Capacitor convenient to weld

Abstract

The utility model discloses a capacitor convenient for welding, which is plugged on a PCB (printed circuit board) and comprises a thin film capacitor body, a pair of pins are symmetrically connected onto the thin film capacitor body, and a limit frame is fixedly sleeved on the pins. The limiting frame comprises a connecting sleeve connected with the pins in a sleeving mode and a plurality of supporting rods arranged on the side face of the connecting sleeve at equal intervals in a surrounding mode. When the pins of the thin film capacitor body are inserted into the preset holes in the PCB, the tail ends of the supporting rods abut against the surface of the PCB to limit the insertion depth of the pins. In order to solve the problems that when a capacitor is connected with a PCB, pins on the capacitor are inserted too deep, so that the distance between electrodes of the thin film capacitor and the PCB is too close, after welding is completed, transverse dragging borne by the pins is too large, and the pins are prone to being heated and damaged in the long-time using process, limiting frames are fixedly connected to the pins in a sleeving mode, and therefore the pins are not prone to being damaged. And the limiting frame is used for limiting, so that the pins can be effectively prevented from being inserted too deep.

Description

Technical Field

[0001] The utility model belongs to the field of electromagnetic induction, in particular to a capacitor which is easy to weld. Background Art

[0002] The current film capacitor structure generally consists of an electrode and two pins extending from the electrode. Film capacitors with this structure have the following problems when soldering them to PCB boards in the laboratory: after the pins on the film capacitor are inserted into the solder holes on the PCB board, the specific soldering position of the pins is located on the back of the PCB board. Therefore, the PCB board needs to be flipped over for soldering. Once the PCB board is flipped over, the weight of the PCB board is applied to the film capacitor, which can easily cause the two pins on the film capacitor to be inserted too deep into the solder holes of the PCB board, resulting in the film capacitor electrodes being too close to the PCB board. After soldering is completed, the pins are subjected to excessive lateral tension, which can easily cause heat and damage during long-term use.

[0003] Chinese patent CN 219321190 U discloses a thin film capacitor that is easy to weld. By adding a limit plate located on the same horizontal plane to a pair of pins of the film capacitor body, the limit plate synchronously limits the insertion depth of the pair of pins in the solder holes on the PCB board, effectively preventing the pair of pins of the film capacitor body from being inserted too deeply due to the gravity of the PCB board during the laboratory back buckle soldering process, and the insertion depth being inconsistent, resulting in excessive lateral pulling of the pair of pins and twisting of the connection between the electrode and the pin, which in turn may lead to the problem of the film capacitor body being easily damaged by heat due to long-term use. The welding quality of the film capacitor body is effectively improved, especially when multiple film capacitor bodies are welded simultaneously, the welding depth of the multiple film capacitor bodies can be kept consistent, thereby improving the welding aesthetics.

[0004] In the prior art, a limiter is provided on the pin to control the distance between the capacitor and the PCB. However, the prior art only relies on the limiter to control the insertion depth of the pin. To ensure firmness during soldering, a tooling mechanism is required to fix the capacitor and the PCB in contact. However, mechanical stress should be avoided during soldering to prevent physical deformation of the capacitor. Summary of the Invention

[0005] The purpose of this section is to summarize some aspects of the embodiments of the present invention and briefly introduce some preferred embodiments. Some simplifications or omissions may be made in this section and in the abstract and title of the utility model to avoid obscuring the purpose of this section, the abstract and the title of the utility model, and such simplifications or omissions shall not be used to limit the scope of the present invention.

[0006] In order to solve the above problems, the present invention adopts the following technical solutions.

[0007] A capacitor that is easy to solder and is plugged into a PCB. The capacitor includes a film capacitor body with a pair of pins symmetrically connected to the film capacitor body. A limit frame is fixedly sleeved on the pins. The limit frame includes a connecting sleeve sleeved with the pins and a plurality of support rods arranged in a surrounding manner and equidistantly on the sides of the connecting sleeve. When the pins of the film capacitor body are inserted into preset holes on the PCB, the ends of the support rods abut against the surface of the PCB to limit the insertion depth of the pins.

[0008] The support rod is a U-shaped structure, and a groove is opened at the end of the support rod. The groove is filled with an insulating layer, and the filling height of the insulating layer protrudes from the groove at the end of the support rod. An insulating film is attached to the surface of the groove.

[0009] The insulating layer is specifically organic silica gel, and the outer surface of the organic silica gel is covered with a film sleeve, and the edge of the film sleeve is attached to the end side surface of the support rod.

[0010] An annular connecting groove is provided on the end surface of the pin close to the film capacitor body, and the depth of the connecting groove is equal to the thickness of the connecting sleeve. The connecting sleeve is engaged with the pin via the connecting groove.

[0011] The connecting sleeve is made of insulating material. When the connecting sleeve is sleeved on the pin, it can prevent current from flowing into the support rod through the connecting sleeve, thereby causing discharge at the contact end between the support rod and the PCB board.

[0012] The connecting sleeve is made of the same material as the pin. When the connecting sleeve is sleeved on the pin, it can compensate for the weakening of the current flowing through the pin caused by the reduction of the conductor cross-section due to the opening of the connecting slot.

[0013] The support rod is made of insulating material, and when the connecting sleeve is a conductor, it can prevent current from being transmitted to the PCB board through the support rod and causing a short circuit on the PCB board.

[0014] The support rod is made of the same material as the connecting sleeve, and heat can be quickly dissipated through the support rod during pin welding.

[0015] Compared with the prior art, the beneficial effects of the present invention are:

[0016] In order to prevent the pins on the capacitor from being inserted too deeply when connected to the PCB board, causing the electrodes of the film capacitor to be too close to the PCB board, and the pins to be subjected to excessive lateral tension after soldering, which may cause them to heat up and be damaged during long-term use, the present application fixes a limit frame on the pins, and uses the limit frame to limit the pins, which can effectively prevent the pins from being inserted too deeply.

[0017] Furthermore, the present application has a groove at the end of the limit frame, and the groove is filled with an insulating layer. On the one hand, the insulating layer can allow the limit frame to be temporarily bonded to the PCB board, so that the pins and the PCB board are kept horizontal, preventing the pins from being inserted at inconsistent depths, which leads to the disadvantage of excessive lateral pulling of the pins. The bonding of the insulating layer also makes it easier for the capacitor to remain stable when the pins and the PCB board are soldered. At the same time, the insulating layer has insulating properties that can prevent the capacitor or the PCB board from short-circuiting due to discharge caused by the passage of current at the abutment between the limit frame and the PCB board.

[0018] In order to ensure that the connection between the limit frame and the pin is relatively fixed, the present application provides a connecting groove on the pin. However, the opening of the connecting groove will result in a smaller cross-sectional area of the pin, thereby reducing the passage of current. Therefore, the present application can make the connecting sleeve on the limit frame that is connected to the pin sleeve using a conductor to compensate for the connecting groove. Furthermore, when the impact of the opening of the connecting groove on the passage of current can be ignored, the connecting sleeve can also be made of insulating material to avoid the current being transmitted to the PCB board through the limit frame and causing a short circuit.

[0019] The support plate on the corresponding limit frame can be made of insulating material when the connecting sleeve is a conductor, thereby also preventing the current from being transferred to the PCB board through the limit frame and causing a short circuit. Furthermore, the support plate can also be made of the same material as the connecting sleeve. On the one hand, it is convenient to manufacture the connecting sleeve and the support plate as one piece, thereby ensuring the overall strength of the limit frame. On the other hand, when the support plate and the connecting sleeve are both made of conductive materials, it is convenient to dissipate heat, and can quickly dissipate the heat generated by the pins during welding and the use of the capacitor. When the support plate is a conductor, its end is filled with an insulating layer. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 This is a three-dimensional structure diagram of a capacitor.

[0021] Figure 2 This is a structural diagram of the pin and its limiting mechanism.

[0022] Figure 3 for Figure 2 An enlarged view of the entire limit mechanism at point A in the middle.

[0023] Figure 4 A three-dimensional structure for connecting capacitors to PCB boards Figure 1 .

[0024] Figure 5 A three-dimensional structure for connecting capacitors to PCB boards Figure 2 .

[0025] The correspondence between the labels in the figures and the component names is as follows: 100, film capacitor body; 101, pin; 101a, connection groove; 102, limit frame; 102a, connection sleeve; 102b, support rod; 102c, insulation layer; 102d, film sleeve; 200, PCB board. DETAILED DESCRIPTION

[0026] In order to make the above-mentioned objects, features and advantages of the present invention more obvious and easy to understand, the specific implementation methods of the present invention are described in detail below with reference to the accompanying drawings.

[0027] In the following description, many specific details are set forth to facilitate a full understanding of the present invention. However, the present invention is implemented in other ways different from those described herein. Those skilled in the art can make similar generalizations without violating the connotation of the present invention. Therefore, the present invention is not limited to the specific embodiments disclosed below.

[0028] Secondly, the term "one embodiment" or "embodiment" herein refers to a specific feature, structure, or characteristic that may be included in at least one implementation of the present invention. The phrase "in one embodiment" appearing in various places throughout this specification does not necessarily refer to the same embodiment, nor does it refer to a separate or selective embodiment that is mutually exclusive with other embodiments. The present invention provides the following embodiments.

[0029] See Figure 1 and Figure 2 This is a diagram of the overall structure of the capacitor that is easy to weld in this embodiment. The capacitor in this embodiment is inserted into the PCB board 200. The capacitor includes a film capacitor body 100, and a pair of pins 101 are symmetrically connected to the film capacitor body 100. A limit frame 102 is fixedly sleeved on the pins 101. The limit frame 102 includes a connecting sleeve 102a that is sleeved with the pins 101 and a plurality of support rods 102b that are equidistantly arranged on the side of the connecting sleeve 102a in a surrounding manner; when the pins 101 of the film capacitor body 100 are inserted into the preset holes on the PCB board 200, the ends of the support rods 102b abut against the surface of the PCB board 200 to limit the insertion depth of the pins 101.

[0030] See Figure 3This is a structural diagram of the limiting mechanism in this embodiment. The support rod 102b in this embodiment is a Z-shaped structure, which on the one hand makes the surface area of the support rod 102b larger, thereby facilitating heat dissipation. On the other hand, there is a larger space between the support rod 102b and the pin 101, which to a certain extent avoids heat accumulation. Furthermore, in order to ensure that the connection between the limiting frame 102 and the pin 101 is more secure and prevents it from falling off, the present application provides an annular connecting groove 101a on the end face of the pin 101 close to the film capacitor body 100, and the opening depth of the connecting groove 101a is equal to the thickness of the connecting sleeve 102a, and the connecting sleeve 102a is connected to the pin 101 by means of the connecting groove 101a.

[0031] See Figure 4 and Figure 5 This is a schematic diagram of the assembly of the capacitor and the PCB board in this embodiment. In this application, a connecting groove 101a is opened on the pin 101, but the opening of the connecting groove 101a will result in a smaller cross-sectional area of the pin 101, thereby reducing the current passing through. Therefore, in this embodiment, the connecting sleeve 102a is made of the same material as the pin 101, that is, a conductor material. When the connecting sleeve 102a is sleeved on the pin 101, it can compensate for the weakening of the current passing through the pin 101 caused by the reduction in the conductor cross-section due to the opening of the connecting groove 101a. Furthermore, when the influence of the opening of the connecting groove 101a on the current passing through can be ignored, in this embodiment, the connecting sleeve 102a can be made of an insulating material. When the connecting sleeve 102a is sleeved on the pin 101, it can prevent the current from flowing through the connecting sleeve 102a into the support rod 102b, thereby causing discharge at the contact end of the support rod 102b and the PCB board 200.

[0032] See again Figure 4 and Figure 5 When the connecting sleeve 102a is a conductor, the support rod 102b is made of insulating material to prevent current from being transmitted to the PCB board 200 through the support rod 102b and causing a short circuit on the PCB board 200. Furthermore, the support rod 102b is made of the same material as the connecting sleeve 102a. On the one hand, it is convenient to manufacture the connecting sleeve 102a and the support plate 102b as one piece, thereby ensuring the overall strength of the limit frame 102. On the other hand, when the support plate 102b and the connecting sleeve 102a are both made of conductive materials, it is convenient to dissipate heat, and can quickly dissipate the heat generated by the pin 101 during welding and the use of the film capacitor body 100.

[0033] See Figure 3, when the support plate 102b and the connecting sleeve 102a constituting the limit frame 102 are both made of conductive materials, in order to prevent the current passing through the pin 101 from being dispersed to the limit frame 102, thereby causing discharge at the connection between the support plate 102b and the PCB board 200 and causing a short circuit, this embodiment provides a groove at the end of the support rod 102b, and fills the groove with an insulating layer 102c. The insulating layer 102c is used to isolate the connection between the support plate 102b and the PCB board 200. The insulating layer 102c allows the limit frame 102 to be temporarily bonded to the PCB board, thereby keeping the pin 101 and the PCB board 200 plugged in horizontally, preventing the pin 101 from being inserted into the PCB board 200 at an inconsistent depth. At the same time, when the insulating layer 102c is used for bonding, the limit frame 102 needs to be fixed. 02 applies a certain force, at this time the insulating layer 102c is squeezed by the force, in order to prevent the insulating layer 102c from being compressed and diffusing, causing the support rod 102b to contact the PCB board 200, the filling height of the insulating layer 102c protrudes from the groove at the end of the support rod 102b, that is, the filling amount of the insulating layer 102c is large, and an insulating film is attached to the surface of the groove to further prevent the support rod 102b from contacting the PCB board 200. The insulating layer 102c is specifically organic silicone, and the outer surface of the organic silicone is covered with a film sleeve 102d, and the edge of the film sleeve 102d is attached to the end side of the support rod 102b. The film sleeve 102d is used to prevent the organic silicone from coming into contact with the air and hardening. The film sleeve 102d is torn off when in use.

[0034] The above content is a further detailed description of the present invention in combination with specific implementation methods. It cannot be determined that the specific implementation of the present invention is limited to these descriptions. For ordinary technicians in the technical field to which the present invention belongs, without departing from the concept of the present invention, making some simple deductions or substitutions should be regarded as falling within the scope of protection determined by the claims submitted for the present invention.

Claims

1. A capacitor that is easy to weld and is plugged into a PCB board (200), the capacitor comprising a film capacitor body (100), a pair of pins (101) symmetrically connected to the film capacitor body (100), and characterized in that: A limiting frame (102) is fixedly sleeved on the pin (101), and the limiting frame (102) comprises a connecting sleeve (102a) sleeved with the pin (101) and a plurality of supporting rods (102b) arranged in a surrounding manner and at equal intervals on the side of the connecting sleeve (102a); when the pin (101) of the film capacitor body (100) is inserted into a preset hole on the PCB board (200), the end of the supporting rod (102b) abuts against the surface of the PCB board (200) to limit the insertion depth of the pin (101).

2. The capacitor according to claim 1, wherein: The support rod (102b) has a Z-shaped structure, and a groove is provided at the end of the support rod (102b). The groove is filled with an insulating layer (102c), and the filling height of the insulating layer (102c) protrudes from the groove at the end of the support rod (102b). An insulating film is adhered to the surface of the groove.

3. The capacitor according to claim 2, wherein: The insulating layer (102c) is specifically organic silica gel, and the outer surface of the organic silica gel is covered with a film sleeve (102d), and the edge of the film sleeve (102d) is attached to the end side surface of the support rod (102b).

4. The capacitor according to claim 1, wherein: An annular connecting groove (101a) is provided on the end surface of the pin (101) close to the film capacitor body (100), and the depth of the connecting groove (101a) is equal to the thickness of the connecting sleeve (102a). The connecting sleeve (102a) is engaged and connected with the pin (101) via the connecting groove (101a).

5. The capacitor according to claim 4, wherein: The connecting sleeve (102a) is made of insulating material. When the connecting sleeve (102a) is sleeved on the pin (101), it can prevent current from flowing through the connecting sleeve (102a) into the support rod (102b), thereby causing discharge at the contact end between the support rod (102b) and the PCB board (200).

6. The capacitor according to claim 5, wherein: The connecting sleeve (102a) is made of the same material as the pin (101). When the connecting sleeve (102a) is sleeved on the pin (101), it can compensate for the weakening of the current flowing through the pin (101) due to the reduction in the conductor cross-section caused by the opening of the connecting groove (101a).

7. The capacitor according to claim 6, wherein: The support rod (102b) is made of insulating material, and when the connecting sleeve (102a) is a conductor, current can be prevented from being transmitted to the PCB board (200) through the support rod (102b), thereby preventing the PCB board (200) from short-circuiting.

8. The capacitor according to claim 7, wherein: The support rod (102b) is made of the same material as the connecting sleeve (102a), and heat can be quickly dissipated through the support rod (102b) when the pin (101) is welded.

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