Optocoupler support preheating table device

Abstract

The utility model relates to the technical field of optical coupler support preheating devices, in particular to an optical coupler support preheating table device. By means of the positioning assembly arranged on the heating platform, on one hand, the feeding frame can be limited to move in the direction perpendicular to the surface of the heating platform, on the other hand, the placed feeding frame can be positioned, then all sets of optocouplers are further limited through limiting blocks, and meanwhile through the cooperation of the structure of an avoiding groove, the feeding frame can be conveniently positioned. A chip and a gold thread can accurately fall into the avoiding groove, the probability that the chip and the gold thread are damaged in the preheating process is reduced, the uniqueness of the optocoupler support during placement is guaranteed through the arranged positioning needle, and therefore it is guaranteed that the chip and the gold thread accurately fall into the avoiding groove, and the chip and the gold thread are prevented from being damaged due to the fact that the placement angle is wrong; the problems that when an optocoupler support is taken and placed on a preheating platform through a feeding frame at present, chips or gold wires possibly collide or rub with the surface of the preheating platform, and therefore the chips are damaged, and the gold wires are collapsed are solved.

Description

Technical Field

[0001] The utility model relates to the technical field of optical coupling bracket preheating devices, in particular to an optical coupling bracket preheating platform device. Background Art

[0002] The production process of plastic packaging is as follows: arranging chips - preheating the frame - placing the frame into the mold - adding plastic packaging material - closing the mold for injection molding - curing - opening the mold - unloading; the frame and the loading rack need to be preheated on the preheating platform before plastic packaging. During plastic packaging, for some optocoupler brackets, when the optocoupler bracket is on the loading rack, the chip faces downward, such as LSOP4L, SOP4L and SSOP4L products. During plastic packaging, the chip faces downward and the loading rack needs to be manually moved from the preheating platform to the plastic packaging mold when loading. When the existing preheating table is in use, employees are not allowed to manually move the loading rack. At this time, the loading rack will move the product in a direction parallel to the surface of the preheating table. Since the chip is located below the frame and close to the step side of the preheating platform, the product may hit the step on the preheating platform during movement, resulting in chip damage and gold wire collapse. Or when the chip is placed on the preheating table, the loading rack may not move the optocoupler bracket perpendicular to the surface of the preheating table when placing it on the preheating table, which may also cause friction between the chip or gold wire and the surface of the preheating platform, resulting in chip damage and gold wire collapse, which directly leads to a decrease in the qualified rate of product scrap. Utility Model Content

[0003] In response to the shortcomings of the existing technology, the utility model provides an optocoupler bracket preheating table device, which solves the problem that when the optocoupler bracket is currently placed on the preheating table through a loading rack, the chip or gold wire may collide or rub with the surface of the preheating platform, thereby causing chip defects and gold wire collapse.

[0004] To achieve the above objectives, the present invention provides the following technical solutions:

[0005] An optical coupler bracket preheating platform device includes a heating platform for preheating the optical coupler bracket, wherein the heating platform is equipped with an anti-collision mechanism for preventing the optical coupler chip from colliding with the heating platform;

[0006] The method includes a positioning component for guiding the loading rack to drive the optocoupler bracket to move in a direction perpendicular to the surface of the heating platform. The heating platform is provided with several pairs of limit blocks for positioning the upper and lower sides of each group of optocouplers on the optocoupler bracket. The heating platform is also provided with an avoidance groove for avoiding the optocoupler chip and gold wire.

[0007] Preferably, the positioning assembly includes several groups of first positioning columns arranged around the heating platform for limiting the outside of the loading rack, and also includes second positioning columns arranged on the heating platform for limiting the inside of the loading rack.

[0008] Preferably, the limit blocks include several groups of first limit blocks arranged in the middle of the heating platform, and also include second limit blocks arranged on the heating platform and cooperating with the first limit blocks to fix the side of the optical coupling bracket.

[0009] Preferably, there are a plurality of avoidance grooves, which are arranged along the direction from the side close to the first limit block to the side close to the second limit block.

[0010] Preferably, two second limit blocks symmetrically distributed about the center of the heating platform are fixed with positioning pins for cooperating with positioning holes on the optical coupling bracket for positioning.

[0011] Preferably, the height of the first positioning column and the second positioning column is no less than 2 mm higher than the surface of the limiting block.

[0012] Compared with the prior art, the present invention provides an optical coupler bracket preheating platform device, which has the following beneficial effects:

[0013] 1. By setting the positioning component on the heating platform, on the one hand, it can limit the movement of the loading rack in the direction perpendicular to the surface of the heating platform. On the other hand, it can position the loading rack after it is placed, and then further limit each group of optocouplers through the limit block. At the same time, with the structure of the avoidance groove, the chip and gold wire can be accurately placed in the avoidance groove, reducing the probability of damage to the chip and gold wire during the preheating process and improving the qualified rate.

[0014] 2. The positioning pins are used to ensure the uniqueness of the placement of the optocoupler bracket. Since there are four possible ways to place the optocoupler bracket in an area, the positioning pins are used to ensure that the chip and gold wire fall accurately into the avoidance groove, preventing damage to the chip and gold wire due to incorrect placement angles.

[0015] 3. By setting up multiple avoidance grooves, on the one hand, the avoidance effect of the chip and the gold wire can be ensured, so that the chip and the gold wire are suspended in the air; on the other hand, the optocoupler bracket can be supported to a certain extent to prevent it from deformation and bending during the preheating process. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] The drawings described herein are used to provide a further understanding of the present application and constitute a part of the present application. The illustrative embodiments of the present application and their descriptions are used to explain the present application and do not constitute an improper limitation on the present application. In the drawings:

[0017] Figure 1 It is a schematic diagram of the three-dimensional structure of the utility model;

[0018] Figure 2 It is a top view of the utility model.

[0019] In the figure: 1. Heating platform; 2. Anti-collision mechanism; 21. Positioning assembly; 211. First positioning column; 212. Second positioning column; 22. Limit block; 221. First limiting block; 222. Second limiting block; 23. Avoidance groove; 24. Positioning pin. DETAILED DESCRIPTION

[0020] The following will describe the implementation methods of the present application in detail with reference to the accompanying drawings and examples, so that the implementation process of how the present application applies technical means to solve technical problems and achieve technical effects can be fully understood and implemented accordingly.

[0021] In order to solve the problem that when the current preheating platform is used, when the optical coupler bracket is taken on and placed on the preheating platform by the loading rack, the chip or gold wire may collide or rub with the surface of the preheating platform, thereby causing chip defects and gold wire collapse, this embodiment provides an optical coupler bracket preheating platform device, such as Figure 1 and Figure 2 As shown, the heating platform 1 is equipped with an anti-collision mechanism 2 for preventing the optocoupler chip from colliding with the heating platform 1. The heating platform 1 is a preheating platform. The anti-collision mechanism 2 includes a positioning component 21 for guiding the loading rack to drive the optocoupler bracket to move in a direction perpendicular to the surface of the heating platform 1, so that when the optocoupler bracket is placed on the heating platform 1 or removed from the heating platform 1, the loading rack can move with the optocoupler bracket in a direction perpendicular to the heating platform 1 until there is no risk of contact between the optocoupler bracket and the heating platform 1, thereby preventing the chip or gold wire from colliding with the surface of the preheating platform. This leads to problems of chip defects and gold wire collapse. The heating platform 1 is provided with several pairs of limit blocks 22 for positioning the upper and lower sides of each group of optocouplers on the optocoupler bracket. The heating platform 1 is also provided with an avoidance groove 23 for avoiding the optocoupler chip and the gold wire. The limit blocks 22 are used to position each group of optocouplers. When the optocoupler bracket is heated on the heating platform 1, the optocoupler chip and the gold wire can fall into the avoidance groove 23 more accurately, thereby avoiding the optocoupler chip and the gold wire from contacting the surface of the heating platform 1, thereby preventing the optocoupler chip and the gold wire from being damaged during this process to the greatest extent.

[0022] The positioning component 21 needs to be able to quickly position the optocoupler bracket and also limit the moving path of the loading rack. Therefore, the positioning component 21 includes several groups of first positioning columns 211 arranged around the heating platform 1 for limiting the outside of the loading rack, and also includes a second positioning column 212 arranged on the heating platform 1 for limiting the inside of the loading rack. The first positioning column 211 and the second positioning column 212 cooperate to achieve the positioning of the inside and outside of the loading rack on the one hand, and at the same time, the loading rack can only move in the direction perpendicular to the heating platform 1, which to a certain extent solves the problem of chip damage and gold wire collapse caused by collision or friction between the chip or gold wire and the surface of the preheating platform.

[0023] Since the optocouplers are generally presented in multiple columns, that is, multiple groups of optocouplers, on the optocoupler bracket, a corresponding structure of the limit block 22 needs to be designed when limiting the optocoupler bracket. The limit block 22 includes several groups of first limit blocks 221 arranged in the middle of the heating platform 1, and also includes a second limit block 222 arranged on the heating platform 1 and cooperating with the first limit block 221 to fix the side of the optocoupler bracket. Each group of optocouplers is limited by each group of first limit blocks 221 and second limit blocks 222 to ensure the accuracy of the optocoupler position.

[0024] When there is a single avoidance groove 23, a hollow portion may appear in the middle, which increases the probability of bending of the optocoupler bracket during the heating process. Therefore, there are several avoidance grooves 23, and they are arranged from the side close to the first limit block 221 to the side close to the second limit block 222. In this way, when the chip and the gold wire fall into the avoidance groove 23, the area between the avoidance grooves 23 will support the corresponding area on the optocoupler bracket, thereby preventing it from bending.

[0025] The front and back sides of the optocoupler bracket are relatively similar. When the optocoupler bracket is placed in the same area, there are generally four methods, namely the two square sides, and rotating 180 degrees on the front and back sides respectively, so there are a total of 4 placement methods. Therefore, a corresponding structure needs to be set to prevent it from being placed in the wrong position, such as being placed upside down, etc., which causes the chip or gold wire to hit the heating platform 1. The two second limit blocks 222 symmetrically distributed about the center of the heating platform 1 are fixed with positioning pins 24 for cooperating with the positioning holes on the optocoupler bracket. The positioning pins 24 are used to prevent the optocoupler bracket from being placed in the wrong position, thereby further ensuring that the chip or gold wire is not damaged during the processing process.

[0026] When the first positioning column 211 and the second positioning column 212 are too short, the chip or gold wire may not be completely separated from the avoidance groove 23 after the loading rack is separated from the restriction of the first positioning column 211 and the second positioning column 212, causing the chip or gold wire on the optocoupler bracket to touch the avoidance groove 23. Therefore, the height of the first positioning column 211 and the second positioning column 212 is higher than the surface of the limit block 22 by not less than 2 mm to ensure that the chip or gold wire is not damaged during the processing.

[0027] It should be noted that, in this article, the terms "comprises", "includes" or any other variations thereof are intended to cover non-exclusive inclusion, so that a process, method, article or apparatus that includes a series of elements includes not only those elements, but also includes other elements not explicitly listed, or also includes elements that are inherent to such process, method, article or apparatus.

[0028] Although the embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and variations may be made to these embodiments without departing from the principles and spirit of the present invention, and the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A preheating platform device for an optical coupler bracket, comprising a heating platform (1) for preheating an optical coupler bracket, characterized in that: The heating platform (1) is provided with an anti-collision mechanism (2) for preventing the optical coupling chip from colliding with the heating platform (1); The anti-collision mechanism (2) includes a positioning assembly (21) for guiding the loading rack to drive the optical coupler bracket to move in a direction perpendicular to the surface of the heating platform (1); the heating platform (1) is provided with a plurality of pairs of limit blocks (22) for positioning the upper and lower sides of each group of optical couplers on the optical coupler bracket; and the heating platform (1) is also provided with an avoidance groove (23) for avoiding the optical coupler chip and the gold wire.

2. The preheating stage device according to claim 1, characterized in that: The positioning assembly (21) includes a plurality of first positioning columns (211) arranged around the heating platform (1) for limiting the outside of the loading rack, and also includes a second positioning column (212) arranged on the heating platform (1) for limiting the inside of the loading rack.

3. The preheating stage device according to claim 1, characterized in that: The limit blocks (22) include a plurality of groups of first limit blocks (221) arranged in the middle of the heating platform (1), and also include second limit blocks (222) arranged on the heating platform (1) and cooperating with the first limit blocks (221) to fix the side of the optical coupling bracket.

4. The preheating stage device according to claim 3, characterized in that: There are a plurality of avoidance grooves (23), which are arranged along a direction from a side close to the first limiting block (221) to a side close to the second limiting block (222).

5. The preheating stage device according to claim 3, characterized in that: Positioning pins (24) for cooperating with positioning holes on the optical coupling bracket are fixed on two second limiting blocks (222) symmetrically distributed about the center of the heating platform (1).

6. The preheating stage device according to claim 2, characterized in that: The height of the first positioning column (211) and the second positioning column (212) is not less than 2 mm higher than the surface of the limiting block (22).

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