The invention provides an efficient 
inspection method for inspecting a hermetically sealed 
package for pinholes, in which when a hermetically sealed 
package whose contents such as 
electrically conductive fluid or food are covered with an electrically insulating film is inspected for pinholes by using a 
high voltage, the inspection can be achieved with an extremely simple procedure while fully preventing occurrence of misoperations due to the 
atmosphere such as 
humidity during the inspection.In a hermetically sealed 
package in which contents 1 such as 
electrically conductive fluid are covered with an electrically insulating film 2, an 
electrical conductor 4 derived from a 
voltage output terminal of a DC 
high voltage power supply 6 is put into contact with or proximity to a side face portion 31 of the hermetically sealed package, by which the contents 1 in the hermetically sealed package 3 are electrified. Next, a lead wire 8 is connected to a connecting terminal 5a of an 
electrode 5 put into 
close contact with or opposed proximity to an inspection-object portion 3a of the package 3 where pinholes are most likely to occur, and the lead wire 8 is grounded. Then, a 
discharge current derived from the inspection-object portion 3a that flows only when a pinhole is present is detected by a 
discharge current 
detector 7, by which the presence or absence of a pinhole is detected depending on the presence or absence of the 
discharge current. In this procedure, the inspection can be made by placing the package on a support 
electrode derived from an AC 
high voltage power supply and electrifying the contents.