Circuit additive manufacturing device

Abstract

The utility model discloses a circuit additive manufacturing device which comprises a base station, a three-dimensional moving part is arranged on the base station, a laser device and a metal liquid drop ejector are installed on the three-dimensional moving part, the laser device comprises a laser body and a laser head, and the metal liquid drop ejector comprises a liquid storage device and an ejector head; the injection head is located under the laser head, and coaxial arrangement of the laser device and the metal liquid drop injector is achieved. The spraying head is located under the laser head, the axis of the liquid drop spraying head coincides with the axis of the laser head, metal liquid drops and laser are coaxially arranged, therefore, a metal ion solution and a laser beam can act on the same position at the same time, and only the laser needs to be controlled to induce the liquid drops of the locally deposited solution to generate chemical reaction, so that the metal liquid drops can be completely sprayed. Metal ions are rapidly reduced and deposited, the size and the shape of a copper circuit can be better controlled by accurately controlling the size and the position of liquid drops, the production cost is reduced, and the production time is shortened.

Description

Technical Field

[0001] The utility model relates to the technical field of electronic circuits, and in particular to a circuit additive manufacturing device. Background Art

[0002] With the rapid development of industries such as artificial intelligence, the digital economy, semiconductors, and autonomous driving, the market demand for printed circuit boards (PCBs) is gradually expanding due to industrial upgrading. Fabricating metal circuits on insulating materials such as glass and ceramics is crucial for the processing of automotive parts, semiconductor devices, and optical components. Traditional copper circuit fabrication methods, while widely used in industry, still suffer from issues such as limited fabrication precision, high production costs, low production efficiency, complex processes, and the need for additional electrode materials in some fabrication methods. These issues make it difficult to meet the demands of modern high-performance electronic devices for miniaturization and high quality. In contrast, laser-induced phase deposition (LIPC) technology, an emerging copper deposition method, focuses laser energy at the interface between the substrate and the deposition solution, generating a thermal effect that locally heats the deposition solution, activating redox reactions, and inducing copper deposition. This method achieves very high deposition precision, making it suitable for manufacturing processes requiring fine patterns and complex structures. It has become an important tool in modern manufacturing, playing a vital role in circuit formation. However, despite its significant advantages, LIPPC still has some shortcomings. First, due to the limitations of the laser beam, achieving uniformity and precision in local deposition during the deposition process of large areas or complex shapes is difficult. In addition, this technology uses a line-by-line deposition method during the copper deposition process, which has a relatively slow deposition speed and relatively low preparation efficiency, making it difficult to meet the needs of large-scale production. Secondly, laser heating is concentrated in a small area of the deposition solution, and the solution temperature is not easy to diffuse in time, resulting in local overheating of the solution. This local overheating effect produces a significant heat-affected zone on the surface of the substrate, which may cause thermal stress inside the material and ablation of the substrate surface. In addition, the waste residue produced by ablation will cause certain contamination in the solution, affecting the effectiveness of laser-induced metal ions. Finally, some material may not be fully applied or may fly away during the deposition process, resulting in material waste and reduced material utilization.

[0003] Therefore, how to control the uniformity of local deposition and further achieve efficient, high-quality, high-precision, and low-cost copper circuit manufacturing to meet the needs of modern electronic manufacturing and precision engineering is a key issue that needs to be solved urgently. Utility Model Content

[0004] The purpose of this utility model is to overcome the shortcomings of the above-mentioned existing technologies and provide a circuit additive manufacturing device in which droplets and lasers are coaxial, which can realize efficient, high-quality, high-precision and low-cost copper circuit manufacturing to meet the needs of modern electronic manufacturing and precision engineering fields.

[0005] The purpose of this utility model is achieved through the following technical solutions:

[0006] A circuit additive manufacturing device includes: a base, on which a three-dimensional movable part is provided, and a laser and a metal droplet ejector are installed on the three-dimensional movable part. The laser includes: a laser body and a laser head, and the metal droplet ejector includes: a liquid reservoir and an ejector head; the ejector head is located directly below the laser head, so that the laser and the metal droplet ejector are coaxially arranged; the base is also provided with a workbench for supporting a substrate to be processed.

[0007] Preferably, the three-dimensional moving component includes a Y-axis guide rail arranged on the base, a beam arranged vertically on the base, an X-axis guide rail arranged on the side of the beam and a connecting rod arranged on the X-axis guide rail; both ends of the beam are slidably connected to the Y-axis guide rail; the connecting rod is vertically and slidably arranged on the X-axis guide rail; one side of the connecting rod is provided with a Z-axis guide rail, and the laser and metal droplet ejector are slidably arranged on the Z-axis guide rail.

[0008] Preferably, the metal droplet ejector further includes a conduit and a hydraulic valve. The liquid reservoir is connected to the ejector head via the conduit. A hydraulic valve is installed at one end of the conduit close to the ejector head. The end of the ejector head is a conical outlet, and the conical outlet is extended downward to provide a liquid guide track.

[0009] Preferably, the circuit additive manufacturing device further comprises: a U-shaped fixture for fixing the injection head.

[0010] Preferably, a workbench for carrying a substrate to be processed is further provided on the base, and a driving module for driving the workbench to move along the X-axis and the Y-axis is provided between the workbench and the base.

[0011] Preferably, the crossbeam is in an inverted "concave" shape, the lower end of the crossbeam is a notch, and the workbench is arranged below the notch of the crossbeam.

[0012] Preferably, the circuit additive manufacturing device further comprises: a U-shaped fixture for fixing the injection head.

[0013] The utility model has the following advantages over the prior art:

[0014] The utility model sets the injection head directly below the laser head, and the axis of the droplet injection head coincides with the axis of the laser head, so that the metal droplets and the laser are coaxially arranged. In this way, the metal ion solution and the laser beam can act on the same position at the same time, and the target area can be quickly covered during the deposition process. It is only necessary to control the laser to induce a chemical reaction in the local deposition solution droplets to quickly reduce and deposit the metal ions to realize the additive manufacturing of the circuit of the substrate to be processed. The utility model overcomes the shortcomings of traditional laser-induced droplet deposition copper technology and provides an efficient, precise and low-cost additive manufacturing technology device for the manufacture of high-performance electronic devices and complex structures. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] The drawings constituting part of this application are provided to provide a further understanding of the present invention. The exemplary embodiments of the present invention and their descriptions are provided to explain the present invention and do not constitute an improper limitation of the present invention. In the drawings:

[0016] Figure 1 This is a structural diagram of the circuit additive manufacturing device of the present invention.

[0017] Figure 2 This is a partially enlarged view of the circuit additive manufacturing device of the present invention.

[0018] Figure 3 This is a schematic flow chart of the circuit additive manufacturing method of the present invention.

[0019] Figure 4 This is a planar circuit additive manufacturing diagram of the present invention.

[0020] Figure 5 (a) is a diagram showing the ejector head and the laser head reaching the required positions when the circuit additive manufacturing device of the present invention performs additive manufacturing on a copper circuit plane.

[0021] Figure 5 (b) is a diagram of the contact interface between the laser focused on the upper surface of the ceramic and the droplet when the circuit additive manufacturing device of the present invention performs additive manufacturing on the copper circuit plane.

[0022] Figure 5 (c) is a schematic diagram of the laser energy stimulating the redox reaction of the droplets during the additive manufacturing of the copper circuit plane by the circuit additive manufacturing device of the present invention.

[0023] Figure 5 (d) is a schematic diagram of a continuous copper circuit deposited on a deposition path during planar additive manufacturing of a copper circuit by the circuit additive manufacturing device of the present invention.

[0024] Figure 6 This is a diagram of the three-dimensional circuit additive manufacturing of the utility model.

[0025] Figure 7 (a) is a diagram showing the ejector head and the laser head reaching the required positions when the circuit additive manufacturing device of the present invention performs three-dimensional additive manufacturing on copper circuits.

[0026] Figure 7 (b) is a diagram of the contact interface between the laser focused on the upper surface of the ceramic and the droplet when the circuit additive manufacturing device of the present invention performs three-dimensional additive manufacturing on the copper circuit.

[0027] Figure 7 (c) is a schematic diagram of the laser energy stimulating the redox reaction of the droplets during the three-dimensional additive manufacturing of copper circuits by the circuit additive manufacturing device of the present invention.

[0028] Figure 7 (d) is a schematic diagram of a continuous copper circuit deposited along a deposition path during three-dimensional additive manufacturing of a copper circuit by the circuit additive manufacturing device of the present invention.

[0029] Figure 1: Base 1; Y-axis guide rail 2; crossbeam 3, X-axis guide rail 4; Z-axis connecting rod 5; laser generator 6; laser head 7; liquid reservoir 8; catheter 9; hydraulic valve 10; injection head 11; workbench 12; liquid guide rail 13; U-shaped fixture 14; substrate 15; laser 16; ceramic plate 17; cone 18; copper circuit 19. DETAILED DESCRIPTION

[0030] The present invention will be further described below with reference to the accompanying drawings and embodiments.

[0031] Figure 1 This is a structural diagram of the circuit additive manufacturing device of the present invention. Figure 2 This is a partial enlarged view of the circuit additive manufacturing device of the present invention. Figure 1-Figure 2 A circuit additive manufacturing device includes: a base 1, a three-dimensional moving part is provided on the base 1, a laser and a metal droplet ejector are installed on the three-dimensional moving part, the laser includes: a laser body 6 and a laser head 7, the metal droplet ejector includes: a liquid reservoir 8 and an ejection head 11; the ejection head 11 is located directly below the laser head 7, so that the laser and the metal droplet ejector are coaxially arranged.

[0032] In this embodiment, the injection head 11 is located directly below the laser head 7, and the axis of the droplet injection head 11 coincides with the axis of the laser head 7, so that the metal droplet and the laser are coaxially arranged. In this way, the metal ion solution and the laser beam can act on the same position at the same time, and the target area can be quickly covered during the deposition process. It is only necessary to control the laser to induce a chemical reaction in the local deposition solution droplets to quickly reduce and deposit the metal ions, thereby realizing the additive manufacturing of the circuit of the substrate to be processed. In addition, the coaxial arrangement of the metal droplet and the laser allows the metal ion solution and the laser beam to act synchronously at the same position, and the droplet is deposited directly in the target area, which can accurately control the amount of raw materials. Finally, the coaxial arrangement of the metal droplet and the laser allows the laser energy to be concentrated at the contact point between the metal droplet and the substrate, reducing the thermal impact on the surrounding area, and the droplet plays a heat dissipation role during the deposition process.

[0033] In this embodiment, the circuit additive manufacturing device is installed on a gantry frame, which provides a stable structural support for mounting the base 1 .

[0034] In this embodiment, the three-dimensional moving component includes a Y-axis guide rail 2 provided on the base 1, a crossbeam 3 provided vertically on the base 1, an X-axis guide rail 4 provided on the side of the crossbeam 3, and a connecting rod 5 provided on the X-axis guide rail 4; the two ends of the crossbeam 3 are slidably connected to the Y-axis guide rail 2 to achieve the Y-axis movement of the liquid reservoir 8 and the laser generator (laser body 6). The connecting rod 5 is vertically and slidably provided on the X-axis guide rail 4 to achieve the X-axis movement of the liquid reservoir 8 and the laser generator (laser body 6). One side of the connecting rod 5 is provided with a Z-axis guide rail, and the laser and the metal droplet ejector are slidably provided on the Z-axis guide rail to achieve the Z-axis movement of the liquid reservoir 8 and the laser generator (laser body 6).

[0035] In this embodiment, the base 1 is also provided with a worktable 11 for supporting the substrate to be processed. A drive module is provided between the worktable 11 and the base 1 to drive the worktable 11 along the X-axis and the Y-axis. The crossbeam is in an inverted concave shape, with a notch at its lower end. The worktable is positioned below the notch. An X-axis guide rail 4 is provided on the side surface of the upper end of the crossbeam 3.

[0036] In this embodiment, the laser body 6 includes an excited medium, a pump source, a resonant cavity, an optical resonant cavity, and an output coupler. The laser provides energy through the pump source, causing the atoms or molecules in the gain medium to transition to a high energy level, forming an inversion distribution. When the high-energy-level atoms or molecules spontaneously return to a low-energy level, they release photons. These photons, through stimulated radiation, cause other excited atoms or molecules to release photons of the same frequency, phase, and direction. The reflectors in the resonant cavity reflect these photons multiple times, further amplifying the number of photons, and ultimately forming a high-intensity, coherent laser beam through the output coupler to act on the interface between the droplet and the workpiece.

[0037] In this embodiment, the metal droplet ejector further includes a conduit 9 and a hydraulic valve 10. The reservoir 8 is connected to the ejector head 11 via the conduit 9. The hydraulic valve 10 is installed at one end of the conduit 9 close to the ejector head 11. The end of the ejector head 11 is a conical outlet, and the conical outlet is extended downward to provide a liquid guide track 13. The reservoir 8 is used to store the liquid to be ejected. A hydraulic valve 10 is installed between the conduit 9 and the ejector head 11 to control the flow of the liquid. When the hydraulic valve 10 is opened, the liquid in the reservoir 8 flows to the ejector head 11 through the conduit 9 under the action of gravity and hydraulic pressure. Adjusting the opening of the hydraulic valve 10 can accurately control the flow of liquid through the conduit 9, thereby adjusting the ejection rate and droplet size of the ejector head 11. The ejector head 11 is designed to be conical and the outlet is provided with an extended liquid guide track 13 so that the liquid is subjected to uniform pressure distribution, forming consistent and stable droplets, improving the ejection accuracy and reducing the retention and accumulation of liquid inside the ejector head 11, thereby reducing the risk of clogging. This design ensures that droplets are ejected at a precisely controlled rate and size, ensuring high precision and consistency in the ejection process.

[0038] In this embodiment, the metal droplet ejector's reservoir 8 is connected to the laser generator (laser body 6) and located on the connecting rod 5, enabling Z-axis movement of the reservoir 8 and the laser generator (laser body 6). The X-axis guide rail 4, Y-axis guide rail 2, and Z-axis guide rail provided in this device are used to increase the device's degrees of freedom.

[0039] In this embodiment, the circuit additive manufacturing device further includes: a U-shaped fixture 14 for fixing the injection head 11 .

[0040] See also Figure 1-Figure 3 A circuit additive manufacturing method applicable to the above-mentioned circuit additive manufacturing device includes:

[0041] S1. preparing a metal ion deposition solution for preparing a copper circuit;

[0042] S2, placing the processed substrate to be processed on the workbench 11 of the circuit additive manufacturing device;

[0043] S3. Setting a laser scanning path in the circuit additive manufacturing device and positioning the laser and the metal droplet ejector to the desired position according to the preset circuit pattern;

[0044] S4, pouring the prepared metal ion deposition solution into the liquid reservoir 8 of the circuit additive manufacturing device, and setting the liquid output of the droplet ejector;

[0045] S5. Start the laser and the metal droplet ejector, and let the liquid drip onto the substrate to be processed. At the same time, adjust the laser head 7 so that the laser is focused on the contact interface between the substrate to be processed and the droplet. Deposition is carried out along the set laser scanning path. The metal ions in the liquid undergo redox reaction and are deposited on the surface of the substrate to be processed, thereby realizing additive manufacturing of the circuit.

[0046] In this embodiment, after step S5, the following steps are further included: performing quality inspection on the substrate to ensure circuit conductivity and structural integrity, and laminating the deposited substrate to prevent oxidation of the copper circuit.

[0047] In this embodiment, the metal ion deposition solution includes at least one of a metal copper ion solution, a complexing agent, a stabilizer, and an alkaline solution.

[0048] In this embodiment, the substrate to be processed is one of glass, ceramic, glass fiber, epoxy resin, polyester resin, silicon carbide, aluminum nitride, and polyimide.

[0049] In this embodiment, the processing of the substrate to be processed includes at least one of micro / nano structure preparation, surface finishing, roughening, and surface chemical treatment.

[0050] In this embodiment, the laser light source is one of nanosecond laser, picosecond laser, and femtosecond laser; and the substrate to be processed is one of planar and three-dimensional.

[0051] The working principle of the circuit additive manufacturing method of this scheme is as follows: first, the laser scanning path is set, and the laser (laser) and metal droplet ejector are precisely positioned to the desired position according to the preset circuit pattern. The laser focus is adjusted to focus the laser on the contact interface between the upper surface of the ceramic substrate and the droplet. Then, the metal ejector and laser system (laser) are turned on simultaneously. When the hydraulic valve 10 is opened, the liquid flows from the reservoir 8 through the conduit 9 to the ejector head 11 under the action of gravity and hydraulic pressure. By adjusting the opening of the hydraulic valve 10, the liquid flow through the conduit 9 is controlled so that the ejector head 11 discharges droplets of the required size and flow rate. The laser and the metal droplet ejector are coaxially arranged, so that the metal droplets and the laser can be simultaneously applied to the same point on the substrate. The metal droplets are deposited instantly at the position where the laser is focused, similar to the layer-by-layer deposition of additive manufacturing. By planning the laser scanning path and changing the laser process parameters, the additive manufacturing of the circuit can be achieved.

[0052] Experimental data 1

[0053] See also Figure 4 、 Figure 5 (a)- Figure 5 (d) A method for planar additive manufacturing of copper circuits using the device of the present invention includes the following:

[0054] The circuit board substrate uses a 1mm thick zirconium oxide ceramic plate 17 with a thermal conductivity of 2.2-3W·(mK) -1 , size is 40×40×1mm, the deposition solution system is 20-30g / L copper sulfate, and laser 16 induction is performed using a laser machine tool with an infrared nanosecond laser wavelength of 1064λ / nm, a pulse width of 100-350ns, and a frequency of 20-1000kHz.

[0055] 1. Prepare a copper sulfate solution with a concentration of 20-30g / L; 2. Place the zirconia ceramic plate in ethanol for ultrasonic cleaning for 15 minutes, and then dry it in a drying oven for 15 minutes to ensure that there are no pollutants on the surface. Roughen the front side of the zirconia ceramic plate to be processed, and finally place the zirconia ceramic substrate flat on the surface of the workbench 11; 3. Set the laser scanning path and accurately position the laser and metal droplet ejector to the required position according to the preset circuit pattern, such as Figure 5 (a); 4. Inject the chemical deposition solution into the metal droplet reservoir 8, set the droplet ejector discharge program to set the droplet size to 20-50 μm and the flow rate to 0.2-1 m / s; 5. Simultaneously open the laser system and the hydraulic valve 10, allowing the liquid to drip onto the ceramic substrate while the laser is focused on the contact interface between the upper surface of the substrate and the droplet, as shown in FIG. Figure 5 (b) shows that the metal ions are deposited on the substrate surface by redox reaction. Figure 5 (c) and Figure 5 As shown in (d), deposition along a set scanning path can achieve additive manufacturing of circuits.

[0056] Experimental Data 2

[0057] See also Figure 6 、 Figure 7 (a)- Figure 7 (d) A method for three-dimensional additive manufacturing of copper circuits using the apparatus of the present invention includes the following:

[0058] The circuit board substrate uses a 1mm thick zirconium oxide ceramic plate 17 with a thermal conductivity of 2.2-3W·(mK) -1, a cone 18 model with a size of 40×40×1mm and an angle of 30°, a deposition solution system of 20-30g / L copper sulfate, and a laser machine tool with a UV nanosecond laser repetition frequency of 300kHz, a pulse width of 40ns, and a spot diameter of 50μm for laser 16 induction.

[0059] 1. Prepare a copper sulfate solution with a concentration of 20-30g / L; 2. Place the zirconia ceramic plate in ethanol for ultrasonic cleaning for 15 minutes. After cleaning, dry it in a drying oven for 15 minutes to ensure that there are no pollutants on the surface. Roughen the front side of the zirconia ceramic plate to be processed to increase the surface roughness and increase the contact time between the metal droplets and the substrate surface. Finally, place the zirconia ceramic substrate on a conical surface with an angle of 30°; 3. Set the laser scanning path and accurately position the laser and metal droplet ejector to the required position according to the preset circuit pattern, such as Figure 7 (a); 4. Inject the chemical deposition solution into the metal droplet reservoir 8, set the droplet ejector discharge program to set the droplet size to 20-50 μm and the flow rate to 0.5-1.5 m / s; 5. Simultaneously open the laser system and the hydraulic valve 10, allowing the liquid to drip onto the ceramic substrate while the laser is focused on the contact interface between the upper surface of the substrate and the droplet, as shown in FIG. Figure 7 As shown in (b), metal ions are deposited onto the substrate surface by redox reaction, as Figure 7 (c) and Figure 7 As shown in (d), additive manufacturing of circuits can be achieved by depositing from bottom to top along a set scanning path.

[0060] Beneficial technical effects of this utility model:

[0061] 1. The utility model arranges the metal droplet and the laser coaxially so that the metal ion solution and the laser beam act on the same position at the same time. During the deposition process, the target area can be quickly covered. It is only necessary to control the laser to induce a chemical reaction in the local deposition solution droplet to quickly reduce and deposit the metal ions. In addition, the size and shape of the copper circuit can be better controlled by precisely controlling the size and position of the droplet, thereby achieving the deposition of complex shapes and high-resolution patterns. The process steps are simplified, the equipment and process complexity are reduced, the production cost and time are reduced, and it is suitable for large-scale production needs.

[0062] 2. The method provided by the utility model can achieve synchronous deposition and uniform distribution on the substrate surface, reduce thickness fluctuation and unevenness, improve surface flatness, improve the adhesion of the copper deposit layer to the substrate, and reduce the risk of delamination and falling off.

[0063] 3. The coaxial arrangement of the metal droplet and the laser in the present invention allows the laser energy to be concentrated at the contact point between the metal droplet and the substrate, reducing the thermal impact on the surrounding area and lowering the risk of thermal deformation and damage to the substrate material.

[0064] 4. The coaxial arrangement of the metal droplets and the laser in the present invention enables the metal ion solution and the laser beam to act synchronously at the same position, and the droplets are deposited directly in the target area, which can accurately control the amount of copper material used, improve material utilization, reduce material waste and waste liquid treatment requirements, and is environmentally friendly.

[0065] The above specific implementation methods are preferred embodiments of the present invention and cannot limit the present invention. Any other changes or other equivalent replacement methods that do not deviate from the technical solution of the present invention are included in the scope of protection of the present invention.

Claims

1. A circuit additive manufacturing device, characterized in that: include: A base is provided with a three-dimensional moving part, and a laser and a metal droplet ejector are installed on the three-dimensional moving part. The laser includes: a laser body and a laser head, The metal droplet ejector comprises: a liquid reservoir and an ejection head; the ejection head is located directly below the laser head, so that the laser and the metal droplet ejector are coaxially arranged.

2. The circuit additive manufacturing device according to claim 1, characterized in that: The three-dimensional moving component includes a Y-axis guide rail arranged on the base, a beam arranged vertically on the base, an X-axis guide rail arranged on the side of the beam, and a connecting rod arranged on the X-axis guide rail; the two ends of the beam are slidably connected to the Y-axis guide rail; the connecting rod is vertically and slidably arranged on the X-axis guide rail; one side of the connecting rod is provided with a Z-axis guide rail, and the laser and metal droplet ejector are slidably arranged on the Z-axis guide rail.

3. The circuit additive manufacturing device according to claim 2, characterized in that: The metal droplet ejector further includes a conduit and a hydraulic valve. The liquid reservoir is connected to the ejector head via the conduit. A hydraulic valve is installed at one end of the conduit close to the ejector head. The end of the ejector head is a conical outlet, which is extended downward to provide a liquid guide track.

4. The circuit additive manufacturing device according to claim 2, characterized in that: The base is also provided with a workbench for carrying a substrate to be processed, and a driving module for driving the workbench to move along the X-axis and the Y-axis is provided between the workbench and the base.

5. The circuit additive manufacturing device according to claim 4, characterized in that: The crossbeam is in an inverted "concave" shape, the lower end of the crossbeam is a notch, and the workbench is arranged below the notch of the crossbeam.

6. The circuit additive manufacturing device according to claim 1, characterized in that: Also includes: U-shaped holder for fixing the spray head.

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