Sensor integrated connecting structure, thin film type sensor and touch display screen

Abstract

The embodiment of the utility model provides a sensor integrated connecting structure, a thin film type sensor and a touch display screen, and relates to the field of thin film type sensors. The sensor integrated connecting structure comprises a base material layer, a conductive layer, a reinforcing layer and a reinforcing plate, the conductive layer comprises a wire and a plug-in piece, and the wire is connected with the plug-in piece; the wires and the plug-in sheets are arranged on the upper surface of the base material layer; the wire is provided with a bending part; the reinforcing layer covers the surface of the plugging sheet; the reinforcing plate is arranged on the lower surface of the base material layer; one end of the reinforcing plate close to the plug-in sheet is fixedly connected with the base material layer, and the other end of the reinforcing plate far away from the plug-in sheet is separable from the base material layer. According to the utility model, a flexible circuit board is not adopted for connection, and the connector can be directly plugged with other parts, thereby simplifying the structure, and reducing the occurrence of abnormal connection. And meanwhile, the sensor can be ensured to be completely attached to an adjacent part. In addition, the connection structure can improve the reliability of plugging, ensure the overall structural strength of the connection structure, and prolong the service life.

Description

Technical Field

[0001] The utility model relates to the technical field of thin film sensors, and in particular to a sensor-integrated connection structure, a thin film sensor, and a touch display screen. Background Art

[0002] Touch screens are widely used in consumer electronics, smart homes, smart cities, entertainment and games, education and teaching, smart medical care and other fields. Touch has become an integral part of our lives. Among them, metal mesh touch is currently the best interactive touch solution and is being used more and more widely.

[0003] The existing electrical connection method of sensors needs to be based on flexible circuit boards and external connections, but the binding between the sensor and the flexible circuit board is unstable, prone to connection anomalies, and the process is complicated, which affects the production yield and the overall cost of the product is high. In addition, the existing sensors and adjacent components cannot be fully fitted, and the binding area needs to be moved outside the fitting area to avoid affecting the fitting, but this will result in a wider frame. In addition, the existing sensors, especially metal grid touch sensors, have a bending resistance problem in the routing of the bending area, so they need to be connected based on a flexible circuit board, and the connection method needs to be connected using an ACF (anisotropic conductive film) binding method. The ACF binding method will increase the production process, and it is currently impossible to use the conductive layer on the substrate for direct plugging. Using the substrate for direct plugging is prone to wear and tear, resulting in a very short service life and poor reliability. Utility Model Content

[0004] The present invention provides a sensor-integrated connection structure, a thin-film sensor, and a touchscreen display. These structures can be directly plugged into other components without requiring a flexible circuit board for connection, simplifying the structure and reducing the likelihood of connection anomalies. Furthermore, they ensure that the sensor and adjacent components fit perfectly together. Furthermore, this sensor-integrated connection structure improves plug-in reliability and prevents breakage or microcracks from occurring during bending.

[0005] The embodiment of the present utility model can be implemented as follows:

[0006] An embodiment of the present invention provides a sensor-integrated connection structure, which includes:

[0007] substrate layer;

[0008] A conductive layer, the conductive layer including a wiring and a plug-in piece, the wiring being connected to the plug-in piece; the wiring and the plug-in piece are both arranged on the upper surface of the base material layer; the wiring is provided with a bending portion;

[0009] A reinforcement layer, the reinforcement layer covering the surface of the plug-in piece;

[0010] A reinforcing plate is arranged on the lower surface of the base material layer; one end of the reinforcing plate close to the plug-in piece is fixedly connected to the base material layer, and the other end of the reinforcing plate away from the plug-in piece is separable from the base material layer.

[0011] In an optional embodiment, the bending portion is a metal grid wiring.

[0012] In an optional embodiment, the routing includes a first routing, a second routing and the bending portion, the bending portion includes a plurality of thin routings, and the two ends of each of the thin routings are respectively connected to the first routing and the second routing; and the line width of each of the thin routings is smaller than the width of the first routing and the second routing.

[0013] In an optional embodiment, each of the thin traces is in a grid shape.

[0014] In an optional embodiment, the bending portion further includes a transition portion, and the first routing line is connected to each of the thin routing lines via the transition portion, and / or the second routing line is connected to each of the thin routing lines via the transition portion.

[0015] In an optional embodiment, a protective layer and an insulating ink layer are further included, and the surface of the wiring is covered with the protective layer;

[0016] The insulating ink layer covers the conductive layer.

[0017] In an optional embodiment, the sensor-integrated connection structure further includes a shielding film and a protective film, and the surface of the wiring away from the substrate layer is provided with the shielding film and the protective film.

[0018] An embodiment of the present utility model also provides a thin film sensor, comprising a sensor body and a sensor-integrated connection structure according to any one of the above-mentioned embodiments, wherein the sensor-integrated connection structure is integrally arranged with the sensor body, wherein the sensor body is connected to the outside via the sensor-integrated connection structure.

[0019] An embodiment of the present invention further provides a touch display screen, comprising a display screen module and the thin film sensor described in any one of the above embodiments, wherein the thin film sensor is fully bonded to the adjacent display screen module.

[0020] In an optional embodiment, the touch screen further comprises a polarizing element; the polarizing element, the thin film sensor and the display screen module are sequentially stacked, and the thin film sensor is fully bonded to the polarizing element and the display screen module respectively;

[0021] Alternatively, the polarizing element, the display screen module and the thin film sensor are stacked in sequence, and the thin film sensor and the display screen module are fully bonded.

[0022] The beneficial effects of the sensor-integrated connection structure, thin-film sensor, and touch display screen of the embodiment of the present invention include:

[0023] The sensor's integrated connection structure includes a base layer, a conductive layer, a reinforcement layer, and a stiffening plate. The conductive layer includes wiring and a connector, which are connected to the connector. Both the wiring and the connector are located on the top surface of the base layer. By providing the conductive layer on the base layer, the sensor and connection structure are integrated into a single design. The connector connects to the external control board via the connector, eliminating the need for a flexible printed circuit board. This simplifies the connection structure and reduces the risk of connection anomalies. Furthermore, it ensures that the sensor fits perfectly with adjacent components. Furthermore, the wiring has a bend to prevent breakage or microcracks in the sensor's integrated connection structure when bent.

[0024] The reinforcing layer covers the surface of the plug-in piece. By covering the surface of the plug-in piece with the reinforcing layer, the strength of the plug-in piece can be improved, and the metal conductive layer can be prevented from being oxidized, thereby improving reliability.

[0025] The reinforcing plate is placed on the lower surface of the base material layer. The end of the reinforcing plate, closest to the plug-in tab, is fixedly connected to the base material layer, while the other end, away from the plug-in tab, is detachable from the base material layer. By placing the reinforcing plate below the base material layer, the overall structural strength of the connection is ensured, extending its service life. Furthermore, the reinforcing plate is semi-detachable, facilitating easy insertion. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the following is a brief introduction to the drawings required for use in the embodiments. It should be understood that the following drawings only illustrate certain embodiments of the present invention and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other relevant drawings can be obtained based on these drawings without paying any creative work.

[0027] Figure 1 A schematic diagram of a thin film sensor provided in an embodiment of the present utility model;

[0028] Figure 2 A schematic diagram of a touch screen provided in an embodiment of the present utility model;

[0029] Figure 3 A schematic diagram of a sensor-integrated connection structure provided in an embodiment of the present utility model;

[0030] Figure 4This is an exploded schematic diagram of the sensor-integrated connection structure provided in an embodiment of the present utility model;

[0031] Figure 5 A schematic diagram of a first type of wiring provided in an embodiment of the present utility model;

[0032] Figure 6 This is a schematic diagram of the second type of routing provided in an embodiment of the present utility model.

[0033] Icon: 1000-touch screen; 100-sensor integrated connection structure; 110-substrate layer; 120-conductive layer; 121-wiring; 1211-first wiring; 1212-second wiring; 1213-thin wiring; 1214-transition part; 122-connector; 130-reinforcement layer; 140-reinforcement plate; 150-protective film; 200-thin film sensor; 210-sensor body; 300-cover plate; 310-edge cover area; 320-window area; 400-optical adhesive layer; 500-display module. DETAILED DESCRIPTION

[0034] To make the purpose, technical solutions, and advantages of the embodiments of the present invention more clear, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings of the embodiments of the present invention. Obviously, the described embodiments are only some embodiments of the present invention, not all embodiments. Generally, the components of the embodiments of the present invention described and shown in the drawings herein can be arranged and designed in various different configurations.

[0035] Therefore, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the claimed invention, but rather merely represents selected embodiments of the present invention. All other embodiments derived by persons of ordinary skill in the art based on the embodiments of the present invention without creative effort are intended to fall within the scope of protection of the present invention.

[0036] It should be noted that similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, it does not need to be further defined or explained in subsequent drawings.

[0037] In the description of the present invention, it should be noted that if the terms "upper", "lower", "inside", "outside", etc. appear, the orientation or position relationship indicated is based on the orientation or position relationship shown in the accompanying drawings, or is the orientation or position relationship in which the utility model product is usually placed when in use. It is only for the convenience of describing the present invention and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, it cannot be understood as a limitation on the present invention.

[0038] In addition, the terms "first", "second", etc., if used, are merely used to distinguish and describe, and should not be understood as indicating or implying relative importance.

[0039] It should be noted that, in the absence of conflict, the features in the embodiments of the present invention can be combined with each other.

[0040] Touch screens are widely used in consumer electronics, smart homes, smart cities, entertainment and gaming, education, smart healthcare, and other fields. Touchscreens have become an integral part of our lives. Metal mesh touchscreens are currently the best interactive touch solution and are increasingly widely used. Existing sensors require an FPC (flexible printed circuit) to electrically connect to the corresponding control board. This is especially true for thin-film sensors, such as touch sensors, which require the FPC and sensor bonding area to be located on the same plane. Because the FPC and sensor bonding requires approximately 2mm of space, the ink area on the cover plate must be increased by 2mm, impacting the product's aesthetics and preventing the realization of an extremely narrow bezel. Furthermore, the touch sensor cannot fully bond with other components, resulting in a gap in the FPC thickness. Alternatively, the sensor bonding area can be moved outside the bonding area to achieve a full bond, resulting in a wider bezel, impacting both product reliability and aesthetics.

[0041] In addition, the existing electrical connection method of the sensor needs to be based on a flexible circuit board and external connection, but the binding between the sensor and the flexible circuit board is unstable, prone to connection abnormalities, and the process is complicated, which affects the production yield and the overall cost of the product is high. Moreover, the existing sensor and adjacent components cannot be fully fitted, and the binding area needs to be moved outside the fitting area to avoid affecting the fitting, but this will result in a wider frame. In addition, the existing sensors, especially the metal grid touch sensors, have a problem of poor bending resistance in the routing of the bending area, so they need to be connected based on a flexible circuit board, and the connection method needs to be connected using an ACF (anisotropic conductive film) binding method. The ACF binding method will increase the production process, and it is currently impossible to use the conductive layer on the substrate for direct plugging. Using the substrate for direct plugging is prone to wear and tear, resulting in a very short service life and poor reliability.

[0042] Based on this, see Figure 1 、 Figure 2 、 Figure 3 and Figure 4The sensor-integrated connection structure 100 provided in the embodiment of the present invention can effectively improve the technical problems mentioned above. The sensor-integrated connection structure 100 can be directly connected with other components without using a flexible circuit board, which simplifies the structure and reduces the occurrence of abnormal connections. In addition, it can also ensure that the sensor is completely fitted with adjacent components. The sensor-integrated connection structure 100 can also improve the reliability of plug-in. In addition, the sensor-integrated connection structure 100 can also avoid breakage or microcracks when bent. The sensor-integrated connection structure 100 can be applied to a thin film sensor 200, a touch display screen 1000 or other electronic devices. Devices with the sensor-integrated connection structure 100 all have the functions mentioned above, which will not be elaborated here.

[0043] Figure 1 This is a schematic diagram of a thin film sensor 200 provided in an embodiment of the present invention, as shown in FIG. Figure 1 As shown, the touch screen display 1000 provided in this embodiment includes a display module 500 and a thin film sensor 200. The thin film sensor 200 and the adjacent display module 500 are fully bonded. Full bonding can improve the overall appearance of the product. Specifically, the touch screen display 1000 includes a cover plate 300, a thin film sensor 200, and a display module 500, which are arranged in sequence from top to bottom. The cover plate 300 and the thin film sensor 200, as well as the display module 500 and the thin film sensor 200, are connected via an optical adhesive layer 400. The thin film sensor 200 is also electrically connected to the display module 500 via a sensor-integrated connection structure 100. One end of the sensor-integrated connection structure 100 is integral with the thin film sensor 200, and the other end of the sensor-integrated connection structure 100 is plugged into the display module 500. Specifically, the optical adhesive layer 400 in this embodiment is OAC. Of course, other transparent optical adhesives can also be used, and this is not limited here. In addition, in order to facilitate the observation of the operation content of the thin film sensor 200, and to improve the reliability of the overall structure and avoid the problem of oxidation corrosion of the conductive layer 120, the cover 300 in this embodiment includes a window area 320 and an edge cover area 310. The edge cover area 310 is arranged at the edge of the cover 300 and is connected to the window area 320.

[0044] To reduce light reflection and glare, adjust and control the brightness of the display module 500, and improve visibility, the touch screen 1000 in this embodiment also includes a polarizing element. The polarizing element, thin-film sensor 200, and display module 500 are stacked in sequence, with the thin-film sensor 200 fully bonded to both the polarizing element and the display module 500. Alternatively, the polarizing element, display module 500, and thin-film sensor 200 are stacked in sequence, with the thin-film sensor 200 fully bonded to the display module 500. Of course, the touch screen 1000 may also include other structures, depending on specific usage requirements and not limited here.

[0045] Based on the sensor-integrated connection structure 100, the touch sensor and the display module can be fully bonded, with the top and bottom frame areas basically aligned. Further preferably, when the display module requires a polarizing element, the touch sensor is preferably arranged under the polarizing element, and the touch sensor, polarizing element, and display module are all fully bonded, which can improve the overall product appearance.

[0046] The touchscreen display 1000 can be used in an electronic device (not shown). The electronic device in this embodiment includes a processor and the aforementioned touchscreen display 1000, with the processor electrically connected to the touchscreen display 1000. The processor is configured to process information acquired by the touchscreen display 1000 to control the operation of the electronic device. Of course, the electronic device may also include other structures such as memory, depending on the specific use case and is not limited here.

[0047] The structure of the film sensor 200 is described in detail below. Figure 2 This is a schematic diagram of a thin film sensor 200 provided in an embodiment of the present invention, as shown in FIG. Figure 2 As shown, the thin-film sensor 200 in this embodiment includes a sensor body 210 and a sensor-integrated connection structure 100. The sensor-integrated connection structure 100 is integrally provided with the sensor body 210, wherein the sensor body 210 is connected to the outside via the sensor-integrated connection structure 100. Specifically, the sensor-integrated connection structure 100 and the sensor body 210 are integrally structured, the wiring 121 is electrically connected to the sensor body 210, and the plug-in piece 122 is used to plug into the display module 500.

[0048] The specific structure of the sensor-integrated connection structure 100 will be described in detail below.

[0049] Figure 3 A schematic diagram of a sensor-integrated connection structure 100 provided in an embodiment of the present invention; Figure 4 This is an exploded schematic diagram of the sensor integrated connection structure 100 provided in the embodiment of the present invention, please refer to Figure 3and Figure 4 The sensor-integrated connection structure 100 in this embodiment includes a substrate layer 110, a conductive layer 120, a reinforcement layer 130, and a reinforcement plate 140. The conductive layer 120 includes a wiring 121 and a plug-in piece 122. The wiring 121 and the plug-in piece 122 are different structures integrally formed in the same conductive layer 120, and the wiring 121 is connected to the plug-in piece 122. The wiring 121 and the plug-in piece 122 are both arranged on the upper surface of the substrate layer 110. The wiring 121 has a bending portion. The reinforcement layer 130 covers the surface of the plug-in piece 122. The reinforcement plate 140 is arranged on the lower surface of the substrate layer 110. The end of the reinforcement plate 140 close to the plug-in piece 122 is fixedly connected to the substrate layer 110, and the other end of the reinforcement plate 140 away from the plug-in piece 122 is detachable from the substrate layer 110. The reinforcement layer 130 in this embodiment is a carbon paste layer. Of course, other conductive and oxidation-resistant material layers can also be used, which is not limited here. Specifically, carbon paste is screen-printed onto the connector tabs 122 of the conductive layer 120. The reinforcing plate 140 is secured to the back of the conductive layer 120 printed with carbon paste using highly viscous double-sided tape, with the adhesive applied to the back of the connector area. Simultaneously, insulating ink is screen-printed onto the protective film 150 to ensure reliability. Carbon paste is a mixture of carbon nanotubes and an organic solvent, and offers excellent conductivity and oxidation resistance.

[0050] By providing a conductive layer 120 on the substrate, the sensor and connection structure are integrated into a single design. Connectors 122 connect to the external control board, eliminating the need for a flexible printed circuit board. This simplifies the connection structure, reduces connection errors, reduces process steps, streamlines the process, improves yield, and reduces production costs. Furthermore, this structure eliminates the need for a binding area, reducing the width of the lower bezel, achieving a narrower frame and enhancing product aesthetics. This structure also ensures a perfect fit between the sensor and adjacent components. Covering the surface of the connector 122 with a reinforcement layer 130 enhances its strength and prevents oxidation of the metal conductive layer 120, improving reliability. Providing a reinforcement plate 140 beneath the substrate layer 110 ensures the overall structural strength of the connection structure. Furthermore, the semi-detachable reinforcement plate 140 facilitates connection. Furthermore, the curved portion of the trace 121 prevents breakage or microcracks in the sensor-integrated connection structure 100 when bent.

[0051] Please continue reading Figure 3 and Figure 4The sensor-integrated connection structure 100 in this embodiment also includes a protective layer. The surface of the trace 121 is covered with the protective layer to isolate moisture and oxygen and protect the traces on the conductive layer 120. The transparent protective layer is composed of acrylic resin, polydimethylsiloxane, polymethylsiloxane, and other ingredients. The protective layer is evenly applied to both sides of the trace by coating, with a thickness controlled between 1 μm and 4 μm.

[0052] In addition, to improve the reliability of the conductive layer 120 in the connection structure and avoid oxidation corrosion problems in the conductive layer 120, the sensor-integrated connection structure 100 in this embodiment also includes an insulating ink layer (not shown in the figure), which covers the conductive layer 120. The insulating ink is formed above the protective layer by screen printing to ensure its reliability. That is, a semi-transparent insulating ink layer with a thickness of 8um to 12um is printed on both sides of the conductive layer 120. Of course, the thickness of the insulating ink layer can also be changed according to actual conditions. The insulating ink layer can be composed of components such as epoxy resin, polyurethane, and acrylic resin.

[0053] In addition, the sensor-integrated connection structure 100 in this embodiment also includes a shielding film and a protective film 150, and the surface of the wiring 121 away from the substrate layer 110 is provided with a shielding film and a protective film 150. An EMI shielding film is affixed to the upper surface of the wiring 121 to shield external electromagnetic interference. The EMI shielding film is a new type of electronic film material, mainly used to suppress electromagnetic interference (EMI). It uses a shielding body made of special materials to confine electromagnetic waves to a certain range, thereby suppressing or attenuating electromagnetic radiation and effectively reducing the impact of electromagnetic interference on other electronic devices. At the same time, a layer of protective film can be attached to the front and back surfaces of the substrate layer 110 and the conductive layer 120 to prevent scratches on the line and protect the overall connection structure.

[0054] In order to improve the bending resistance of trace 121 to adapt to various connection conditions, please refer to Figure 5 and Figure 6 , Figure 5 This is a schematic diagram of a first type of wiring 121 provided in an embodiment of the present utility model; Figure 6This is a schematic diagram of the second type of trace 121 provided in an embodiment of the present invention. The trace 121 in this embodiment includes a first trace 1211, a second trace 1212, and a bend. The bend includes multiple thin traces 1213, each of which is connected to the first trace 1211 and the second trace 1212 at both ends. The width of each thin trace 1213 is smaller than that of the first trace 1211 and the second trace 1212. By splitting the trace structure, which originally had the same width as the first trace 1211 and the second trace 1212, into multiple thin traces 1213, bending stress can be shared, thereby improving bending resistance. The number n of thin traces 1213 depends on the width of the first trace 1211 and the width of the thin trace 1213. Specifically, the smaller the ratio of the width of the thin trace 1213 to the width of the first trace 1211, the larger the number n of thin traces 1213 that can be split out, the more dispersed the bending stress distribution is, and the higher the design redundancy that can ensure uninterrupted traces.

[0055] In addition, to make the line width change gradually transition, please continue to refer to Figure 5 The bending portion in this embodiment also includes a transition portion 1214 , and the first trace 1211 is connected to each thin trace 1213 via the transition portion 1214 , and / or the second trace 1212 is connected to each thin trace 1213 via the transition portion 1214 .

[0056] To further improve the bending resistance of trace 121, please refer to Figure 6 Each thin trace 1213 in this embodiment is in a grid shape. In addition, part of each thin trace 1213 may also be in a grid shape. Specifically, half of each thin trace 1213 may be in a grid shape, and the other half may be a normal trace structure. Of course, the proportion of the grid shape may also be other proportions, which are not limited here. The grid-shaped trace design helps to release stress during the bending process and avoid breakage or microcracks in the line during bending. In addition, the entire trace 121 may also be designed as a metal grid; or the bending portion may be designed as a metal grid trace.

[0057] For different sensors, the sensor-integrated connection structure 100 can have multiple components, corresponding to different conductive layers 120. Alternatively, multiple different conductive layers 120 can be integrated into a single sensor-integrated connection structure 100 through vias or other methods. Vias, also known as plated holes, are a crucial component in printed circuit board (PCB) manufacturing. They penetrate the entire PCB through metal layers within the board, electrically connecting circuits between different layers. Vias can be through-holes, blind vias, or buried vias.

[0058] To sum up, the sensor-integrated connection structure 100 includes a substrate layer 110, a conductive layer 120, a reinforcement layer 130 and a reinforcement plate 140. The conductive layer 120 includes a wiring 121 and a plug-in piece 122, and the wiring 121 is connected to the plug-in piece 122; the wiring 121 and the plug-in piece 122 are both arranged on the upper surface of the substrate layer 110; the wiring is provided with a bending portion; the reinforcement layer 130 covers the surface of the plug-in piece 122; the reinforcement plate 140 is arranged on the lower surface of the substrate layer 110; one end of the reinforcement plate 140 close to the plug-in piece 122 is fixedly connected to the substrate layer 110, and the other end of the reinforcement plate 140 away from the plug-in piece 122 is separable from the substrate layer 110. By providing a conductive layer 120 on the substrate, the sensor and the connection structure are designed as an integrated whole, and the connection is performed through the plug-in piece 122 and the external control board. The connection does not require a flexible circuit board, which simplifies the connection structure and reduces the occurrence of connection abnormalities. In addition, it can also ensure that the sensor and adjacent components are completely fitted. By covering the surface of the plug-in piece 122 with a reinforcing layer 130, the strength of the plug-in piece 122 can be improved, and the metal conductive layer 120 can also be prevented from oxidizing, thereby improving reliability. By providing a reinforcement plate 140 under the substrate layer 110, the overall structural strength of the connection structure can be ensured and the service life can be extended. In addition, the reinforcement plate 140 adopts a semi-separated method, which can be easily plugged in. In addition, the wiring 121 is provided with a bending portion, which is resistant to bending and can prevent the sensor-integrated connection structure 100 from breaking or microcracks when bent.

[0059] The above is only a specific implementation method of the present invention, but the protection scope of the present invention is not limited to this. Any changes or replacements that can be easily thought of by any technician familiar with this technical field within the technical scope disclosed in the present invention should be included in the protection scope of the present invention.

Claims

1. A sensor-integrated connection structure, characterized in that: include: a substrate layer (110); A conductive layer (120), the conductive layer (120) comprising a wiring (121) and a plug-in piece (122), the wiring (121) being connected to the plug-in piece (122); the wiring (121) and the plug-in piece (122) being both arranged on the upper surface of the base material layer (110); the wiring (121) being provided with a bending portion; A reinforcement layer (130), the reinforcement layer (130) covering the surface of the plug-in sheet (122); A reinforcing plate (140) is provided on the lower surface of the base material layer (110); one end of the reinforcing plate (140) close to the plug-in piece (122) is fixedly connected to the base material layer (110), and the other end of the reinforcing plate (140) away from the plug-in piece (122) is separable from the base material layer (110).

2. The sensor-integrated connection structure according to claim 1, characterized in that: The bent portion is a metal grid wiring.

3. The sensor-integrated connection structure according to claim 1, characterized in that: The routing (121) comprises a first routing (1211), a second routing (1212) and the bending portion, wherein the bending portion comprises a plurality of thin routings (1213), and the two ends of each thin routing (1213) are respectively connected to the first routing (1211) and the second routing (1212); and the line width of each thin routing (1213) is smaller than the width of the first routing (1211) and the second routing (1212).

4. The sensor-integrated connection structure according to claim 3, characterized in that: Each of the thin traces (1213) is in a grid shape.

5. The sensor-integrated connection structure according to claim 3 or claim 4, characterized in that: The bending portion further includes a transition portion (1214), wherein the first trace (1211) is connected to each of the thin traces (1213) via the transition portion (1214), and / or the second trace (1212) is connected to each of the thin traces (1213) via the transition portion (1214).

6. The sensor-integrated connection structure according to claim 1, characterized in that: It also includes a protective layer and an insulating ink layer, wherein the protective layer covers the surface of the wiring (121); The insulating ink layer covers the conductive layer (120).

7. The sensor-integrated connection structure according to claim 1, characterized in that: It also includes a shielding film and a protective film (150), and the surface of the wiring (121) away from the substrate layer (110) is provided with the shielding film and the protective film (150).

8. A thin film sensor, characterized in that: The invention comprises a sensor body (210) and a sensor-integrated connection structure (100) as claimed in any one of claims 1 to 7, wherein the sensor-integrated connection structure (100) is integrally arranged with the sensor body (210), wherein the sensor body (210) is connected to the outside via the sensor-integrated connection structure (100).

9. A touch display screen, characterized in that: It comprises a display screen module (500) and the thin film sensor (200) according to claim 8, wherein the thin film sensor (200) and the adjacent display screen module (500) are fully bonded.

10. The touch display screen according to claim 9, wherein: The touch display screen (1000) further includes a polarizing element; The polarizing element, the thin film sensor (200) and the display screen module (500) are stacked in sequence, and the thin film sensor (200) is fully bonded to the polarizing element and the display screen module (500) respectively; Alternatively, the polarizing element, the display screen module (500) and the thin film sensor (200) are stacked in sequence, and the thin film sensor (200) and the display screen module (500) are fully bonded.

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