UV (ultraviolet) ink hole plugging device for PCB (printed circuit board) solder mask treatment

Abstract

The utility model discloses a UV (ultraviolet) ink hole plugging device for PCB (printed circuit board) resistance welding treatment, and relates to the technical field of PCB resistance welding treatment. A platform is fixedly connected to the side end of a UV ink hole plugging device, a base table is connected to the bottom end of the UV ink hole plugging device in a matched mode, an air outlet groove is longitudinally formed in the platform, a spray head is slidably connected in the base table, a spray groove is formed in the spray head, a feeding hole is formed in the top end of the spray head, an exhaust plate is slidably connected in the spray groove, and the diameter of the exhaust plate is larger than the inner diameter of the feeding hole. The bottom end of the exhaust plate is fixedly connected with a control rod; the UV printing ink filling device has the beneficial effects that UV printing ink enters the spraying groove along with the exhaust plate, when the exhaust plate penetrates through the welding hole, the exhaust plate exhausts air in the welding hole, the air is finally exhausted from the air outlet groove, the exhaust plate achieves the effect of exhausting the air, the phenomenon that the air cannot occur during UV printing ink filling is avoided, and the sufficiency of UV printing ink filling is guaranteed.

Description

Technical Field

[0001] The utility model belongs to the field of solder resist processing of PCB boards, and particularly relates to a UV ink hole plugging device for solder resist processing of PCB boards. Background Art

[0002] PCB solder mask treatment refers to the process of applying solder mask to the soldered parts after the soldering is completed on the PCB to protect the solder joints and wires, prevent oxidation, corrosion and the influence of the external environment, and improve the reliability and durability of the PCB. Solder mask treatment is usually to coat a layer of special solder mask on the PCB.

[0003] In the prior art, in order to prevent solder mask material from entering the solder holes of electronic components on a PCB board, a UV ink plugging device is often used for solder mask treatment. The PCB board is placed on the device platform, and the nozzle on the UV ink plugging device is aimed at the solder holes on the PCB board to spray UV ink. The UV ink fills the solder holes, and then a scraper is used to smooth the UV ink, thereby achieving solder mask treatment on the solder holes.

[0004] However, after the nozzle is aligned with the solder holes on the PCB board to spray UV ink, since the PCB board is placed on the device platform, when the UV ink enters the solder holes, the air in the solder holes will not be discharged from the bottom of the solder holes in time, which causes the UV ink to have air in the solder holes, resulting in insufficient filling of the solder holes by the UV ink, affecting the effect of the UV ink plugging device on the solder mask treatment of the PCB board. Utility Model Content

[0005] The present invention aims to solve at least one of the technical problems existing in the prior art. To this end, the present invention provides a UV ink hole plugging device for solder mask treatment on PCB boards. The UV ink hole plugging device for solder mask treatment on PCB boards solves the problem that after a nozzle is aligned with a solder hole on a PCB board to spray UV ink, the PCB board is placed on the device platform and the air in the solder hole is not promptly discharged from the bottom of the solder hole when the UV ink enters the solder hole. This causes air to remain in the solder hole, resulting in insufficient filling of the solder hole with the UV ink, and thus affecting the effectiveness of the UV ink hole plugging device in treating the solder mask on the PCB board.

[0006] To achieve the above-mentioned object, according to an embodiment of the first aspect of the present invention, a UV ink via plugging device for solder mask treatment of a PCB is provided, comprising:

[0007] A UV ink plugging device, wherein the side end of the UV ink plugging device is fixedly connected to a platform, the bottom end of the UV ink plugging device is cooperatively connected to a base, and the platform is longitudinally provided with an air outlet groove;

[0008] A nozzle, which is slidably connected to the base, has a nozzle slot inside, and a feed hole at the top of the nozzle; and

[0009] The exhaust plate is slidably connected in the spray slot, the diameter of the exhaust plate is larger than the inner diameter of the feed hole, and the bottom end of the exhaust plate is fixedly connected with a control rod.

[0010] As a further solution of the present invention: the two ends of the platform are respectively fixedly connected with fixed brackets, the top of the platform is abutted and connected with a PCB board, the PCB board is longitudinally opened with a plurality of welding holes, the top of the PCB board is abutted and connected with the nozzle, the welding holes are communicated with the spray slot, and the welding holes are slidably connected with the exhaust plate.

[0011] As a further solution of the present invention: the fixing bracket is longitudinally provided with a threaded hole at one end close to the PCB board, a threaded rod is threadedly connected in the threaded hole, a fixing seat is fixedly connected to the bottom end of the threaded rod, and the fixing seat is abutted against the PCB board.

[0012] As a further solution of the present invention: a sealing gasket is fixedly connected to the bottom end of the nozzle, and the sealing gasket is abutted against the PCB board.

[0013] As a further solution of the present invention: the control rod is connected to a limit plate in a direction perpendicular to the horizontal plane of the platform, both ends of the limit plate are fixedly connected to the inner wall of the platform, and the limit plate is in abutting connection with the exhaust plate.

[0014] As a further solution of the present invention: a plurality of limiting holes are longitudinally opened on the limiting plate, and the limiting holes are slidably connected to the control rod.

[0015] Compared with the prior art, the beneficial effects of the present invention are:

[0016] 1. Control the control lever to insert the exhaust plate into the nozzle. The exhaust plate and the top of the nozzle are against each other. The base moves the nozzle downward to prepare for spraying. The nozzle drives the sealing gasket to move downward. The nozzle and the sealing gasket are against the PCB board. The solder hole and the spray slot are connected to each other. Since the diameter of the exhaust plate is larger than the inner diameter of the feed hole, the top of the nozzle limits the exhaust plate, and the exhaust plate blocks the feed hole to prevent air from entering the base. Control the control lever to pull the exhaust plate downward. The exhaust plate slides along the inner wall of the nozzle and the exhaust plate discharges the air in the spray slot downward.

[0017] 2. UV ink follows the exhaust plate into the spray tank. When the exhaust plate passes through the welding hole, the exhaust plate discharges the air in the welding hole, and the air is finally discharged from the air outlet slot. The exhaust plate achieves the effect of exhausting air, avoiding the phenomenon of air appearing when UV ink is filled, and ensuring the adequacy of UV ink filling. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 It is a schematic diagram of the overall structure of the utility model;

[0019] Figure 2 The left side diagram is the overall structure of the utility model;

[0020] Figure 3 This is the AA cross-sectional view of the overall structure of the utility model;

[0021] Figure 4 This is a schematic diagram of the nozzle structure of the utility model.

[0022] Illustration: 1. UV ink plugging device; 2. Threaded rod; 3. Fixed bracket; 4. Fixed seat; 5. Platform; 6. PCB board; 7. Solder hole; 8. Base; 9. Control rod; 10. Threaded hole; 11. Limit plate; 12. Limit hole; 13. Exhaust plate; 14. Nozzle; 15. Spray slot; 16. Feed hole; 17. Sealing gasket; 18. Exhaust slot. DETAILED DESCRIPTION

[0023] The following will clearly and completely describe the technical solutions of the present invention in conjunction with the embodiments. Obviously, the embodiments described are only a part of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0024] like Figures 1 to 4 As shown, the UV ink plugging device for PCB board solder mask treatment includes: a UV ink plugging device 1, a nozzle 14 and an exhaust plate 13,

[0025] The side end of the UV ink plugging device 1 is fixedly connected to a platform 5, and the bottom end of the UV ink plugging device 1 is cooperatively connected to a base 8. The platform 5 is longitudinally provided with an air outlet groove 18. The platform 5 has a bearing function. Compared with the traditional bearing method, the platform 5 is longitudinally provided with an air outlet groove 18. The air outlet groove 18 facilitates the discharge of air and avoids the phenomenon that the platform 5 forms an air barrier. The base 8 can move along the top of the UV ink plugging device 1. The specific working principle belongs to the existing technology and will not be described in detail here.

[0026] The nozzle 14 is slidably connected in the base 8. A nozzle slot 15 is provided inside the nozzle 14. A feed hole 16 is provided at the top of the nozzle 14. The base 8 moves the nozzle 14 along the top of the UV ink plugging device 1. The base 8 moves the nozzle 14 downward to prepare for spraying. The nozzle 14 can deliver and spray the UV ink. The UV ink enters the nozzle 14 from the UV ink plugging device 1 through the feed hole 16. The UV ink is sprayed through the nozzle slot 15.

[0027] The exhaust plate 13 is slidably connected in the spray slot 15. The diameter of the exhaust plate 13 is larger than the inner diameter of the feed hole 16. The bottom end of the exhaust plate 13 is fixedly connected to the control rod 9. When the UV ink enters the feed hole 16, the exhaust plate 13 is held against the top of the nozzle 14. Since the diameter of the exhaust plate 13 is larger than the inner diameter of the feed hole 16, the top of the nozzle 14 limits the exhaust plate 13, and the exhaust plate 13 blocks the feed hole 16 to prevent air from entering the base 8. The control rod 9 is controlled to pull the exhaust plate 13 downward, and the exhaust plate 13 slides along the inner wall of the nozzle 14. The exhaust plate 13 discharges the air in the spray slot 15 downward, wherein the UV ink follows the exhaust plate 13 into the spray slot 15. The exhaust plate 13 achieves the effect of discharging air, avoids the phenomenon of no air appearing when the UV ink is filled, and ensures the adequacy of the UV ink filling.

[0028] In some specific embodiments, the two ends of the platform 5 are respectively fixedly connected to the fixed bracket 3, the top of the platform 5 is abutted and connected to the PCB board 6, the PCB board 6 is longitudinally opened with a plurality of welding holes 7, the top of the PCB board 6 is abutted and connected to the nozzle 14, the welding hole 7 and the spray slot 15 are communicated with each other, and the welding hole 7 is slidably connected to the exhaust plate 13. In order for those skilled in the art to better understand the working principle of the embodiment of the utility model, wherein the PCB board 6 is an existing product, when the exhaust plate 13 passes through the welding hole 7, the exhaust plate 13 discharges the air at the welding hole 7, and the air at the welding hole 7 is discharged from the air outlet groove 18. When the UV ink fills the welding hole 7, there will be no air in the welding hole 7 to affect the filling of the UV ink.

[0029] In some specific embodiments, the fixing bracket 3 is longitudinally provided with a threaded hole 10 at one end close to the PCB board 6, and a threaded rod 2 is threadedly connected to the threaded hole 10, and a fixing seat 4 is fixedly connected to the bottom end of the threaded rod 2, and the fixing seat 4 is abutted against the PCB board 6. In order to prevent the PCB board 6 from loosening and deviating when the soldering hole 7 is filled with UV ink, when the PCB board 6 is placed on the platform 5, the threaded rod 2 is rotated, and the threaded rod 2 is threadedly connected to the threaded hole 10. The threaded rod 2 drives the fixing seat 4 to move downward, and the fixing seat 4 abuts and fixes the PCB board 6. The rotation of the threaded rod 2 is stopped, and the threaded rod 2 is fixed to the fixing seat 4 by the threaded connection with the threaded hole 10, thereby preventing the PCB board 6 from deviating when the soldering hole 7 is filled with UV ink, resulting in insufficient filling of the UV ink.

[0030] In some specific embodiments, a sealing gasket 17 is fixedly connected to the bottom end of the nozzle 14, and the sealing gasket 17 is abutted against the PCB board 6. In order to prevent the UV ink from leaking from the contact point between the nozzle 14 and the PCB board 6, the sealing gasket 17 fixed at the bottom end of the nozzle 14 seals the connection between the welding hole 7 and the spray slot 15. At the same time, the sealing gasket 17 has plasticity, and the sealing gasket 17 further positions the PCB board 6 to ensure the stability of the PCB board 6 when filling with UV ink.

[0031] In some specific embodiments, the control rod 9 is connected to the limit plate 11 in a direction perpendicular to the horizontal plane of the platform 5. The two ends of the limit plate 11 are respectively fixedly connected to the inner wall of the platform 5. The limit plate 11 is abutted against the exhaust plate 13. In order to ensure the stability of the control rod 9 controlling the movement of the exhaust plate 13, the limit plate 11 provides a limiting function when the control rod 9 slides. When the exhaust plate 13 slides out of the welding hole 7, the exhaust plate 13 and the limit plate 11 abut. At the same time, the exhaust plate 13 blocks the bottom end of the welding hole 7. On the one hand, it prevents air from entering the welding hole 7 again. On the other hand, it prevents UV ink from leaking from the bottom end of the welding hole 7, thereby causing waste of UV ink filling and saving the cost of UV ink filling.

[0032] In some specific embodiments, the limiting plate 11 is longitudinally provided with a plurality of limiting holes 12, which are slidably connected to the control rod 9. The limiting plate 11 limits the control rod 9 through the limiting holes 12, thereby achieving a guiding effect when the control rod 9 controls the exhaust plate 13 to slide downward.

[0033] In order for those skilled in the art to better understand the working principle of the embodiments of the present invention, the following is an explanation in conjunction with specific application scenarios:

[0034] When the PCB board 6 is placed on the platform 5, the threaded rod 2 is rotated, the threaded rod 2 is threadedly connected with the threaded hole 10, the threaded rod 2 drives the fixing seat 4 to move downward, the fixing seat 4 holds and fixes the PCB board 6, the threaded rod 2 is stopped, the threaded rod 2 is fixed to the fixing seat 4 by the threaded connection with the threaded hole 10, the base 8 moves the nozzle 14 along the top of the UV ink plugging device 1, the control rod 9 is controlled to insert the exhaust plate 13 into the nozzle 14, the exhaust plate 13 and the top of the nozzle 14 are held against each other, the base 8 moves the nozzle 14 downward to prepare for spraying, the nozzle 14 drives the sealing gasket 17 to move downward, the nozzle 14 and the sealing gasket 17 are held against the PCB board 6, the welding hole 7 and the spray slot 15 are connected with each other, because the exhaust plate The diameter of 13 is larger than the inner diameter of the feed hole 16. Therefore, the top of the nozzle 14 limits the exhaust plate 13, and the exhaust plate 13 blocks the feed hole 16 to prevent air from entering the base 8. The control rod 9 is controlled to pull the exhaust plate 13 downward. The exhaust plate 13 slides along the inner wall of the nozzle 14, and the exhaust plate 13 discharges the air in the spray slot 15 downward. Among them, the UV ink follows the exhaust plate 13 into the spray slot 15. When the exhaust plate 13 passes through the welding hole 7, the exhaust plate 13 discharges the air in the welding hole 7, and the air is finally discharged from the air outlet groove 18. The exhaust plate 13 achieves the effect of exhausting air, avoids the phenomenon of air not appearing when the UV ink is filled, and ensures the adequacy of the UV ink filling;

[0035] Among them, when the exhaust plate 13 slides out of the welding hole 7, the exhaust plate 13 and the limit plate 11 are held against each other, and at the same time, the exhaust plate 13 blocks the bottom end of the welding hole 7, on the one hand to prevent air from entering the welding hole 7 again, and on the other hand to prevent UV ink from leaking from the bottom end of the welding hole 7, thereby causing waste of UV ink filling and saving the cost of UV ink filling. In order to prevent UV ink from leaking from the contact point between the nozzle 14 and the PCB board 6, the sealing gasket 17 fixed at the bottom end of the nozzle 14 seals the connection between the welding hole 7 and the spray slot 15. At the same time, the sealing gasket 17 has plasticity, and the sealing gasket 17 further positions the PCB board 6 to ensure the stability of the PCB board 6 when filling with UV ink. The limit plate 11 provides a limiting function when the control rod 9 slides.

[0036] The above embodiments are only used to illustrate the technical method of the present invention and are not intended to limit the present invention. Although the present invention has been described in detail with reference to the preferred embodiments, those skilled in the art should understand that the technical method of the present invention may be modified or replaced by equivalents without departing from the spirit and scope of the technical method of the present invention.

Claims

1. A UV ink plugging device for PCB board solder mask treatment, characterized in that: include: A UV ink plugging device (1), wherein a side end of the UV ink plugging device (1) is fixedly connected to a platform (5), a bottom end of the UV ink plugging device (1) is cooperatively connected to a base (8), and an air outlet groove (18) is longitudinally provided on the platform (5); A nozzle (14), wherein the nozzle (14) is slidably connected in the base (8), a nozzle slot (15) is provided inside the nozzle (14), and a feed hole (16) is provided at the top of the nozzle (14); and The exhaust plate (13) is slidably connected in the spray slot (15), the diameter of the exhaust plate (13) is larger than the inner diameter of the feed hole (16), and the bottom end of the exhaust plate (13) is fixedly connected to a control rod (9).

2. The UV ink plugging device for PCB board solder mask treatment according to claim 1, characterized in that: The two ends of the platform (5) are respectively fixedly connected to fixed brackets (3), the top end of the platform (5) is butted against a PCB board (6), the PCB board (6) is longitudinally provided with a plurality of welding holes (7), the top end of the PCB board (6) is butted against a nozzle (14), the welding holes (7) and the spray slot (15) are communicated with each other, and the welding holes (7) are slidably connected to the exhaust plate (13).

3. The UV ink plugging device for PCB board solder mask treatment according to claim 2, characterized in that: The fixing bracket (3) is longitudinally provided with a threaded hole (10) at one end close to the PCB board (6); a threaded rod (2) is internally threadedly connected to the threaded hole (10); a fixing seat (4) is fixedly connected to the bottom end of the threaded rod (2); and the fixing seat (4) is abutted against the PCB board (6).

4. The UV ink plugging device for PCB board solder mask treatment according to claim 2, characterized in that: A sealing gasket (17) is fixedly connected to the bottom end of the nozzle (14), and the sealing gasket (17) is abutted against and connected to the PCB board (6).

5. The UV ink plugging device for PCB board solder mask treatment according to claim 1, characterized in that: The control rod (9) is connected to a limit plate (11) in a direction perpendicular to the horizontal plane of the platform (5); both ends of the limit plate (11) are fixedly connected to the inner wall of the platform (5); and the limit plate (11) is abutted against the exhaust plate (13).

6. The UV ink plugging device for PCB board solder mask treatment according to claim 5, characterized in that: The limiting plate (11) is longitudinally provided with a plurality of limiting holes (12), and the limiting holes (12) are slidably connected to the control rod (9).

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