Enhanced anti-crack ceramic capacitor structure

Abstract

The utility model relates to the technical field of ceramic capacitors, in particular to an enhanced anti-crack ceramic capacitor structure, which comprises a ceramic medium, two ends of the ceramic medium are provided with outer electrodes; a groove is formed in the surface of the ceramic medium, and a clamping groove is formed in the inner wall of the groove; an electrode structure is arranged on the inner side of the ceramic dielectric, the electrode structure comprises six groups of electrode plates, the electrode plates are located on the inner side of the ceramic dielectric, the six groups of electrode plates are distributed left and right, and narrow parts are arranged at the end parts of the electrode plates. According to the utility model, the narrow part is arranged at the joint of the surface of the electrode plate and the outer electrode, and the width of the narrow part is smaller than that of the electrode plate, so that the distance between the joint of the electrode plate and the outer electrode and the side edge of the ceramic medium can be increased, the bending crack area of a product plate can be effectively avoided, and further easy degradation in the use process is avoided; and the service life of the ceramic capacitor can be prolonged.

Description

Technical Field

[0001] The utility model relates to the technical field of ceramic capacitors, in particular to an enhanced anti-cracking ceramic capacitor structure. Background Art

[0002] Ceramic capacitors are capacitors with ceramic as the dielectric. Their structure consists of two or more alternating ceramic layers and metal layers. The inner electrode is connected to the outer electrode of the capacitor. The inner electrode is printed into an inner electrode pattern of a certain shape and size on the ceramic dielectric diaphragm using the screen printing principle, and the MLCC inner electrode structure is formed by staggering and overprinting.

[0003] In the prior art, the inner electrode a in the ceramic dielectric c is rectangular in shape (refer to Figure 5 ), since the connection area between the inner electrode a and the outer electrode b is relatively wide, when the product undergoes a plate bending test after welding, cracks are likely to occur at the connection between the inner electrode a and the outer electrode b, causing product failure and thus reducing the product life.

[0004] Therefore, in order to solve the above problems, an enhanced anti-cracking ceramic capacitor structure is proposed. Utility Model Content

[0005] The purpose of the present invention is to provide an enhanced anti-crack ceramic capacitor structure to solve the problem mentioned in the background art that the inner electrode a in the ceramic dielectric c is rectangular (refer to Figure 5 ), since the connection area between the inner electrode a and the outer electrode b is relatively wide, cracks are likely to occur at the connection between the inner electrode a and the outer electrode b when the product undergoes a plate bending test after welding, causing product failure and thus reducing the product life.

[0006] To achieve the above-mentioned object, the present invention provides the following technical solutions: an enhanced anti-crack ceramic capacitor structure, comprising: a ceramic dielectric, with external electrodes provided at both ends of the ceramic dielectric;

[0007] A groove is provided on the surface of the ceramic medium, and a clamping groove is provided on the inner wall of the groove;

[0008] An electrode structure is provided inside the ceramic medium. The electrode structure includes electrode plates. The electrode plates are located inside the ceramic medium. There are six groups of electrode plates. The six groups of electrode plates are distributed left and right. The ends of the electrode plates are provided with narrow portions.

[0009] Preferably, a heat dissipation structure is installed on the ceramic medium, and the heat dissipation structure includes a heat dissipation shell, and the heat dissipation shell is clamped on the inner side of the groove, and a rubber clamping block and a thermal pad are bonded to the inner wall of the heat dissipation shell.

[0010] Preferably, one end of the narrow portion extends to the outer wall of the ceramic medium and contacts the outer electrode.

[0011] Preferably, the width of the narrow portion is smaller than the width of the electrode plate.

[0012] Preferably, the rubber card block passes through the thermal pad, and the rubber card block is clamped inside the card slot.

[0013] Preferably, the surface of the thermal pad is in contact with the inner wall of the groove.

[0014] Compared with the prior art, the beneficial effects of the present invention are as follows: the present invention increases the distance between the bonding area between the electrode plate and the external electrode and the side of the ceramic medium by setting a narrow portion at the area where the surface of the electrode plate is bonded to the external electrode, and the width of the narrow portion is smaller than the width of the electrode plate. This can effectively avoid the area where the product plate is bent and cracked, thereby preventing easy deterioration during use and extending the service life of the ceramic capacitor.

[0015] 1. The present invention provides an electrode structure in which the width of the narrow portion is smaller than the width of the electrode plate. This increases the distance between the electrode plate and the outer electrode contact area and the side edge of the ceramic dielectric, effectively avoiding areas prone to bending cracks in the product plate, thereby preventing easy deterioration during use and extending the service life of the ceramic capacitor. The narrow portion reduces the surface area of the electrode plate, reducing the area for screen printing, thereby saving costs and improving economic benefits.

[0016] 2. The utility model is provided with a heat dissipation structure, and the heat dissipation shell is inserted into the inner side of the groove. The rubber clamp can be clamped into the inner side of the clamping groove, which can fix the installation of the heat dissipation shell on the ceramic medium. The thermal pad will fit the inner wall of the groove, and the heat on the ceramic medium can be conducted through the thermal pad and transferred to the heat dissipation shell, and then dissipated through the heat dissipation shell, which can prevent the temperature of the ceramic capacitor from being too high. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 It is a schematic front view of the structure of the utility model;

[0018] Figure 2 This is a schematic diagram of the explosion structure of the utility model;

[0019] Figure 3 It is a schematic side sectional view of the structure of the present utility model;

[0020] Figure 4 This is a schematic top view cross-sectional diagram of the structure of the ceramic medium of the utility model;

[0021] Figure 5 Schematic diagrams of front and side cross-sections of ceramic capacitors in the prior art.

[0022] In the figure: 1. Ceramic dielectric; 11. Groove; 12. Card slot; 13. External electrode; 2. Electrode structure; 21. Electrode plate; 22. Narrow portion; 3. Heat dissipation structure; 31. Heat dissipation housing; 32. Rubber card block; 33. Thermal pad. DETAILED DESCRIPTION

[0023] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0024] See also Figure 1-Figure 5 , an embodiment provided by the utility model:

[0025] The ceramic medium 1 and electrode plate 21 used in this application are products that can be directly purchased on the market. Their principles and connection methods are existing technologies well known to those skilled in the art, so they will not be described here in detail.

[0026] An enhanced anti-crack ceramic capacitor structure includes: a ceramic dielectric 1, with external electrodes 13 provided at both ends of the ceramic dielectric 1;

[0027] A groove 11 is formed on the surface of the ceramic medium 1, and a clamping groove 12 is formed on the inner wall of the groove 11;

[0028] An electrode structure 2 is provided on the inner side of the ceramic medium 1. The electrode structure 2 includes an electrode plate 21. The electrode plate 21 is located on the inner side of the ceramic medium 1. There are six groups of electrode plates 21, and the six groups of electrode plates 21 are distributed on the left and right. A narrow portion 22 is provided at the end of the electrode plate 21. By providing a narrow portion 22 at the portion where the surface of the electrode plate 21 is bonded to the external electrode 13, the width of the narrow portion 22 is smaller than the width of the electrode plate 21, and the distance between the bonding portion of the electrode plate 21 and the external electrode 13 and the side of the ceramic medium 1 can be increased, which can effectively avoid the area of the product plate bending crack, thereby avoiding easy deterioration during use and extending the service life of the ceramic capacitor.

[0029] Furthermore, a heat dissipation structure 3 is installed on the ceramic medium 1. The heat dissipation structure 3 includes a heat dissipation shell 31. The heat dissipation shell 31 is clamped on the inner side of the groove 11. A rubber clamp 32 and a thermal pad 33 are adhered to the inner wall of the heat dissipation shell 31. The heat dissipation shell 31 is inserted into the inner side of the groove 11. The rubber clamp 32 can be clamped on the inner side of the card slot 12, which can fix the installation of the heat dissipation shell 31 on the ceramic medium 1. The thermal pad 33 will fit the inner wall of the groove 11. The heat on the ceramic medium 1 can be conducted out through the thermal pad 33 and transferred to the heat dissipation shell 31, and then dissipated through the heat dissipation shell 31, which can prevent the temperature of the ceramic capacitor from being too high.

[0030] Furthermore, one end of the narrow portion 22 extends to the outer wall of the ceramic dielectric 1 and contacts the outer electrode 13 . The arrangement of the narrow portion 22 can ensure the normal function of the ceramic capacitor.

[0031] Furthermore, the width of the narrow portion 22 is smaller than the width of the electrode plate 21, which can increase the distance between the bonding area of the electrode plate 21 and the external electrode 13 and the side of the ceramic medium 1, effectively avoiding the area of bending cracks in the product plate, thereby preventing easy deterioration during use and extending the service life of the ceramic capacitor. The setting of the narrow portion 22 makes the surface area of the electrode plate 21 smaller, which can reduce the area of screen printing, thereby saving costs and improving economic benefits.

[0032] Furthermore, the rubber block 32 passes through the thermal pad 33 and is clamped inside the card slot 12 . The rubber block 32 cooperates with the card slot 12 to connect and position the heat dissipation housing 31 inside the groove 11 .

[0033] Furthermore, the surface of the thermal pad 33 is in contact with the inner wall of the groove 11 , and the heat on the ceramic medium 1 can be conducted away through the thermal pad 33 and transferred to the heat dissipation housing 31 .

[0034] Working Principle: The width of the narrow portion 22 is smaller than that of the electrode plate 21, which can increase the distance between the contact area between the electrode plate 21 and the external electrode 13 and the side of the ceramic dielectric 1, effectively avoiding the area where the product plate is prone to bending cracks, thereby preventing easy deterioration during use and extending the service life of the ceramic capacitor. The setting of the narrow portion 22 reduces the surface area of the electrode plate 21, which can reduce the area for screen printing, thereby saving costs and improving economic benefits.

[0035] The heat dissipation housing 31 is inserted into the inner side of the groove 11, and the rubber block 32 can be clamped into the inner side of the card slot 12, so as to fix the installation of the heat dissipation housing 31 on the ceramic medium 1. The thermal pad 33 will fit the inner wall of the groove 11, and the heat on the ceramic medium 1 can be conducted out through the thermal pad 33 and transferred to the heat dissipation housing 31, and then dissipated through the heat dissipation housing 31, so as to prevent the temperature of the ceramic capacitor from being too high.

[0036] The above description is only a preferred embodiment of the present invention and does not constitute any form of limitation to the present invention. Any ordinary technician in this industry can smoothly implement the present invention as shown in the drawings and described above. However, any equivalent changes, modifications and evolutions made by technicians familiar with this profession without departing from the scope of the technical solution of the present invention using the technical content disclosed above are all equivalent embodiments of the present invention. At the same time, any equivalent changes, modifications and evolutions made to the above embodiments based on the essential technology of the present invention are still within the scope of protection of the technical solution of the present invention.

Claims

1. An enhanced anti-crack ceramic capacitor structure, comprising: A ceramic medium (1), wherein both ends of the ceramic medium (1) are provided with external electrodes (13); Its characteristics are: A groove (11) is provided on the surface of the ceramic medium (1), and a clamping groove (12) is provided on the inner wall of the groove (11); An electrode structure (2) is provided on the inner side of the ceramic medium (1), and the electrode structure (2) includes an electrode plate (21). The electrode plate (21) is located on the inner side of the ceramic medium (1). Six groups of electrode plates (21) are provided, and the six groups of electrode plates (21) are distributed on the left and right. The ends of the electrode plates (21) are provided with narrow portions (22).

2. The enhanced crack-resistant ceramic capacitor structure according to claim 1, characterized in that: A heat dissipation structure (3) is installed on the ceramic medium (1), and the heat dissipation structure (3) includes a heat dissipation shell (31). The heat dissipation shell (31) is clamped on the inner side of the groove (11), and a rubber clamping block (32) and a thermal pad (33) are bonded to the inner wall of the heat dissipation shell (31).

3. The enhanced crack-resistant ceramic capacitor structure according to claim 1, characterized in that: One end of the narrow portion (22) extends to the outer wall of the ceramic medium (1) and contacts the outer electrode (13).

4. The enhanced crack-resistant ceramic capacitor structure according to claim 1, characterized in that: The width of the narrow portion (22) is smaller than the width of the electrode plate (21).

5. The enhanced crack-resistant ceramic capacitor structure according to claim 2, characterized in that: The rubber clamping block (32) passes through the heat-conducting pad (33), and the rubber clamping block (32) is clamped inside the clamping slot (12).

6. The enhanced crack-resistant ceramic capacitor structure according to claim 2, characterized in that: The surface of the thermal pad (33) is in contact with the inner wall of the groove (11).

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