Wafer cutting platform

Abstract

The utility model relates to the technical field of wafer cutting, and discloses a wafer cutting platform which comprises a fixed base and a fixed plate, the fixed plate is fixedly connected with a third driving motor, the output end of the third driving motor is fixedly connected with a first bevel gear, the first bevel gear is meshed with a second bevel gear, and the second bevel gear is meshed with a third bevel gear. The second bevel gear is fixedly connected with a rotating column, the rotating column is fixedly connected with a placing frame, a second sliding groove is formed in the fixing plate, a second sliding block is slidably connected into the second sliding groove, and the second sliding block is fixedly connected with a sliding column. According to the utility model, the wafer can be effectively prevented from displacing or shaking during cutting, so that the accuracy of a cutting line is ensured, the cutting quality is improved, the rejection rate is reduced, and the cutting requirement can be met only by simply adjusting the inclination angle and the cutting position by adjusting the inclination angle of the wafer and the cutting position of the wafer; the production efficiency and the adaptability of the cutting platform are improved, and the cutting flexibility is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of wafer cutting, in particular to a wafer cutting platform. Background Art

[0002] With the rapid development of the semiconductor industry today, wafers are the basic materials for the manufacture of semiconductor devices, and the quality of their processing technology is directly related to the performance and quality of semiconductor products. Wafer cutting is a key link in the wafer processing process, and its importance is self-evident. With the continuous growth of market demand for semiconductor products, the requirements for wafer cutting technology are also getting higher and higher.

[0003] The existing technology has the following shortcomings: when cutting wafers, traditional wafer cutting platforms often only place the wafers on the cutting platform without fixing the wafers, which may cause the wafers to move during cutting, reducing the accuracy of cutting, and often cannot adjust the tilt angle and cutting position of the wafer when cutting the wafer, reducing the flexibility of wafer cutting. Therefore, it is necessary to design a wafer cutting platform. Utility Model Content

[0004] The purpose of the utility model is to solve the shortcomings of the prior art and to propose a wafer cutting platform.

[0005] In order to achieve the above-mentioned purpose, the utility model adopts the following technical solutions: a wafer cutting platform, including a fixed base and a fixed plate, the fixed plate is fixedly connected to a third drive motor, the output end of the third drive motor is fixedly connected to a first bevel gear, the first bevel gear is meshed with a second bevel gear, the second bevel gear is fixedly connected to a rotating column, the rotating column is fixedly connected to a placement rack, a second slide groove is provided on the fixed plate, a second slider is slidably connected in the second slide groove, the second slider is fixedly connected to a sliding column, the sliding column is fixedly connected to a fixed block, and the fixed block is fixedly connected to a fixed clamping block.

[0006] As a further description of the above technical solution:

[0007] The fixed base is fixedly connected to a first drive motor, an output end of the first drive motor is fixedly connected to a threaded rod, the threaded rod is threadedly connected to a threaded fixing bracket, the threaded fixing bracket is slidably connected to the fixed rod, and a cutting head is provided on the threaded fixing bracket.

[0008] As a further description of the above technical solution:

[0009] A square groove is provided on the fixed base, a second driving motor is fixedly connected in the square groove, a driving gear is fixedly connected to the output end of the second driving motor, the driving gear is meshed with a driven half gear, an arc block is fixedly connected to the driven half gear, the arc block is fixedly connected to the first slider, the fixed base is fixedly connected to the arc fixing block, a first sliding groove is provided on the arc fixing block, and the first slider is slidably connected in the first sliding groove.

[0010] As a further description of the above technical solution:

[0011] The arc block is fixedly connected to the fixed plate, the placement rack is provided with an arc chute, and a sliding column is slidably connected in the arc chute.

[0012] As a further description of the above technical solution:

[0013] The threaded rod is rotatably connected to the fixed base, and the fixed rod is fixedly connected to the fixed base.

[0014] As a further description of the above technical solution:

[0015] The fixed base is fixedly connected to the fixed leg, and the rotating column is rotatably connected to the fixed plate.

[0016] As a further description of the above technical solution:

[0017] The arc-shaped slide groove is arc-shaped, the placement rack is attached to the second sliding block, three groups of sliding columns are provided, and three groups of fixing blocks are provided.

[0018] The utility model has the following beneficial effects:

[0019] 1. In the present invention, the first bevel gear is driven to rotate by the third drive motor, thereby driving the second slider to slide in the second slide groove, and then driving the fixed block to move inward to fix and clamp the wafer to be cut, so as to effectively prevent the wafer from being displaced or shaken during cutting, thereby ensuring the accuracy of the cutting line, improving the cutting quality, and reducing the scrap rate.

[0020] 2. In the present invention, the second driving motor drives the active gear to rotate, thereby driving the fixed plate to adjust the tilt angle, and then driving the wafer clamped above to tilt and adjust the cutting angle. The first driving motor drives the threaded rod to rotate, thereby driving the cutting head provided on the threaded fixing frame to move and adjust the cutting position. By adjusting the tilt angle of the wafer and the position of cutting the wafer, it is only necessary to simply adjust the tilt angle and cutting position to meet the cutting requirements, thereby improving production efficiency and the adaptability of the cutting platform and increasing flexibility during cutting. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 This is a schematic diagram of the three-dimensional structure of a wafer cutting platform proposed in the present invention;

[0022] Figure 2 This is a schematic diagram of the partial structure of a wafer cutting platform proposed in the present invention;

[0023] Figure 3 Schematic diagram of the partial explosion structure of a wafer cutting platform proposed in this utility model Figure 1 ;

[0024] Figure 4 Schematic diagram of the partial explosion structure of a wafer cutting platform proposed in this utility model Figure 2 .

[0025] Legend:

[0026] 1. Fixed base; 2. Fixed leg; 3. First drive motor; 4. Threaded rod; 5. Threaded fixing bracket; 6. Fixed rod; 7. Cutting head; 8. Arc-shaped fixing block; 9. Second drive motor; 10. Driving gear; 11. Driven half gear; 12. Arc-shaped block; 13. First slider; 14. First slide; 15. Fixed plate; 16. Third drive motor; 17. First bevel gear; 18. Second bevel gear; 19. Rotating column; 20. Placement rack; 21. Second slide; 22. Second slider; 23. Sliding column; 24. Fixed block; 25. Fixed clamping block; 26. Arc-shaped slide; 27. Square groove. DETAILED DESCRIPTION

[0027] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0028] Reference Figures 1-4The present invention provides an embodiment of a wafer cutting platform, comprising a fixed base 1 and a fixed plate 15, the fixed plate 15 is fixedly connected to a third driving motor 16, the output end of the third driving motor 16 is fixedly connected to a first bevel gear 17, the first bevel gear 17 is meshed with a second bevel gear 18, the second bevel gear 18 is fixedly connected to a rotating column 19, and the rotating column 19 is fixedly connected to a placing frame 20. A second sliding groove 21 is provided on the fixed plate 15, and a second slider 22 is slidably connected in the second sliding groove 21. The second slider 22 is fixedly connected to a sliding column 23, and the sliding column 23 is fixedly connected to a fixed block 24, and the fixed block 24 is fixedly connected to a fixed clamping block 25. The first bevel gear 17 is driven by the third driving motor 16 to rotate, thereby driving the second slider 22 to slide in the second sliding groove 21, and then driving the fixed block 24 to move inward to fix and clamp the wafer to be cut, so that the wafer can be effectively prevented from being displaced or shaken during cutting, thereby ensuring the accuracy of the cutting line, improving the cutting quality, and reducing the scrap rate.

[0029] The fixed base 1 is fixedly connected to the first drive motor 3, the output end of the first drive motor 3 is fixedly connected to the threaded rod 4, the threaded rod 4 is threadedly connected to the threaded fixing frame 5, the threaded fixing frame 5 is slidably connected to the fixed rod 6, the threaded fixing frame 5 is provided with a cutting head 7, the fixed base 1 is provided with a square groove 27, the square groove 27 is fixedly connected to the second drive motor 9, the output end of the second drive motor 9 is fixedly connected to the driving gear 10, the driving gear 10 is engaged with the driven half gear 11, the driven half gear 11 is fixedly connected to the arc block 12, the arc block 12 is fixedly connected to the first slider 13, the fixed base 1 is fixedly connected to the arc fixed block 8, the arc fixed block 8 is provided with a first slide 14, the first slide 14 is slidably connected to the first slider 13, the arc block 12 is fixedly connected to the fixed plate 15, the placement frame 20 is provided with an arc slide 26, the arc slide 26 is slidably connected to the sliding column 23, The threaded rod 4 is rotatably connected to the fixed base 1, the fixed rod 6 is fixedly connected to the fixed base 1, the fixed base 1 is fixedly connected with the fixed leg 2, the rotating column 19 is rotatably connected to the fixed plate 15, the arc-shaped slide groove 26 is an arc, the placement rack 20 is fitted on the second slider 22, the sliding column 23 is provided with three groups, and the fixed block 24 is provided with three groups. The second driving motor 9 drives the active gear 10 to rotate, thereby driving the fixed plate 15 to adjust the tilt angle, and then driving the wafer clamped above to tilt and adjust the cutting angle. The first driving motor 3 drives the threaded rod 4 to rotate, thereby driving the cutting head 7 provided on the threaded fixing frame 5 to move and adjust the cutting position. By adjusting the tilt angle of the wafer and the position of cutting the wafer, it is only necessary to simply adjust the tilt angle and cutting position to meet the cutting requirements, thereby improving the production efficiency and the adaptability of the cutting platform and increasing the flexibility during cutting.

[0030] Working principle: First, when cutting the wafer, place the wafer on the placement rack 20, start the third drive motor 16, and the third drive motor 16 drives the first bevel gear 17 to rotate. The rotation of the first bevel gear 17 drives the second bevel gear 18 to rotate. The rotation of the second bevel gear 18 drives the rotating column 19 to rotate on the fixed plate 15. The rotation of the rotating column 19 drives the placement rack 20 to rotate. The rotation of the placement rack 20 drives the sliding column 23 to slide in the arc-shaped slide groove 26, thereby driving the second slider 22 to slide in the second slide groove 21, and then drives the fixed block 24 to move inward to fix and clamp the wafer to be cut, so as to effectively prevent the wafer from being displaced or shaken during cutting, thereby ensuring the accuracy of the cutting line, improving the cutting quality, and reducing the scrap rate. Then, start the second drive motor 9 , the second driving motor 9 drives the active gear 10 to rotate, the active gear 10 rotates and drives the driven half gear 11 to rotate and drive the first slider 13 on the arc block 12 to slide in the first slide groove 14, thereby driving the fixed plate 15 to adjust the tilt angle, and then driving the wafer clamped above to tilt and adjust the cutting angle, then, start the first driving motor 3, the first driving motor 3 drives the threaded rod 4 to rotate, the threaded rod 4 rotates and drives the threaded fixing frame 5 to slide on the fixing rod 6, thereby driving the cutting head 7 provided on the threaded fixing frame 5 to move and adjust the cutting position, by adjusting the tilt angle of the wafer and the position of cutting the wafer, it is only necessary to simply adjust the tilt angle and cutting position to meet the cutting requirements, thereby improving the production efficiency and the adaptability of the cutting platform, and increasing the flexibility during cutting.

[0031] Finally, it should be noted that the above is only a preferred embodiment of the present invention and is not intended to limit the present invention. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art can still modify the technical solutions described in the aforementioned embodiments or make equivalent replacements for some of the technical features therein. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principles of the present invention should be included in the scope of protection of the present invention.

Claims

1. A wafer cutting platform, comprising a fixed base (1) and a fixed plate (15), characterized in that: The fixing plate (15) is fixedly connected to a third drive motor (16), an output end of the third drive motor (16) is fixedly connected to a first bevel gear (17), the first bevel gear (17) is meshed with a second bevel gear (18), the second bevel gear (18) is fixedly connected to a rotating column (19), the rotating column (19) is fixedly connected to a placement frame (20), a second sliding groove (21) is provided on the fixing plate (15), a second slider (22) is slidably connected in the second sliding groove (21), the second slider (22) is fixedly connected to a sliding column (23), the sliding column (23) is fixedly connected to a fixed block (24), and the fixed block (24) is fixedly connected to a fixed clamping block (25).

2. The wafer cutting platform according to claim 1, characterized in that: The fixed base (1) is fixedly connected to a first drive motor (3), an output end of the first drive motor (3) is fixedly connected to a threaded rod (4), the threaded rod (4) is threadedly connected to a threaded fixing frame (5), the threaded fixing frame (5) is slidably connected to a fixed rod (6), and a cutting head (7) is provided on the threaded fixing frame (5).

3. The wafer cutting platform according to claim 2, characterized in that: The fixed base (1) is provided with a square groove (27), a second drive motor (9) is fixedly connected in the square groove (27), an output end of the second drive motor (9) is fixedly connected to a driving gear (10), the driving gear (10) is meshed with a driven half gear (11), the driven half gear (11) is fixedly connected to an arc block (12), the arc block (12) is fixedly connected to a first slider (13), the fixed base (1) is fixedly connected to an arc-shaped fixed block (8), a first sliding groove (14) is provided on the arc-shaped fixed block (8), and the first slider (13) is slidably connected in the first sliding groove (14).

4. The wafer cutting platform according to claim 3, characterized in that: The arc block (12) is fixedly connected to the fixed plate (15), and the placement rack (20) is provided with an arc chute (26), and a sliding column (23) is slidably connected in the arc chute (26).

5. The wafer cutting platform according to claim 4, characterized in that: The threaded rod (4) is rotatably connected to the fixed base (1), and the fixed rod (6) is fixedly connected to the fixed base (1).

6. The wafer cutting platform according to claim 5, characterized in that: The fixed base (1) is fixedly connected to a fixed leg (2), and the rotating column (19) is rotatably connected to the fixed plate (15).

7. The wafer cutting platform according to claim 6, characterized in that: The arc-shaped chute (26) is arc-shaped, the placement rack (20) is attached to the second slider (22), the sliding columns (23) are provided in three groups, and the fixing blocks (24) are provided in three groups.

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