Preheating device for semiconductor product
By designing placement grooves and guide grooves that adapt to the volume differences of semiconductor products, combined with temperature controls and clamping grooves, the stability problem of semiconductor products during the testing process is solved, stable support and flexible temperature control are achieved, and test applicability and safety are improved.
Patent Information
- Application Number
- CN202422347598.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-09-25
- Publication Date
- 2025-08-08
- Estimated Expiration
- 2034-09-25
AI Technical Summary
During the testing process, existing semiconductor products are difficult to ensure stability due to differences in the volume of the head and feet and are susceptible to damage.
A preheating device is designed, including a mounting base and a placing plate. The placing plate is equipped with interconnected head and foot placement grooves. The head placement portion is deeper than the foot placement portion to adapt to the volume difference of semiconductor products, and is equipped with guide grooves and clamping grooves to facilitate placement and removal of the product. At the same time, temperature controls and temperature sensors are used for precise temperature control.
Improves the stability and applicability of semiconductor products during testing, ensuring that each part is stable and supports, avoids damage, and achieves flexible temperature control.
Smart Images
Figure CN223205589U_ABST
Abstract
Description
Technical Field
[0001] The present application relates to the field of semiconductor product testing technology, and in particular to a preheating device for semiconductor products. Background Art
[0002] During the production and manufacturing process of semiconductor products, it is necessary to test the semiconductor products under different temperature environments to obtain the parameter performance of the semiconductor products under different temperature environments.
[0003] In the existing technology, temperature control equipment is often used to change the temperature of semiconductor products. The temperature control equipment usually includes a temperature control unit and a placement plate. The placement plate is flat and is used to place semiconductor products. The operation of the temperature control unit can change the ambient temperature, thereby changing the temperature of the placement plate, and then placing the semiconductor products in different temperature environments for subsequent testing.
[0004] Although the above equipment can keep semiconductor products in different ambient temperatures as required, it lacks flexibility in the placement of semiconductor products. In actual operation, semiconductor products are often designed with a top-heavy structure. Figure 1 The head 101 of this type of semiconductor product 1 is larger in volume and the foot 102 is smaller in volume. The difference in volume between the head 101 and the foot 102 of the semiconductor product also leads to a difference in weight between the two parts. When it is placed on a placement board, the stability of the semiconductor product is difficult to ensure. In the subsequent testing of the semiconductor product, the various parts of the semiconductor product are difficult to obtain stable support, which can easily cause the semiconductor product to be damaged during the testing process. Utility Model Content
[0005] In order to improve the problems existing in the above-mentioned technology, the present application provides a preheating device for semiconductor products.
[0006] The present application provides a preheating device for semiconductor products using the following technical solutions:
[0007] A preheating device for semiconductor products includes a mounting seat and a placement plate. The placement plate is arranged on the mounting seat. The mounting seat is provided with a temperature control unit. The placement plate is provided with a placement groove for placing the semiconductor product. The placement groove includes a head placement part and a foot placement part that are interconnected. The depth of the head placement part is deeper than the foot placement part.
[0008] By adopting the above technical solution, the preheating device as a whole is composed of two parts: a mounting seat and a placement plate. Before testing the semiconductor product, the semiconductor can be placed in the placement groove. At this time, the head of the semiconductor product is located in the head placement part, and the foot of the semiconductor product is located in the foot placement part. The depth of the head placement part is deeper than the foot placement part, that is, there is a height difference between the placement top surface of the head placement part and the placement top surface of the foot placement part. The height difference is designed to adapt to the volume difference between the head and foot of the semiconductor product, so that the semiconductor product can be completely embedded in the placement groove, the placement top surface of the head placement part supports the head of the semiconductor product, and the placement top surface of the foot placement part supports the foot of the semiconductor product. The semiconductor product as a whole can be stably placed in the placement groove, and each part of the semiconductor product can be stably supported; after that, the temperature control unit operates to make the mounting seat reach the set temperature, so that the semiconductor product can be placed in different temperature environments for subsequent testing.
[0009] Optionally, a guide groove communicating with the placement groove is formed on the placement plate, and a cross section of the guide groove gradually increases in a direction away from the placement groove.
[0010] By adopting the above technical solution, the semiconductor product enters the placement groove through the guide groove, and the cross-section of the guide groove gradually increases in the direction away from the placement groove, that is, the guide groove is in the shape of an outward-expanding trumpet, which is conducive to the docking of the semiconductor product with the placement groove, and further facilitates the semiconductor product to enter the placement groove accurately and smoothly.
[0011] Optionally, two groups of clamping grooves are provided on the placement plate, the two groups of clamping grooves are arranged opposite to each other and are located on both sides of the placement groove, and the clamping grooves are communicated with the placement groove.
[0012] By adopting the above technical solution, after the test of the semiconductor product is completed, the semiconductor product needs to be taken out from the placement tank. At this time, a specific clamping device is often used to perform this operation. Therefore, a clamping groove is set in the placement tank to remove the semiconductor product.
[0013] Optionally, two groups of the clamping grooves are opened on both sides of the head placement portion and are connected to the head placement portion.
[0014] By adopting the above technical solution, the semiconductor product has a large head and a small foot. Therefore, the weight of the semiconductor product head will be heavier than the foot. Therefore, the clamping grooves are set on both sides of the head placement part. When the semiconductor product is taken out from the placement groove, the head of the semiconductor product is mainly clamped, thereby making the overall force of the semiconductor product when it is removed more balanced, thereby improving the stability of the semiconductor product during the removal process.
[0015] Optionally, the temperature control unit includes a plurality of temperature control plates arranged in the mounting base, and the temperature control plates are connected to a control system via cables.
[0016] By adopting the above technical solution, the temperature control piece is energized through the cable to make it reach the set temperature, and then the mounting seat reaches the set temperature. Since the temperature control piece is arranged in the mounting seat, the temperature emitted by the temperature control piece can be transmitted to the mounting seat as directly as possible, and the mounting seat then transmits the temperature to the placement plate, so that the semiconductor product in the placement slot is in the set temperature environment, avoiding the temperature from being disturbed by external factors; in addition, there are multiple temperature control pieces and they are dispersedly arranged in the mounting seat, so that the temperature can be evenly and dispersedly transmitted to the mounting seat, so that the temperature in each area of the mounting seat is evenly distributed, which is conducive to the semiconductor product being in a balanced and stable temperature environment.
[0017] Optionally, a temperature sensor is provided in the mounting base, and the temperature sensor is electrically connected to the control system.
[0018] By adopting the above technical solution, the temperature sensor is used to sense the temperature of the mounting base. When the temperature sensor senses that there is a large difference between the ambient temperature and the set value, the temperature sensor outputs a signal, and the control system receives the signal to control the temperature of the temperature control plate through the cable, thereby regulating the ambient temperature to ensure that the ambient temperature is within the control range and avoid large deviations in the ambient temperature.
[0019] Optionally, a plurality of temperature sensors are provided, and each temperature sensor corresponds to a temperature control plate.
[0020] By adopting the above technical solution, multiple temperature sensors are provided and used to directly sense the temperature of the temperature control plate. Therefore, when any temperature control plate fails, the corresponding temperature sensor can detect it in time so that the faulty temperature control plate can be promptly repaired and replaced, thereby avoiding affecting the overall operation of the device.
[0021] Optionally, the mounting seat includes a base and a temperature control seat, the temperature control seat is arranged on the base, the placement plate and the temperature control unit are both arranged on the temperature control seat, and a sealing gasket is arranged between the base and the temperature control seat.
[0022] By adopting the above technical solution, the sealing gasket between the base and the temperature control seat can prevent temperature transfer, ensuring that the temperature can be transferred as directly as possible to the temperature control seat, and then to the placement plate, avoiding external factors from interfering with the temperature.
[0023] In summary, this application includes at least one of the following beneficial technical effects:
[0024] 1. The preheating device consists of two parts: a mounting base and a placement plate. Before testing a semiconductor product, the semiconductor can be placed in the placement slot. At this time, the head of the semiconductor product is located in the head placement portion, and the foot of the semiconductor product is located in the foot placement portion. The head placement portion is deeper than the foot placement portion, that is, there is a height difference between the placement top surface of the head placement portion and the placement top surface of the foot placement portion. This height difference is designed to accommodate the volume difference between the head and foot of the semiconductor product. This allows the semiconductor product to be fully embedded in the placement slot. The placement top surface of the head placement portion supports the head of the semiconductor product, and the placement top surface of the foot placement portion supports the foot of the semiconductor product. The semiconductor product can be stably placed in the placement slot as a whole, and all parts of the semiconductor product can be stably supported.
[0025] 2. The preheating device consists of two parts: a mounting base and a placement plate. Before testing a semiconductor product, the semiconductor can be placed in the placement slot. At this time, the head of the semiconductor product is located in the head placement portion, and the foot of the semiconductor product is located in the foot placement portion. The head placement portion is deeper than the foot placement portion, that is, there is a height difference between the placement top surface of the head placement portion and the placement top surface of the foot placement portion. This height difference is designed to accommodate the volume difference between the head and foot of the semiconductor product. This allows the semiconductor product to be fully embedded in the placement slot. The placement top surface of the head placement portion supports the head of the semiconductor product, and the placement top surface of the foot placement portion supports the foot of the semiconductor product. The semiconductor product can be stably placed in the placement slot as a whole, and all parts of the semiconductor product can be stably supported.
[0026] 3. After the test of the semiconductor product is completed, the semiconductor product needs to be taken out from the placement tank. At this time, a specific clamping device is often used to perform this operation. Therefore, a clamping groove is set in the placement tank to facilitate the removal of the semiconductor product. BRIEF DESCRIPTION OF THE DRAWINGS
[0027] Figure 1 It is a schematic diagram of a semiconductor product in an embodiment of the present application.
[0028] Figure 2 is a schematic diagram of a mounting base in an embodiment of the present application;
[0029] Figure 3 is a cross-sectional view of a mounting base in an embodiment of the present application;
[0030] Figure 4 is a schematic diagram of a placement plate in an embodiment of the present application;
[0031] Figure 5 is a partial top view of a placement plate in an embodiment of the present application;
[0032] Figure 6 yes Figure 4 Schematic diagram of the enlarged portion A.
[0033] Explanation of the accompanying drawings: 1. Semiconductor product; 101. Head; 102. Foot; 2. Mounting seat; 201. Base; 202. Temperature control seat; 3. Placement plate; 4. Placement groove; 401. Head placement part; 402. Foot placement part; 5. Guide groove; 6. Clamping groove; 7. Temperature control plate; 8. Temperature sensor; 9. Sealing gasket. DETAILED DESCRIPTION
[0034] The following is combined with Figure 2-6 This application is described in further detail.
[0035] The present application embodiment discloses a preheating device for semiconductor products. Figure 2 and Figure 3 The preheating device for semiconductor products includes a mounting base 2 and a placement plate 3. The placement plate 3 is arranged on the mounting base 2. The mounting base 2 is provided with a temperature control unit. Figure 4 and Figure 5 A placement groove 4 for placing the semiconductor product 1 is opened on the placement plate 3. The placement groove 4 includes a head placement portion 401 and a foot placement portion 402 that are interconnected. The depth of the head placement portion 401 is deeper than that of the foot placement portion 402.
[0036] Reference Figure 5 and Figure 6 The placement plate 3 is provided with a guide groove 5 that communicates with the placement slot 4. The cross-section of the guide groove 5 gradually increases as it moves away from the placement slot 4. The placement plate 3 is provided with two sets of clamping grooves 6, which are located on both sides of the head placement portion 401 and communicate with the head placement portion 401. After testing of the semiconductor product 1 is completed, the clamping grooves 6 are used to clamp the head 101 of the semiconductor product 1 and remove the semiconductor product 1 from the placement slot 4.
[0037] In the embodiment of the present application, each group of clamping grooves 6 includes two clamping grooves 6 . Therefore, in the embodiment of the present application, there are two clamping grooves 6 on both sides of each head placement portion 401 .
[0038] In the embodiment of the present application, in order to improve the efficiency of testing the semiconductor product 1, a plurality of placement slots 4 are provided on the placement plate 3, thereby enabling the testing of a plurality of semiconductor products 1 to be performed simultaneously.
[0039] In an embodiment of the present application, the placement plate 3 is fixed to the mounting seat 2 by welding, and the bottom surface of the placement plate 3 is in contact with the top surface of the mounting seat 2; in other embodiments, the connection between the placement plate 3 and the mounting seat 2 can be performed by a detachable connection such as rivets or bolts.
[0040] Reference Figure 2and Figure 3 The mounting base 2 includes a base 201 and a temperature control base 202. The temperature control base 202 is arranged on the base 201. The placement plate 3 is fixed on the temperature control base 202. The temperature control unit includes a plurality of dispersed temperature control pieces 7 arranged in the temperature control base 202. The temperature control piece 7 is connected to a control system (not shown in the figure) through a cable (not shown in the figure); a plurality of temperature sensors 8 are arranged in the temperature control base 202. Each temperature sensor 8 corresponds to a temperature control piece 7 and is electrically connected to the control system. The cable is energized to make the temperature control piece 7 reach the set temperature. Since there are multiple temperature control pieces 7 and they are dispersedly arranged in the temperature control seat 202, the temperature can then be evenly and dispersedly transmitted to the temperature control seat 202 to make the temperature control seat 202 reach the set temperature. The temperature control seat 202 then transmits the temperature to the placement plate 3 to make the semiconductor product 1 in the placement slot 4 be in the set temperature environment; the temperature sensor 8 is used to sense the temperature of the temperature control piece 7. When the temperature sensor 8 senses that there is a large difference between the temperature of the temperature control piece 7 and the set value, the temperature sensor 8 outputs a signal, and the control system receives the signal to control the temperature of the temperature control piece 7 through the cable, thereby regulating the ambient temperature to ensure that the ambient temperature is within the control range and avoid large deviations in the ambient temperature.
[0041] The implementation principle of a preheating device for semiconductor products in the embodiment of the present application is as follows: the preheating device as a whole is composed of two parts: a mounting seat 2 and a placement plate 3. Before testing the semiconductor product 1, the semiconductor can be placed in the placement groove 4. At this time, the head 101 of the semiconductor product 1 is located in the head placement part 401, and the foot 102 of the semiconductor product 1 is located in the foot placement part 402. The depth of the head placement part 401 is deeper than the foot placement part 402, that is, there is a height difference between the placement top surface of the head placement part 401 and the placement top surface of the foot placement part 402. The height difference is to adapt to the head 101 of the semiconductor product. 1 and the foot 102, so that the semiconductor product 1 can be completely embedded in the placement groove 4, the placement top surface of the head placement part 401 supports the head 101 of the semiconductor product 1, and the placement top surface of the foot placement part 402 supports the foot 102 of the semiconductor product 1. The semiconductor product 1 as a whole can be stably placed in the placement groove 4, and all parts of the semiconductor product 1 can be stably supported; after this, the temperature control piece 7 operates to make the mounting seat 2 reach the set temperature, thereby allowing the semiconductor product 1 to be placed in different temperature environments for subsequent testing.
[0042] The preheating device involved in the present application is particularly suitable for tests that require changing the ambient temperature to test the performance of a semiconductor product 1, such as normal temperature testing, high temperature testing, and low temperature testing. By designing a placement plate 3 with grooves of different depths, the applicability and stability of the semiconductor product 1 test are improved. At the same time, combined with the heating and cooling functions, flexible temperature control is achieved to meet the needs of different test environments.
[0043] The above are all preferred embodiments of the present application, and are not intended to limit the scope of protection of the present application. Therefore, any equivalent changes made based on the structure, shape, and principle of the present application should be included in the scope of protection of the present application.
Claims
1. A preheating device for semiconductor products, characterized in that: The device comprises a mounting seat (2) and a placement plate (3), wherein the placement plate (3) is arranged on the mounting seat (2), a temperature control unit is provided on the mounting seat (2), and a placement groove (4) for placing a semiconductor product (1) is provided on the placement plate (3), wherein the placement groove (4) comprises a head placement portion (401) and a foot placement portion (402) which are interconnected, and the depth of the head placement portion (401) is deeper than that of the foot placement portion (402).
2. A preheating device for semiconductor products according to claim 1, characterized in that: The placement plate (3) is provided with a guide groove (5) communicating with the placement groove (4), and the cross section of the guide groove (5) gradually increases in a direction away from the placement groove (4).
3. The preheating device for semiconductor products according to claim 1, characterized in that: Two groups of clamping grooves (6) are provided on the placement plate (3), the two groups of clamping grooves (6) are arranged opposite to each other and are located on both sides of the placement groove (4), and the clamping grooves (6) are communicated with the placement groove (4).
4. A preheating device for semiconductor products according to claim 3, characterized in that: The two groups of clamping grooves (6) are opened on both sides of the head placement portion (401) and are connected to the head placement portion (401).
5. The preheating device for semiconductor products according to claim 1, characterized in that: The temperature control unit comprises a plurality of temperature control sheets (7) arranged in the mounting seat (2), and the temperature control sheets (7) are connected to a control system via cables.
6. A preheating device for semiconductor products according to claim 5, characterized in that: A temperature sensor (8) is provided in the mounting seat (2), and the temperature sensor (8) is electrically connected to the control system.
7. A preheating device for semiconductor products according to claim 6, characterized in that: A plurality of temperature sensors (8) are provided, and each temperature sensor (8) corresponds to a temperature control plate (7).
8. The preheating device for semiconductor products according to claim 1, characterized in that: The mounting seat (2) comprises a base (201) and a temperature control seat (202); the temperature control seat (202) is arranged on the base (201); the placement plate (3) and the temperature control unit are both arranged on the temperature control seat (202); and a sealing gasket (9) is arranged between the base (201) and the temperature control seat (202).