Sealing member, pickup device, and electronic apparatus

Abstract

The utility model discloses a sealing element, a pickup device and electronic equipment, and the microphone assembly comprises a circuit board and a plurality of microphone sensors, the circuit board is provided with a first board surface and a second board surface which are oppositely arranged, and the plurality of microphone sensors are arranged on the first board surface of the circuit board at intervals; the sealing part is provided with a plurality of containing grooves arranged at intervals, the containing grooves are configured to contain the microphone sensors in a one-to-one correspondence mode, each containing groove is provided with a notch, and each notch is configured to allow the corresponding microphone sensor to penetrate through. The sealing element, the pickup device and the electronic equipment provided by the embodiment of the utility model have the advantages that the number of parts required for assembly is small, and the assembly efficiency is high.

Description

Technical Field

[0001] The embodiments of the present application relate to the technical field of display devices, and in particular to a seal, a sound pickup device, and an electronic device. Background Art

[0002] An array microphone consists of a number of acoustic sensors (typically microphone components) that convert speech information from a sound field into electronic signals for transmission. Array microphones are used in a variety of products with human-computer interaction capabilities, such as smart interactive TVs, tablets, and mobile phones.

[0003] In the related art, an array microphone includes a circuit board, a microphone sensor disposed on the circuit board, and a sealing cover. The sealing cover is disposed outside the microphone sensor to seal the microphone sensor, thereby improving the sound pickup performance of the array microphone.

[0004] However, the above array microphone is complicated to assemble. Utility Model Content

[0005] The purpose of the embodiments of the present application is to provide a sealing member, a sound pickup device, and an electronic device, which can solve the problem of complicated assembly of a sealing cover.

[0006] To achieve the above-mentioned purpose, one aspect of an embodiment of the present application provides a seal for a microphone assembly, the microphone assembly including a circuit board and a plurality of microphone sensors, the circuit board having a first board surface and a second board surface arranged opposite to each other, and the plurality of microphone sensors being arranged at intervals on the first board surface of the circuit board; the seal has a plurality of accommodating grooves arranged at intervals, the plurality of accommodating grooves being configured to accommodate a plurality of microphone sensors in a one-to-one correspondence, each accommodating groove having a notch, and each notch being configured to allow a corresponding microphone sensor to pass through.

[0007] The seal provided by the present invention integrates multiple receiving slots to reduce the number of parts required for assembly. Furthermore, users can simultaneously use at least two receiving slots to accommodate corresponding microphone sensors, avoiding the need to assemble them one by one as in related art, thus improving assembly efficiency.

[0008] Optionally, the seal includes a main body and a cover portion; the main body has a top end and a bottom end relatively arranged in a preset direction, the top end of the main body is configured to be connected to the second board surface of the circuit board, and the main body has a side in a direction perpendicular to the preset direction; the cover is connected to the side of the main body, and the cover is provided with a plurality of receiving grooves; when the cover is assembled with the microphone sensor, the cover is flipped relative to the main body so that the notches of the plurality of receiving grooves are all facing the first board surface of the circuit board.

[0009] Through the above solution, the main body plays a buffering role, and the cover is turned over relative to the main body to seal the microphone sensor.

[0010] Optionally, the sealing member includes a rotating shaft, and the main body portion and the cover portion are rotatably connected via the rotating shaft.

[0011] Through the above solution, the cover portion is turned over relative to the main body portion by utilizing the rotating shaft.

[0012] Optionally, the main body and the multiple cover parts are an integral part formed by an integral molding process, and the cover parts can be bent relative to the main body.

[0013] The above solution facilitates the processing of the seal.

[0014] Optionally, the multiple cover parts include a connecting part and a sealing part, the connecting part is arranged on the side of the main body part, the sealing part is connected to one end of the connecting part away from the main body part and has a receiving groove for accommodating the microphone sensor; the thickness of the sealing part is greater than the thickness of the connecting part.

[0015] The above solution can meet the bending requirements and the requirements for the depth of the accommodating groove.

[0016] Optionally, the connecting portion includes a plurality of first segments, the plurality of first segments are arranged at intervals, one end of the plurality of first segments is connected to the main body portion, and the other end of the plurality of first segments is connected to the sealing portion.

[0017] With the above solution, the difficulty of bending the connecting portion is reduced by reducing the area of the connecting portion that needs to be bent.

[0018] Optionally, the sealing portion includes a plurality of second small segments, the plurality of second small segments are arranged at intervals, one end of the plurality of second small segments is connected to the connecting portion, and each second small segment is provided with a receiving groove.

[0019] Optionally, a positioning groove for accommodating a circuit board is provided at the top of the main body.

[0020] The above solution facilitates the rapid positioning of the circuit board and the main body.

[0021] Optionally, the main body is provided with a plurality of second sound pickup holes, the plurality of second sound pickup holes are configured to correspond one-to-one to the plurality of microphone sensors, and each of the second sound pickup holes runs through the main body.

[0022] Through the above solution, sound transmission is achieved by utilizing the second sound pickup hole.

[0023] Another aspect of the embodiments of the present application further provides a sound pickup device, including a microphone assembly and the above sealing member.

[0024] The sound pickup device provided in the embodiment of the present application has the advantage of high assembly efficiency.

[0025] Another aspect of the embodiments of the present application further provides an electronic device, including a housing and the above-mentioned sound pickup device, wherein the sound pickup device is located in an inner cavity of the housing.

[0026] The electronic device provided in the embodiments of the present application has the advantage of high assembly efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0028] Figure 1 A schematic diagram of an electronic device provided in an embodiment of the present application;

[0029] Figure 2 A schematic diagram of a sealing member of a sound pickup device provided in an embodiment of the present application when not assembled;

[0030] Figure 3 for Figure 2 A schematic diagram of the sealing member of the pickup device after assembly is shown;

[0031] Figure 4 for Figure 3 A longitudinal cross-sectional view of the pickup device is shown;

[0032] Figure 5 A schematic diagram of a sealing member of another sound pickup device provided in an embodiment of the present application after assembly;

[0033] Figure 6 for Figure 5 A schematic diagram of the sealing member of the pickup device after assembly is shown;

[0034] Figure 7 for Figure 3 A longitudinal cross-sectional view of the second positioning hole of the pickup device is shown;

[0035] Figure 8 for Figure 3 Longitudinal section showing the connector location.

[0036] Description of reference numerals:

[0037] 1000, sound pickup device;

[0038] 100, microphone assembly; 110, circuit board; 111, first sound pickup hole; 112, first board surface; 113, second board surface; 114, first positioning hole; 120, microphone sensor; 130, connector; 140, indicator light;

[0039] 200, sealing member; 210, main body; 211, positioning groove; 212, second sound pickup hole; 213, second positioning hole; 214, first through hole; 220, cover; 221, connecting portion; 222, sealing portion; 223, receiving groove; 224, rotating shaft;

[0040] 2000, housing; 2100, positioning rod. DETAILED DESCRIPTION

[0041] As described in the background, array microphones in related art suffer from cumbersome assembly. The inventors discovered that this problem arises because an array microphone includes multiple microphone sensors. To ensure a tight seal, each microphone sensor requires a sealing cap. This necessitates the assembly of multiple sealing caps, each of which must be individually mounted on the outer sides of the multiple microphone sensors. This results in a microphone array with numerous assembly parts and repetitive assembly operations, which inevitably leads to cumbersome assembly.

[0042] To address the aforementioned technical issues, the present invention provides a sealing member with multiple integrated receiving slots, which are used to accommodate multiple microphone sensors. This allows the assembly of the sound pickup device to be performed using a single sealing member, reducing the number of parts required. Furthermore, users can simultaneously use at least two receiving slots to accommodate corresponding microphone sensors, avoiding the need to assemble them one by one as in related art, thus improving assembly efficiency.

[0043] In order to make the purpose, technical solutions and advantages of the embodiments of the present application clearer, the technical solutions in the embodiments of the present application will be clearly and completely described below in combination with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments.

[0044] Based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of this application. In the absence of conflict, the following embodiments and features in the embodiments can be combined with each other.

[0045] Figure 1 An electronic device provided in an embodiment of the present application, referring to Figure 1The electronic device provided in the embodiment of the present application may include a housing 2000, a power supply device, a control device and a sound pickup device 1000. The power supply device may be electrically connected to the control device and the sound pickup device 1000, and may provide electrical energy to the control device and the sound pickup device 1000. The sound pickup device 1000 may be electrically connected to the control device and controlled by the control device. For example, when the user activates the sound pickup function of the electronic device, the control device may control the sound pickup device 1000 to start, so that the sound pickup device 1000 picks up sounds in the environment. The electronic device may be a smart interactive tablet, and the housing 2000 may be the frame of the smart interactive tablet.

[0046] It should be noted that the power supply device and the control device are not shown in the figure. The embodiment of the present application does not make any specific limitations or improvements to the position, connection method, operating principle, etc. of the power supply device and the control device, as long as the sound pickup device 1000 and the shell 2000 can meet the functions of the various devices mentioned above.

[0047] Figure 2 This is a schematic diagram of a sealing member 200 of a sound pickup device 1000 provided in an embodiment of the present application when not assembled. Figure 3 for Figure 2 FIG2 is a schematic diagram showing the sealing member 200 of the pickup device 1000 after assembly. Figure 2 and Figure 3 The sound pickup device 1000 includes a circuit board 110, a sealing member 200, and a plurality of microphone sensors 120. The circuit board 110 may have a first board surface 112 and a second board surface 113 disposed opposite to each other. The plurality of microphone sensors 120 may be disposed on the first panel of the circuit board 110.

[0048] The plurality of microphone sensors 120 may be as follows Figure 2 and Figure 3 Alternatively, the microphone sensors 120 may be arranged in a straight line; alternatively, the microphone sensors 120 may be arranged in a ring pattern; alternatively, the microphone sensors 120 may be arranged in a grid pattern. Of course, the microphone sensors 120 may also be arranged in a shape (such as a triangle, rectangle, etc.). The above is merely an example, and the present embodiment does not specifically limit the pattern formed by the arrangement of the microphone sensors 120.

[0049] For ease of description, the present embodiment uses a coordinate system established by a first direction X, a second direction Y, and a third direction Z, which are perpendicular to each other, to illustrate the sound pickup device 1000. The side where the circuit board 110 is connected to the microphone sensor 120 is considered the top (in the direction indicated by arrow X in the figure), while the side of the circuit board 110 facing away from the microphone sensor 120 is considered the bottom. The other two directions are front and back (the direction indicated by arrow Y in the figure is the front), and the remaining two directions are left and right (the direction indicated by arrow Z in the figure is the left).

[0050] Figure 4 for Figure 3 FIG. 1 shows a longitudinal cross-sectional view of the pickup device 1000. Figure 2-Figure 4 The sealing member 200 has a plurality of accommodating grooves 223 arranged at intervals, and the plurality of accommodating grooves 223 can accommodate a plurality of microphone sensors 120 in a one-to-one correspondence. Each accommodating groove 223 can have a notch, and each notch can allow a corresponding microphone sensor 120 to pass through. During assembly, the notch of each accommodating groove 223 can face the first board surface 112 of the circuit board 110, and the microphone sensor 120 can enter the inner cavity of the accommodating groove 223 through the corresponding notch. In summary, the sealing member 200 integrates a plurality of accommodating grooves 223 to reduce the number of parts required for assembly. In addition, the user can use at least two accommodating grooves 223 to accommodate corresponding microphone sensors 120 at a time, avoiding assembly one by one as in the related art, which has the advantage of improving assembly efficiency.

[0051] It's worth noting that to protect the circuit board 110, an elastic buffer can be positioned between the circuit board 110 and the housing 2000. The assembly process for the pickup device 1000 involves assembling the buffer between the circuit board 110 and the housing 2000. To further reduce the number of parts and steps required to assemble the pickup device 1000, the seal 200 provided in this embodiment of the application can provide a buffering function.

[0052] Specifically, refer to Figure 4 The sealing member 200 may include a main body 210 and a cover 220. The main body 210 has a top and a bottom that are oppositely disposed in the first direction X. The top of the main body 210 may be connected to the second surface 113 of the circuit board 110, and the bottom of the main body 210 may be connected to the housing 2000. Thus, the main body 210 is disposed between the circuit board 110 and the housing 2000 to provide a buffering effect, thereby protecting the circuit board 110.

[0053] In addition, the main body 210 has a side surface perpendicular to the first direction X, and the cover portion 220 can be connected to the side surface of the main body 210. For example, the second direction Y and the third direction Z are both perpendicular to the first direction X. The main body 210 has a front side and a rear side opposite to each other in the second direction Y, and the main body 210 has a left side and a right side opposite to each other in the third direction Z. The cover portion 220 can be connected to at least one of the left side, right side, front side, or rear side of the main body 210. Figure 2-Figure 4 , taking the case where the cover portion 220 is connected to the rear side of the main body portion 210 as an example.

[0054] In addition, when the cover portion 220 is assembled with the microphone sensor 120, the cover portion 220 can be flipped relative to the main body 210 so that the openings of the plurality of receiving grooves 223 are all facing the first board surface 112 of the circuit board 110. Figure 2-Figure 4 In the embodiment, the cover portion 220 is connected to the rear side of the main body portion 210. When the sealing member 200 is assembled with the microphone assembly 100, the second board surface 113 of the circuit board 110 can be installed on the top of the main body portion 210, and the cover portion 220 of the sealing member 200 can be flipped from the rear side to the front side relative to the main body portion 210, so that the notch of the receiving groove 223 of the cover portion 220 is Figure 2 Shown facing upward, flipped to Figure 3 and Figure 4 The direction shown is downward, so that the microphone sensor 120 can enter the receiving groove 223 through the notch.

[0055] Optionally, the cover portion 220 and the first board surface 112 of the circuit board 110 may be fixed by adhesive connection or other methods to improve the sealing effect of the cover portion 220 sealing the microphone sensor 120 .

[0056] Optionally, the cover portion 220 can be flipped relative to the main body portion 210 via a rotating shaft 224 or an elastic arm. Figure 6 The sealing member 200 may include a rotating shaft 224, which may be fixedly connected to one end of the main body 210. The rotating shaft 224 may also be provided through one end of the cover 220 and rotatably connected to the cover 220. In this way, the cover 220 can be flipped relative to the main body 210 via the rotating shaft 224.

[0057] Another exemplary reference Figure 4 The main body 210 and the cover 220 are an integral piece formed by an integral molding process, and the cover 220 can be bent relative to the main body 210. Furthermore, the sealing member 200 can be made of a flexible material such as rubber to meet the requirements of bending and buffering.

[0058] In order to facilitate the bending of the cover portion 220 and to provide a receiving groove 223 with a certain depth, the cover portion 220 may further include a connecting portion 221 and a sealing portion 222. The connecting portion 221 may be connected to the main body portion 210, and the sealing portion 222 may be connected to an end of the connecting portion 221 away from the main body portion 210, and the sealing portion 222 may be provided with a receiving groove 223. The thickness of the connecting portion 221 may be less than the thickness of the sealing portion 222, so that the connecting portion 221 can be bent relative to the main body portion 210 during assembly, or the connecting portion 221 itself can be bent. The thickness of the sealing portion 222 may be greater than the thickness of the connecting portion 221, so that the sealing groove provided in the sealing portion 222 can meet the depth requirement for accommodating the microphone sensor 120.

[0059] refer to Figure 2 and Figure 3 To facilitate bending of the cover portion 220, the connecting portion 221 can further include multiple first segments, which can be spaced apart. One end of each of the first segments is connected to the main body 210, and the other ends of each of the first segments are connected to the sealing portion 222. This reduces the bending area of the connecting portion 221, thereby making it easier to bend the connecting portion 221. Furthermore, other electrical components besides the microphone sensor 120 may be present on the circuit board 110. Dividing the connecting portion 221 into multiple spaced-apart first segments can help avoid these components.

[0060] Optionally, the sealing portion 222 may include multiple second segments, which may be spaced apart, and one end of each of the multiple second segments may be connected to the connecting portion 221, and each second segment may be provided with a receiving groove 223. Furthermore, to reduce the weight of the sealing member 200 and to avoid other electrical components, the sealing portion 222 may include multiple second segments, which may be connected to the multiple first segments in a one-to-one correspondence, and each second segment may be provided with at least one receiving groove 223.

[0061] A possible structure of the main body 210 is described below.

[0062] Optionally, the main body 210 and the circuit board 110 may be fixed by snap connection, bonding, interference fit, or the like.

[0063] Optionally, a positioning groove 211 may be provided at the top of the main body 210, and the circuit board 110 may be assembled in the inner cavity of the positioning groove 211 to facilitate positioning and assembling the circuit board 110. The shape of the positioning groove 211 may be adapted to the shape of the circuit board 110. Figure 2 The cross section of the circuit board 110 is rectangular, and the cross section of the positioning groove 211 is also rectangular.

[0064] refer to Figure 4 The circuit board 110 may be provided with a first sound pickup hole 111 at a position corresponding to the microphone sensor 120. The first sound pickup hole 111 extends through the circuit board 110. The main body 210 may be provided with a second sound pickup hole 212 at a position corresponding to the first sound pickup hole 111. The second sound pickup hole 212 extends through the main body 210, and the first sound pickup hole 111 and the second sound pickup hole 212 are interconnected. The housing 2000 may be provided with a third sound pickup hole. The third sound pickup hole, the first sound pickup hole 111, and the second sound pickup hole 212 are interconnected, so that sound can be transmitted to the microphone sensor 120 provided in the sound pickup device 1000 through the interconnected first sound pickup hole 111, the second sound pickup hole 212, and the third sound pickup hole.

[0065] Specifically, during the sound pickup process of the microphone sensor 120, since the microphone sensor 120 is disposed within the receiving groove 223 of the cover portion 220, the circuit board 110 can be provided with a first sound pickup hole 111 that connects the microphone sensor 120 to the outside world. Correspondingly, the main body 210 is provided with a second sound pickup hole 212 that connects to the first sound pickup hole 111. This facilitates the microphone sensor 120 to pick up sounds in the environment. Furthermore, by making the main body 210 and the cover portion 220 from a soft rubber material, the sound in the environment is transmitted to the microphone sensor 120 through the first sound pickup hole 111 and the second sound pickup hole 212, thereby preventing sound loss, thereby ensuring good sound pickup performance of the microphone sensor 120.

[0066] It should be noted that during the machining of the second sound pickup hole 212 on the main body 210, machining precision deviations may occur. To prevent the machining position of the second sound pickup hole 212 from misaligning with the position of the first sound pickup hole 111, which could result in the main body 210 blocking the first sound pickup hole 111 and thus affecting the sound pickup performance of the microphone sensor 120, the orthographic projection of the inner wall of the first sound pickup hole 111 at the top of the main body 210 is located within the second sound pickup hole 212. This prevents the second sound pickup hole 212 from blocking the first sound pickup hole 111, effectively ensuring the sound pickup performance of the microphone sensor 120. Continuing with the figure, optionally, the aperture of the first sound pickup hole 111 is smaller than the aperture of the second sound pickup hole 212.

[0067] refer to Figure 8 The circuit board 110 is further provided with a connector 130 for connecting an external device. The connector 130 can be provided on the first panel of the circuit board 110 and can be used to connect an external microphone device.

[0068] Optionally, the second panel of the circuit board 110 may be provided with an indicator light 140. The control device of the electronic device may be in communication with the connector 130 and the indicator light 140, respectively. When the connector 130 is connected to an external device, the control device may control the indicator light 140 to flash or change color to notify the user that the external device is properly connected.

[0069] Optionally, to avoid the indicator light 140, the main body 210 may be provided with a first through hole 214, which may be used to accommodate the indicator light 140 protruding from the second panel of the circuit board 110. It is understood that the housing 2000 may be provided with a hole or a light-transmitting plate at a position corresponding to the indicator light 140, so that the light emitted by the indicator light 140 can pass through and be observed by the user.

[0070] refer to Figure 7Optionally, the housing 2000 of the electronic device may be provided with a positioning rod 2100 for mounting the sound pickup device 1000. The main body 210 may be provided with a second positioning hole 213 at a position corresponding to the positioning rod 2100. The second positioning hole 213 extends through the main body 210. The circuit board 110 may be provided with a first positioning hole 114 at a position corresponding to the second positioning hole 213. The first positioning hole 114 extends through the circuit board 110. The first positioning hole 114 and the second positioning hole 213 are in communication with each other.

[0071] Among them, the terms "upper" and "lower" are used to describe the relative position relationship of each structure in the accompanying drawings, which is only for the convenience of description and is not used to limit the scope of implementation of this application. Changes or adjustments to their relative relationships should also be regarded as the scope of implementation of this application without substantially changing the technical content.

[0072] It should be noted that, in this application, unless otherwise expressly specified or limited, a first feature being "above" or "below" a second feature may mean that the first and second features are in direct contact, or that the first and second features are in indirect contact through an intermediate medium. Furthermore, a first feature being "above," "above," and "above" a second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is at a higher level than the second feature. A first feature being "below," "below," and "below" a second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is at a lower level than the second feature.

[0073] Furthermore, in this application, unless otherwise expressly specified or limited, the terms "mounted," "connected," "connected," "fixed," and the like should be understood broadly. For example, they may refer to fixed connection, detachable connection, or integration; they may refer to direct connection or indirect connection through an intermediate medium; they may refer to internal communication between two components or interaction between two components. Those skilled in the art will understand the specific meanings of the above terms in this application based on the specific circumstances.

[0074] Throughout this specification, reference to terms such as "one embodiment," "some embodiments," "illustrative embodiments," "examples," "specific examples," or "some examples" means that the specific features, structures, materials, or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present disclosure. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

[0075] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit them. Although the present application has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some or all of the technical features therein. These modifications or replacements do not deviate the essence of the corresponding technical solutions from the scope of the technical solutions of the embodiments of the present application.

Claims

1. A seal for a microphone assembly, characterized in that: The microphone assembly (100) comprises a circuit board (110) and a plurality of microphone sensors (120), wherein the circuit board (110) has a first board surface (112) and a second board surface (113) arranged opposite to each other, and the plurality of microphone sensors (120) are arranged at intervals on the first board surface (112) of the circuit board (110); The sealing member (200) has a plurality of accommodating grooves (223) arranged at intervals, the plurality of accommodating grooves (223) being configured to accommodate the plurality of microphone sensors (120) in a one-to-one correspondence, each of the accommodating grooves (223) having a notch, and each of the notches being configured to allow the corresponding microphone sensor (120) to pass through; The sealing member comprises a main body portion (210) and a cover portion (220); The main body (210) has a top end and a bottom end that are arranged opposite to each other in a preset direction (X), the top end of the main body (210) is configured to be connected to the second board surface (113) of the circuit board (110), and the main body (210) has a side surface in a direction perpendicular to the preset direction (X); The cover portion (220) is connected to a side surface of the main body portion (210), and the cover portion (220) is provided with the plurality of accommodating grooves (223); When the cover portion (220) is assembled with the microphone sensor (120), the cover portion (220) is flipped relative to the main body portion (210) so that the notches of the multiple receiving grooves (223) all face the first board surface (112) of the circuit board (110).

2. The seal according to claim 1, characterized in that The sealing member (200) includes a rotating shaft (224), and the main body (210) and the cover plate (220) are rotatably connected via the rotating shaft (224).

3. The seal according to claim 1, wherein: The main body (210) and the cover plate (220) are an integral part formed by an integral molding process, and the cover plate (220) is capable of bending relative to the main body (210).

4. The seal according to claim 3, characterized in that The cover portion (220) comprises a connecting portion (221) and a sealing portion (222), wherein the connecting portion (221) is arranged on a side surface of the main body portion (210), and the sealing portion (222) is connected to an end of the connecting portion (221) away from the main body portion (210) and has a receiving groove (223) for receiving the microphone sensor (120); The thickness of the sealing portion (222) is greater than the thickness of the connecting portion (221).

5. The seal according to claim 4, characterized in that The connecting portion (221) includes a plurality of first segments, the plurality of first segments are arranged at intervals, one end of the plurality of first segments is connected to the main body portion (210), and the other end of the plurality of first segments is connected to the sealing portion (222); And / or, the sealing portion (222) includes a plurality of second small segments, the plurality of second small segments are arranged at intervals, one end of the plurality of second small segments is connected to the connecting portion (221), and each of the second small segments is provided with the accommodating groove (223).

6. The seal according to any one of claims 1 to 5, characterized in that: A positioning groove (211) for accommodating the circuit board (110) is provided at the top end of the main body (210).

7. The seal according to any one of claims 1 to 5, characterized in that: The main body (210) is provided with a plurality of second sound pickup holes (212), the plurality of second sound pickup holes (212) are configured to correspond one-to-one with the plurality of microphone sensors (120), and each of the second sound pickup holes (212) runs through the main body (210).

8. A sound pickup device, characterized in that: The invention comprises a microphone assembly (100) and a sealing member (200) according to any one of claims 1 to 7.

9. An electronic device, characterized in that: The invention comprises a housing (2000) and the sound pickup device (1000) according to claim 8, wherein the sound pickup device (1000) is located in an inner cavity of the housing (2000).

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