Capacitive coupling packaging structure

Abstract

The utility model discloses a capacitive coupling packaging structure. The capacitive coupling packaging structure comprises a first packaging component, a second packaging component, a first conductive component, a second conductive component, a first chip and a second chip. The first package member has two opposite first sides and two second sides connecting the two first sides. The second package member covers the first package member. The first conductive component and the second conductive component are arranged in the first packaging component. One part of the first conductive component and one part of the second conductive component respectively extend out of the second packaging component through the two first sides. The other part of the first conductive component and the other part of the second conductive component are flush with the two second sides. The first chip and the second chip generate a capacitive coupling relationship through the first conductive component and the second conductive component.

Description

Technical Field

[0001] The utility model relates to a packaging structure, in particular to a capacitive coupling packaging structure. Background Art

[0002] During the manufacturing process, conventional capacitive coupling packaging structures often use a single-die packaging method to encapsulate the chip and conductive components. However, due to the single-die packaging, the isolation voltage performance of conventional capacitive coupling packaging structures is very unsatisfactory.

[0003] Therefore, the inventors believe that the above defects can be improved, and have devoted themselves to research and applied scientific principles to finally propose a utility model that has a reasonable design and effectively improves the above defects. Utility Model Content

[0004] The technical problem to be solved by the present invention is to provide a capacitive coupling packaging structure in view of the deficiencies in the prior art.

[0005] An embodiment of the present invention discloses a capacitive coupling packaging structure, comprising: a first packaging component having two opposite first sides and two second sides connecting the two first sides; a second packaging component covering the first packaging component; a first conductive component and a second conductive component, arranged in the first packaging component, wherein a portion of the first conductive component and a portion of the second conductive component respectively extend out of the second packaging component through the two first sides, and another portion of the first conductive component and another portion of the second conductive component are aligned with the two second sides; and a first chip and a second chip, wherein the first chip is electrically coupled to the first conductive component, and the second chip is electrically coupled to the second conductive component, and the first chip and the second chip generate a capacitive coupling relationship through the first conductive component and the second conductive component.

[0006] Preferably, each second side has a first area and a second area spaced apart from each other, and an intermediate area located between the first area and the second area, and the position where the first conductive component is aligned with the portion of the second side and the position where the second conductive component is aligned with the portion of the second side are located in the intermediate area.

[0007] Preferably, the surface roughness of each second side in the middle region is greater than the surface roughness of each second side in the first region and the second region.

[0008] Preferably, the middle area is stepped and has a first transverse portion, a longitudinal portion, and a second transverse portion, the two ends of the longitudinal portion are connected to the first transverse portion and the second transverse portion, the portion of the first conductive component that is aligned with the second side is located in the first transverse portion, and the portion of the second conductive component that is aligned with the second side is located in the second transverse portion.

[0009] Preferably, the first conductive component has a predetermined configuration line, and the height of the first conductive component located on one side of the predetermined configuration line is higher or lower than the height of the first conductive component located on the other side of the predetermined configuration line.

[0010] Preferably, the first conductive component includes a plurality of first pins connected to the first chip and two first coupling plates connected to the first chip, the plurality of first pins are arranged in the first packaging component, and the ends of the plurality of first pins pass through the two first sides and the second packaging component and are exposed outside the second packaging component; the second conductive component includes a plurality of second pins connected to the second chip and two second coupling plates connected to the second chip, a portion of the plurality of first pins are connected to the two first coupling plates and defined as a first coupling pin, a portion of the plurality of second pins are connected to the two second coupling plates and defined as a second coupling pin, and the height position of the first coupling pin is different from the height position of the second coupling pin.

[0011] Preferably, the first conductive component includes a plurality of first pins connected to the first chip, each of the first pins includes a first inner segment and a first outer segment connected to the first inner segment, the predetermined configuration line passes between the first inner segment and the first outer segment, and the height position of the first outer segment is different from the height position of the first inner segment.

[0012] Preferably, the second conductive component includes a plurality of second pins connected to the second chip, the plurality of second pins are arranged in the first packaging component, the ends of the plurality of second pins pass through the two first sides and the second packaging component and are exposed outside the second packaging component, and the height position of the plurality of second pins is equal to the height position of each first outer segment.

[0013] Preferably, the first conductive component includes two first coupling plates connected to the first chip, and the second conductive component includes two second coupling plates connected to the second chip. The two first coupling plates and the two second coupling plates are arranged in the first packaging component, and the ends of the two first coupling plates are aligned with one of the second sides, and the ends of the two second coupling plates are aligned with the other second side. The two first coupling plates are equal to the height position of each first inner segment, and the two second coupling plates are equal to the height position of each first outer segment.

[0014] Preferably, the first conductive component further includes a first placement pad for setting the first chip, and the second conductive component further includes a second placement pad for setting the second chip, the first placement pad is equal to the height position of each first inner segment, and the second placement pad is equal to the height position of each first outer segment.

[0015] Preferably, the first conductive component includes a plurality of first pins connected to the first chip, and the second conductive component includes a plurality of second pins connected to the second chip; a portion of the plurality of first pins connects to two first coupling plates and is defined as a first coupling pin, and a first predetermined angle is formed between the first coupling pin and the first coupling plate; a portion of the plurality of second pins connects to two second coupling plates and is defined as a second coupling pin, and a second predetermined angle is formed between the second coupling pin and the second coupling plate, and the first predetermined angle and the second predetermined angle are not less than 10 degrees.

[0016] Preferably, the first conductive component includes a plurality of first pins connected to the first chip, and the second conductive component includes a plurality of second pins connected to the second chip; a portion of the plurality of first pins connects two first coupling plates and is defined as a first coupling pin, and the width of the first coupling pin at an end adjacent to the first coupling plate is greater than the width of the first coupling pin at an end away from the first coupling plate; a portion of the plurality of second pins connects two second coupling plates and is defined as a second coupling pin, and the width of the second coupling pin at an end adjacent to the second coupling plate is greater than the width of the second coupling pin at an end away from the second coupling plate.

[0017] In summary, the capacitive coupling packaging structure disclosed in the embodiments of the present invention can improve the isolation voltage through the designs of "the first conductive component and the second conductive component are arranged in the first packaging component" and "one part of the first conductive component and one part of the second conductive component respectively extend out of the second packaging component through the two first sides, and the other part of the first conductive component and the other part of the second conductive component are aligned with the two second sides."

[0018] To further understand the features and technical contents of the present invention, please refer to the following detailed description and drawings of the present invention. However, such description and drawings are only used to illustrate the present invention and are not intended to limit the scope of protection of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 A schematic diagram showing a capacitive coupling packaging structure according to an embodiment of the present invention.

[0020] Figure 2 A schematic diagram showing a capacitive coupling packaging structure according to an embodiment of the present invention.

[0021] Figure 3 A schematic diagram showing a capacitive coupling packaging structure according to an embodiment of the present invention.

[0022] Figure 4 A schematic diagram showing a capacitive coupling packaging structure according to an embodiment of the present invention.

[0023] Figures 5 to 9 They respectively represent side views of a capacitive coupling packaging structure according to an embodiment of the present invention.

[0024] Figure 10 A schematic diagram showing a capacitive coupling packaging structure according to an embodiment of the present invention.

[0025] Figure 11 A schematic diagram showing a capacitive coupling packaging structure according to an embodiment of the present invention.

[0026] Figure 12 A schematic diagram showing a capacitive coupling packaging structure according to an embodiment of the present invention.

[0027] Figures 13 to 15 They respectively represent side views of a capacitive coupling packaging structure according to an embodiment of the present invention.

[0028] Figures 16 to 18 Schematic diagrams respectively show the process steps of a method for manufacturing a capacitive coupling packaging structure according to an embodiment of the present invention.

[0029] Figure 19This is a three-dimensional schematic diagram of the capacitive coupling packaging structure of the present invention in another embodiment in which the first packaging component and the second packaging component are omitted.

[0030] Figure 20 for Figure 19 Schematic top view of .

[0031] Figure 21 It is a three-dimensional schematic diagram of the first conductive component and the second conductive component of the present invention when they are covered by the first packaging component.

[0032] Figure 22 For the Figure 21 Schematic cross-sectional view of line XXII-XXII.

[0033] Figure 23 for Figure 19 Another top view schematic diagram of .

[0034] Figure 24 for Figure 23 Schematic cross-section diagram.

[0035] Figure 25 for Figure 19 Another top view schematic diagram of .

[0036] Figure 26 for Figure 25 Schematic diagram of the magnified XXVI region.

[0037] Figure 27 for Figure 19 A three-dimensional schematic diagram of a capacitive coupling packaging structure in another embodiment. DETAILED DESCRIPTION

[0038] The following is an explanation of the disclosed embodiments of the present invention through specific specific embodiments. Those skilled in the art can understand the advantages and effects of the present invention from the contents disclosed in this specification. The present invention can be implemented or applied through other different specific embodiments, and the details in this specification can also be modified and changed based on different viewpoints and applications without departing from the concept of the present invention. In addition, the drawings of the present invention are only simple schematic illustrations and are not depicted according to actual dimensions. It is stated in advance. The following embodiments will further explain the relevant technical contents of the present invention in detail, but the disclosed contents are not intended to limit the scope of protection of the present invention.

[0039] It should be understood that although terms such as "first," "second," and "third" may be used herein to describe various components or signals, these components or signals should not be limited by these terms. These terms are primarily used to distinguish one component from another, or one signal from another. In addition, the term "or" used herein may include any one or more combinations of the associated listed items, depending on the actual situation. Furthermore, the term "electrically coupled" used herein refers to either "indirect electrical connection" or "direct electrical connection."

[0040] See also Figure 1 , a schematic diagram illustrating a capacitive coupling package structure 100A according to an embodiment of the present invention. Capacitive coupling package structure 100A includes a plurality of first pins 11, a plurality of second pins 21, two first coupling plates 13, two second coupling plates 23, a first chip 16, a second chip 26, a first packaging component 30, and a second packaging component 40. The first chip 16 is electrically connected to the plurality of first pins 11 and the two first coupling plates 13. The second chip 26 is electrically connected to the plurality of first pins 11 and the two second coupling plates 23. The first packaging component 30 encapsulates the plurality of first pins 11, the plurality of second pins 21, the first chip 16, the second chip 26, and the first and second coupling plates 13 and 23. The second packaging component 40 encapsulates the first packaging component 30, the plurality of first pins 11, and the plurality of second pins 21. The ends of the two first coupling plates 13 and the two second coupling plates 23 are not exposed outside the second packaging component 40. The ends of the plurality of first pins 11 and the plurality of second pins 21 are exposed outside the second packaging component 40. The two first coupling plates 13 and the two second coupling plates 23 are vertically separated and partially overlapped vertically (details will be described later). The first chip 16 is electrically connected to the plurality of first pins 11 and the two first coupling plates 13 by means of welding wires 17. The second chip 26 is electrically connected to the plurality of first pins 11 and the two second coupling plates 23 by means of welding wires 27. There is a first horizontal distance d1 between the first chip 16 and the second chip 26. Figure 1 shown.

[0041] In this embodiment, the capacitive coupling package structure 100A further includes a first placement pad 15 and a second placement pad 25. The first chip 16 is fixed on the first placement pad 15, and the second chip 26 is fixed on the second placement pad 25. Further, the first pin 11 has a first placement pad pin 111, and the first placement pad 15 is connected to the first placement pad pin 111. The second pin 21 has a second placement pad pin 211, and the second placement pad 25 is connected to the second placement pad pin 211. In some embodiments, the first placement pad 15 and the second placement pad 25 are spaced apart in the vertical direction D1 (see FIG. Figure 5) are of the same height. In other embodiments, there is a height difference between the first placement pad 15 and the second placement pad 25. The height difference is greater than 200 μm. According to some embodiments, the height difference is greater than or equal to 400 μm.

[0042] in accordance with Figure 1 In the embodiment shown, as viewed from the vertical direction D1, the center of the first chip 16 and the center of the second chip 26 are aligned to define an axis L1. The two first coupling plates 13 and the two second coupling plates 23 are located on one side of the axis L1. A first coupling plate 13 and the corresponding second coupling plate 23 form a signal channel. Figure 1 In the embodiment shown, the two signal channels are located on the same side of the axis L1.

[0043] See also Figure 2 , a schematic diagram of a capacitive coupling packaging structure 100B according to an embodiment of the present invention is shown. In this embodiment, the two first coupling plates and the two second coupling plates are located on either side of the axis, that is, the two signal channels are located on either side of the axis L1.

[0044] See also Figure 3 , a schematic diagram illustrating a capacitive coupling package structure 100C according to an embodiment of the present invention, is shown. In this embodiment, the capacitive coupling package structure 100C further includes two third coupling plates 33 and two fourth coupling plates 43. The two third coupling plates 33 and the two fourth coupling plates 43 are vertically separated and partially overlapped (details will be described later). The two third coupling plates 33 and the two fourth coupling plates 43 are located on the other side of the axis L1. With this structure, the capacitive coupling package structure 100C has four signal channels.

[0045] See also Figure 4 , which is a schematic diagram of a capacitive coupling packaging structure 100D according to an embodiment of the present invention. In this embodiment, the ends 131, 231 of the two first coupling plates 13 and the two second coupling plates 23 are exposed outside the first packaging component 30 and are covered by the second packaging component 40. In the foregoing, the ends of the first coupling plates 13 and the second coupling plates 23 are not exposed outside the second packaging component 40, which means that the ends 131, 231 of the first coupling plates 13 and the second coupling plates 23 are located inside the second packaging component 40 (e.g., Figure 4 However, the present invention is not limited thereto. In some embodiments, the ends 131, 231 of the first coupling plate 13 and the second coupling plate 23 are flush with the second packaging member 40 (not shown). Figure 4In the illustrated embodiment, the capacitive coupling package structure 100D further includes two third coupling plates 33 and two fourth coupling plates 43 . Ends 331 , 431 of the third coupling plates 33 and the two fourth coupling plates 43 are exposed outside the first package component 30 and are covered by the second package component 40 .

[0046] See also Figure 5 , which is a side view schematic diagram of a capacitive coupling packaging structure 100E according to an embodiment of the present invention. In this embodiment, there is a first vertical spacing H1 between the two first coupling plates 13 and the two second coupling plates 23, and the first vertical spacing H1 is greater than 200μm. In some embodiments, the first vertical spacing H1 is greater than or equal to 400μm. The vertical spacing refers to the distance in the vertical direction D1. In the double packaging space generated by the first packaging component 30 and the second packaging component 40, due to limited space, the creepage distance and electrical clearance requirements of the capacitive coupling packaging structure 100C can be met within this vertical spacing range. Similarly, please refer to Figure 3 In some embodiments, a second vertical spacing (not shown) is defined between the two third coupling plates 33 and the two fourth coupling plates 43. This second vertical spacing is greater than 200 μm. In some embodiments, the second vertical spacing is greater than or equal to 400 μm. As described above, within the limited space of the dual packaging of the first packaging component 30 and the second packaging component 40, this vertical spacing range can meet the isolation requirements of the capacitive coupling packaging structure.

[0047] See also Figure 6 , showing a side view schematic diagram of a capacitive coupling packaging structure 100F according to an embodiment of the present invention. In this embodiment, there is a first vertical overlapping area A between the two first coupling plates 13 and the two second coupling plates. According to the first vertical overlapping area A, the capacitance value generated between the first coupling plate 13 and the corresponding second coupling plate 23 can be greater than 10fF (femtofarad, expressed as the next level unit of picofarad pF, 1pF = 1000fF). The first vertical overlapping area A refers to the overlapping projection area of the first coupling plate 13 and the second coupling plate 23 on the plane covering the horizontal direction D2 projected along the vertical direction D1. Within the range of this first vertical overlapping area A, the size reduction of the capacitive coupling packaging structure 100F can be met and the requirements of creepage distance and electrical clearance can be met. Similarly, please refer to Figure 3 In some embodiments, the two third coupling plates 33 and the two fourth coupling plates 43 have a second vertical overlap area (not shown). Based on this second vertical overlap area, the capacitance generated between the third coupling plates 33 and the corresponding fourth coupling plates 43 can be greater than 10 fF (femtofarad). In some embodiments, the second vertical overlap area is the same as the first vertical overlap area.

[0048] Please refer to Figure 4 and Figure 5 In this embodiment, a second vertical spacing (not shown) is defined between the two third coupling plates 33 and the two fourth coupling plates 43. This second vertical spacing is greater than 200 μm. In some embodiments, the second vertical spacing is greater than or equal to 400 μm. As described above, within the limited space of the dual packaging of the first packaging component 30 and the second packaging component 40, this vertical spacing range can meet the electrical clearance requirements of the capacitive coupling packaging structure.

[0049] See also Figures 7 and 8 , respectively, are side views of capacitive coupling packaging structures 100G-100H according to an embodiment of the present invention. Figure 7 and Figure 8 The difference lies in the relative positions of the first coupling plate 13 and the second coupling plate in the vertical direction D1. The first coupling plate 13 and the second coupling plate 23 have a first vertical distance H1, which is equivalent to the height difference between the first placement pad 15 and the second placement pad 25.

[0050] According to some embodiments, at least one of the first placement pad pin 111 and the second placement pad pin 211 has two bent portions. Figure 7 and Figure 8 In the embodiment shown, the second placement pad pin 211 has two bent portions 2111, so that the first placement pad 15 and the second placement pad 25 have the aforementioned height difference. Both bent portions 2111 are located outside the first packaging component 30 and are covered by the second packaging component 40. In addition, in addition to having two bent portions 2111, the second placement pad pin 211 also includes a main body 2112, and a turning angle is generated between one bent portion 2111 and the main body 2112. Of course, the present invention is not limited to only the second placement pad pin 211 having two bent portions 2111. According to some embodiments, both the first placement pad pin 111 and the second placement pad pin 211 have a bent portion. In some embodiments, at least one of the first placement pad pin 111 and the second placement pad pin 211 has a bent portion, and the other placement pad pin has no bent portion. The present invention is not limited.

[0051] See also Figure 9 , a schematic side view of a capacitive coupling package structure 100I according to one embodiment of the present invention. In this embodiment, the first mounting pad 15 has a first mounting surface 151, and the second mounting pad 25 has a second mounting surface 251. The first mounting surface 151 and the second mounting surface 251 face each other. In other words, in this embodiment, the first chip 16 and the second chip 26 face each other in the vertical direction D1. This capacitive coupling package structure also meets the requirements for miniaturization of capacitive coupling packages, as well as creepage distance and electrical clearance requirements.

[0052] See also Figure 10 , which shows a schematic diagram of a capacitive coupling packaging structure 100J according to an embodiment of the present invention. In this embodiment, Figure 3 The embodiment shown differs in that the two first coupling plates 13 are perpendicular to the plane defined by the plurality of first pins 11, and the two second coupling plates 23 are perpendicular to the plane defined by the plurality of second pins 21. The two first coupling plates 13 and the two second coupling plates 23 are horizontally separated and partially overlapped (details will be described later).

[0053] in accordance with Figure 10 In the illustrated embodiment, as viewed from the orthographic projection direction D1 (the same as the vertical direction D1 described above), the center of the first chip 16 and the center of the second chip 26 are aligned to define an axis L1. The two first coupling plates 13 and the two second coupling plates 23 are located on one side of the axis L1. The first coupling plates 13 and the corresponding second coupling plates 23 form a signal channel.

[0054] See also Figure 11 , a schematic diagram of a capacitive coupling package structure 100K according to one embodiment of the present invention, is shown. In this embodiment, the two first coupling plates 13 and the two second coupling plates 23 are located on either side of the axis L1, meaning that the two signal channels are located on either side of the axis L1. The present invention does not limit the two signal channels to being located on the same side or on different sides of the axis L1.

[0055] See also Figure 12 , a schematic diagram illustrating a capacitive coupling package structure 100L according to an embodiment of the present invention. In this embodiment, the capacitive coupling package structure 100L further includes two third coupling plates 33 and two fourth coupling plates 43. The two third coupling plates 33 and the two fourth coupling plates 43 are horizontally separated and partially overlapped (details will be described later). The two third coupling plates 33 and the two fourth coupling plates 43 are located on the other side of the axis L1. The two third coupling plates 33 are perpendicular to the plane defined by the plurality of first pins 11, and the two fourth coupling plates 43 are perpendicular to the plane defined by the plurality of second pins 21. With this structure, the capacitive coupling package structure 100L has four signal channels.

[0056] In this embodiment, the capacitive coupling package structure 100L further includes a first mounting pad 15 and a second mounting pad 25. The first chip 16 is fixed to the first mounting pad 15, and the second chip 26 is fixed to the second mounting pad 25. Furthermore, the first pin 11 has a first mounting pad pin 111, and the first mounting pad 15 is connected to the first mounting pad pin 111. The second pin 21 has a second mounting pad pin 211, and the second mounting pad 25 is connected to the second mounting pad pin 211.

[0057] Similar, please refer to Figure 2The ends of the two first coupling plates 13 and the two second coupling plates 23 of the capacitive coupling package structure 100L (ends 131 of the first coupling plate 13 and 231 of the second coupling plate 23) are exposed outside the first packaging component 30 and are covered by the second packaging component 40. The ends 331, 431 of the third coupling plate 33 and the two fourth coupling plates 43 are exposed outside the first packaging component 30 and are covered by the second packaging component 40.

[0058] See also Figures 13 to 15 , Figure 13 and Figure 14 1 and 100 are schematic side views of capacitive coupling packaging structures 100M and 100N according to an embodiment of the present invention. Figure 15 A schematic side view of a capacitive coupling package structure 100O according to an embodiment of the present invention is shown. In these embodiments, the two first coupling plates 13 and the two second coupling plates 23 each have a plate body (end 131 of the first coupling plate 13 and plate body 231 of the second coupling plate 23) and a bent extension 132, 232. Each extension (extension 132 or extension 232) is substantially perpendicular to the corresponding plate body (end 131 or plate body 231). A second horizontal distance d2 is defined between the extensions 132 of the two first coupling plates and the extensions 232 of the two second coupling plates. The second horizontal distance d2 is greater than 200 μm. In some embodiments, the second horizontal distance d2 is greater than or equal to 400 μm. Furthermore, in this embodiment, the two first coupling plates 13 and the two second coupling plates 23 have a first horizontal overlap area a, which refers to the area of overlap between the extension portion 132 and the extension portion 232 projected in the horizontal direction D2. The first horizontal overlap area a is such that the capacitance generated between the first coupling plate 13 and the corresponding second coupling plate 23 is greater than 10 fF (femtofarad). Figure 13 and Figure 14 In the embodiment shown, the extending portion 132 of the first coupling plate 13 and the extending portion 232 of the second coupling plate 23 extend in the same direction. However, the present invention is not limited thereto. Figure 15 In the embodiment shown, the extending portion 132 of the first coupling plate 13 and the extending portion 232 of the second coupling plate 23 extend in different directions. Figure 13 and Figure 14 In the embodiment shown, the first placement pad 15 and the second placement pad 25 have the same height in the vertical direction D1. Figure 15 In the illustrated embodiment, there is a height difference between the first placement pad 15 and the second placement pad 25 .

[0059] Please refer to Figures 13 to 15Similarly, in some embodiments, the two third coupling plates 33 and the two fourth coupling plates 43 of the capacitive coupling packaging structure each have a plate body and a bent extension (not shown). A second horizontal distance exists between the extensions of the third coupling plates 33 and the extensions of the fourth coupling plates 43. The second horizontal distance is greater than 200 μm. In some embodiments, the second horizontal distance is greater than or equal to 400 μm. Furthermore, the third coupling plates 33 and the fourth coupling plates 43 have a second horizontal overlap area (e.g., the overlap area of the two extensions projected along the horizontal direction D2). The second horizontal overlap area ensures that the capacitance generated between the third coupling plates 33 and the fourth coupling plates 43 is greater than 10 fF (femtofarad). Similarly, the extensions of the two third coupling plates and the extensions of the two fourth coupling plates may extend in the same or different directions.

[0060] See also Figure 15 According to some embodiments, at least one of the first placement pad pin 111 and the second placement pad pin 211 has two bent portions (not shown) to create a height difference between the first placement pad 15 and the second placement pad 25 .

[0061] See also Figure 16 , and please refer to Figure 3 and Figure 4 , Figure 16 A schematic diagram illustrating a method 200 for manufacturing a capacitive coupling package structure according to an embodiment of the present invention includes the following steps:

[0062] Step S1: Provide a first lead frame F1 and a second lead frame F2. The first lead frame F1 includes a plurality of first leads 11 and two first coupling plates 13. The second lead frame F2 includes a plurality of second leads 21 and two second coupling plates 23. A plurality of first connecting sections (tie bars) 11a are provided between the plurality of first leads 11, and a plurality of second connecting sections 21a are provided between the plurality of second leads 21. In this embodiment, the first lead frame F1 and the second lead frame F2 may be planar structures.

[0063] Step S2 : providing a first chip 16 and a second chip 26 . The first chip 16 is electrically connected to the first pins 11 and the two first coupling plates 13 . The second chip 26 is electrically connected to the second pins 21 and the two second coupling plates 23 .

[0064] Step S3: Align the first lead frame F1 and the second lead frame F2 so that the two first coupling plates 13 are vertically separated from and partially overlapped with the second coupling plates 23 . For details on vertical separation and partial overlap, please refer to the description of the aforementioned embodiment of the capacitive coupling package structure.

[0065] Step S4: A first packaging member 30 is provided to cover the plurality of first leads 11, the plurality of second leads 21, the two first coupling plates 13, the two second coupling plates 23, the first chip 16, and the second chip 26. In some embodiments, the first packaging member 30 is primarily made of epoxy resin. More specifically, it is composed of epoxy resin, phenolic resin, a catalyst, and silica powder.

[0066] Step S5 : cutting a plurality of first connecting segments 11 a , a plurality of second connecting segments 21 a , two first coupling plates 13 (eg, end portions), and two second coupling plates 23 (eg, end portions).

[0067] Step S6: Provide a second packaging component 40 to cover the first packaging component 30, the plurality of first leads 11, and the plurality of second leads 21. The ends of the two first coupling plates 13 and the two second coupling plates 23 are not exposed outside the second packaging component 40. The material of the second packaging component 40 can be the same as or different from that of the first packaging component 30.

[0068] Step S7: cutting a plurality of first pins 11 and a plurality of second pins 21. The capacitive coupling packaging structure is completed, as shown in FIG. Figure 4 shown.

[0069] According to some embodiments, Figure 3 As shown, the first lead frame F1 further includes two third coupling plates 33, and the second lead frame F2 further includes two fourth coupling plates 43. The alignment step S3 further includes vertically separating the two third coupling plates 33 from the two fourth coupling plates 43 and partially vertically overlapping them.

[0070] According to some embodiments, before step S2, step S11 is performed: bending the plurality of first pins 11 or bending the plurality of second pins 21 so that the first pins 11 or the second pins 21 have a bent portion (see Figure 5 Or see Figure 7 ), so that there is a height difference between the first placement pad 15 and the second placement pad 25.

[0071] According to some embodiments, before the second packaging member 40 is provided, a flipping step (not shown) is further performed: the first lead frame F1 or the second lead frame F2 is flipped, for example, by flipping 180 degrees with the axis L1 as the rotation axis, so that the top surface of the first chip 16 is opposite to the top surface of the second chip 26, as shown in FIG. Figure 9 shown.

[0072] See also Figure 17 , and please refer to Figures 11 to 14 , Figure 17 A schematic diagram illustrating a method 300 for manufacturing a capacitive coupling package structure according to an embodiment of the present invention includes the following steps:

[0073] Step P1: Provide a first lead frame F1 and a second lead frame F2. The first lead frame F1 includes a plurality of first pins 11 and two first coupling plates 13. The second lead frame F2 includes a plurality of second pins 21 and two second coupling plates 23. A plurality of first connecting segments 11 a are provided between the plurality of first pins 11, and a plurality of second connecting segments 21 a are provided between the plurality of second pins 21.

[0074] Step P2: providing a first chip 16 and a second chip 26 . The first chip 16 is electrically connected to the first pins 11 and the two first coupling plates 13 . The second chip 26 is electrically connected to the second pins 21 and the two second coupling plates 23 .

[0075] Step P3 : Align the first lead frame F1 and the second lead frame F2 so that the two first coupling plates 13 are horizontally separated from the second coupling plates 23 and partially overlap horizontally.

[0076] Step P4 : Dispose a first packaging component 30 to cover the plurality of first leads 11 , the plurality of second leads 21 , the two first coupling plates 13 , the two second coupling plates 23 , the first chip 16 and the second chip 26 .

[0077] Step P5: Cutting a plurality of first connecting segments 11 a , a plurality of second connecting segments 21 a , two first coupling plates 13 , and two second coupling plates 23 .

[0078] Step P6: Dispose a second packaging component 40 to cover the first packaging component 30 , the first leads 11 and the second leads 21 , with the ends of the two first coupling plates 13 and the two second coupling plates 23 not exposed outside the second packaging component 40 .

[0079] Step P7: cutting a plurality of first leads 11 and a plurality of second leads 21 .

[0080] Figure 17 and Figure 16 The embodiment described differs in that: Figure 16 In the embodiment shown, the two first coupling plates 13 are vertically separated from the second coupling plate 23 and partially overlap vertically. Figure 17 In the illustrated embodiment, the two first coupling plates 13 are horizontally separated from the second coupling plate 23 and partially overlapped horizontally.

[0081] According to some embodiments, before step P2 (providing the first chip 16 and the second chip 26), the first coupling plate 13 and the second coupling plate 23 are bent to achieve the purpose of horizontal separation and partial horizontal overlap of the first coupling plate 13 and the second coupling plate 23 (see FIG. Figure 13), for example, the extension portion 132 of the first coupling plate 13 and the extension portion 232 of the second coupling plate 23 are parallel and opposite. According to some embodiments, the bending direction of the first coupling plate 13 and the second coupling plate 23 are the same, for example Figure 13 and Figure 14 However, the present invention is not limited thereto, and according to some embodiments, the bending directions of the first coupling plate 13 and the second coupling plate 23 are different, for example Figure 15 The embodiment shown.

[0082] According to some embodiments, before step P2 , step P11 is performed: bending the first pins 11 or the second pins 21 to have a bent portion, so that there is a height difference between the first placement pad 15 and the second placement pad 25 .

[0083] According to some embodiments, Figure 12 As shown, the first lead frame F1 further includes two third coupling plates 33. The second lead frame F2 further includes two fourth coupling plates 43. The alignment step further includes horizontally separating the two third coupling plates 33 from the two fourth coupling plates 43 and partially overlapping them.

[0084] In some embodiments, before step P2 (providing the first chip 16 and the second chip 26), the third coupling plate 33 and the fourth coupling plate 43 are further bent so that the extended portion of the third coupling plate 33 and the extended portion of the fourth coupling plate are parallel to each other. Similarly, the bending directions of the third coupling plate 33 and the fourth coupling plate 43 can be the same or different.

[0085] See also Figure 18 , and please refer to Figures 12 to 15 , which is a schematic diagram showing the process of a method 400 for manufacturing a capacitive coupling packaging structure according to an embodiment of the present invention, comprising the following steps:

[0086] Step Z1: Providing a coplanar lead frame, the lead frame comprising a plurality of first pins 11, a plurality of second pins 21, two first coupling plates 13, and two second coupling plates 23, wherein the first coupling plate 13 is connected to the two second coupling plates 23, wherein a plurality of first connecting segments 11 a are defined between the plurality of first pins 11, and a plurality of second connecting segments 21 a are defined between the plurality of second pins 21.

[0087] Step Z2: Separate the two first coupling plates 13 and the two second coupling plates 23 so that the two first coupling plates 13 are horizontally separated from the two second coupling plates 23 and partially overlap horizontally.

[0088] Step Z3: providing a first chip 16 and a second chip 26 , wherein the first chip 16 is electrically connected to the first pins 11 and the first coupling plate 13 , and the second chip 26 is electrically connected to the second pins 21 and the second coupling plate 23 .

[0089] Step Z4: Dispose a first packaging component 30 to cover the plurality of first leads 11 , the plurality of second leads 21 , the two first coupling plates 13 , the two second coupling plates 23 , the first chip 16 and the second chip 26 .

[0090] Step Z5: Cutting a plurality of first connecting segments 11 a , a plurality of second connecting segments 21 a , two first coupling plates 13 , and two second coupling plates 23 .

[0091] Step Z6: Dispose a second packaging component 40 to cover the first packaging component 30 , the plurality of first leads 11 and the plurality of second leads 21 , with the ends of the two first coupling plates 13 and the two second coupling plates 23 not exposed outside the second packaging component 40 .

[0092] Step Z7: cutting a plurality of first leads 11 and a plurality of second leads 21 .

[0093] Figure 18 The embodiment shown is Figure 17 The embodiment shown differs in that the leadframe includes a first leadframe F1 and a second leadframe F2. For example, the leadframe is an integrally formed structure, and thus the two first coupling plates 13 are connected to the two second coupling plates 23, respectively. In some embodiments, the first coupling plates 13 and the second coupling plates 23 can be separated by stamping. Furthermore, the separation step includes bending the first coupling plates 13 and the second coupling plates 23, for example by passing a punch through the cutouts of the first coupling plates 13 and the second coupling plates 23. The punch has a width greater than the cutouts, thereby bending the first coupling plates 13 and the second coupling plates 23. In this case, the first coupling plates 13 and the second coupling plates 23 are bent in the same direction. However, in some embodiments, the first coupling plates 13 and the second coupling plates 23 are bent in different directions.

[0094] According to some embodiments, Figure 12 As shown, the lead frame further includes two third coupling plates 33 and two fourth coupling plates 43. Separation step Z3 further includes horizontally separating the two third coupling plates 33 and the two fourth coupling plates 43 so that they partially overlap horizontally. Furthermore, the step includes bending the third coupling plates 33 and the fourth coupling plates 43. The bending directions of the third coupling plates 33 and the fourth coupling plates 43 can be the same or different.

[0095] According to some embodiments, after step Z2, step Z21 is further performed: bending the plurality of first pins 11 or bending the plurality of second pins 21 so that the first pins 11 or the second pins 21 have a bent portion, thereby creating a height difference between the first placement pad 15 and the second placement pad 25. In some embodiments, step Z21 can be performed simultaneously with step Z2.

[0096] Cooperate Figures 19 to 26 As shown, Figures 19 to 26 FIG. 5 shows another embodiment of the capacitive coupling packaging structure 500. Specifically, Figure 24 As shown, the capacitive coupling package structure 500 may include a first package member 510, a second package member 520 covering the first package member 510, a first conductive element 530 and a second conductive element 540 disposed within the first package member 510, and a first chip 550 and a second chip 560 electrically coupled to the first conductive element 530 and the second conductive element 540, respectively. The following describes the various components of the capacitive coupling package structure 500 in this embodiment and their connections.

[0097] like Figures 20 to 22 As shown, the first packaging member 510 has two opposite first sides M1 and two second sides M2 connecting the two first sides M1. In this embodiment, the first packaging member 510 has a length direction D3 (for example: Figure 20 Y-axis direction in the middle of the paper) and a width direction D4 perpendicular to the length direction (for example: Figure 20 The first packaging member 510 has a hexagonal cross-section in the longitudinal direction D3 and the width direction D4. In addition, the first packaging member 510 is rectangular when viewed from above.

[0098] When the first packaging component 510 is viewed from a three-dimensional perspective, one of the first sides M1 includes the first packaging component 510 at Figure 22 The other of the two adjacent left surfaces of the first side M1 includes the first packaging component 510. Figure 22 In addition, one of the second sides M2 includes the first packaging component 510 at Figure 21 The second side M2 includes two adjacent front surfaces of the first packaging component 510, and the other second side M2 includes two adjacent rear surfaces (not shown) of the first packaging component 510.

[0099] Of course, the first packaging member 510 may also be in other three-dimensional shapes. For example, in other embodiments not shown in the drawings, the first packaging member 510 may be a rectangular parallelepiped, which means that the shape of the first packaging member 510 of the present invention is not limited thereto.

[0100] With ginseng Figure 23 and Figure 24 As shown, the second packaging component 520 covers the first packaging component 510. In actual operation, the second packaging component 520 is overmolded on the first packaging component 510, so that the first packaging component 510 is completely covered by the second packaging component 520.

[0101] Participate again Figure 21 and Figure 23 As shown, the first conductive component 530 and the second conductive component 540 are partially disposed in the first packaging component 510, and one portion of the first conductive component 530 and one portion of the second conductive component 540 respectively extend out of the second packaging component 520 through the two first sides M1, and another portion of the first conductive component 530 and another portion of the second conductive component 540 are aligned with the second side M2.

[0102] To put it another way, the portion of the first conductive component 530 along the width direction D4 and the portion of the second conductive component 540 along the width direction D4 are formed by the first packaging component 510 penetrating into the second packaging component 520 along the width direction D4, and passing out from the second packaging component 520 along the opposite side surfaces (i.e., the two first sides M1) along the width direction D4 to be exposed outside the second packaging component 520.

[0103] Furthermore, the portion of the first conductive element 530 and the portion of the second conductive element 540 along the length direction D3 are aligned with opposite side surfaces (i.e., the two second sides M2) of the first packaging member 510 along the length direction D3. In other words, the first conductive element 530 is not covered by the two end portions of the second packaging member 520 along the length direction D3.

[0104] More specifically, each second side M2 has a first region M21 and a second region M22 spaced apart from each other, and a middle region M23 located between the first region M21 and the second region M22. The portion of the first conductive element 530 that aligns with the second side M2 (hereinafter referred to as the first alignment portion CP1) and the portion of the second conductive element 540 that aligns with the second side M2 (hereinafter referred to as the second alignment portion CP2) are located in the middle region M23.

[0105] Preferably, a height position of the first trimming portion CP1 in a height direction D5 perpendicular to the length direction D3 and the width direction D4 may be different from a height position of the second trimming portion CP2 in the height direction D5 .

[0106] Specifically, in this embodiment, the middle region M23 is stepped and comprises a first transverse portion M231, a longitudinal portion M232, and a second transverse portion M233. The longitudinal portion M232 connects the first transverse portion M231 and the second transverse portion M233 at both ends. Furthermore, the longitudinal portion M232 is perpendicular to the first transverse portion M231 and the second transverse portion M233. The first alignment portion CP1 is located in the first transverse portion M231, and the second alignment portion CP2 is located in the second transverse portion M233.

[0107] It is worth noting that, in actual operation, the longitudinal portion M232 can serve as a glue path for the first packaging component 510 during the packaging process.

[0108] For example, two molds (not shown) combined with each other are designed to shape the colloid to have the characteristics of the first packaging component 510 of the present invention (for example: two second sides M2 and two first sides M1), and the two side parts of the two molds corresponding to the position of the longitudinal part M232 are respectively designed as a glue filling hole and a discharge hole. During actual production, the first conductive component 530 and the second conductive component 540 are placed in the two molds, and the two combined molds are filled with a packaging colloid using the glue filling holes and the excess glue is discharged from the discharge holes. When the packaging colloid is solidified, the two side surfaces of the packaging colloid in the longitudinal direction are cut by a tool, so that the exposed parts of the first conductive component 530 and the second conductive component 540 in the longitudinal direction are cut, and the two side surfaces of the packaging colloid in the longitudinal direction D3 (that is, by Figure 20 The first conductive component 530 and the second conductive component 540 in the embodiment become Figure 21 and Figure 23 The first conductive component 530 and the second conductive component 540 in the embodiment of the present invention are shown in FIG.

[0109] In practice, the cutting tool can cut a portion of the encapsulant (i.e., the first encapsulating member) so that the surface roughness of each second side M2 in the middle region M23 is greater than the surface roughness of each second side M2 in the first region M21 and the second region M22. Thus, when the first encapsulating member undergoes secondary packaging, the bond between the first encapsulating member 510 and the second encapsulating member 520 can be increased.

[0110] To facilitate understanding of the relationship between the first trimming portion CP1 and the second trimming portion CP2 at different heights relative to the first packaging component 510 and the second packaging component 520 , the first conductive component 530 and the second conductive component 540 are described in more detail below.

[0111] Participate again Figure 19 and Figure 22 As shown, the first conductive element 530 has a predetermined configuration line PL, and the first conductive element 530 is located on one side of the predetermined configuration line PL (for example: Figure 20 The height position of the portion on the right side of the predetermined configuration line PL is higher or lower than that of the first conductive component on the other side of the predetermined configuration line PL (for example: Figure 20 In practice, the predetermined configuration line PL can be understood as the operating position of a bending device for bending the first conductive element 530. In other words, after being bent along the predetermined configuration line PL, the first conductive element 530 is divided into two parts, and the two parts are located in two planes, one of which is higher than the other.

[0112] In more detail, the first conductive element 530 includes a plurality of first pins 531 connected to the first chip 550, two first coupling plates 532, and a first mounting pad 533. The plurality of first pins 531, the two first coupling plates 532, and the first mounting pad 533 are disposed within the first packaging component 510, with some of the plurality of first pins 531 connected to the first mounting pad 533. The ends of the plurality of first pins 531 further pass through the two first sides M1 and the second packaging component 520, becoming exposed outside the second packaging component 520. In other words, each first pin 531 extends generally along the width direction D4.

[0113] Furthermore, the plurality of first pins 531 are collectively passed through by the predetermined configuration line PL. Specifically, each first pin 531 includes a first inner segment 5311 and a first outer segment 5312 connected to the first inner segment 5311. The predetermined configuration line PL passes between the first inner segment 5311 and the first outer segment 5312, allowing the height position of the first outer segment 5312 in the height direction D5 to be different from the height position of the first inner segment 5311 in the height direction D5.

[0114] In addition, the height positions of the two first coupling plates 532 and the first placement pad 533 in the height direction D5 are equal to the first inner section 5311 .

[0115] Participate again Figure 19 and Figure 22 As shown, the structure of the second conductive component 540 is substantially the same as that of the first conductive component 530 , that is, the second conductive component 540 includes a plurality of second pins 541 connected to the second chip 560 , two second coupling plates 542 , and a second placement pad 543 .

[0116] The plurality of second pins 541, the two second coupling plates 542, and the second mounting pads 543 are disposed within the first packaging member 510, with some of the plurality of second pins 541 connected to the second mounting pads 543. Furthermore, the ends of the plurality of second pins 541 pass through the two first sides M1 and the second packaging member 520 along the width direction D4, and are exposed outside the second packaging member 520.

[0117] The difference between the second conductive component 540 and the first conductive component 530 is that the second conductive component 540 is not processed by the bending device, and the height position of the second conductive component 540 in the height direction D5 is equal to the height position of each first outer segment 5312 in the height direction D5. In other words, the height positions of the plurality of second pins 541, the two second coupling plates 542, and the two second placement pads 543 are equal to the height positions of each first outer segment 5312. In other words, the second conductive component 540 is a planar structure, but the present invention is not limited to this. Accordingly, the capacitive coupling packaging structure 500 can meet the isolation distance requirements (i.e., greater than or equal to 400 microns) and can also ensure the consistency of the capacitance value and electrical properties of the coupling capacitor.

[0118] For example, in other unillustrated embodiments of the present invention, the height position of the second conductive component 540 in the height direction D5 may also be equal to the height position of each first inner segment 5311 in the height direction D5.

[0119] In addition, it should be additionally explained that the two first coupling plates 532 and the second coupling plate 542 are used to realize a capacitive coupling relationship between the first chip 550 and the second chip 560 .

[0120] Specifically, if Figure 19 and Figure 20 As shown, the first coupling plate 532 and the second coupling plate 542 are spaced apart from each other in the height direction D5, and a projection area of the first coupling plate 532 along the height direction D5 onto a bottom surface of the second packaging component 520 substantially overlaps a projection area of the second coupling plate 542 along the height direction D5 onto the bottom surface of the second packaging component 520.

[0121] Accordingly, when the adjacent first coupling plates 532 and the adjacent second coupling plates 542 are close to each other but not in contact with each other, capacitance is generated between the adjacent first coupling plates 532 and the second coupling plates 542 through the action of the electric field.

[0122] In addition, to avoid the influence of parasitic capacitances generated by the first coupling plate 532 and the second coupling plate 542, the first pins 531 connected to the first coupling plate 532 and the second pins 541 connected to the second coupling plate 542 may be arranged skewed relative to the first coupling plate 532 and the second coupling plate 542.

[0123] Specifically, each of the plurality of first pins 531 connected to the first coupling plate 532 is defined as a first coupling pin 531P, and each of the plurality of second pins 541 connected to the second coupling plate 542 is defined as a second coupling pin 541P. A first predetermined angle θ1 is defined between the first coupling pin 531P and the first coupling plate 532, and a second predetermined angle θ2 is defined between the second coupling pin 541P and the second coupling plate 542. The first predetermined angle θ1 and the second predetermined angle θ2 are preferably not less than 10 degrees. The first coupling pin 531P and the second coupling pin 541P are located in different planes. In other words, the first coupling pin 531P and the second coupling pin 541P are positioned at different heights in the height direction D5.

[0124] Furthermore, to ensure that deformation is reduced between each first coupling pin 531P and the first coupling plate 532, and between each second coupling pin 541P and the second coupling plate 542, the width of the first coupling pin 531P at the end adjacent to the first coupling plate 532 can be designed to be greater than the width of the first coupling pin 531P at the end away from the first coupling plate 532, and the width of the second coupling pin 541P at the end adjacent to the second coupling plate 542 can also be designed to be greater than the width of the second coupling pin 541P at the end away from the second coupling plate 542.

[0125] In addition, it should be noted that the capacitive coupling package structure 500 in this embodiment includes the first chip 550 and the second chip 560, but the present invention can omit one of the chips (eg, Figure 27 The capacitive coupling packaging structure 500 ′ is shown.

[0126] [Technical effects of the embodiment of the utility model]:

[0127] In summary, the capacitive coupling packaging structure disclosed in the embodiments of the present invention can improve the isolation voltage through the designs of "the first conductive component and the second conductive component are arranged in the first packaging component" and "one part of the first conductive component and one part of the second conductive component respectively extend out of the second packaging component through the two first sides, and the other part of the first conductive component and the other part of the second conductive component are aligned with the two second sides."

[0128] The above description is only a preferred feasible embodiment of the present invention and is not intended to limit the scope of protection of the present invention. All equivalent changes and modifications made within the scope of the patent application of the present invention shall fall within the scope of protection of the claims of the present invention.

Claims

1. A capacitive coupling packaging structure, characterized in that: The capacitive coupling packaging structure includes: a first packaging member having two opposite first sides and two second sides connecting the two first sides; a second packaging component, covering the first packaging component; a first conductive element and a second conductive element disposed within the first packaging member, wherein a portion of the first conductive element and a portion of the second conductive element respectively extend out of the second packaging member through the two first sides, and another portion of the first conductive element and another portion of the second conductive element are aligned with the two second sides; and A first chip and a second chip, the first chip is electrically coupled to the first conductive component, the second chip is electrically coupled to the second conductive component, and the first chip and the second chip generate a capacitive coupling relationship through the first conductive component and the second conductive component.

2. The capacitive coupling packaging structure according to claim 1, wherein: Each second side has a first area and a second area spaced apart from each other, and an intermediate area located between the first area and the second area, and the position where the first conductive component is aligned with the portion of the second side and the position where the second conductive component is aligned with the portion of the second side are located in the intermediate area.

3. The capacitive coupling packaging structure according to claim 2, wherein: The surface roughness of each second side in the middle region is greater than the surface roughness of each second side in the first region and the second region.

4. The capacitive coupling packaging structure according to claim 2, wherein: The middle area is stepped and has a first transverse portion, a longitudinal portion, and a second transverse portion. The two ends of the longitudinal portion are connected to the first transverse portion and the second transverse portion. The portion of the first conductive component that is aligned with the second side is located in the first transverse portion, and the portion of the second conductive component that is aligned with the second side is located in the second transverse portion.

5. The capacitive coupling packaging structure according to claim 1, wherein: The first conductive element has a predetermined configuration line, and the height of the first conductive element located on one side of the predetermined configuration line is higher or lower than the height of the first conductive element located on the other side of the predetermined configuration line.

6. The capacitive coupling packaging structure according to claim 5, characterized in that: The first conductive component includes a plurality of first pins connected to the first chip and two first coupling plates connected to the first chip, the plurality of first pins being disposed within the first packaging component, and ends of the plurality of first pins passing through the two first sides and the second packaging component to be exposed outside the second packaging component; The second conductive component includes a plurality of second pins connected to the second chip and two second coupling plates connected to the second chip. A portion of the plurality of first pins is connected to the two first coupling plates and defined as a first coupling pin, and a portion of the plurality of second pins is connected to the two second coupling plates and defined as a second coupling pin. The height position of the first coupling pin is different from the height position of the second coupling pin.

7. The capacitive coupling packaging structure according to claim 5, wherein: The first conductive component includes a plurality of first pins connected to the first chip, each of the first pins includes a first inner segment and a first outer segment connected to the first inner segment, the predetermined configuration line passes between the first inner segment and the first outer segment, and the height position of the first outer segment is different from the height position of the first inner segment.

8. The capacitive coupling packaging structure according to claim 7, wherein: The second conductive component includes a plurality of second pins connected to the second chip, the plurality of second pins are arranged in the first packaging component, the ends of the plurality of second pins pass through the two first sides and the second packaging component and are exposed outside the second packaging component, and the height position of the plurality of second pins is equal to the height position of each first outer segment.

9. The capacitive coupling packaging structure according to claim 8, wherein: The first conductive component includes two first coupling plates connected to the first chip, and the second conductive component includes two second coupling plates connected to the second chip. The two first coupling plates and the two second coupling plates are arranged in the first packaging component. The ends of the two first coupling plates are aligned with one of the second sides, and the ends of the two second coupling plates are aligned with the other second side. The two first coupling plates are at the same height as the first inner sections, and the two second coupling plates are at the same height as the first outer sections.

10. The capacitive coupling packaging structure according to claim 7, wherein: The first conductive component further includes a first placement pad for placing the first chip, and the second conductive component further includes a second placement pad for placing the second chip. The first placement pad is equal to the height position of each first inner segment, and the second placement pad is equal to the height position of each first outer segment.

11. The capacitive coupling packaging structure according to claim 9, wherein: A portion of the plurality of first pins is connected to two first coupling plates and is defined as a first coupling pin, wherein a first predetermined angle is formed between the first coupling pin and the first coupling plate; Part of the second pins connects two second coupling plates and is defined as a second coupling pin. A second predetermined angle is formed between the second coupling pin and the second coupling plate. The first predetermined angle and the second predetermined angle are not less than 10 degrees.

12. The capacitive coupling packaging structure according to claim 9, wherein: A portion of the plurality of first pins connects two of the first coupling plates and is defined as a first coupling pin, wherein a width of the first coupling pin at an end adjacent to the first coupling plate is greater than a width of the first coupling pin at an end distal from the first coupling plate; A portion of the second pins connects two second coupling plates and defines a second coupling pin. The width of the second coupling pin at one end adjacent to the second coupling plate is greater than the width of the second coupling pin at one end away from the second coupling plate.

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