Crimping temperature control device for chip testing and testing device

Abstract

The utility model provides a crimping temperature control device for chip testing, and the device comprises a pressure head assembly which comprises a plurality of sub pressure heads, and the plurality of sub pressure heads are arranged at intervals, are used for pressing and contacting different positions of a to-be-tested chip, and are used for achieving the temperature control of the different positions of the to-be-tested chip; and the adjusting assembly is connected with or is in pressing contact with the pressing head assembly, and is used for transmitting pressure to the pressing head assembly, so that the plurality of sub-pressing heads are in pressing contact with different positions of the chip to be tested.

Description

Technical Field

[0001] The present disclosure relates to the technical field of chip testing, and more particularly, to a compression temperature control device and a testing device for chip testing. Background Art

[0002] In today's era of big data and cloud computing, AI (artificial intelligence) chips, exemplified by graphics processing units (GPUs), have evolved into bare-die (FCBGA) Flip Chip Ball Grid Array (FCBGA) packaging to cope with the high heat generated by high computing power. This chip format dispenses with the integrated heat spreader (IHS) required of traditional lidded die chips. Instead, a heat sink is directly attached to the bare die after thermal interface material is added, improving heat dissipation efficiency. However, the lack of a heat spreader compresses chip warpage, forcing it to be considered in practical heat dissipation and temperature control solutions.

[0003] Chip warpage is primarily caused by two factors: first, due to the stress difference between the packaging material and the chip itself, the substrate shrinks after bonding, causing warpage in the bare chip. Second, when the bare chip operates at full power, its heat-generating areas expand and contract, causing more severe warpage than a covered chip. With the continuous advancement of AI chips, these two unfriendly changes have made the impact of chip warpage more pronounced. One change is the increasing size of chips. Compared to 561mm² ten years ago, today's top-tier GPUs have exceeded the 3000mm² mark. Furthermore, with the promotion of 2.5D and 3D CoWos (Chip On Wafer On Substrate, CoWos) packaging technologies and the addition of new HBM (High Bandwidth Memory, HBM) units, the bare chip area has exceeded the limits of wafer processing. (Typically, foundries are limited by the single-shot exposure capabilities of lithography machines, with the maximum size of a single die being around 26 x 33mm.) Such a large surface creates an extremely complex mechanical environment, making the chip more fragile. Differences in heat dissipation across different regions also create significant challenges for temperature control and heat conduction. Another change is the increasing heat generated by chips. Ten years ago, the thermal design power (TDP) of top-tier GPUs was only 235W. Today, this parameter has skyrocketed to 600W or even higher. Such a high TDP inevitably leads to a sharp increase in chip heat generation.

[0004] Therefore, how to adapt to the external characteristics of the "bare chip" and effectively carry out temperature control based on local power consumption differences has become a difficult problem that must be overcome during the chip testing phase, especially chip mass production testing. Utility Model Content

[0005] The present disclosure provides a pressing temperature control device and a testing device for chip testing to solve the problem of how to adapt to the conditions on the chip surface during chip testing, achieve good contact between the pressing head assembly and different positions on the chip surface, and better carry out temperature control of the chip.

[0006] According to a first aspect of the present disclosure, a pressing temperature control device for chip testing is provided, the device comprising: a pressing head assembly, the pressing head assembly comprising a plurality of sub-pressing heads, the plurality of sub-pressing heads being arranged at intervals, for pressing and contacting different positions of a chip to be tested, and for achieving temperature control of different positions of the chip to be tested; and an adjusting assembly, the adjusting assembly being connected to or pressing and contacting the pressing head assembly, and for transmitting pressure to the pressing head assembly, so as to achieve pressing and contacting of the plurality of sub-pressing heads with different positions of the chip to be tested.

[0007] In this device, by setting up multiple independent sub-pressing heads and adjustment components, during the chip testing process, the press head component can adapt to the conditions of the chip surface, achieve good contact with different positions on the chip surface, and better control the temperature of the chip.

[0008] In a possible implementation manner, the plurality of sub-indenters have the same length and shape.

[0009] In a possible embodiment, a temperature sensor is provided at one end of the plurality of sub-pressing heads facing the chip to be tested, so as to obtain temperature information of different positions of the chip to be tested through the temperature sensor.

[0010] In one possible embodiment, the device further includes: multiple controllers, the multiple sub-pressing heads are correspondingly connected to the multiple controllers, and the multiple controllers are used to control the temperatures of the multiple sub-pressing heads respectively according to the temperature information, thereby realizing independent control of the temperatures of different positions of the chip to be tested.

[0011] In this embodiment, each sub-head is equipped with an independent temperature controller, which can realize independent temperature increase or decrease, thereby achieving precise control of the temperature at different positions of the chip.

[0012] In another possible embodiment, the device further includes: a controller, the multiple sub-pressing heads are connected to the controller, and the controller is used to uniformly control the temperatures of the multiple sub-pressing heads according to the temperature information, thereby achieving unified control of the temperatures of different positions of the chip to be tested.

[0013] In this embodiment, multiple sub-pressure heads are connected to the same controller, and the controller can perform overall control of the chip temperature based on the temperature information at different positions of the chip, such as taking the median or average of all temperature information to take into account the temperature information at more positions on the chip surface, but the implementation method is simpler.

[0014] In one possible embodiment, the adjustment component is a hydraulic component, which is connected to or pressed into contact with the pressure head component and is used to transmit pressure to the pressure head component to achieve that the multiple sub-pressure heads press into contact with different positions of the chip to be tested, and the pressure at different positions of the chip to be tested is uniform.

[0015] In this embodiment, through the hydraulic component, during the chip testing process, the pressure head assembly can adapt to the conditions of the chip surface, achieve good contact with different positions on the chip surface, and better control the temperature of the chip; and the pressure head assembly can achieve uniform pressure distribution at various positions of the chip to be tested, and finally convert it into uniform pressure on the entire surface of the chip, thereby avoiding damaging the chip.

[0016] In a possible embodiment, the hydraulic assembly includes a hydraulic pack, and the hydraulic pack is disposed at one end of the plurality of sub-pressing heads away from the chip to be tested, and is connected to or in tight contact with the plurality of sub-pressing heads.

[0017] In one possible embodiment, the hydraulic bag is filled with a chemically stable liquid or a mixture of a chemically stable liquid and gas.

[0018] In a possible embodiment, the outer covering material of the hydraulic pack includes at least one of high-temperature resistant high-density plastic or high-temperature resistant rubber.

[0019] In one possible embodiment, the hydraulic assembly further includes a frame, which includes a hydraulic cavity for accommodating the hydraulic pack, and a bottom plate of the hydraulic cavity is provided with a plurality of first through holes, one end of the plurality of sub-pressure heads passes through the plurality of first through holes for pressing and contacting the chip to be tested, and the other end is connected to or pressed and contacted with the hydraulic pack.

[0020] In one possible embodiment, the volume of the hydraulic bag is adapted to the volume of the hydraulic chamber so as to completely fill the hydraulic chamber.

[0021] In a possible embodiment, the sub-pressing head includes a press head body and a limit block, the diameter of the limit block is larger than the first through hole, and the press head body and the limit block are an integrally formed or mechanically connected structure.

[0022] In a possible embodiment, the pressing head body passes through the first through hole to be used for pressing and contacting the chip to be tested; the limiting block is assembled between the hydraulic pack and the bottom plate of the hydraulic chamber and is in pressing contact with the hydraulic pack.

[0023] In a possible embodiment, the frame further includes an upper cover for closing the hydraulic cavity to achieve a pressing contact between the hydraulic pack and the limiting block.

[0024] In one possible embodiment, the frame further includes a accommodating cavity, which is arranged adjacent to the hydraulic cavity, the top plate of the accommodating cavity being the bottom plate of the hydraulic cavity, the bottom plate of the accommodating cavity being provided with a plurality of second through holes, and the positions of the second through holes being arranged corresponding to the first through holes, and the plurality of sub-pressure heads passing through the first through holes and the second through holes for fixation.

[0025] According to the second aspect of the present disclosure, a test device for chip testing is provided, the device comprising: a pressing temperature control device as described in any one of the above items; a driving component, the driving component being used to drive the pressing temperature control device to press and contact the chip to be tested; and a test board, the board being provided with a test slot for placing the chip to be tested. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] The above and other objects, features and advantages of the exemplary embodiments of the present disclosure will become readily understood by reading the following detailed description with reference to the accompanying drawings. In the accompanying drawings, several embodiments of the present disclosure are shown in an illustrative and non-limiting manner, and the same or corresponding reference numerals represent the same or corresponding parts, wherein:

[0027] Figure 1a Shows a schematic diagram of the existing pressure head structure;

[0028] Figure 1b Shows a schematic diagram of the existing pressure head structure split into multiple sub-pressure heads;

[0029] Figure 2 1 shows a schematic structural diagram of a compression temperature control device 10 for chip testing according to one embodiment of the present disclosure;

[0030] Figure 3 A schematic diagram showing a chip test in which the compression temperature control device 11 does not fully contact the chip 300 according to an embodiment of the present disclosure;

[0031] Figure 4 A schematic diagram showing a chip 300 in full contact with a pressing temperature control device 11 for chip testing according to an embodiment of the present disclosure is shown;

[0032] Figure 5 1 shows a schematic structural diagram of a compression temperature control device 20 for chip testing according to one embodiment of the present disclosure;

[0033] Figure 6 A schematic structural diagram of a compression temperature control device 30 for chip testing according to an embodiment of the present disclosure is shown. DETAILED DESCRIPTION

[0034] The following will be combined with the accompanying drawings in the embodiments of the present disclosure to clearly and completely describe the technical solutions in the embodiments of the present disclosure. Obviously, the embodiments described are part of the embodiments of the present disclosure, not all of the embodiments. Based on the embodiments of the present disclosure, all other embodiments obtained by those skilled in the art without making any creative efforts shall fall within the scope of protection of this disclosure.

[0035] It should be understood that the terms "first," "second," "third," and "fourth," etc. in the claims, specification, and drawings of the present disclosure are used to distinguish different objects rather than to describe a specific order. "First," "second," "third," and "fourth," etc. do not simply refer to one, but may also refer to a plurality of objects. The terms "include" and "comprising" used in the specification and claims of the present disclosure indicate the presence of the described features, integers, steps, operations, elements, and / or components, but do not exclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and / or combinations thereof.

[0036] It should also be understood that the terms used in this disclosure are for the purpose of describing specific embodiments only and are not intended to limit the present disclosure. As used in this disclosure and the claims, the singular forms "a," "an," and "the" are intended to include the plural forms unless the context clearly indicates otherwise. It should further be understood that the term "and / or" as used in this disclosure and the claims refers to any and all possible combinations of one or more of the associated listed items, including and including these combinations.

[0037] As used in this specification and claims, the term "if" can be interpreted as "when" or "upon" or "in response to determining" or "in response to detecting," depending on the context. Similarly, the phrase "if it is determined" or "if [described condition or event] is detected" can be interpreted as meaning "upon determination" or "in response to determining" or "upon detection of [described condition or event]" or "in response to detecting [described condition or event]," depending on the context.

[0038] The specific embodiments of the present disclosure are described in detail below with reference to the accompanying drawings.

[0039] In today's era of big data and cloud computing, AI (artificial intelligence) chips, exemplified by graphics processing units (GPUs), have evolved into bare-die (FCBGA) Flip Chip Ball Grid Array (FCBGA) packaging to cope with the high heat generated by high computing power. This chip format dispenses with the integrated heat spreader (IHS) required of traditional lidded die chips. Instead, a heat sink is directly attached to the bare die after thermal interface material is added, improving heat dissipation efficiency. However, the lack of a heat spreader compresses chip warpage, forcing it to be considered in heat dissipation and temperature control solutions.

[0040] Chip warpage is primarily caused by two factors: first, due to the stress difference between the packaging material and the chip itself, the substrate shrinks after bonding, causing warpage in the bare chip. Second, when the bare chip operates at full power, its heat-generating areas expand and contract, causing more severe warpage than a covered chip. With the continuous advancement of AI chips, these two unfriendly changes have made the impact of chip warpage more pronounced. One change is the increasing size of chips. Compared to 561mm² ten years ago, today's top-tier GPUs have exceeded the 3000mm² mark. Furthermore, with the promotion of 2.5D and 3D CoWos (Chip On Wafer On Substrate, CoWos) packaging technologies and the addition of new HBM (High Bandwidth Memory, HBM) units, the bare chip area has exceeded the limits of wafer processing. (Typically, foundries are limited by the single-shot exposure capabilities of lithography machines, with the maximum size of a single die being around 26 x 33mm.) Such a large surface creates an extremely complex mechanical environment, making the chip more fragile. Differences in heat dissipation across different regions also create significant challenges for temperature control and heat conduction. Another change is the increasing heat generated by chips. Ten years ago, the thermal design power (TDP) of top-tier GPUs was only 235W. Today, this parameter has skyrocketed to 600W or even higher. Such a high TDP inevitably leads to a sharp increase in chip heat generation.

[0041] Existing temperature control devices for chip testing generally use a pressure head containing a heating structure and / or a refrigerant to contact the upper surface of the chip to apply pressure to the chip and perform heat exchange with the chip, so that the chip pins are reliably connected to the test board and the test temperature of the chip is stabilized within the test range. Figure 1a As shown, the indenter 100 in the existing testing equipment is a whole metal module with a fixed shape, and the lower surface of the indenter 100 can be used to contact the upper surface of the chip to facilitate heat exchange with the chip.

[0042] When testing chips, it is often desirable to maintain the same temperature across the entire chip area. This means that when measuring high temperatures, the entire chip area is maintained at the same high temperature; when measuring room temperatures, the entire chip area is maintained at the same room temperature; and when measuring low temperatures, the entire chip area is maintained at the same low temperature to meet testing requirements. However, in existing chip testing, chip warping can affect the proper contact between the chip and the indenter, resulting in good contact in some areas and poor contact in others. Temperature control is affected in areas with poor contact, leading to significant temperature differences between different chip areas, which in turn affects the validity and accuracy of chip test results, especially when measuring high temperatures.

[0043] Therefore, how to adapt to the external characteristics of the "bare chip" and effectively carry out temperature control based on local power consumption differences has become a difficult problem that must be overcome during the chip testing phase, especially chip mass production testing.

[0044] An embodiment of the present disclosure provides a pressing temperature control device for chip testing, which includes: a pressing head assembly, which includes a plurality of sub-pressing heads, and the plurality of sub-pressing heads are arranged at intervals, and are used to press and contact different positions of the chip to be tested, and to achieve temperature control of different positions of the chip to be tested; and an adjusting assembly, which is connected or press-contacted with the pressing head assembly, and is used to transmit pressure to the pressing head assembly to achieve the plurality of sub-pressing heads pressing and contacting different positions of the chip to be tested.

[0045] In this device, by setting up multiple independent sub-pressing heads and adjustment components, during the chip (or chip to be tested) testing process, the press head assembly can adapt to the conditions of the chip surface, such as warping and deformation, to achieve good contact with different positions on the chip surface, and better control the temperature of the chip.

[0046] Among them, chip testing includes chip mass production testing or chip experiments and other scenarios used to verify chip functions or performance; pressing contact includes pressing contact, clamping contact or abutment.

[0047] Furthermore, the lengths and shapes of the plurality of sub-indenters may be the same, for example, they may be rectangular or cylindrical, to facilitate mass production and assembly. Figure 1b As shown, the existing indenter 100 can be split into a plurality of rectangular or cylindrical sub-indenters.

[0048] In one embodiment, the adjustment component may include multiple independent adjustment devices, which are respectively connected or pressed into contact with multiple sub-pressing heads to adapt to the conditions of the chip surface, achieve good contact between the multiple sub-pressing heads and different positions on the chip surface, and better achieve temperature control of the chip.

[0049] In one embodiment, the adjustment assembly may be a hydraulic assembly that connects to or presses against the indenter assembly and is used to transmit pressure to the indenter assembly, thereby achieving uniform pressure across the various locations of the chip under test by applying multiple sub-indenters. In this embodiment, the hydraulic assembly allows the indenter assembly to adapt to the chip surface during chip testing, achieving good contact with various locations on the chip surface and better controlling the chip's temperature. Furthermore, the indenter assembly can evenly distribute pressure across various locations on the chip under test, ultimately converting pressure to uniform across the entire surface of the chip, thereby preventing damage to the chip.

[0050] Figure 2 FIG. 1 shows a schematic structural diagram of a compression temperature control device 10 for chip testing according to an embodiment of the present disclosure. Figure 2 As shown, the device includes: a pressing head assembly 110, which includes a plurality of sub-pressing heads 111, and the plurality of sub-pressing heads 111 are arranged at intervals, and are used to press and contact different positions of the chip to be tested 300, and to achieve temperature control of different positions of the chip to be tested 300; and a hydraulic assembly 210, which is connected to the pressing head assembly 110 and is used to transmit pressure to the pressing head assembly 110, so as to achieve the plurality of sub-pressing heads 111 pressing and contacting different positions of the chip to be tested 300, and the pressure at different positions of the chip to be tested 300 is uniform.

[0051] The plurality of sub-pressing heads 111 may be evenly spaced apart to uniformly dissipate heat across the entire area of the chip 300 .

[0052] Further Figure 2 As shown, the arrow pointing to the hydraulic assembly 210 represents the driving force acting on the crimping temperature control device 10 , which is used to drive the hydraulic assembly 210 to transmit pressure to the pressing head assembly 110 , thereby enabling the pressing head assembly 110 to press and contact the chip 300 .

[0053] In one embodiment, the hydraulic assembly 210 includes a hydraulic pack, and the hydraulic pack is disposed at one end of the plurality of sub-pressing heads 111 away from the chip to be tested 300 , and is connected to the plurality of sub-pressing heads 111 .

[0054] It should be understood that the phrase "hydraulic assembly 210 includes a hydraulic pack" encompasses various situations in which the hydraulic assembly 210 itself is the hydraulic pack, or in which the hydraulic assembly 210 includes the hydraulic pack and other structures. For example, the hydraulic assembly 210 may be a hydraulic pack that is connected to multiple sub-rams 111. In another example, the hydraulic assembly 210 may include a hydraulic pack and a hydraulic chamber for accommodating the hydraulic pack, wherein the bottom plate of the hydraulic chamber may have multiple through-holes, through which the multiple sub-rams 111 can pass to connect to the hydraulic pack.

[0055] More specifically, the hydraulic pack can be filled with a chemically stable liquid or a mixture of a chemically stable liquid and a gas. Depending on the actual application requirements, if a certain free float stroke is required, air can be appropriately added.

[0056] In one embodiment, the outer covering material of the hydraulic pack may include at least one of high-density plastic resistant to high temperatures or rubber resistant to high temperatures.

[0057] Figure 3 FIG. 1 shows a schematic diagram of a chip test pressure contact temperature control device 11 according to another embodiment of the present disclosure, wherein the pressure contact temperature control device 11 does not fully contact the chip. Figure 3 As shown, the device includes: a pressing head assembly 110, which includes a plurality of sub-pressing heads 111, which are arranged at intervals and are used to press and contact different positions of the chip to be tested 300, and are used to achieve temperature control of different positions of the chip to be tested 300; and a hydraulic assembly 211, which is connected to the pressing head assembly 110 and is used to transmit pressure to the pressing head assembly 110, so as to achieve the plurality of sub-pressing heads 111 pressing and contacting different positions of the chip to be tested 300, and the pressure at different positions of the chip to be tested 300 is uniform.

[0058] Further Figure 3 As shown, the hydraulic component 211 is a hydraulic bag, which can be understood as a connected chamber filled with a chemically stable liquid or a mixture of chemically stable liquid and gas. In the process of each sub-pressure head 111 rising and falling with the surface of the chip 300, the hydraulic bag can automatically adapt to the flatness change of the chip 300 surface through the flow of liquid or gas-liquid mixed molecules, thereby achieving adaptive good contact between each sub-pressure head 111 and different positions of the chip 300; at the same time, the hydraulic bag generates an equivalent supporting force due to the squeezing of the connected liquid or gas-liquid mixed molecules, thereby achieving uniform pressure distribution at various positions on the surface of the chip 300, and finally converting to uniform pressure on the entire surface of the chip 300.

[0059] It should be understood that the warping deformation or flatness difference of the chip surface is subtle, usually within 0.3mm. Therefore, in the structural design process, by setting up a hydraulic package, it is possible to achieve adaptive changes in the chip surface and make the entire device simple and easy to use.

[0060] In addition, the specific design of the structure or material of the sub-pressure head and the hydraulic pack in this embodiment can refer to the relevant content above and will not be repeated here.

[0061] In one embodiment, the steps of performing chip testing using the above-mentioned crimping temperature control device 11 include:

[0062] Step 1: Assemble the ram assembly 110 and the hydraulic assembly 211. First, confirm that the appearance of the sub-ram 111 and the hydraulic assembly 211 are normal. Then, install the sub-rams 111 on the hydraulic assembly 211 one by one and press back and forth by hand to confirm that each sub-ram 111 rebounds smoothly and has the same stroke.

[0063] Step 2: Assemble the crimping temperature control device 11 to the machine (not in Figure 3 The assembled crimping temperature control device 11 is embedded in the fixture and installed on the machine together. A dummy chip is used to confirm that there is no obvious interference during the pressing process.

[0064] Step 3: Install the chip. After confirming that there are no interference issues, place a dummy chip in test slot 400 and cover the chip with indentation paper. Press once using the standard pressure setting. Then, verify the color distribution of the indentation paper on the chip. If the color is uniform, physical contact has been achieved as expected. After confirming that physical contact is normal, place a fresh chip in test slot 400 and press several times as normal. Then, inspect the chip's appearance and the condition of the solder balls. Once normal, electrical testing and verification can be performed.

[0065] Figure 4 FIG. 1 shows a schematic diagram of a chip-testing pressure-bonding temperature control device 11 in full contact with the chip according to an embodiment of the present disclosure. Figure 4 As shown, in the driving force (such as Figure 4 Under the action of the plurality of sub-pressing heads 111, the plurality of sub-pressing heads 111 adapt to the surface of the chip 300, thereby achieving good contact with different positions of the chip 300.

[0066] Figure 5 FIG. 2 shows a schematic structural diagram of a compression temperature control device 20 for chip testing according to an embodiment of the present disclosure. Figure 5 As shown, the device includes: a pressing head assembly 120, which includes a plurality of sub-pressing heads 121, which are arranged at intervals and are used to press and contact different positions of the chip to be tested 300, and are used to achieve temperature control of different positions of the chip to be tested 300; and a hydraulic assembly 220, which presses and contacts the pressing head assembly 120 and is used to transmit pressure to the pressing head assembly 120, so as to achieve the plurality of sub-pressing heads 121 pressing and contacting different positions of the chip to be tested 300, and the pressure at different positions of the chip to be tested 300 is uniform.

[0067] The plurality of sub-pressing heads 121 may be evenly spaced apart to uniformly dissipate heat across the entire area of the chip 300 .

[0068] Further Figure 5As shown, the hydraulic assembly 220 includes a hydraulic package 221 , and the hydraulic package 221 is disposed at one end of the plurality of sub-pressing heads 121 away from the chip to be tested 300 , and is in tight contact with the plurality of sub-pressing heads 121 .

[0069] The hydraulic assembly 220 further includes a frame, which includes a hydraulic cavity for accommodating a hydraulic pack 221. Multiple sub-pressing heads 121 can be embedded in the hydraulic cavity to achieve pressing contact with the hydraulic assembly 220. Furthermore, the bottom plate of the hydraulic cavity can be provided with multiple first through-holes 122. One end of each sub-pressing head 121 passes through the multiple first through-holes 122 for pressing contact with the chip under test 300, and the other end thereof is in pressing contact with the hydraulic pack 221.

[0070] More specifically, the volume and / or shape of the hydraulic pack 221 can be adapted to the volume and / or shape of the hydraulic cavity, so that it can completely fill the hydraulic cavity after being placed in the hydraulic cavity. Furthermore, the frame can also include a cover for sealing the hydraulic cavity. Once the cover is locked, a sealed space is formed, and the hydraulic pack 221 presses down on the multiple sub-rams 121.

[0071] Further Figure 5 As shown, each sub-pressing head 121 may include a press head body and a limit block, the diameter of the limit block is larger than the first through hole 122, preferably, the diameter of the limit block may be slightly larger than the first through hole 122 so that the sub-pressing head will not slip in a free state.

[0072] More specifically, the pressing head body passes through the first through hole 122 to press and contact the chip under test 300 ; and the limiting block is assembled between the hydraulic package 221 and the bottom plate of the hydraulic chamber and presses and contacts the hydraulic package 221 .

[0073] Optionally, the pressing head body and the limiting block may be integrally formed or mechanically connected. The frame may be a metal frame.

[0074] In addition, for detailed descriptions of the functions and materials of the hydraulic pack, please refer to the relevant content above and will not be repeated here.

[0075] In one embodiment, during chip testing using the above-mentioned crimping temperature control device 20, the steps of assembling the crimping head assembly 120 and the hydraulic assembly 220 include:

[0076] First, confirm that the appearance of the sub-press head 121 and the hydraulic assembly 220 are in normal condition;

[0077] Then, multiple sub-pressing heads 121 are passed through the first through holes 122 on the hydraulic chamber from top to bottom, so that the limit blocks of the sub-pressing heads 121 are embedded in the hydraulic chamber;

[0078] Then, the hydraulic pack 221 is placed in the hydraulic cavity to fill the hydraulic cavity;

[0079] Finally, cover the hydraulic chamber with the upper cover and lock it. After the assembly is completed, press back and forth by hand to confirm that each sub-pressing head 121 rebounds smoothly and has the same stroke.

[0080] Figure 6 FIG. 3 shows a schematic structural diagram of a pressure-bonding temperature control device 30 for chip testing according to another embodiment of the present disclosure. Figure 6 As shown, the device includes: a pressure head assembly 120 and a hydraulic assembly 230. The hydraulic assembly 230 includes a frame, which includes Figure 5 In addition to the hydraulic chamber shown, the device also includes a receiving chamber, which is adjacent to the hydraulic chamber. The top plate of the receiving chamber serves as the bottom plate of the hydraulic chamber. The bottom plate of the receiving chamber also defines a plurality of second through-holes 124. The second through-holes 124 are positioned corresponding to the first through-holes 122. Multiple sub-rams 121 can pass through the first and second through-holes 122, 124 to secure them horizontally and prevent them from shaking during use.

[0081] In one embodiment, each of the multiple sub-indenters may be provided with a temperature sensor at one end facing the chip under test, thereby obtaining temperature information at different locations on the chip under test via the temperature sensor. In other embodiments, some of the multiple sub-indenters may be provided with a temperature sensor at one end facing the chip under test, thereby obtaining temperature information at corresponding locations on the chip under test via the temperature sensor. More specifically, a temperature sensor may be provided at the center point of one end of the sub-indenter.

[0082] In one embodiment, the crimping temperature control device further includes: a plurality of controllers, the plurality of sub-presses are correspondingly connected to the plurality of controllers, and the plurality of controllers respectively control the temperature of the plurality of sub-presses according to the temperature information, thereby realizing the control of the temperature of different positions of the chip to be tested. In this embodiment, each sub-press has an independent temperature controller, which can realize a separate temperature increase or decrease, thereby realizing accurate control of the temperature of different positions of the chip. For example, a chip includes different structures such as operation, storage and control, and there will be temperature differences at different positions. If an independent temperature controller is set to control the temperature of each part separately, it will be more accurate.

[0083] In another embodiment, the crimping temperature control device further comprises: a controller, the multiple sub-presses are connected to the controller, and the controller uniformly controls the temperature of the multiple sub-presses according to the temperature information, thereby achieving unified control of the temperature at different positions of the chip to be tested. In this embodiment, the multiple sub-presses are connected to the same controller, and the controller can perform overall control of the chip temperature based on the temperature information at different positions of the chip, for example, by taking the median or average of all temperature information to take into account the temperature information at more positions on the chip surface, but the implementation method is simpler.

[0084] More specifically, based on the temperature condition of the chip surface fed back by the temperature sensor, the temperature of the press head can be automatically adjusted through the machine's ATC (Auto Temperature Control) control system.

[0085] The present disclosure also provides a testing device for chip testing, which includes: a pressing temperature control device as described in any of the above items; a driving component, which is used to drive the pressing temperature control device to press and contact the chip to be tested or provide driving force to the pressing temperature control device; and a test board, on which a test slot is provided for placing the chip to be tested.

[0086] The driving assembly can be connected to the crimping temperature control device, and other structural components such as a limiter can be set between the driving assembly and the crimping temperature control device, such as Figure 3 or Figure 4 The arrow points to the component.

[0087] The embodiments of the present disclosure are described in detail above. Specific examples are used herein to illustrate the principles and implementation methods of the present disclosure. The description of the above embodiments is only used to help understand the method and core ideas of the present disclosure. At the same time, changes or modifications made by those skilled in the art based on the ideas of the present disclosure, on the specific implementation methods and application scope of the present disclosure, all fall within the scope of protection of the present disclosure. In summary, the contents of this specification should not be understood as limiting the present disclosure.

Claims

1. A temperature control device for chip testing, characterized in that: The device comprises: A pressing head assembly, the pressing head assembly comprising a plurality of sub-pressing heads, the plurality of sub-pressing heads being spaced apart and configured to press and contact different positions of the chip to be tested, and to achieve temperature control of the different positions of the chip to be tested; and An adjusting component is connected to or pressed into contact with the pressing head component and is used to transmit pressure to the pressing head component to enable the multiple sub-pressing heads to press into contact with different positions of the chip to be tested.

2. The device according to claim 1, characterized in that The plurality of sub-indenters have the same length and shape.

3. The device according to claim 1, characterized in that A temperature sensor is provided at one end of the plurality of sub-presses facing the chip to be tested, so as to obtain temperature information of different positions of the chip to be tested through the temperature sensor.

4. The device according to claim 3, characterized in that The device also includes: a plurality of controllers, the plurality of sub-presses being connected to the plurality of controllers respectively, and the plurality of controllers being used to control the temperatures of the plurality of sub-presses respectively according to the temperature information, thereby achieving independent control of the temperatures of different positions of the chip to be tested; or A controller is provided, wherein the plurality of sub-presses are connected to the controller, and the controller is used to uniformly control the temperatures of the plurality of sub-presses according to the temperature information, thereby achieving uniform control of the temperatures of different positions of the chip to be tested.

5. The device according to any one of claims 1 to 4, characterized in that The adjustment component is a hydraulic component, which is connected to or pressed into contact with the pressure head component and is used to transmit pressure to the pressure head component to achieve that the multiple sub-pressure heads press into contact with different positions of the chip to be tested, and the pressure at different positions of the chip to be tested is uniform.

6. The device according to claim 5, characterized in that The hydraulic assembly includes a hydraulic bag, and the hydraulic bag is arranged at one end of the plurality of sub-pressing heads away from the chip to be tested, and is connected to or in tight contact with the plurality of sub-pressing heads.

7. The device according to claim 6, characterized in that The hydraulic bag is filled with a chemically stable liquid or a mixture of a chemically stable liquid and a gas.

8. The device according to claim 6 or 7, characterized in that The outer covering material of the hydraulic pack includes at least one of high-density plastic that is resistant to high temperatures or rubber that is resistant to high temperatures.

9. The device according to claim 6 or 7, characterized in that The hydraulic assembly also includes a frame, which includes a hydraulic cavity for accommodating the hydraulic pack, and a bottom plate of the hydraulic cavity is provided with a plurality of first through holes, one end of the plurality of sub-pressure heads passes through the plurality of first through holes for pressing and contacting the chip to be tested, and the other end is connected to or pressed and contacted with the hydraulic pack.

10. The device according to claim 9, characterized in that The volume of the hydraulic bag is adapted to the volume of the hydraulic chamber in order to completely fill the hydraulic chamber.

11. The device according to claim 9, characterized in that The sub-pressing head includes a press head body and a limit block. The diameter of the limit block is larger than the first through hole. The press head body and the limit block are integrally formed or mechanically connected.

12. The device according to claim 11, characterized in that The pressing head body passes through the first through hole to press and contact the chip to be tested; the limiting block is assembled between the hydraulic pack and the bottom plate of the hydraulic chamber and is in press and contact with the hydraulic pack.

13. The device according to claim 12, characterized in that The frame further includes an upper cover for closing the hydraulic cavity to achieve a pressing contact between the hydraulic pack and the limiting block.

14. The device according to claim 13, characterized in that The frame also includes a accommodating cavity, which is arranged adjacent to the hydraulic cavity. The top plate of the accommodating cavity is the bottom plate of the hydraulic cavity. The bottom plate of the accommodating cavity is provided with a plurality of second through holes, and the positions of the second through holes are arranged corresponding to the first through holes. The plurality of sub-pressure heads pass through the first through holes and the second through holes for fixation.

15. A test device for chip testing, characterized in that: The device comprises: The crimping temperature control device according to any one of claims 1 to 14; a driving assembly, the driving assembly being used to drive the pressing temperature control device to press and contact the chip to be tested; and A test board is provided with a test slot for placing the chip to be tested.

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