Power supply module

Abstract

The utility model relates to the technical field of power supply modules, and discloses a power supply module, which comprises a shell, a first circuit board and a first enclosure, the first circuit board is arranged in the shell and comprises a first substrate and a first electronic device, the first substrate comprises a first surface and a second surface which are arranged oppositely, and the first electronic device is arranged on the first surface. The first enclosure comprises a first enclosure part, the first end of the first enclosure part is pasted and fixed to the outer side wall, located between the first surface and the second surface, of the first base plate, the second end of the first enclosure part protrudes out of the first surface in the direction from the second surface to the first surface, and the first enclosure part is arranged around at least part of the periphery of the first base plate. According to the embodiment of the invention, the first enclosure does not occupy the space of the first surface of the first circuit board, so that more available space can be reserved for the design and layout of the first circuit board, and the miniaturization design can be realized.

Description

Technical Field

[0001] The present application relates to the technical field of power modules, and in particular to a power module. Background Art

[0002] To improve the reliability of the circuit board of the power module, a potting compound is usually applied to the surface of the circuit board. The potting compound covers the surface of the electronic components arranged on the circuit board to improve its durability and reliability.

[0003] Currently, during the production of power modules, foam strips are placed around the edges of the circuit board surface where the electronic components are located to prevent the potting compound from overflowing. These strips need to be attached to a relatively smooth surface, requiring ample margins for the placement of the strips. This results in a larger circuit board and hinders product miniaturization. Utility Model Content

[0004] In view of the problems existing in the background technology, the purpose of this application is to provide a power supply module that overcomes the above problems or at least partially solves the above problems.

[0005] According to a first aspect of the present application, a power supply module is provided, comprising: a housing, a first circuit board, and a first enclosure. The first circuit board is disposed in the housing, the first circuit board comprising a first substrate and a first electronic device, the first substrate comprising a first surface and a second surface disposed opposite to each other, and the first electronic device being disposed on the first surface. The first enclosure comprises a first enclosure, the first end of the first enclosure being adhered and fixed to the outer side wall of the first substrate between the first surface and the second surface, the second end of the first enclosure protruding from the first surface in a direction from the second surface to the first surface, and the first enclosure being disposed around at least part of the periphery of the first substrate.

[0006] In one or more optional embodiments above, the first enclosure further includes a first fixing portion, a first end of the first fixing portion is connected to the first end of the first enclosing portion, and a second end of the first fixing portion is adhered and fixed to the edge of the second surface.

[0007] In one or more optional embodiments above, the first fixing portion extends along at least a portion of the periphery of the second surface, and the first enclosing portion is obtained by bending the first end of the first fixing portion along the second surface toward the first surface and extending.

[0008] In one or more optional embodiments above, a first connector is provided on the first surface of the first circuit board, a first avoidance gap is provided on the first enclosure, and one end of the first connector is passed through the first avoidance gap.

[0009] In one or more optional embodiments above, a second circuit board is further included, the second circuit board is arranged in the shell, the second circuit board is arranged opposite to the first circuit board, the second circuit board includes a second substrate and a second electronic device, the second substrate includes a third surface and a fourth surface arranged opposite to each other, the third surface is arranged opposite to the first surface, and the second electronic device is arranged on the third surface. The power module also includes a second enclosure, the second enclosure includes a second enclosure portion, the first end of the second enclosure portion is adhered and fixed to the outer side wall of the second substrate located between the third surface and the fourth surface, and the second end of the second enclosure portion protrudes from the third surface along the direction from the fourth surface to the third surface, and the second enclosure portion is arranged around at least part of the periphery of the second substrate.

[0010] In one or more optional embodiments above, the second enclosure further includes a second fixing portion, a first end of the second fixing portion is connected to the first end of the second enclosing portion, and a second end of the second fixing portion is adhered and fixed to the edge of the fourth surface.

[0011] In one or more optional embodiments above, the second fixing portion extends along at least a portion of the periphery of the fourth surface, and the second enclosing portion is obtained by bending the first end of the second fixing portion along the fourth surface toward the third surface and extending.

[0012] In one or more optional embodiments above, a second connector is provided on the third surface of the second circuit board, a second avoidance gap is provided on the second enclosure, and one end of the second connector is passed through the second avoidance gap.

[0013] In one or more optional embodiments above, along a first direction, the first substrate has a first end and a second end that are oppositely disposed, and along the first direction, the second substrate has a third end and a fourth end that are oppositely disposed, wherein the first direction is perpendicular to the direction from the first substrate to the second substrate. The power module includes a cooling fan, which is disposed within the housing and is at least partially located between the first end and the third end along the direction from the first substrate to the second substrate. The first enclosure has a first opening formed at the first end, and the second enclosure has a second opening formed at the third end.

[0014] In one or more optional embodiments above, one end of the cooling fan is located in the first opening along the direction from the first substrate to the second substrate; and / or the other end of the cooling fan is located in the second opening along the direction from the first substrate to the second substrate.

[0015] The beneficial effects of the embodiments of the present application are as follows: the power module of the embodiments of the present application, by setting a first enclosure on the periphery of the first substrate, the first enclosing portion of the first enclosure is glued and fixed to the outer wall of the first substrate located between the first surface and the second surface. Compared with the traditional method of gluing a foam strip to the first surface to block the potting glue, it is beneficial to reduce the occupation of the first surface space of the first circuit board, thereby leaving more available space for the design and layout of the first circuit board, and helping to achieve a miniaturized design. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] To more clearly illustrate the specific embodiments of this application or the technical solutions in the prior art, the following briefly describes the drawings required for the specific embodiments or the description of the prior art. Similar elements or parts are generally identified by similar reference numerals throughout the drawings. Elements or parts in the drawings are not necessarily drawn to scale.

[0017] Figure 1 A three-dimensional diagram of a power module provided in an embodiment of the present application;

[0018] Figure 2 for Figure 1 Exploded view of the power module in Figure 1;

[0019] Figure 3 A schematic diagram showing a first enclosure and a second enclosure of a power module provided in an embodiment of the present application, which are respectively arranged on a first substrate and a second substrate;

[0020] Figure 4 Another schematic diagram of a power module provided in an embodiment of the present application, in which the first enclosure and the second enclosure are respectively disposed on the first substrate and the second substrate;

[0021] Figure 5 The first socket and the second socket are respectively arranged at Figure 3 A schematic diagram of the first substrate and the second substrate in FIG.

[0022] Figure 6 A partial schematic diagram of a power module provided in an embodiment of the present application;

[0023] Figure 7 A schematic diagram of a first enclosure and a second enclosure of a power module provided in an embodiment of the present application;

[0024] Figure 8 This is a schematic diagram of a power module provided in an embodiment of the present application, in which a first substrate and a second substrate are respectively provided with a first barrier tape and a second barrier tape. DETAILED DESCRIPTION

[0025] In order to facilitate understanding of the present application, the present application is described in more detail below in conjunction with the accompanying drawings and specific embodiments. It should be noted that when an element is described as "fixed to" another element, it can be directly on the other element, or there can be one or more centered elements therebetween. When an element is described as "connected to" another element, it can be directly connected to the other element, or there can be one or more centered elements therebetween. The terms "vertical", "horizontal", "left", "right", "inside", "outside" and similar expressions used in this specification are for illustrative purposes only.

[0026] Unless otherwise defined, all technical and scientific terms used in this specification have the same meanings as those commonly understood by those skilled in the art to which this application belongs. The terms used in this specification are for the purpose of describing specific embodiments only and are not intended to limit this application. The term "and / or" as used in this specification includes any and all combinations of one or more of the relevant listed items.

[0027] In this specification, unless otherwise specified or limited, the terms "connected," "connect," and "fixed" should be understood in a broad sense. For example, they can refer to fixed connections, detachable connections, or integration; mechanical connections or electrical connections; direct connections or indirect connections through an intermediate medium; and internal communication between two components or interaction between two components. Those skilled in the art will understand the specific meanings of these terms in this utility model based on specific circumstances.

[0028] In addition, the technical features involved in different embodiments of the present application described below can be combined with each other as long as they do not conflict with each other.

[0029] See also Figure 1 and Figure 2 The power module 1000 includes a housing 1, a first circuit board 2, and a first enclosure 3. The first circuit board 2 is disposed within the housing 1, and the first enclosure 3 is disposed at the edge of the first circuit board 2. The first enclosure 3 is used to prevent the potting glue from overflowing the edge of the circuit board when the potting glue is poured on the surface of the circuit board.

[0030] See also Figure 2-4 In some embodiments, the first circuit board 2 includes a first substrate 21 and a first electronic device 22 . The first substrate 21 includes a first surface 211 and a second surface 212 that are disposed opposite to each other. The first electronic device 22 is disposed on the first surface 211 .

[0031] In some embodiments, the first enclosure 3 includes a first enclosing portion 31. The first end of the first enclosing portion 31 is adhered and fixed to the outer wall of the first substrate 21 between the first surface 211 and the second surface 212. The second end of the first enclosing portion 31 protrudes from the first surface 211 in the direction from the second surface 212 to the first surface 211. The first enclosing portion 31 is disposed around at least a portion of the periphery of the first substrate 21. The second end of the first enclosing portion 31 protrudes from the first surface 211. The first enclosing portion 31 is used to prevent glue from overflowing from the edge of the first surface 211 during glue potting on the first surface 211 of the first circuit board 2.

[0032] Here, “the first enclosing portion 31 is arranged around at least part of the periphery of the first substrate 21” means that the first enclosing portion 31 can be enclosed along the periphery of the first substrate 21 to form a closed structure connected end to end, or it can be a semi-closed structure with one or more openings.

[0033] The power module 1000 of the embodiment of the present application is configured with a first enclosure 3 provided on the periphery of the first substrate 21. The first enclosing portion 31 of the first enclosure 3 is adhered and fixed to the outer wall of the first substrate 21 between the first surface 211 and the second surface 212. Compared with the conventional method of adhering a foam strip to the first surface 211 to block the potting glue, this method is beneficial in reducing the space occupied by the first surface 211 of the first circuit board 2, thereby leaving more available space for the design and layout of the first circuit board 2, and helping to achieve a miniaturized design.

[0034] In some embodiments, a first adhesive layer (not shown) is provided on the surface of the first end of the first enclosing portion 31 facing the first substrate 21 , and the first end of the first enclosing portion 31 is adhered and fixed to the outer wall of the first substrate 21 through the first adhesive layer.

[0035] In some embodiments, the first enclosure 3 further includes a first fixing portion 32, a first end of the first fixing portion 32 being connected to the first end of the first enclosing portion 31, and a second end of the first fixing portion 32 being adhered and fixed to an edge of the second surface 212. The first fixing portion 32 provides additional support for the first enclosing portion 31, thereby facilitating a more secure fixation of the first enclosure 3 to the first substrate 21.

[0036] In some embodiments, a second adhesive layer (not shown) is disposed on the surface of the first fixing portion 32 facing the first substrate 21 , and the first fixing portion 32 is adhered and fixed to the second surface 212 via the second adhesive layer.

[0037] In some embodiments, the first fixing portion 32 extends along at least a portion of the periphery of the second surface 212. The first fixing portion 32 can extend along the periphery of the second surface 212 to form a continuous structure connected end to end, or can be provided in sections along the edge of the second surface 212. The first fixing portion 32 extending along at least a portion of the periphery of the second surface 212 helps increase the bonding area between the first fixing portion 32 and the second surface 212, thereby more firmly fixing the first fixing portion 32 to the first substrate 21.

[0038] In some embodiments, the first enclosing portion 31 is formed by bending the first end of the first fixing portion 32 along the second surface 212 toward the first surface 211 and then extending. The first fixing portion 32 and the first enclosing portion 31 are disposed correspondingly. The first enclosing portion 31 is formed by bending the first end of the first fixing portion 32 along the second surface 212 toward the first surface 211 and then extending, which facilitates processing.

[0039] In some embodiments, the first enclosure 3 includes but is not limited to being made of PET (polyethylene terephthalate) polyester film.

[0040] In some embodiments, the first enclosure 31 is provided with a first through hole 32a. The number of first through holes 32a can be set to one or more according to actual conditions. For example, the first through hole 32a can be used to avoid electronic components provided on the second surface 212 or to expose the opening of a via provided on the first substrate 21.

[0041] See also Figure 2 、 Figure 3 and Figure 5 In some embodiments, a first socket 23 is provided on the first surface 211 of the first circuit board 2, and a first relief notch 31a is provided on the first enclosure 31. One end of the first socket 23 extends through the first relief notch 31a. The first socket 23 provides an interface for the first circuit board 2 to electrically connect to other devices. The first relief notch 31a allows the end of the first socket 23 provided with the plug interface to extend, facilitating connection with a corresponding plug. The housing of the first socket 23 also serves to prevent overflow of potting compound. The first enclosure 3 cooperates with the first socket 23 to surround the first surface 211, preventing the potting compound from overflowing the first surface 211 during potting.

[0042] See also Figure 2-4In some embodiments, the power module 1000 includes a second circuit board 4, which is arranged in the shell 1. The second circuit board 4 is arranged opposite to the first circuit board 2. The second circuit board 4 includes a second substrate 41 and a second electronic device 42. The second substrate 41 includes a third surface 411 and a fourth surface 412 arranged opposite to each other. The third surface 411 is arranged opposite to the first surface 211, and the second electronic device 42 is arranged on the third surface 411.

[0043] In some embodiments, the power module 1000 also includes a second enclosure 5, the second enclosure 5 includes a second enclosure portion 51, the first end of the second enclosure portion 51 is adhered and fixed to the outer wall of the second substrate 41 between the third surface 411 and the fourth surface 412, and the second end of the second enclosure portion 51 protrudes from the third surface 411 along the direction from the fourth surface 412 to the third surface 411, and the second enclosure portion 51 is arranged around at least part of the periphery of the second substrate 41.

[0044] Here, “the second enclosing portion 51 is arranged around at least part of the periphery of the second substrate 41” means that the second enclosing portion 51 can be a closed structure formed along the periphery of the second substrate 41, or it can be a semi-enclosed structure with one or more openings.

[0045] In some embodiments, a third adhesive layer (not shown) is provided on the surface of the first end of the second enclosing portion 51 facing the second substrate 41 , and the first end of the second enclosing portion 51 is adhered and fixed to the outer wall of the second substrate 41 through the third adhesive layer.

[0046] In some embodiments, the second enclosure 5 further includes a second fixing portion 52, a first end of the second fixing portion 52 being connected to the first end of the second enclosing portion 51, and a second end of the second fixing portion 52 being adhered and fixed to an edge of the fourth surface 412. The second fixing portion 52 provides additional support for the second enclosing portion 51, thereby facilitating a more secure fixation of the second enclosure 5 to the second substrate 41.

[0047] In some embodiments, a fourth adhesive layer (not shown) is disposed on the surface of the second fixing portion 52 facing the second substrate 41 , and the second fixing portion 52 is adhered and fixed to the fourth surface 412 via the fourth adhesive layer.

[0048] In some embodiments, the second fixing portion 52 extends along at least a portion of the periphery of the fourth surface 412. The second fixing portion 52 may extend along the periphery of the fourth surface 412 to form a continuous structure connected end to end, or may be provided in sections along the edge of the fourth surface 412. The second fixing portion 52 extending along at least a portion of the periphery of the fourth surface 412 facilitates increasing the bonding area between the second fixing portion 52 and the fourth surface 412, thereby more securely securing the second fixing portion 52 to the second substrate 41.

[0049] In some embodiments, the second enclosing portion 51 is formed by bending the first end of the second fixing portion 52 along the fourth surface 412 toward the third surface 411 and then extending. The second fixing portion 52 is disposed correspondingly to the second enclosing portion 51. The second enclosing portion 51 is formed by bending the first end of the second fixing portion 52 along the fourth surface 412 toward the third surface 411 and then extending, which facilitates processing.

[0050] In some embodiments, the second enclosure 5 includes but is not limited to being made of PET (polyethylene terephthalate) polyester film.

[0051] In some embodiments, the second enclosing portion 51 is provided with a second through hole 52a. The number of the second through hole 52a can be set to one or more according to actual conditions. For example, the second through hole 52a can be used to avoid electronic components provided on the fourth surface 412 or to expose the opening of a via provided on the second substrate 41.

[0052] See also Figure 2-5 In some embodiments, a second socket 43 is provided on the third surface 411 of the second circuit board 4, and a second relief notch 51a is provided on the second enclosure 51. One end of the second socket 43 is inserted into the second relief notch 51a. The second socket 43 provides an interface for the second circuit board 4 to electrically connect to other devices. The second relief notch 51a allows the end of the second socket 43 provided with the plug interface to extend, facilitating connection with a corresponding plug. The housing of the second socket 43 also serves to prevent overflow of potting compound. The second enclosure 5 cooperates with the second socket 43 to surround the third surface 411, preventing the potting compound from overflowing the third surface 411 during potting.

[0053] See also Figure 2 、 Figure 4 and Figure 6 In some embodiments, along the first direction X, the first substrate 21 has a first end 213 and a second end 214 that are oppositely arranged, and along the first direction X, the second substrate 41 has a third end 413 and a fourth end 414 that are oppositely arranged, wherein the first direction X is perpendicular to the direction from the first substrate 21 to the second substrate 41.

[0054] In some embodiments, the power module 1000 includes a cooling fan 6, which is disposed in the housing 1. The cooling fan 6 is partially located between the first end 213 and the third end 413 along the direction from the first substrate 21 to the second substrate 41. The cooling fan 6 is used to drive the airflow to flow through the first electronic device 22 and the second electronic device 42 in a direction parallel to the first direction X.

[0055] In some embodiments, the housing 1 is provided with a housing cavity (not shown), within which the first circuit board 2, the second circuit board 4, and the cooling fan 6 are disposed. A first ventilation hole 11a and a second ventilation hole 12a are provided at opposite ends of the housing 1 along a first direction X. The first ventilation holes 11a and the second ventilation holes 12a are configured to provide convection along the first direction X.

[0056] In some embodiments, along the first direction X, the shell 1 includes a first wall 11 and a second wall 12 relative to each other, and the first ventilation hole 11a and the second ventilation hole 12a are respectively arranged on the first wall 11 and the second wall 12. Along the first direction X, one end of the cooling fan 6 is fixed to the first wall 11, and the other end of the cooling fan 6 is located between the first end 213 of the first substrate 21 and the third end 413 of the second substrate 41.

[0057] In some embodiments, the first enclosure 31 has a first opening 213a formed at the first end 213, and the second enclosure 51 has a second opening 413a formed at the third end 413. The first opening 213a and the second opening 413a are used to avoid the cooling fan 6. By providing the first opening 213a and the second opening 413a to avoid the cooling fan 6 located between the first end 213 and the third end 413, interference between the cooling fan 6 and the first enclosure 31 and the second enclosure 51 during installation can be reduced. Furthermore, along the direction from the first substrate 21 to the second substrate 41, a portion of the cooling fan 6 can be located within the first opening 213a and / or the second opening 413a. This allows the cooling fan 6 to be closer to the first surface 211 of the first substrate 21 and / or the third surface 411 of the second substrate 41. This reduces the gap between the first substrate 21 and the second substrate 41, making the overall layout of the first circuit board 2, the second circuit board 4, and the cooling fan 6 more compact and saving space.

[0058] In some embodiments, along the direction from the first substrate 21 to the second substrate 41 , two opposite ends of the cooling fan 6 are at least partially located in the first opening 213 a and the second opening 413 a , respectively.

[0059] See also Figure 2-3 and Figure 7 In some embodiments, the first substrate 21 is generally square. The first enclosure 3 includes a first portion 3a and a second portion 3b extending along the first direction X, and a third portion 3c extending along the second direction Y. The first portion 3a and the second portion 3b are disposed opposite each other on parallel edges of the first substrate 21 along the second direction Y. The first opening 213a and the third portion 3c are disposed opposite each other on parallel edges of the first substrate 21 along the first direction X.

[0060] In some embodiments, the first portion 3a, the second portion 3b and the third portion 3c are all generally L-shaped long strips to match the right-angled corners between the outer wall between the first surface 211 and the second surface 212 and the second surface 212 in the square plate-shaped first substrate 21.

[0061] In some embodiments, the second substrate 41 is generally square. The second enclosure 5 includes a fourth portion 5a and a fifth portion 5b extending along the first direction X, and a sixth portion 5c extending along the second direction Y. The fourth portion 5a and the fifth portion 5b are disposed opposite each other on two parallel edges of the first substrate 21 along the second direction Y. The second opening 413a and the sixth portion 5c are disposed opposite each other on two parallel edges of the second substrate 41 along the first direction X.

[0062] In some embodiments, the fourth part 5a, the fifth part 5b and the sixth part 5c are all generally L-shaped long strips to match the right-angle corner between the outer wall between the third surface 411 and the fourth surface 412 and the fourth surface 412 in the second substrate 41 which is a square plate.

[0063] See also Figure 4 and Figure 8 In some embodiments, during the production of the power module 1000, to reduce the risk of potting compound overflowing through the first opening 213a, a first barrier tape 24 is attached to the first surface 211 before potting. The first barrier tape 24 seals the first opening 213a to prevent potting compound from overflowing. After potting is complete, the first barrier tape 24 is removed. The first barrier tape 24 includes, but is not limited to, a foam strip made of EVA (ethylene vinyl acetate).

[0064] In some embodiments, during the production process of the power module 1000, to reduce the risk of potting compound overflowing through the second opening 413a, a second barrier tape 44 is attached to the third surface 411 before potting. The second barrier tape 44 seals the second opening 413a to prevent the potting compound from overflowing. After potting is complete, the second barrier tape 44 is removed. The second barrier tape 44 includes, but is not limited to, EVA (ethylene vinyl acetate) foam.

[0065] Based on the same inventive concept, an embodiment of the present application further provides a charging pile, comprising the power module 1000 in any of the above embodiments.

[0066] The above description is merely an embodiment of the present application and does not limit the patent scope of the present application. Any equivalent structure or equivalent process transformation made using the contents of the present application specification and drawings, or directly or indirectly applied in other related technical fields, are also included in the patent protection scope of the present application.

Claims

1. A power module, characterized in that: include: case; a first circuit board disposed in the housing, the first circuit board comprising a first substrate and a first electronic device, the first substrate comprising a first surface and a second surface disposed opposite to each other, the first electronic device being disposed on the first surface; The first enclosure includes a first enclosure portion, a first end of the first enclosure portion is adhered and fixed to the outer wall of the first substrate between the first surface and the second surface, and a second end of the first enclosure portion protrudes from the first surface along the direction from the second surface to the first surface. The first enclosure portion is arranged around at least part of the periphery of the first substrate.

2. The power module according to claim 1, wherein: The first enclosure further includes a first fixing portion, a first end of the first fixing portion is connected to the first end of the first enclosing portion, and a second end of the first fixing portion is adhered and fixed to the edge of the second surface.

3. The power module according to claim 2, wherein: The first fixing portion is extended along at least a portion of the periphery of the second surface, and the first enclosing portion is formed by bending a first end of the first fixing portion along the second surface toward the first surface and then extending.

4. The power module according to claim 1, wherein: A first connector is provided on the first surface of the first circuit board, a first avoidance gap is provided on the first enclosing portion, and one end of the first connector is passed through the first avoidance gap.

5. The power module according to any one of claims 1 to 4, characterized in that: The housing further includes a second circuit board, the second circuit board being disposed in the housing, the second circuit board being disposed opposite to the first circuit board, the second circuit board including a second substrate and a second electronic device, the second substrate including a third surface and a fourth surface disposed opposite to each other, the third surface being disposed opposite to the first surface, and the second electronic device being disposed on the third surface; The power module also includes a second enclosure, which includes a second enclosure portion. A first end of the second enclosure portion is adhered and fixed to the outer wall of the second substrate between the third surface and the fourth surface. Along the direction from the fourth surface to the third surface, the second end of the second enclosure portion protrudes from the third surface. The second enclosure portion is arranged around at least part of the periphery of the second substrate.

6. The power module according to claim 5, characterized in that: The second enclosure further includes a second fixing portion, a first end of the second fixing portion is connected to the first end of the second enclosing portion, and a second end of the second fixing portion is adhered and fixed to the edge of the fourth surface.

7. The power module according to claim 6, characterized in that: The second fixing portion is extended along at least a portion of the periphery of the fourth surface, and the second enclosing portion is formed by bending a first end of the second fixing portion and extending along the fourth surface toward the third surface.

8. The power module according to claim 5, characterized in that: A second connector is provided on the third surface of the second circuit board, a second avoidance gap is provided on the second enclosed portion, and one end of the second connector is passed through the second avoidance gap.

9. The power module according to claim 5, characterized in that: The first substrate has a first end and a second end opposite to each other along a first direction, and the second substrate has a third end and a fourth end opposite to each other along the first direction, wherein the first direction is perpendicular to a direction from the first substrate to the second substrate; The power module includes a cooling fan, which is arranged in the housing. Along the direction from the first substrate to the second substrate, the cooling fan is at least partially located between the first end and the third end. The first enclosure forms a first opening at the first end, and the second enclosure forms a second opening at the third end.

10. The power module according to claim 9, characterized in that: One end of the cooling fan is located in the first opening along the direction from the first substrate to the second substrate; and / or Along the direction from the first substrate to the second substrate, the other end of the heat dissipation fan is located in the second opening.

Images