Silicon wafer positioning device
By using the locking pins of the loading disk and positioning components to fit the V-shaped grooves of the silicon wafer during the silicon wafer cutting process, the problem of inaccurate positioning of the silicon wafer is solved, and the accuracy of the wafer cutting and the success rate of the lobe after sub-testing is improved.
Patent Information
- Application Number
- CN202422440290.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-10-10
- Publication Date
- 2025-08-05
- Estimated Expiration
- 2034-10-10
AI Technical Summary
In the prior art, the lack of positioning devices when slicing the silicon wafers, resulting in the position shift of the silicon wafers, the failure to crack in half after split measurement, affecting the accuracy of slicing.
The load disk and positioning components are adopted. The center of the load disk is equipped with a circular through hole to accommodate the silicon wafer. The positioning components include a clamp pin and an elastic member. The front end of the clamp pin is fitted with the V-shaped groove of the silicon wafer. The elastic member drives the clamp pin to move in the radial direction to fix or release the silicon wafer to ensure accurate positioning.
It improves the accuracy of silicon wafer cutting, avoids silicon wafer placement offset and lobes, and ensures that it can crack in half after partial measurement.
Smart Images
Figure CN223193792U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of silicon wafer processing, in particular to a silicon wafer positioning device. Background Art
[0002] After cutting, silicon wafers need to be inspected before entering the next processing flow. Since the silicon wafers used for the inspection project are required to be 6-inch or 8-inch silicon wafers, and the silicon wafers cut by the cutting machine are all 12-inch silicon wafers, the 12-inch silicon wafers need to be placed on the wafer cutting machine to take out 6-inch or 8-inch silicon wafers. While taking out the wafers, the crystal orientation of the silicon wafers needs to be clearly positioned to ensure that the silicon wafers can be split in half during the test after the split.
[0003] In the prior art, there is no specific positioning device when peeling out silicon wafers, so the following problems exist: 1. When using a laser to peel out a 12-inch silicon wafer, the lack of positioning will cause the operator to place the silicon wafer offset, resulting in the laser being unable to peel out two standard 6-inch silicon wafers or one standard 8-inch silicon wafer from the 12-inch silicon wafer, and even causing the silicon wafer to crack; 2. Because the crystal orientation of the silicon wafer is not positioned, the peeled silicon wafer cannot be split into two identical halves during testing after splitting, making subsequent testing impossible. Utility Model Content
[0004] The purpose of the utility model is to provide a silicon wafer positioning device to solve the problems in the prior art that the silicon wafer picking position is easily offset, the silicon wafer is cracked, and the silicon wafer cannot be split in half after measurement, thereby improving the accuracy of silicon wafer picking.
[0005] To achieve this purpose, the present invention adopts the following technical solutions:
[0006] Provided is a silicon wafer positioning device, comprising:
[0007] A carrier plate is provided at a processing station, and a circular through hole is provided in the center of the carrier plate, and the circular through hole is used to accommodate a 12-inch silicon wafer;
[0008] A positioning assembly is arranged on the circumferential side of the circular through hole, and includes a pin and an elastic member. The front end of the pin includes a first abutment surface and a second abutment surface set at an angle, which are used to engage with the V-shaped groove of the silicon wafer. The elastic member is arranged at the rear end of the pin to drive the pin to move radially, thereby fixing or releasing the silicon wafer.
[0009] As an optional technical solution for the silicon wafer positioning device, the positioning assembly also includes an abutment block, the carrier is provided with a first groove, the first groove extends along the radial direction, and is used to accommodate the pin and the elastic member, the abutment block is provided at the rear end of the first groove, one end of the elastic member abuts against the pin, and the other end abuts against the abutment block.
[0010] As an optional technical solution for the silicon wafer positioning device, a slideway is provided on the side wall of the first groove along the radial direction, and a slide rod is passed through the latch in the horizontal direction, and the slide rod can be slidably arranged in the slideway.
[0011] As an optional technical solution for the silicon wafer positioning device, the first groove is provided with a first section and a second section from the inside to the outside along the radial direction, the width of the first section is smaller than the width of the second section, the slide is provided in the second section, and when the slide rod slides along the radial direction, it can abut against the connecting surface of the first section and the second section.
[0012] As an optional technical solution for the silicon wafer positioning device, the silicon wafer positioning device also includes a bolt, and a first threaded hole is provided at a position corresponding to the abutment block and the elastic member. The bolt passes through the first threaded hole and abuts against the elastic member, and the threaded connection position of the bolt and the first threaded hole is changed, thereby adjusting the compression amount of the elastic member.
[0013] As an optional technical solution for the silicon wafer positioning device, a second groove is provided on the carrier, and the second groove extends along the radial direction and passes through the carrier to facilitate the placement of the silicon wafer.
[0014] As an optional technical solution for the silicon wafer positioning device, the carrier is provided with a fixing hole, and a fastener passes through the fixing hole to fix the carrier to the processing station of the carrier.
[0015] As an optional technical solution for the silicon wafer positioning device, two groups of positioning components are arranged at intervals around the axial direction to position the 100 crystal orientation and the 110 crystal orientation of the silicon wafer.
[0016] As an optional technical solution for the silicon wafer positioning device, the elastic member is configured as a spring.
[0017] As an optional technical solution for the silicon wafer positioning device, the carrier is made of alloy.
[0018] Beneficial effects of the utility model:
[0019] This application provides a silicon wafer positioning device, comprising a carrier plate and a positioning assembly. The carrier plate is positioned at a processing station, and a circular through-hole is provided in the center of the carrier plate for accommodating a 12-inch silicon wafer. The positioning assembly is positioned around the circular through-hole and comprises a latch and an elastic member. The front end of the latch comprises a first abutting surface and a second abutting surface arranged at an angle for engaging with a V-shaped groove on the silicon wafer. The elastic member is positioned at the rear end of the latch to drive the latch to move radially, thereby securing or releasing the silicon wafer. By placing the carrier plate at the processing station and placing the silicon wafer in the circular through-hole, the silicon wafer can be accurately positioned, preventing wafer removal failure caused by wafer misalignment. The latch engages with the V-shaped groove on the silicon wafer to determine the crystal orientation of the silicon wafer, thereby improving the accuracy of wafer removal. BRIEF DESCRIPTION OF THE DRAWINGS
[0020] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following is a brief introduction to the drawings required for use in the description of the embodiments of the present invention. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on the contents of the embodiments of the present invention and these drawings without paying any creative work.
[0021] Figure 1 This is an axonometric diagram of a silicon wafer positioning device provided by an embodiment of the present utility model;
[0022] Figure 2 It is a partial structural diagram of the silicon wafer positioning device provided by an embodiment of the present utility model.
[0023] In the picture:
[0024] 10. Carrying plate; 11. First groove; 111. Slideway; 12. Second groove; 13. Fixing hole;
[0025] 20. Positioning assembly; 21. Bayonet; 211. Slide rod; 22. Abutment block. DETAILED DESCRIPTION
[0026] The present invention will be further described in detail below with reference to the accompanying drawings and examples. It should be understood that the specific embodiments described herein are intended only to illustrate the present invention and are not intended to limit the present invention. It should also be noted that, for ease of description, the accompanying drawings only illustrate portions relevant to the present invention, not all of its components.
[0027] In the description of this utility model, unless otherwise specified or limited, the terms "connected," "connect," and "fixed" should be understood in a broad sense. For example, they can refer to fixed connection, detachable connection, or integration; mechanical connection or electrical connection; direct connection or indirect connection through an intermediate medium; internal communication between two components or interaction between two components. Those skilled in the art will understand the specific meanings of the above terms in this utility model based on the specific circumstances.
[0028] In the present invention, unless otherwise expressly specified or limited, a first feature being "above" or "below" a second feature may include the first and second features being in direct contact, or may include the first and second features being in contact not directly but through another feature between them. Moreover, a first feature being "above," "above," and "above" a second feature may include the first feature being directly above or obliquely above the second feature, or may simply mean that the first feature is higher in level than the second feature. A first feature being "below," "below," and "below" a second feature may include the first feature being directly below or obliquely below the second feature, or may simply mean that the first feature is lower in level than the second feature.
[0029] In the description of this embodiment, the terms "upper," "lower," "right," and other orientations or positional relationships are based on the orientations or positional relationships shown in the accompanying drawings and are intended solely for ease of description and simplified operation. They do not indicate or imply that the devices or components referred to must have a specific orientation, be constructed, or operate in a specific orientation. Therefore, they should not be construed as limitations on the present invention. Furthermore, the terms "first" and "second" are used solely for descriptive purposes and have no special meaning.
[0030] After cutting, silicon wafers need to be inspected before entering the next processing flow. Since the silicon wafers used for the inspection project are required to be 6-inch or 8-inch silicon wafers, and the silicon wafers cut by the cutting machine are all 12-inch silicon wafers, the 12-inch silicon wafers need to be placed on the wafer cutting machine to take out 6-inch or 8-inch silicon wafers. While taking out the wafers, the crystal orientation of the silicon wafers needs to be clearly positioned to ensure that the silicon wafers can be split in half during the test after the split.
[0031] In the prior art, there is no specific positioning device when peeling out silicon wafers, so the following problems exist: 1. When using a laser to peel out a 12-inch silicon wafer, the lack of positioning will cause the operator to place the silicon wafer offset, resulting in the laser being unable to peel out two standard 6-inch silicon wafers or one standard 8-inch silicon wafer from the 12-inch silicon wafer, and even causing the silicon wafer to crack; 2. Because the crystal orientation of the silicon wafer is not positioned, the peeled silicon wafer cannot be split into two identical halves during testing after splitting, making subsequent testing impossible.
[0032] To solve the above problems, this embodiment provides a silicon wafer positioning device. Figure 1 and Figure 2 The device comprises a carrier plate 10 and a positioning assembly 20. The carrier plate 10 is positioned at a processing station. A circular through-hole is provided in the center of the carrier plate 10 for accommodating a 12-inch silicon wafer. The positioning assembly 20 is provided around the circular through-hole and comprises a latch 21 and an elastic member. The front end of the latch 21 comprises a first abutting surface and a second abutting surface arranged at an angle for engaging with the V-shaped groove of the silicon wafer. The elastic member is provided at the rear end of the latch 21 to drive the latch 21 to move radially, thereby securing or releasing the silicon wafer. By placing the carrier plate 10 at the processing station and placing the silicon wafer in the circular through-hole, the silicon wafer can be accurately positioned, thereby preventing wafer removal failure caused by wafer placement deviation. The latch 21 is engaged with the V-shaped groove on the silicon wafer to determine the crystal orientation of the silicon wafer, thereby improving the accuracy of wafer removal. Specifically, the carrier 10 is made of alloy to increase its stability. Two groups of positioning components 20 are arranged axially at intervals to position the 100 and 110 crystal orientations of the silicon wafer, thereby determining the crystal orientation of the silicon wafer when it is removed.
[0033] Furthermore, the positioning assembly 20 also includes an abutment block 22. The carrier 10 is provided with a first groove 11, which extends radially and is used to accommodate the latch 21 and the elastic member. The abutment block 22 is provided at the rear end of the first groove 11. One end of the elastic member abuts the latch 21, and the other end abuts the abutment block 22. In this embodiment, the elastic member is configured as a spring, one end of the spring abuts the latch 21, and the other end abuts the abutment block 22. When the silicon wafer is placed into the circular through-hole, the sidewall of the silicon wafer squeezes the latch 21 and the spring, and the spring drives the latch 21 to retract into the first groove 11. When the silicon wafer is placed, the latch 21 corresponds to the V-shaped groove. The spring is released, driving the latch 21 to engage with the inner wall of the V-shaped groove to secure the silicon wafer. In other embodiments, the elastic member can also be configured as an elastic column, such as a rubber column; or the spring can be sheathed on the outside of the rubber column. The spring and the rubber column are used together to prevent the central axis of the spring from shifting during deformation and thus escaping from the first groove 11.
[0034] Furthermore, a slideway 111 is provided radially on the sidewall of the first groove 11, and a slide bar 211 is provided horizontally through the bayonet 21, which can slide inside the slideway 111. The positioning of the slide bar 211 and the slideway 111 prevents the bayonet 21 from vertically disengaging from the first groove 11. Furthermore, the first groove 11 is provided radially with a first section and a second section from inside to outside, wherein the width of the first section is smaller than the width of the second section. The slideway 111 is provided in the second section, and when the slide bar 211 slides radially, it can abut against the connecting surface of the first section and the second section. By changing the width of the first groove 11, the connecting surface of the first section and the second section is limited to the bayonet 21, and at the same time, the sidewall of the first groove 11 limits the bayonet 21, preventing the bayonet 21 from horizontally disengaging from the first groove 11.
[0035] Furthermore, the silicon wafer positioning device includes a bolt. A first threaded hole is provided at the position of the abutment block 22 corresponding to the elastic member. The bolt passes through the first threaded hole and abuts the elastic member. Changing the threaded connection position between the bolt and the first threaded hole adjusts the compression of the elastic member. Specifically, as the space available for the spring to deform decreases, the spring is always compressed. When the latch 21 is aligned with the V-shaped groove, the force released by the spring increases, thereby enhancing the stability of the silicon wafer.
[0036] Furthermore, the carrier plate 10 is provided with a second groove 12, which extends radially through the carrier plate 10 to facilitate placement of the silicon wafer. The second groove 12 is configured as a relief groove. In practice, a suction pen can be used to absorb the sidewall of the silicon wafer before inserting the silicon wafer into the circular through-hole through the second groove 12. In this embodiment, three second grooves 12 are provided axially at intervals.
[0037] Furthermore, the carrier plate 10 is provided with fixing holes 13, through which fasteners pass to fix the carrier plate 10 to the processing station of the carrier. Specifically, the carrier plate 10 is set to be square, and a plurality of fixing holes 13 are provided at intervals along the edge of the carrier plate 10 to fix the carrier plate 10.
[0038] Obviously, the above-described embodiments of the present invention are merely examples for the purpose of clearly illustrating the present invention and are not intended to limit the manner in which the present invention is to be implemented. A person skilled in the art would be able to make various obvious changes, readjustments, and substitutions without departing from the scope of protection of the present invention. It is not necessary and impossible to enumerate all embodiments here. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present invention shall be included within the scope of protection of the claims of the present invention.
Claims
1. A silicon wafer positioning device, characterized in that: include: A carrier plate (10), the carrier plate (10) being arranged at a processing station, a circular through hole being arranged at the center of the carrier plate (10), the circular through hole being used to accommodate a 12-inch silicon wafer; A positioning assembly (20) is provided on the peripheral side of the circular through hole, and includes a bayonet (21) and an elastic member. The front end of the bayonet (21) includes a first abutting surface and a second abutting surface arranged at an angle, and is used to engage with the V-shaped groove of the silicon wafer. The elastic member is provided at the rear end of the bayonet (21) to drive the bayonet (21) to move radially, thereby fixing or releasing the silicon wafer.
2. The silicon wafer positioning device according to claim 1, characterized in that: The positioning assembly (20) further includes an abutment block (22), the carrier (10) is provided with a first groove (11), the first groove (11) extends along the radial direction and is used to accommodate the bayonet (21) and the elastic member, the abutment block (22) is provided at the rear end of the first groove (11), one end of the elastic member abuts against the bayonet (21), and the other end abuts against the abutment block (22).
3. The silicon wafer positioning device according to claim 2, characterized in that: A slideway (111) is provided on the side wall of the first groove (11) along the radial direction, and a slide rod (211) is passed through the latch (21) in the horizontal direction. The slide rod (211) can be slidably arranged in the slideway (111).
4. The silicon wafer positioning device according to claim 3, characterized in that: The first groove (11) is provided with a first section and a second section from inside to outside along the radial direction, the width of the first section is smaller than the width of the second section, the slideway (111) is provided in the second section, and when the slide rod (211) slides along the radial direction, it can abut against the connecting surface of the first section and the second section.
5. The silicon wafer positioning device according to claim 2, characterized in that: The silicon wafer positioning device also includes a bolt, and a first threaded hole is provided at a position of the abutting block (22) corresponding to the elastic member. The bolt passes through the first threaded hole and abuts against the elastic member, and the threaded connection position of the bolt and the first threaded hole is changed, thereby adjusting the compression amount of the elastic member.
6. The silicon wafer positioning device according to any one of claims 1 to 5, characterized in that: A second groove (12) is provided on the carrier (10), and the second groove (12) extends along the radial direction and passes through the carrier (10) to facilitate the placement of the silicon wafer.
7. The silicon wafer positioning device according to any one of claims 1 to 5, characterized in that: The carrier (10) is provided with a fixing hole (13), and a fastener passes through the fixing hole (13) to fix the carrier (10) to the processing station of the carrier.
8. The silicon wafer positioning device according to any one of claims 1 to 5, characterized in that: Two groups of positioning components (20) are arranged at intervals around the axial direction to position the 100 crystal orientation and the 110 crystal orientation of the silicon wafer.
9. The silicon wafer positioning device according to any one of claims 1 to 5, characterized in that: The elastic member is configured as a spring.
10. The silicon wafer positioning device according to any one of claims 1 to 5, characterized in that: The material of the carrier plate (10) is alloy.