Semiconductor wafer internal cutting processing equipment

Abstract

The utility model discloses semiconductor wafer internal cutting processing equipment. Comprising a feeding and discharging mechanism and a machining carrying table, the feeding and discharging mechanism comprises a basket mechanism, a clamping assembly, a tidying assembly and a carrying mechanism, the clamping assembly and the tidying assembly are arranged on the outlet side of the basket mechanism, and the carrying mechanism is arranged above the tidying assembly and the machining carrying table; the lifting basket mechanism moves the semiconductor wafer in the Z-axis direction, the clamping assembly moves the semiconductor wafer in the Y-axis direction, the carrying mechanism moves the semiconductor wafer in the Y-axis direction and the Z-axis direction, and the Y-axis movement track of the carrying mechanism is located between the arranging assembly and the machining carrying table. The arranging assembly is divided into an upper layer and a lower layer, the basket mechanism, the clamping assembly, the lower layer and the carrying mechanism form a feeding channel, and the carrying mechanism, the upper layer, the clamping assembly and the basket mechanism form a discharging channel. According to the utility model, automatic loading and unloading of semiconductor wafers are realized through the loading and unloading mechanism, the loading and unloading efficiency is greatly improved, and the manual labor intensity and the production cost are reduced.

Description

Technical field:

[0001] The utility model belongs to the technical field of semiconductor wafer processing, and in particular relates to semiconductor wafer incision processing equipment. Background technology:

[0002] In the semiconductor wafer production process, the wafer needs to be internally cut. With the advancement of integrated circuit technology, the thickness of semiconductor wafers has gradually decreased. In order to ensure the cutting effect, laser cutting has gradually replaced saw blade cutting.

[0003] Existing laser cutting equipment still relies on manual loading and unloading during batch processing of semiconductor wafers. This is not only inefficient and unable to meet the requirements of loading and unloading, but also labor-intensive. Designing a semiconductor wafer incision processing equipment that can automatically load and unload efficiently is a problem that needs to be solved.

[0004] The information disclosed in this background technology section is only intended to increase the understanding of the overall background of the present invention, and should not be regarded as an admission or any form of suggestion that the information constitutes the prior art already known to those skilled in the art. Utility model content:

[0005] The purpose of the present invention is to provide a semiconductor wafer incision processing device, thereby overcoming the above-mentioned defects in the prior art.

[0006] To achieve the above-mentioned purpose, the utility model provides a semiconductor wafer incision processing equipment, including a loading and unloading mechanism and a processing platform. The loading and unloading mechanism includes a basket lifting mechanism, a clamping component, a tidying component and a conveying mechanism. The clamping component and the tidying component are arranged on the outlet side of the basket lifting mechanism, and the conveying mechanism is arranged above the tidying component and the processing platform; the basket lifting mechanism moves the semiconductor wafer in the Z-axis direction, the clamping component moves the semiconductor wafer in the Y-axis direction, and the conveying mechanism moves the semiconductor wafer in the Y-axis and Z-axis directions, and the Y-axis motion trajectory of the conveying mechanism is located between the tidying component and the processing platform; the tidying component is divided into an upper layer and a lower layer, the basket lifting mechanism, the clamping component, the lower layer and the conveying mechanism form a loading channel, and the conveying mechanism, the upper layer, the clamping component and the basket lifting mechanism form a unloading channel. Through the cooperation of the loading channel and the unloading channel, uninterrupted loading and unloading of semiconductor wafers can be achieved.

[0007] Preferably, in the technical solution, the basket lifting mechanism includes a basket, a lifting plate, a lifting module, a first servo motor, and a frame. The frame is provided with a lifting module and a first servo motor. The first servo motor is transmission-connected to the lifting module. The lifting module is provided with a lifting plate, and a basket is provided on the lifting plate. The basket is provided with layered placement racks, and each layer of placement racks corresponds to a semiconductor wafer. The lifting plate is driven up and down by the first servo motor and the lifting module, thereby changing the height of each layer of semiconductor wafers in the basket.

[0008] Preferably, in the technical solution, the regularization component includes a regularization mechanism, a forward and reverse synchronous dual slider module, an X-axis guide rail, a support seat, and a fifth servo motor. The support seat is arranged on the basket outlet side, and the support seat is provided with an X-axis guide rail and a fifth servo motor. The X-axis guide rail is provided with a forward and reverse synchronous dual slider module. The fifth servo motor is transmission-connected to the forward and reverse synchronous dual slider module, and the regularization mechanism is symmetrically arranged on the forward and reverse synchronous dual slider module; the regularization mechanism includes an upper regularization bar, a lower regularization bar, a regularization cylinder, and a fine-tuning slide rail. The lower regularization bar is arranged on the forward and reverse synchronous dual slider module, and the lower regularization bar is provided with a regularization cylinder and a fine-tuning slide rail. The upper regularization bar is arranged on the fine-tuning slide rail. The regularization cylinder is connected to the upper regularization bar, and the distance between the upper regularization bars is adjusted by the regularization cylinder; the lower regularization bar performs X-axial positioning on the loaded semiconductor wafer, and the upper regularization bar performs X-axial positioning on the unloaded semiconductor wafer.

[0009] Preferably, in the technical solution, steel ring detection sensors are provided on both the upper regular strip and the lower regular strip to detect the edge position of the semiconductor wafer.

[0010] Preferably, in the technical solution, the clamping assembly includes a clamping assembly, a movable arm, a movable module, a second servo motor, and a support frame. The support frame is provided with a movable module and a second servo motor. The movable module is arranged along the Y-axis direction. The second servo motor is transmission-connected to the movable module. A movable arm is provided on the movable module. A clamping assembly is provided at the end of the movable arm. The clamping assembly is located on the inner side of the regularizing mechanism, and the moving trajectory of the clamping assembly is located between the basket and the regularizing mechanism.

[0011] Preferably, in the technical solution, the clamp assembly includes a clamping cylinder, a chuck, an upper and lower layer switching cylinder, and a buffer cylinder. The buffer cylinder is arranged at the end of the movable arm, and the upper and lower layer switching cylinder is arranged at the output end of the buffer cylinder. The upper and lower layer switching cylinder output end is provided with a clamping cylinder, and the clamping cylinder output end is provided with a chuck, which is arranged toward the semiconductor wafer; the chuck is driven to extend and retract by the buffer cylinder, and cooperates with the clamping cylinder to realize the chuck taking and releasing materials; the upper limit point and the lower limit point of the upper and lower layer switching cylinder output are respectively aligned with the height of the upper regular strip and the lower regular strip, and the position of the chuck is switched by the upper and lower layer switching cylinder to realize the switching of the chuck in the loading channel and the unloading channel.

[0012] Preferably, in the technical solution, the conveying mechanism includes a conveying plate, a vacuum adsorption component, a Z-axis conveying module, a third servo motor, a Y-axis conveying module, a fourth servo motor, and a conveying frame. The conveying frame is arranged above the regular assembly and the processing platform. The Y-axis conveying module and the fourth servo motor are arranged on the conveying frame along the Y-axis direction. The fourth servo motor is transmission-connected to the Y-axis conveying module. A moving seat is arranged on the Y-axis conveying module. The Z-axis conveying module and the third servo motor are arranged on the moving seat. The third servo motor is connected to the Z-axis conveying module. A conveying plate is arranged on the Z-axis conveying module. The conveying plate is provided with a vacuum adsorption component, and the vacuum adsorption component is arranged downward; the semiconductor wafer is adsorbed by the vacuum adsorption component, the height of the semiconductor wafer is adjusted by the Z-axis conveying module, and the movement of the semiconductor wafer between the regular assembly and the processing platform is realized by the Y-axis conveying module. The vacuum adsorption component, the Z-axis conveying module and the Y-axis conveying module cooperate to realize the semiconductor wafer taking on the lower regular strip and placing on the upper regular strip.

[0013] Compared with the prior art, the present invention has the following beneficial effects:

[0014] The automatic loading and unloading of semiconductor wafers is achieved through the loading and unloading mechanism, which greatly improves the loading and unloading efficiency compared to manual loading and unloading, meets the production needs of the equipment, and reduces manual labor intensity and production costs. Description of the drawings:

[0015] Figure 1 This is a schematic diagram of the structure of the semiconductor wafer incision processing equipment of the utility model;

[0016] Figure 2 This is a schematic diagram of the structure of the clamping assembly of the utility model;

[0017] Figure 3 This is a schematic diagram of the structure of the clamp assembly of the utility model;

[0018] Figure 4 This is a schematic diagram of the structure of the regular components of the utility model;

[0019] Figure 5 This is a schematic diagram of the structure of the transport mechanism of the utility model. Specific implementation method:

[0020] The specific implementation methods of the present invention are described in detail below, but it should be understood that the protection scope of the present invention is not limited by the specific implementation methods.

[0021] Unless expressly stated otherwise, throughout the specification and claims, the term "comprise" or variations such as "include" or "comprising", etc., will be understood to include the stated elements or components but not to exclude other elements or other components.

[0022] like Figure 1 As shown, a semiconductor wafer incision processing equipment includes a loading and unloading mechanism and a processing platform 1, the loading and unloading mechanism includes a basket lifting mechanism 2, a clamping component 3, a tidying component 4, and a conveying mechanism 5, the clamping component 3 and the tidying component 4 are arranged on the outlet side of the basket lifting mechanism 2, and the conveying mechanism 5 is arranged above the tidying component 4 and the processing platform 1; the basket lifting mechanism 2 moves the semiconductor wafer 6 in the Z-axis direction, the clamping component 3 moves the semiconductor wafer 6 in the Y-axis direction, and the conveying mechanism 5 moves the semiconductor wafer 6 in the Y-axis and Z-axis directions, and the Y-axis motion trajectory of the conveying mechanism 5 is located between the tidying component 4 and the processing platform 1; the tidying component 4 is divided into an upper layer and a lower layer, the basket lifting mechanism 2, the clamping component 3, the lower layer, and the conveying mechanism 5 form a loading channel, and the conveying mechanism 5, the upper layer, the clamping component 3, and the basket lifting mechanism 2 form a unloading channel, and the loading channel and the unloading channel cooperate to realize uninterrupted loading and unloading of the semiconductor wafer 6.

[0023] like Figure 1 As shown, the basket lifting mechanism 2 includes a basket 20, a lifting plate 21, a lifting module 22, a first servo motor 23, and a frame 24. The frame 24 is provided with a lifting module 22 and a first servo motor 23. The first servo motor 23 is transmission-connected to the lifting module 22. The lifting plate 21 is provided on the lifting module 22. The basket 20 is provided on the lifting plate 21. The basket 20 is provided with placement racks in layers, and each layer of placement racks corresponds to a semiconductor wafer. The lifting plate 21 is driven up and down by the first servo motor 23 and the lifting module 22, thereby changing the height of each layer of semiconductor wafers in the basket.

[0024] like Figure 4 As shown, the regularization component 4 includes a regularization mechanism, a forward and reverse synchronous double slider module 44, an X-axis guide rail 45, a support seat 46, and a fifth servo motor 48. The support seat 46 is arranged on the outlet side of the basket 20, and the X-axis guide rail 45 and the fifth servo motor 48 are arranged on the support seat 46. The forward and reverse synchronous double slider module 44 is arranged on the X-axis guide rail 45. The fifth servo motor 48 is transmission-connected to the forward and reverse synchronous double slider module 44. The regularization mechanism is symmetrically arranged on the forward and reverse synchronous double slider module 44; the regularization mechanism includes an upper regularization bar 40 The lower-layer regularizing bar 41, regularizing cylinder 42, and fine-tuning slide 43 are arranged on a dual-slider module 44 that moves in both forward and reverse directions. The lower-layer regularizing bar 41 is equipped with a regularizing cylinder 42 and a fine-tuning slide 43. The upper-layer regularizing bar 40 is arranged on the fine-tuning slide 43. The regularizing cylinder 42 is connected to the upper-layer regularizing bar 40, and the distance between the upper-layer regularizing bars 40 is adjusted by the regularizing cylinder 42. The lower-layer regularizing bar 41 performs X-axial positioning for the loaded semiconductor wafer, while the upper-layer regularizing bar 40 performs X-axial positioning for the unloaded semiconductor wafer. Both the upper-layer regularizing bar 40 and the lower-layer regularizing bar 41 are equipped with steel ring detection sensors 47 for detecting the edge position of the semiconductor wafer.

[0025] like Figure 2 As shown, the clamping assembly 3 includes a clamping assembly 30, a movable arm 31, a movable module 32, a second servo motor 33, and a support frame 34. The support frame 34 is provided with a movable module 32 and a second servo motor 33. The movable module 32 is arranged along the Y-axis direction. The second servo motor 33 is transmission-connected to the movable module 32. The movable arm 31 is provided on the movable module 32. The clamping assembly 30 is provided at the end of the movable arm 31. The clamping assembly 30 is located on the inner side of the regularizing mechanism, and the moving trajectory of the clamping assembly 30 is located between the basket 20 and the regularizing mechanism.

[0026] like Figure 3 As shown, the clamp assembly 30 includes a clamping cylinder 300, a chuck 301, an upper and lower layer switching cylinder 302, and a buffer cylinder 303. The buffer cylinder 303 is arranged at the end of the movable arm 31, and the upper and lower layer switching cylinder 302 is provided at the output end of the buffer cylinder 303. The output end of the upper and lower layer switching cylinder 302 is provided with a clamping cylinder 300, and the output end of the clamping cylinder 300 is provided with a chuck 301, which is arranged toward the semiconductor wafer; the chuck 301 is driven to extend and retract by the buffer cylinder 303, and cooperates with the clamping cylinder 300 to realize the material picking and unloading of the chuck 301; the upper limit point and the lower limit point of the output of the upper and lower layer switching cylinder 302 are respectively aligned with the height of the upper regular strip 40 and the lower regular strip 41, and the position of the chuck 301 is switched by the upper and lower layer switching cylinder 302 to realize the switching of the chuck 301 in the loading channel and the unloading channel.

[0027] like Figure 5As shown, the transport mechanism 5 includes a transport plate 50, a vacuum adsorption component 51, a Z-axis transport module 52, a third servo motor 53, a Y-axis transport module 54, a fourth servo motor 55, and a transport frame 56. The transport frame 56 is arranged above the regular component 4 and the processing carrier 1. The transport frame 56 is provided with a Y-axis transport module 54 and a fourth servo motor 55 along the Y-axis direction. The fourth servo motor 55 is transmission-connected to the Y-axis transport module 54. The Y-axis transport module 54 is provided with a moving seat. The moving seat is provided with a Z-axis transport module 52 and a third servo motor 53. The third servo motor 53 is connected to the Z-axis. The Z-axis transport module 52 is connected to the processing platform 1. The Z-axis transport module 52 is provided with a transport tray 50. The transport tray 50 is provided with a vacuum adsorption assembly 51. The vacuum adsorption assembly 51 is arranged downward. The semiconductor wafer is adsorbed by the vacuum adsorption assembly 51, and the height of the semiconductor wafer is adjusted by the Z-axis transport module 52. The semiconductor wafer is moved between the regularization assembly 4 and the processing platform 1 by the Y-axis transport module 54. The vacuum adsorption assembly 51, the Z-axis transport module 52 and the Y-axis transport module 54 cooperate to realize the semiconductor wafer to be taken from the lower regularization strip 41 and to be put on the upper regularization strip 40. The vacuum adsorption assembly 51 has a gas-off holding function. After the gas is cut off in an emergency, the vacuum adsorption assembly 51 can still adsorb the product and place the product in a safe location to ensure the safety of the product.

[0028] During operation, according to the size of the semiconductor wafer 6, the fifth servo motor 48 starts to drive the forward and reverse synchronous double slider module 44 to move, adjust the distance between the lower regular strips 41 to a suitable position, and place the semiconductor wafer 6 on the corresponding placement rack in the basket 20. The first servo motor 23 starts to drive the basket 20 to rise through the lifting plate 21, and the top placement rack is flush with the lower regular strip 41. The second servo motor 33 starts to drive the clamping assembly 30 to move toward the basket 20 along the Y-axis direction. When the chuck 301 moves to the top placement rack, the buffer cylinder 303 drives the chuck 301 to extend forward, and the clamping cylinder 300 drives the chuck 301 to clamp the semiconductor wafer 6 in the top placement rack. The second servo motor 33 drives the chuck 301 is reset, and the chuck 301 places the semiconductor wafer 6 on the lower aligning strip 41. The second servo motor 33 drives the chuck 301 out of the aligning assembly 4. The fourth servo motor 55 is activated, driving the vacuum adsorption assembly 51 to move above the lower aligning strip 41. The third servo motor 53 is activated, driving the vacuum adsorption assembly 51 to descend to the lower aligning strip 41. The vacuum adsorption assembly 51 picks up the semiconductor wafer 6. The fourth servo motor 55 is reset, and the vacuum adsorption assembly 51 moves the semiconductor wafer 6 to the processing platform 1, where it is released and placed on the processing platform 1. The third servo motor 53 is reset, driving the vacuum adsorption assembly 51 to rise. The laser head performs incision processing on the semiconductor wafer 6 on the processing platform 1. At the same time, the basket 20 continues to rise, aligning the lower aligning strip 41 of the second-layer placement rack. The chuck 301 clamps the semiconductor wafer 6 in the second-layer placement rack and moves it onto the lower aligning strip 41. When the semiconductor wafer 6 on the processing platform 1 is processed, the vacuum suction component 51 removes the semiconductor wafer 6 and transfers it to the upper regularization bar 40. The vacuum suction component 51 moves away, the upper and lower layer switching cylinder 302 is activated, and the chuck 301 switches to the upper limit point. The chuck 301 clamps the processed semiconductor wafer 6 on the upper regularization bar 40 and places it on the placement rack on the top layer of the basket 20. The vacuum suction component 51 picks up the semiconductor wafer 6 on the lower regularization bar 41 and moves it to the processing platform 1. This cycle repeats, realizing automatic loading and unloading of semiconductor wafers 6. Compared with manual loading and unloading, it greatly improves loading and unloading efficiency, meets the production requirements of the equipment, and reduces labor intensity and production costs.

[0029] The foregoing descriptions of specific exemplary embodiments of the present invention are for purposes of illustration and description. These descriptions are not intended to limit the present invention to the precise forms disclosed, and it is apparent that many modifications and variations are possible in light of the foregoing teachings. The exemplary embodiments have been selected and described for the purpose of explaining the specific principles of the present invention and their practical application, thereby enabling those skilled in the art to realize and utilize a variety of exemplary embodiments of the present invention and various options and variations. The scope of the present invention is intended to be defined by the claims and their equivalents.

Claims

1. A semiconductor wafer incision processing equipment, characterized by: It includes a loading and unloading mechanism and a processing platform. The loading and unloading mechanism includes a basket lifting mechanism, a clamping assembly, a tidying assembly, and a conveying mechanism. The clamping assembly and the tidying assembly are arranged on the outlet side of the basket lifting mechanism, and the conveying mechanism is arranged above the tidying assembly and the processing platform; the basket lifting mechanism moves the semiconductor wafer in the Z-axis direction, the clamping assembly moves the semiconductor wafer in the Y-axis direction, and the conveying mechanism moves the semiconductor wafer in the Y-axis and Z-axis directions. The Y-axis motion trajectory of the conveying mechanism is located between the tidying assembly and the processing platform; the tidying assembly is divided into an upper layer and a lower layer, the basket lifting mechanism, the clamping assembly, the lower layer, and the conveying mechanism form a loading channel, and the conveying mechanism, the upper layer, the clamping assembly, and the basket lifting mechanism form a unloading channel.

2. The semiconductor wafer incision processing equipment according to claim 1, characterized in that: The basket lifting mechanism includes a basket, a lifting plate, a lifting module, a first servo motor, and a frame. The frame is provided with a lifting module and a first servo motor. The first servo motor is transmission-connected to the lifting module. The lifting module is provided with a lifting plate, and the lifting plate is provided with a basket. The basket is provided with layered placement racks, and each layer of placement racks corresponds to a semiconductor wafer.

3. The semiconductor wafer incision processing equipment according to claim 2, characterized in that: The regularization component includes a regularization mechanism, a forward and reverse simultaneous moving double slider module, an X-axis guide rail, a support seat, and a fifth servo motor. The support seat is arranged on the basket outlet side, and the support seat is provided with an X-axis guide rail and a fifth servo motor. The X-axis guide rail is provided with a forward and reverse simultaneous moving double slider module. The fifth servo motor is transmission-connected to the forward and reverse simultaneous moving double slider module, and the regularization mechanism is symmetrically arranged on the forward and reverse simultaneous moving double slider module; the regularization mechanism includes an upper regularization bar, a lower regularization bar, a regularization cylinder, and a fine-tuning slide rail. The lower regularization bar is arranged on the forward and reverse simultaneous moving double slider module, and the lower regularization bar is provided with a regularization cylinder and a fine-tuning slide rail. The upper regularization bar is arranged on the fine-tuning slide rail, and the regularization cylinder is connected to the upper regularization bar; the lower regularization bar performs X-axial positioning on the loaded semiconductor wafer, and the upper regularization bar performs X-axial positioning on the unloaded semiconductor wafer.

4. The semiconductor wafer incision processing equipment according to claim 3, characterized in that: Steel ring detection sensors are provided on both the upper regular strips and the lower regular strips.

5. The semiconductor wafer incision processing equipment according to claim 3, characterized in that: The clamping assembly includes a clamping assembly, a movable arm, a movable module, a second servo motor, and a support frame. The movable module and the second servo motor are arranged on the support frame. The movable module is arranged along the Y-axis direction. The second servo motor is transmission-connected to the movable module. The movable arm is arranged on the movable module. The clamping assembly is arranged at the end of the movable arm. The clamping assembly is located on the inner side of the regularizing mechanism, and the moving trajectory of the clamping assembly is located between the basket and the regularizing mechanism.

6. The semiconductor wafer incision processing equipment according to claim 5, characterized in that: The clamping assembly includes a clamping cylinder, a chuck, an upper and lower layer switching cylinder, and a buffer cylinder. The buffer cylinder is arranged at the end of the movable arm, and the upper and lower layer switching cylinder is arranged at the output end of the buffer cylinder. The upper and lower layer switching cylinder output end is provided with a clamping cylinder, and the clamping cylinder output end is provided with a chuck, which is arranged toward the semiconductor wafer; the chuck is driven to extend and retract by the buffer cylinder, and cooperates with the clamping cylinder to realize the chuck taking and unloading of materials; the upper and lower limit points of the upper and lower layer switching cylinder output are respectively aligned with the height of the upper and lower layer regular strips, and the position of the chuck is switched by the upper and lower layer switching cylinder to realize the switching of the chuck in the loading channel and the unloading channel.

7. The semiconductor wafer incision processing equipment according to claim 5, characterized in that: The conveying mechanism includes a conveying plate, a vacuum adsorption component, a Z-axis conveying module, a third servo motor, a Y-axis conveying module, a fourth servo motor, and a conveying frame. The conveying frame is arranged above the regular assembly and the processing platform. The Y-axis conveying module and the fourth servo motor are arranged on the conveying frame along the Y-axis direction. The fourth servo motor is transmission-connected to the Y-axis conveying module. A moving seat is arranged on the Y-axis conveying module. The moving seat is provided with the Z-axis conveying module and the third servo motor. The third servo motor is connected to the Z-axis conveying module. A conveying plate is arranged on the Z-axis conveying module. The conveying plate is provided with a vacuum adsorption component, and the vacuum adsorption component is arranged downward. The semiconductor wafer is adsorbed by the vacuum adsorption component, the height of the semiconductor wafer is adjusted by the Z-axis conveying module, and the movement of the semiconductor wafer between the regular assembly and the processing platform is realized by the Y-axis conveying module. The vacuum adsorption component, the Z-axis conveying module and the Y-axis conveying module cooperate to realize the semiconductor wafer taking on the lower regular strip and putting on the upper regular strip.

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