The utility model provides a thermal parameter data acquisition circuit. (1) The acquisition circuit has 32 signal channels, 8 channels forming a group, covering the number of measuring points of small and medium-sized thermal hydraulic tests; (2) The data collected by the sensor is subjected to electrostatic protection and filtering in the voltage acquisition conversion module, thereby improving the measurement accuracy and reliability; (3) The anti-interference ability is improved by designing the AD acquisition circuit, so that it can adapt to the strong electromagnetic interference environment at the thermal test site; (4) The device has multiple communication interfaces reserved for communication with different peripherals.

[0031] 3. The utility model is a portable thermal parameter data acquisition device, (1) the device weighs less than 6 kg, and the shell size is 240×100×230 (mm) (length×width×height), meeting the requirements of miniaturization, lightness and portability; (2) the device has a built-in display screen, which can monitor signals at the test site and is easy to debug; (3) the device has been sent to a nationally licensed metrology and calibration agency for verification and has been issued a metrology and calibration certificate. The accuracy of each acquisition channel is better than 1‰, and the synchronous sampling rate is not less than 1kHz. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] The accompanying drawings described herein are used to provide a further understanding of the embodiments of the present invention, constitute a part of this application, and do not constitute a limitation of the embodiments of the present invention. In the accompanying drawings:

[0033] Figure 1 This is the data acquisition principle diagram of the universal data acquisition product;

[0034] Figure 2 This is a data acquisition principle diagram of a thermal parameter data acquisition circuit of the utility model;

[0035] Figure 3This is a hardware circuit block diagram of a thermal parameter data acquisition circuit of the utility model;

[0036] Figure 4 This is a schematic diagram of the ESD circuit and passive filtering circuit in the voltage acquisition and conversion unit of the utility model;

[0037] Figure 5 This is a schematic diagram of the AD acquisition circuit of the utility model Figure 1 ;

[0038] Figure 6 This is a schematic diagram of the AD acquisition circuit of the utility model Figure 2 ;

[0039] Figure 7 This utility model is a portable thermal parameter data acquisition device structure Figure 1 ;

[0040] Figure 8 This utility model is a portable thermal parameter data acquisition device structure Figure 2 .

[0041] Reference numerals and corresponding component names:

[0042] 1-housing, 2-terminal row hole, 3-power interface, 4-switch, 5-touch screen, 6-handle, 7-heat dissipation hole, 8-grounding column. DETAILED DESCRIPTION

[0043] Hereinafter, the terms "include" or "may include" used in various embodiments of the present invention indicate the presence of the function, operation or element of the utility model, and do not limit the addition of one or more functions, operations or elements. In addition, as used in various embodiments of the present invention, the terms "include", "have" and their cognates are intended only to indicate specific features, numbers, steps, operations, elements, components or combinations of the foregoing items, and should not be understood as first excluding the presence of one or more other features, numbers, steps, operations, elements, components or combinations of the foregoing items or the possibility of adding one or more features, numbers, steps, operations, elements, components or combinations of the foregoing items.

[0044] In various embodiments of the present invention, the expression "or" or "at least one of A or / and B" includes any or all combinations of the words listed simultaneously. For example, the expression "A or B" or "at least one of A or / and B" may include A, may include B, or may include both A and B.

[0045] The expressions (such as "first", "second", etc.) used in the various embodiments of the present invention may modify the various components in the various embodiments, but may not limit the corresponding components. For example, the above expressions do not limit the order and / or importance of the elements. The above expressions are only used to distinguish one element from other elements. For example, the first user device and the second user device indicate different user devices, although both are user devices. For example, without departing from the scope of the various embodiments of the present invention, the first element may be referred to as the second element, and similarly, the second element may also be referred to as the first element.

[0046] It should be noted that when a component is described as being “connected” to another component, the first component may be directly connected to the second component, and a third component may be “connected” between the first and second components. Conversely, when a component is described as being “directly connected” to another component, it can be understood that there is no third component between the first and second components.

[0047] The terms used in the various embodiments of the present invention are only used to describe the purpose of specific embodiments and are not intended to limit the various embodiments of the present invention. As used herein, the singular form is intended to also include the plural form, unless the context clearly indicates otherwise. Unless otherwise specified, all terms used herein (including technical terms and scientific terms) have the same meaning as those generally understood by those skilled in the art of the various embodiments of the present invention. The terms (such as those defined in generally used dictionaries) will be interpreted as having the same meaning as the contextual meaning in the relevant technical field and will not be interpreted as having an idealized meaning or an overly formal meaning, unless clearly specified in the various embodiments of the present invention.

[0048] In order to make the purpose, technical solutions and advantages of the present invention more clearly understood, the present invention is further described in detail below in conjunction with embodiments and drawings. The schematic implementation methods of the present invention and their descriptions are only used to explain the present invention and are not intended to limit the present invention.

[0049] The utility model designs a thermal parameter data acquisition circuit and portable device, which realizes multi-parameter high-precision acquisition through hardware circuit design. Figure 2 As shown, compared with the prior art Figure 1Compared with the traditional thermal test equipment, an electrostatic protection circuit and a passive filtering circuit are added to improve the circuit reliability and measurement accuracy; at the same time, considering the number of measuring points and parameter types of the thermal test device, 32 1~5V standard voltage input channels are set (the ADC chip in the A / D conversion circuit has a total of 8 input pins, so there are a total of 4 groups of data processing circuits) to meet the measurement of all thermal parameters. The A / D conversion peripheral circuit is specially designed to improve the anti-interference ability; the system is miniaturized and lightweight through structural design, and thermal data acquisition equipment is integrated to simplify the test preparation process, form standardized products, and improve work efficiency.

[0050] Example 1

[0051] like Figure 3 As shown, the utility model is a thermal parameter data acquisition circuit, which includes a system power supply module, a voltage acquisition and conversion module, a main processing module, a communication module, a peripheral unit and an external trigger unit; the voltage acquisition and conversion module, the main processing module and the peripheral unit are connected in sequence;

[0052] The system power supply module is used to power the voltage acquisition and conversion module, main processing module, communication module, peripheral units, and external trigger unit. Specifically, the system power supply module includes a switching power supply unit and an LDO unit connected in sequence. The switching power supply unit uses the Jinshengyang AC / DC power supply module LH25-10B12 model to convert the external input 220V AC input into 12V DC. The LDO unit is used to convert the 12V DC into 5V and 3.3V low-noise DC power and provide it to the entire system.

[0053] The voltage acquisition and conversion module includes multiple voltage acquisition and conversion units, each of which includes an ESD circuit, a passive filtering circuit and an ADC conversion circuit connected in sequence. The input end of the ESD circuit is connected to the analog voltage input signal, and the output end of the ADC conversion circuit is connected to the main processing module; the voltage signal passes through the ESD circuit to prevent static electricity from damaging components; then passes through the passive filtering circuit to attenuate noise while providing setup time for the ADC conversion circuit, and finally is transmitted to the main processing module through SPI communication; in specific implementation, the utility model includes 4 voltage acquisition and conversion units. Considering the number of measurement points and parameter types of the thermal test device, 32 voltage input channels are set, that is, a total of 4 voltage acquisition and conversion units; the voltage input signal of each voltage acquisition and conversion unit is 8-channel voltage input converted from thermal parameters.

[0054] The main processing module is used to receive the digital voltage signal converted by the voltage acquisition and conversion module and output it to the peripheral unit for display; the main processing module uses the STM32F767 chip, which has a high main frequency of 216MHz, fast task processing speed, support for multiple communication methods, and support for multiple peripherals.

[0055] The external trigger unit is used to cause the main processing module to suspend the current operation and execute new instructions when an interrupt is triggered.

[0056] The peripheral unit includes a display circuit and various communication interfaces, including CAN communication interface, LAN communication interface and 485 communication interface; the display circuit is used to receive data transmitted by the main processor through RS232 communication; the 485 communication interface is connected to the RTD module to obtain the temperature signal; the CAN interface is used to communicate with the traditional IMC data acquisition board, and the W5500 Ethernet controller is selected as the network port communication chip to transmit data with the industrial computer; local area network LAN.

[0057] The core circuit design of the present invention is the voltage acquisition and conversion module, which is also the biggest difference from the universal data acquisition system. Among them, the ESD circuit uses a TVS transient voltage suppression diode. When the voltage exceeds 12V, the diode quickly turns on to discharge the surge energy and suppress the surge voltage to avoid breakdown. Since the transition band of the first-order filter circuit is wide, the maximum attenuation slope of the amplitude-frequency characteristic is only -20dB / decade. Therefore, the passive filter circuit of the present invention uses a second-order low-pass passive filter to increase the attenuation slope. The capacitors and resistors in the circuit form an RC bipolar oscillator. By adjusting the capacitor and resistor values, the cutoff frequency is set to 9.3kHz, which meets the bandwidth requirement of the 1kHz sampling signal in the experiment. The schematic diagram of the ESD protection and filtering circuit is shown in the figure. Figure 4 shown.

[0058] Figure 4 In the embodiment, the ESD circuit and passive filtering circuit in the voltage acquisition and conversion unit include: TVS diode D5, resistor R18, resistor R22, resistor R24, capacitor C25, resistor R19, resistor R25 and capacitor C27; resistor R18, resistor R22, resistor R24, capacitor C25, resistor R19, resistor R25 and capacitor C27 constitute a passive filtering circuit;

[0059] The positive electrode of TVS diode D5 is grounded, and the negative electrode is connected to voltage input signal AIN1_1. Resistor R22 is connected in parallel to both ends of TVS diode D5; one end of resistor R18 is connected to resistor R22, and the other end is connected to resistor R19; one end of resistor R24 is connected to resistor R22, and the other end is connected to resistor R25; one end of capacitor C25 is connected to resistor R18, and the other end is connected to resistor R24; one end of capacitor C27 is connected to resistor R19, and the other end is connected to R25; the common end of capacitor C27 and resistor R19, and the common end of capacitor C27 and R25 are connected to the ADC1_1_P pin and ADC1_1_N pin of the ADC conversion circuit (AD acquisition circuit) respectively.

[0060] In this embodiment, the ADC conversion circuit includes an AD acquisition circuit. The chip model used in the AD acquisition circuit is AD7606BSTZ. This chip has a 16-bit resolution, a maximum input of ±10V, and an internal differential circuit, which has high signal reliability. The AD acquisition circuit uses a 1μF decoupling capacitor to ensure stable operation of the chip. In order to improve the anti-interference ability of the device, the AD acquisition circuit is The pin is connected to a logic high level to select serial mode. In this serial mode, The pin is used as clock input, the DB7 and DB8 pins are used as data output to the main processing module STM32F767, and the DB15 and DB6 pins are grounded; the RANGE pin of the AD acquisition circuit is connected to a logic high level to set the maximum ±10V input; by configuring the OS2=1, OS1=0, OS0=0 pins to set the 16x oversampling mode, that is, the hardware internally collects 16 samples and averages them to balance the two parameters of ADC conversion time and signal accuracy; Connecting the pin to a logic high level cancels the power saving function; shorting the CONVST A and CONVSTB pins together and applying the conversion start signal enables synchronous sampling; connecting the REF SELECT pin to a logic high level sets the AD internal reference voltage mode to ensure high matching between channels; Figure 5 and Figure 6 As shown, the AD acquisition circuit design is completed.

[0061] The utility model discloses a thermal parameter data acquisition circuit, which has the following advantages: (1) the acquisition circuit has 32 signal channels, 8 channels form a group, covering the number of small and medium-sized thermal hydraulic test measurement points; (2) the sensor acquisition data is subjected to electrostatic protection and filtering processing in the voltage acquisition conversion module, thereby improving the measurement accuracy and reliability; (3) the anti-interference ability is improved by designing the AD acquisition circuit, so that it can adapt to the strong electromagnetic interference environment at the thermal test site; (4) the equipment reserves a variety of communication interfaces, which can communicate with different peripherals.

[0062] Example 2

[0063] like Figure 7 and Figure 8 As shown, the difference between this embodiment and embodiment 1 is that this embodiment provides a portable thermal parameter data acquisition device, which includes a box structure and a thermal parameter data acquisition circuit of embodiment 1, and the acquisition circuit is arranged in the box structure.

[0064] Preferably, the box structure includes a rectangular shell 1, on one side of which a terminal row hole 2, a power interface 3, a switch 4 and a grounding column 8 are provided; on the other side of the shell 1 a touch screen 5 is provided; a handle 6 is provided at the upper end of the shell 1; and strip-shaped heat dissipation holes 7 are opened around the shell 1; one end of the terminal row hole 2 is connected to the secondary side instrument of the thermal parameter sensor, and the other end is used as an 8-way voltage input; the power interface 3 is used to connect an external 220V AC power supply.

[0065] Considering the device's portability and lightweight, the enclosure adopts a compact design. The structural design is based on reliability, including heat dissipation, grounding, and electromagnetic interference (EMI) protection. Heat dissipation: The device's internal components generate heat during operation, so the circuit board is constructed with low-power, heat-dissipating components. Based on thermal conduction theory, metals have high thermal conductivity, so stainless steel was chosen as the enclosure material. Based on thermal radiation theory, black was chosen as the enclosure color to enhance heat radiation and absorb heat. Based on thermal convection theory, strip-shaped heat dissipation holes (7) were provided around the enclosure, and a cooling fan was added to enhance airflow and heat transfer, reducing the device's internal temperature. Grounding: The power grid system is subject to 50Hz power frequency interference, and the enclosure is designed with grounding posts (8) to provide a good grounding for the system and mitigate this interference. EMI protection: This device is used in a thermal testing environment, where a variety of high-power electrical appliances are present. Based on electromagnetic radiation theory, the stainless steel enclosure material has the appropriate magnetic permeability and electrical conductivity, providing excellent interference protection. Furthermore, the grounding design enhances shielding effectiveness. The display screen uses the medical-grade DC32480M035-1010_0X series display screen, which can be operated by touch screen, has a resolution of 320×480, 128MB of storage, and supports multiple communication methods.

[0066] The utility model discloses a portable thermal parameter data acquisition device with the following advantages: (1) the device weighs less than 6 kg, and the shell size is 240×100×230 (mm) (length×width×height), which meets the requirements of miniaturization, lightness and portability; (2) the device has its own display screen, which can monitor signals at the test site and is easy to debug; (3) the device has been sent to a nationally licensed metrology and calibration agency for verification and has been issued a metrology calibration certificate. The accuracy of each acquisition channel is better than 1‰, and the synchronous sampling rate is not less than 1kHz.

[0067] This utility model provides a thermal parameter data acquisition circuit and portable device that can be applied to any thermal hydraulic test, achieving high-precision thermal data acquisition. Through hardware circuit and structural design, data acquisition, processing, and display functions are implemented. The device is compact, lightweight, highly accurate, highly reliable, and autonomously controllable, enabling the development of standardized products. This solves the current problems of universal data acquisition products used in thermal hydraulic tests, such as high noise levels in on-site monitoring signals and the difficulty of the equipment meeting the requirements for multi-parameter acquisition in testing.

[0068] The specific implementation methods described above further illustrate the purpose, technical solutions and beneficial effects of the utility model in detail. It should be understood that the above description is only a specific implementation method of the utility model and is not intended to limit the scope of protection of the utility model. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principles of the utility model should be included in the scope of protection of the utility model.

Claims

1. A thermal parameter data acquisition circuit, characterized in that: The acquisition circuit includes a voltage acquisition conversion module, a main processing module and a peripheral unit connected in sequence, and the acquisition circuit also includes a system power supply module; The voltage acquisition and conversion module includes a plurality of voltage acquisition and conversion units, each of which includes an ESD circuit, a passive filtering circuit, and an ADC conversion circuit connected in sequence. The input end of the ESD circuit is connected to an analog voltage input signal, and the output end of the ADC conversion circuit is connected to the main processing module; The main processing module is used to receive the digital voltage signal converted by the voltage acquisition and conversion module and output it to the peripheral unit for display; The system power supply module is used to supply power to the voltage acquisition and conversion module, the main processing module and the peripheral units.

2. A thermal parameter data acquisition circuit according to claim 1, characterized in that: The voltage input signal is an 8-way voltage input converted from thermal parameters.

3. The thermal parameter data acquisition circuit according to claim 1, characterized in that: The system power supply module includes a switching power supply unit and an LDO unit connected in sequence; The switching power supply unit is used to convert the external input 220V AC power into 12V DC power; The LDO unit is used to convert 12V direct current into 5V and 3.3V direct current.

4. The thermal parameter data acquisition circuit according to claim 1, characterized in that: The ESD circuit uses a TVS transient voltage suppression diode; The passive filtering circuit adopts a second-order low-pass passive filter, and the capacitor and resistor in the circuit form an RC bipolar oscillator.

5. The thermal parameter data acquisition circuit according to claim 4, characterized in that: The ESD circuit and passive filtering circuit in the voltage acquisition and conversion unit include: TVS diode D5, resistor R18, resistor R22, resistor R24, capacitor C25, resistor R19, resistor R25 and capacitor C27; resistor R18, resistor R22, resistor R24, capacitor C25, resistor R19, resistor R25 and capacitor C27 constitute a passive filtering circuit; The positive pole of the TVS diode D5 is grounded and the negative pole is connected to the voltage input signal. The resistor R22 is connected in parallel to the two ends of the TVS diode D5; one end of the resistor R18 is connected to the resistor R22 and the other end is connected to the resistor R19; one end of the resistor R24 is connected to the resistor R22 and the other end is connected to the resistor R25; one end of the capacitor C25 is connected to the resistor R18 and the other end is connected to the resistor R24; one end of the capacitor C27 is connected to the resistor R19 and the other end is connected to R25; the common end of the capacitor C27 and the resistor R19, and the common end of the capacitor C27 and R25 are both output and connected to the ADC conversion circuit.

6. The thermal parameter data acquisition circuit according to claim 1, characterized in that: The ADC conversion circuit includes an AD acquisition circuit, and the chip model used by the AD acquisition circuit is AD7606BSTZ; The AD acquisition circuit The pin is connected to a logic high level to select serial mode. In this serial mode, The pin is used as clock input, the DB7 and DB8 pins are used as data output to the main processing module, and the DB15 and DB6 pins are grounded; The RANGE pin of the AD acquisition circuit is connected to a logic high level to set a maximum ±10V input; and a 16x oversampling mode is set by configuring the OS2=1, OS1=0, and OS0=0 pins.

7. The thermal parameter data acquisition circuit according to claim 1, characterized in that: The main processing module adopts STM32F767 chip; The peripheral unit includes a display circuit and various communication interfaces, including CAN communication interface, LAN communication interface and 485 communication interface; the display circuit is used to receive data transmitted by the main processor through RS232 communication; the CAN interface is used to communicate with the traditional IMC data acquisition board; the 485 communication interface is connected to the RTD module to obtain the temperature signal.

8. The thermal parameter data acquisition circuit according to claim 1, characterized in that: The acquisition circuit also includes an external trigger unit, which is used to cause the main processing module to suspend the current operation and execute a new instruction when an interrupt is triggered.

9. A portable thermal parameter data acquisition device, characterized in that: The acquisition device comprises a box structure and a thermal parameter data acquisition circuit as claimed in any one of claims 1 to 8, wherein the acquisition circuit is arranged in the box structure.

10. The portable thermal parameter data acquisition device according to claim 9, characterized in that: The box structure comprises a rectangular shell (1), one side of the shell (1) is provided with a terminal block hole (2), a power interface (3), a switch (4) and a grounding column (8); the other side of the shell (1) is provided with a touch screen (5); the upper end of the shell (1) is provided with a handle (6); and strip-shaped heat dissipation holes (7) are opened around the four sides of the shell (1).

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