Radiator for outdoor communication base station

Abstract

The utility model discloses a radiator used for an outdoor communication base station, which is arranged on the outdoor communication base station and is attached to at least one heat source of the outdoor communication base station, the radiator comprises a base, a first driving pump, a second driving pump, a first radiating fin and a second radiating fin, the base is provided with a first area, a second area and a backflow area, the backflow area divides the first area and the second area, and refrigerants are arranged in the first area and the second area. The first driving pump is communicated with the first area and the backflow area; the second driving pump is communicated with the second area and the backflow area; the first heat dissipation fins are arranged on the base, the first area, the first heat dissipation fins and the backflow area are communicated to form a first loop, and a refrigerant in the first area circulates in the first loop through the first driving pump; the second cooling fins are arranged on the base, the second area, the second cooling fins and the backflow area are communicated to form a second loop, and the refrigerant in the second area circulates in the second loop through the second driving pump.

Description

Technical Field

[0001] The utility model relates to a radiator, in particular to a radiator used for an outdoor communication base station. Background Art

[0002] With the rapid development of science and technology, people's requirements for communication performance are getting higher and higher, which is accompanied by an increasing demand for outdoor communication base stations.

[0003] When operating, outdoor communication base stations generate a large amount of heat, which may cause the base stations to overheat, resulting in reduced performance and even damage to electronic components due to the continuous increase in temperature.

[0004] At the same time, the power consumption of outdoor communication base stations is increasing. Taking 5G communication base stations as an example, the heat-generating components on the PCBA of 5G communication base stations are scattered, and the power density is not fixed and uniform. Traditional base station heat sinks often cause local high temperatures and cannot meet the heat dissipation requirements of all components, posing potential heat dissipation risks to customers' chips.

[0005] Specifically, because the traditional radiator has a high-power area on the top and a low-power area on the bottom, the heat from the heat source below will be transferred to the upper substrate through the substrate. At the same time, the heat generated by the fin resources occupied by the low-power area below will cause the air flow temperature at the lower end of the fins in the high-power area to rise, thereby reducing the heat dissipation effect.

[0006] Therefore, how to deal with the heat dissipation of higher power consumption heat-generating components, how to make the radiator smaller in size, lighter in weight, and at the same time have better heat dissipation performance, have become problems that researchers in this field are committed to solving. Utility Model Content

[0007] The present invention provides a radiator for an outdoor communication base station, wherein at least one radiator is mounted on the outdoor communication base station and is in contact with at least one heat source of the outdoor communication base station, and the radiator comprises:

[0008] A base having a first area, a second area, and a reflux area, wherein the reflux area separates the first area from the second area, and refrigerant is disposed in the first area and the second area;

[0009] a first driving pump, connecting the first area and the reflux area;

[0010] a second driving pump, connected to the second region and the reflux region;

[0011] a first heat dissipation fin mounted on the base, wherein the first region, the first heat dissipation fin, and the reflux region are connected to form a first loop, and the refrigerant in the first region circulates in the first loop through the first driving pump;

[0012] The second heat dissipation fins are installed on the base. The second area, the second heat dissipation fins and the reflux area are connected to form a second loop. The refrigerant in the second area circulates in the second loop through the second driving pump.

[0013] The above-mentioned radiator, wherein the first driving pump has a first liquid inlet and a first liquid outlet, the radiator includes a first liquid inlet pipeline and a first liquid outlet pipeline, the first liquid inlet is connected to the reflux area through the first liquid inlet pipeline, and the first liquid outlet is connected to the first area through the first liquid outlet pipeline; the second driving pump has a second liquid inlet and a second liquid outlet, the radiator includes a second liquid inlet pipeline and a second liquid outlet pipeline, the second liquid inlet is connected to the reflux area through the second liquid inlet pipeline, and the second liquid outlet is connected to the second area through the second liquid outlet pipeline.

[0014] The above-mentioned radiator, wherein the base comprises:

[0015] The bottom shell has a recessed accommodation space, wherein the reflux area, the first area, and the second area are located in the accommodation space;

[0016] The cover plate is disposed on the bottom shell and covers the accommodating space.

[0017] The above-mentioned radiator, wherein the bottom shell includes:

[0018] bottom plate,

[0019] Four side panels, the four side panels are connected around and connected to the bottom panel, the cover panel is mounted on the side panels, one side panel is provided with a first through hole corresponding to the first area, a second through hole corresponding to the second area, and two third through holes corresponding to the reflux area, the two ends of the first liquid inlet pipe are respectively connected to the first liquid inlet and one of the third through holes, the two ends of the second liquid inlet pipe are respectively connected to the second liquid inlet and another of the third through holes, the two ends of the first liquid outlet pipe are respectively connected to the first through hole and the first liquid outlet, and the two ends of the second liquid outlet pipe are respectively connected to the second through hole and the second liquid outlet.

[0020] The above-mentioned radiator, wherein the bottom shell further includes:

[0021] a first partition plate mounted on the bottom plate, with both ends of the first partition plate connected to the two oppositely disposed side plates, and the first area between the side plate facing the first partition plate and the first partition plate;

[0022] a second partition plate mounted on the bottom plate, with both ends of the second partition plate connected to the two oppositely disposed side plates, and the second area being between the other side plate facing the second partition plate and the second partition plate;

[0023] The reflux area is between the first partition plate and the second partition plate.

[0024] The above-mentioned radiator, wherein the bottom shell further includes:

[0025] The third partition is installed on the bottom plate and is located between the first partition and the second partition. The two ends of the third partition are respectively connected to the two oppositely arranged side plates. The third partition divides the reflux area into a first reflux area and a second reflux area. One pair of the third through holes is located in the first reflux area, and the other pair of the third through holes is located in the second reflux area.

[0026] The above-mentioned radiator, wherein each of the first heat dissipation fins has a first flow channel inside, one end of the first flow channel is connected to the first area, the other end of the first flow channel is connected to the first return area, the first area, the first flow channel and the first return area are connected to form the first loop; each of the second heat dissipation fins has a second flow channel inside, one end of the second flow channel is connected to the second area, the other end of the second flow channel is connected to the second return area, the second area, the second flow channel and the second return area are connected to form the second loop.

[0027] The above-mentioned radiator, wherein the bottom shell further includes:

[0028] a plurality of first partitions disposed on the bottom plate and located in the first region and / or the second region, one end of each first partition connected to the first partition plate or the second partition plate, the first partitions disposed in the first region dividing the first region into a plurality of first main heat dissipation zones, and the first partitions disposed in the second region dividing the second region into a plurality of second main heat dissipation zones;

[0029] A plurality of second spacers are arranged on the base plate and located in the first area and / or the second area, each second spacer is connected to the other end of the first spacer, the second spacer arranged in the first area divides the first area into a first liquid inlet area, the first through hole pair is located in the first liquid inlet area, the second spacer arranged in the second area divides the second area into a second liquid inlet area, the second through hole pair is located in the second liquid inlet area, and a main heat dissipation area liquid inlet is formed between two adjacent second spacers.

[0030] The above-mentioned radiator, wherein the bottom shell further includes:

[0031] Multiple protrusions are arranged on the base plate and located in the first area and / or the second area, one end of each protrusion is connected to the side plate parallel to the first spacer, and the main heat dissipation area liquid inlet is formed between the other end of the protrusion and the adjacent second spacer.

[0032] In the above-mentioned radiator, the bottom shell further comprises: a plurality of columns, which are arranged on the bottom plate and located in the first main heat dissipation area and / or the second main heat dissipation area.

[0033] The above-mentioned heat sink, wherein the cover plate is provided with a first slot for the first area, a second slot for the second area, a third slot for the first recirculation area, and a fourth slot for the second recirculation area;

[0034] Among them, one end of the first heat sink fin is inserted into the first slot, and the other end of the first heat sink fin is inserted into the third slot, so that the first flow channel is connected with the first area and the first reflow area; one end of the second heat sink fin is inserted into the second slot, and the other end of the second heat sink fin is inserted into the fourth slot, so that the second flow channel is connected with the second area and the second reflow area.

[0035] In the above-mentioned heat sink, a top surface of at least one of the column, the protruding portion, the first spacer, and the second spacer abuts against the cover plate.

[0036] In the above-mentioned heat sink, the bottom surface of the base abuts against the heat source.

[0037] In the above-mentioned radiator, the bottom shell is an integrated bottom shell.

[0038] The above-mentioned radiator, wherein the base is rectangular.

[0039] In the above-mentioned radiator, the thermal conductivity of the material of the first partition plate, the second partition plate, and the third partition plate is smaller than the thermal conductivity of the material of the side plate.

[0040] In the above-mentioned radiator, the thermal conductivity of the material of the portion of the side plate in contact with the refrigerant in the first recirculation area and the second recirculation area is smaller than the thermal conductivity of the material of the remaining portion of the side plate.

[0041] In the above-mentioned radiator, the first area is a high power consumption area, and the second area is a low power consumption area.

[0042] Compared with the prior art, the utility model has the following effects:

[0043] 1. This utility model uses a pump to drive the refrigerant, and the radiator base and heat dissipation fins form microchannels. Between the latent heat of evaporation and the condensation return, an external power device is used to achieve a better efficiency from return water to evaporation to condensation, thereby improving the overall performance of the radiator;

[0044] 2. The utility model adopts dual pumps, and the base and the heat dissipation fins are separated at the same time to achieve better thermal isolation, ensuring that a component in the high power density area also has a better heat dissipation effect, which is equivalent to two independent radiators to dissipate heat for the chip. Because the pump in the low power consumption area promotes the two-phase flow circulation, the heat dissipation capacity of the low power consumption radiator can be more effectively improved. Therefore, the lower end inlet temperature of the radiator in the high power consumption area will be lower than the lower end inlet temperature of the existing radiator, and there is no thermal cascade effect. In addition, the pump P in the high power consumption area drives the refrigerant to circulate rapidly at a certain speed, which can achieve an optimal base station heat dissipation.

[0045] The above description of the content of the present invention and the following description of the embodiments are used to demonstrate and explain the principles of the present invention and to provide further explanation of the scope of the patent application of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0046] Figure 1 It is a three-dimensional diagram of a radiator according to the present utility model.

[0047] Figure 2 for Figure 1 Exploded diagram.

[0048] Figure 3 Schematic diagram of the structure of the bottom shell.

[0049] Figure 4 Schematic diagram of area P4.

[0050] Wherein, the reference numerals:

[0051] Radiator 1

[0052] Base 11

[0053] Bottom shell 111

[0054] Baseplate 1111

[0055] Side panels 1112, 1113, 1114, 1115

[0056] First through hole K1

[0057] Second through hole K2

[0058] The third through hole K3

[0059] Accommodation space S

[0060] First separator 1116

[0061] Second partition 1117

[0062] The third partition 1118

[0063] First spacer G1

[0064] Second spacer G2

[0065] Protrusion G3

[0066] Column 1119

[0067] Cover 112

[0068] First slot C1

[0069] Second slot C2

[0070] The third slot C3

[0071] Fourth slot C4

[0072] First area P1

[0073] The first main heat dissipation area P11

[0074] First liquid inlet area P12

[0075] Second area P2

[0076] The second main heat dissipation area P21

[0077] Second liquid inlet area P22

[0078] Main heat dissipation area liquid inlet K4

[0079] Reflow area P3

[0080] First recirculation area P31

[0081] Second reflow area P32

[0082] First drive pump 12

[0083] Second driving pump 13

[0084] First heat dissipation fin 14

[0085] First flow channel R1

[0086] Second heat dissipation fin 15

[0087] Second flow channel R2

[0088] First liquid inlet pipeline 16

[0089] First liquid outlet pipeline 17

[0090] Second liquid inlet pipeline 18

[0091] Second liquid outlet pipeline 19

[0092] Heat source H

[0093] Direction F1

[0094] Area P4 DETAILED DESCRIPTION

[0095] See also Figure 1-Figure 2 , Figure 1 is a three-dimensional diagram of the heat dissipation device according to the present utility model. Figure 2 for Figure 1 Exploded diagram of . Figure 1-Figure 2 As shown, in this embodiment, the utility model is a radiator 1 for an outdoor communication base station, wherein at least one radiator 1 is installed on the outdoor communication base station and is in contact with at least one heat source H of the outdoor communication base station, and the radiator 1 includes: a base 11, a first driving pump 12, a second driving pump 13, a first heat dissipation fin 14 and a second heat dissipation fin 15, the bottom surface of the base 11 is in contact with the heat source H, the base has a first area P1, a second area P2 and a reflux area P3, the reflux area P3 separates the first area P1 and the second area P2, and a refrigerant is provided in the first area P1 and the second area P2; The first driving pump 12 is connected to the first area P1; the second driving pump 13 is connected to the second area P2; the first heat dissipation fins 14 are installed on the base 11, and the first area P1, the first heat dissipation fins 14 are connected to the reflux area P3 to form a first loop, and the refrigerant in the first area circulates in the first loop through the first driving pump 12; the second heat dissipation fins 15 are installed on the base 11, and the second area P2, the second heat dissipation fins 15 are connected to the reflux area P3 to form a second loop, and the refrigerant in the second area P2 circulates in the second loop through the second driving pump 13.

[0096] It should be noted that in this embodiment, it is a preferred implementation to use the first area P1 as a high power consumption area and the second area P2 as a low power consumption area, that is, the first area P1 corresponds to heat dissipation for high energy consumption devices, and the second area P2 corresponds to heat dissipation for low energy consumption devices.

[0097] In one embodiment of the present invention, a plurality of first heat dissipating fins 14 are arranged at intervals along the direction F1 , a plurality of second heat dissipating fins 15 are arranged at intervals along the direction F1 , and a first heat dissipating fin 14 and a second heat dissipating fin 15 are arranged side by side.

[0098] In which, the first driving pump 12 has a first liquid inlet and a first liquid outlet, the radiator includes a first liquid inlet pipeline 16 and a first liquid outlet pipeline 17, the first liquid inlet is connected to the reflux area P3 through the first liquid inlet pipeline 16, and the first liquid outlet is connected to the first area P1 through the first liquid outlet pipeline 17; the second driving pump 13 has a second liquid inlet and a second liquid outlet, the radiator includes a second liquid inlet pipeline 18 and a second liquid outlet pipeline 19, the second liquid inlet is connected to the reflux area P3 through the second liquid inlet pipeline 18, and the second liquid outlet is connected to the second area P2 through the second liquid outlet pipeline 19.

[0099] Further, see Figure 3 , Figure 3 Figure 2 is a schematic diagram of the structure of the bottom shell. Figure 3 As shown, the base 11 includes: a bottom shell 111 and a cover plate 112, the bottom shell 111 has a recessed accommodating space S, the reflow area P3, the first area P1 and the second area P2 are located in the accommodating space S; the cover plate 112 is covered on the bottom shell 111 and covers the accommodating space S.

[0100] In this embodiment, it is preferred that the bottom shell 111 is an integrated bottom shell.

[0101] The bottom shell 111 includes: a bottom plate 1111 and four side plates 1112, 1113, 1114, 1115, the four side plates 1112, 1113, 1114, 1115 are connected around and connected to the bottom plate 1111, the cover plate 112 is mounted on the side plates 1112, 1113, 1114, 1115, and one of the side plates 1112 is provided with a first through hole K1 located in the first area P1, a first through hole K2 located in the second area P2, and a second through hole K3 located in the second area P3. Two through holes K2 and two third through holes K3 located in the reflux area P3, the two ends of the first liquid inlet pipe 16 are respectively connected to the first liquid inlet and one of the third through holes K3, the two ends of the second liquid inlet pipe 18 are respectively connected to the second liquid inlet and another of the third through holes K3, the two ends of the first liquid outlet pipe 17 are respectively connected to the first through hole K1 and the first liquid outlet, and the two ends of the second liquid outlet pipe 17 are respectively connected to the second through hole K2 and the second liquid outlet.

[0102] It should be noted that in this embodiment, it is a preferred embodiment to have the first through hole K1, the second through hole K2 and the third through hole K3 opened on the side panel 1112. In other embodiments of the present invention, the first through hole K1, the second through hole K2 and the third through hole K3 may also be opened on the side panel 1114.

[0103] It should be noted that, in this embodiment, it is a preferred embodiment that the first through hole K1, the second through hole K2 and the third through hole K3 are all opened on one side panel. In other embodiments of the present utility model, the first through hole K1, the second through hole K2 and the third through hole K3 may also be opened on different side panels respectively, for example, the first through hole K1 is opened on the side panel 1113, the second through hole K2 is opened on the side panel 1115, and the third through hole K3 is opened on the side panel 1114 or the side panel 1113.

[0104] Furthermore, the bottom shell 111 further includes: a first partition 1116, a second partition 1117 and a third partition 1118, the first partition 1116 is mounted on the bottom plate 1111 and the two ends of the first partition 1116 are respectively connected to the two side plates 1112 and 1114 arranged opposite to each other, and the first area P1 is formed between the side plate 1113 facing the first partition 1116 and the first partition 1116; the second partition 1117 is mounted on the bottom plate 1111 and the two ends of the second partition 1117 are respectively connected to the two side plates 1112 and 1114 arranged opposite to each other, and the other side plate 1115 facing the second partition 1117 and the third partition 1118 are respectively connected to the two side plates 1112 and 1114 arranged opposite to each other. The second area P2 is between the second partition plates 1117; wherein, the reflux area P3 is between the first partition plate 1116 and the second partition plate 1117; the third partition plate 1118 is installed on the bottom plate 1111 and is located between the first partition plate 1116 and the second partition plate 1117, and the two ends of the third partition plate 1118 are respectively connected to the two oppositely arranged side plates 1112 and 1114, and the third partition plate 1118 divides the reflux area P3 into a first reflux area P31 and a second reflux area P32, one pair of the third through holes K3 is located in the first reflux area P31, and the other pair of the third through holes K3 is located in the second reflux area P32.

[0105] In which, the cover plate 112 is provided with a first slot C1 located in the first area P1, a second slot C2 located in the second area P2, a third slot C3 located in the first recirculation area P31 and a fourth slot C4 located in the second recirculation area P32; wherein, one end of the first heat dissipation fin 14 is inserted into the first slot C1, and the other end of the first heat dissipation fin 14 is inserted into the third slot C3, so that the first flow channel R1 is connected with the first area P1 and the first recirculation area P31; one end of the second heat dissipation fin 15 is inserted into the second slot P2, and the other end of the second heat dissipation fin 15 is inserted into the fourth slot P4, so that the second flow channel R2 is connected with the second area P2 and the second recirculation area P32.

[0106] It should be noted that, in this embodiment, it is a preferred embodiment that the thermal conductivity of the material of the first partition plate, the second partition plate, and the third partition plate is smaller than the thermal conductivity of the material of the side plate.

[0107] In one embodiment of the present invention, the thermal conductivity of the material of the side plate in contact with the refrigerant in the first reflux area P31 and the second reflux area P32 is smaller than the thermal conductivity of the material of the remaining side plate. Figure 4 , Figure 4The thermal conductivity of the material of the side panels in the middle region P4 is lower than the thermal conductivity of the material of the remaining side panels.

[0108] Each of the first heat sink fins 14 has a first flow channel R1 inside, one end of the first flow channel R1 is connected to the first region P1, the other end of the first flow channel R1 is connected to the first recirculation region P31, the first region P1, the first flow channel R1 and the first recirculation region P31 are connected to form a first loop; each of the second heat sink fins 15 has a second flow channel R2 inside, one end of the second flow channel R2 is connected to the second region P2, the other end of the second flow channel R2 is connected to the second recirculation region P32, the second region P2, the second flow channel R2 and the second recirculation region P32 The two cooling fins 14 are connected to form the second loop; based on this, the refrigerant in the high power consumption area P1 flows back to the first reflux area P31 through the first flow channel R1 inside the first heat dissipation fin 14, and then enters the high power consumption area P1 through the drive of the first drive pump 12, thereby circulating; the refrigerant in the low power consumption area P2 flows back to the second reflux area P32 through the second flow channel R2 inside the second heat dissipation fin 15, and then enters the low power consumption area P2 through the drive of the second drive pump 13, thereby circulating. In this process, the flow rate can also be adjusted by adjusting the speed of the high-power and low-power first drive pumps 12 and / or the second drive pumps 13, thereby improving the heat dissipation performance.

[0109] Furthermore, the bottom shell further includes: a plurality of first spacers G1, a plurality of second spacers G2 and a plurality of protrusions G3, the plurality of first spacers G1 being arranged on the bottom plate 1111 and being located in the first area P1 and / or the second area P2, one end of each of the first spacers G1 being connected to the first partition 1116 or the second partition 1117, the first spacers G1 being arranged in the first area P1 dividing the first area P1 into a plurality of first main heat dissipation areas P11, and the first spacers G1 being arranged in the second area P2 dividing the second area P2 into a plurality of second main heat dissipation areas P21; a plurality of second spacers G2 being arranged on the bottom plate 111 and being located in the first area P1 and / or the second area P2, and each of the second spacers G2 being connected to the other end of the first spacer G1 end, the second spacer G2 arranged in the first area P1 divides the first area P1 into a first liquid inlet area P12, the first through hole K1 is located in the first liquid inlet area P12, and the second spacer G2 arranged in the second area P2 divides the second area P2 into a second liquid inlet area P22, the second through hole K2 is located in the second liquid inlet area P12, and a main heat dissipation area liquid inlet K4 is formed between two adjacent second spacers G2; a plurality of protrusions G3 are arranged on the bottom plate 111 and are located in the first area P1 and / or the second area P2, one end of each of the protrusions G3 is connected to the side plates 1112, 1114 parallel to the first spacer G1, and the other end of the protrusion G3 and the adjacent second spacer G2 form the main heat dissipation area liquid inlet K4.

[0110] In this embodiment, it is a preferred implementation that the second spacer G2 is vertically connected to the other end of the first spacer G1 , but the present invention is not limited thereto.

[0111] In this embodiment, the base is rectangular, and one end of the two protrusions G3 is respectively connected to the two side plates 1112 and 1114 that are the width of the rectangle.

[0112] In one embodiment of the present invention, the bottom plate 1111 , the side plates 1112 , 1113 , 1114 , 1115 , the plurality of first spacers G1 , the plurality of second spacers G2 , and the plurality of protruding portions G3 are an integrally formed structure.

[0113] Furthermore, the bottom shell 111 also includes: multiple columns 1119, which are arranged on the bottom plate 1111 and located in the first main heat dissipation area P11 and / or the second main heat dissipation area P21, and the columns 1119 support the cover plate 112 while increasing the heat dissipation area.

[0114] In one embodiment of the present invention, a top surface of at least one of the column 1119 , the protruding portion G3 , the first spacer G1 , and the second spacer G2 abuts against the cover plate 112 .

[0115] In one embodiment of the present invention, the refrigerant is preferably PG25 coolant, but the present invention is not limited thereto.

[0116] In one embodiment of the present invention, the plurality of columns 1119 , the bottom plate 1111 , the side plates 1112 , 1113 , 1114 , 1115 , the plurality of first spacers G1 , the plurality of second spacers G2 , and the plurality of protrusions G3 are an integrally formed structure.

[0117] Compared with traditional radiators, the radiator according to the present invention has the following beneficial effects:

[0118] 1. The high-power area is separated from the low-power area by the reflow zone, and combined with the first and second heat sink fins, the high-power area and the low-power area can be effectively thermally isolated, avoiding the generation of thermal cascades caused by heat conduction.

[0119] 2. By adding a drive pump in the low-power area at the same time, and the working fluid is a low-temperature evaporative refrigerant, and the drive board provides power, the overall heat dissipation performance of the radiator in the low-power area can be improved by one level, so the ambient temperature at the inlet of the first heat sink in the high-power area can be improved. At the same time, the radiator in the high-power area is equipped with a drive pump. Therefore, this type of radiator will have a significant performance improvement compared to previous base station radiators.

[0120] 3. By setting the heat dissipation fins and base to be hollow, it is the mainstream trend of future heat dissipation in terms of weight reduction. It can improve the performance of the radiator by one level in the heat dissipation of 5G base stations;

[0121] 4. The current mainstream of existing base station radiators is that there is a cavity inside the base and pipeline, and then refrigerant is injected. The latent heat of the refrigerant evaporates and reaches the fins for convection and radiation cooling with the air. However, due to the influence of its own gravity, the refrigerant filling is often based on the horizontal line of the heat source as the liquid level. In addition, due to the influence of gravity, it is impossible to lay the pipeline as much as possible across the entire fin, and the return flow will be partially not smooth. The utility model completely solves the disadvantage of two-phase flow without capillary traction to overcome the influence of gravity. Because the pump provides power, the pressure in the pipeline on the fin is the same, so the liquid flow on the fin is evenly distributed, so all condensation areas on the fin can be utilized;

[0122] 5. The present invention has made many improvements to address the uneven reflux of non-capillary two-phase flow, the influence of gravity, or the slow reflux speed, which can achieve faster water return. At the same time, the liquid level can be above the heat source and completely submerge the heat source. The heat dissipation performance can be improved by one level compared with the previous two-phase flow heat dissipation technology. In addition, this case isolates the high-power consumption area separately and isolates the heat through heat transfer theory. Therefore, this heat dissipation is particularly suitable for outdoor base stations with varying power densities.

[0123] Although the present invention is disclosed above with reference to the aforementioned embodiments, they are not intended to limit the present invention. Any person skilled in the art may make slight changes and modifications without departing from the spirit and scope of the present invention. Therefore, the scope of patent protection of the present invention shall be determined by the scope of protection of the claims appended to the present invention.

Claims

1. A radiator for an outdoor communication base station, characterized in that: At least one heat sink is mounted on the outdoor communication base station and is in contact with at least one heat source of the outdoor communication base station, and the heat sink includes: A base having a first area, a second area, and a reflux area, wherein the reflux area separates the first area from the second area, and refrigerant is disposed in the first area and the second area; a first driving pump, connecting the first area and the reflux area; a second driving pump, connected to the second region and the reflux region; a first heat dissipation fin mounted on the base, wherein the first region, the first heat dissipation fin, and the reflux region are connected to form a first loop, and the refrigerant in the first region circulates within the first loop via the first driving pump; The second heat dissipation fins are installed on the base. The second area, the second heat dissipation fins and the reflux area are connected to form a second loop. The refrigerant in the second area circulates in the second loop through the second driving pump.

2. The radiator according to claim 1, wherein The first driving pump has a first liquid inlet and a first liquid outlet, the radiator includes a first liquid inlet pipeline and a first liquid outlet pipeline, the first liquid inlet is connected to the reflux area through the first liquid inlet pipeline, and the first liquid outlet is connected to the first area through the first liquid outlet pipeline; the second driving pump has a second liquid inlet and a second liquid outlet, the radiator includes a second liquid inlet pipeline and a second liquid outlet pipeline, the second liquid inlet is connected to the reflux area through the second liquid inlet pipeline, and the second liquid outlet is connected to the second area through the second liquid outlet pipeline.

3. The radiator according to claim 2, wherein: The base comprises: The bottom shell has a recessed accommodation space, wherein the reflux area, the first area, and the second area are located in the accommodation space; The cover plate is disposed on the bottom shell and covers the accommodating space.

4. The radiator according to claim 3, wherein The bottom shell includes: bottom plate, Four side panels, the four side panels are connected around and connected to the bottom panel, the cover panel is mounted on the side panels, one side panel is provided with a first through hole corresponding to the first area, a second through hole corresponding to the second area, and two third through holes corresponding to the reflux area, the two ends of the first liquid inlet pipe are respectively connected to the first liquid inlet and one of the third through holes, the two ends of the second liquid inlet pipe are respectively connected to the second liquid inlet and another of the third through holes, the two ends of the first liquid outlet pipe are respectively connected to the first through hole and the first liquid outlet, and the two ends of the second liquid outlet pipe are respectively connected to the second through hole and the second liquid outlet.

5. The radiator according to claim 4, wherein The bottom shell also includes: a first partition plate mounted on the bottom plate, with both ends of the first partition plate connected to the two oppositely disposed side plates, and the first area between the side plate facing the first partition plate and the first partition plate; a second partition plate mounted on the bottom plate, with both ends of the second partition plate connected to the two oppositely disposed side plates, and the second area being between the other side plate facing the second partition plate and the second partition plate; The reflux area is between the first partition plate and the second partition plate.

6. The heat sink according to claim 5, wherein: The bottom shell also includes: The third partition is installed on the bottom plate and is located between the first partition and the second partition. The two ends of the third partition are respectively connected to the two oppositely arranged side plates. The third partition divides the reflux area into a first reflux area and a second reflux area. One pair of the third through holes is located in the first reflux area, and the other pair of the third through holes is located in the second reflux area.

7. The heat sink according to claim 6, wherein: Each of the first heat sink fins has a first flow channel inside, one end of the first flow channel is connected to the first region, the other end of the first flow channel is connected to the first return region, and the first region, the first flow channel and the first return region are connected to form a first loop; Each second heat dissipating fin has a second flow channel inside, one end of the second flow channel is connected to the second area, the other end of the second flow channel is connected to the second return area, and the second area, the second flow channel and the second return area are connected to form a second loop.

8. The heat sink according to claim 5, wherein: The bottom shell also includes: a plurality of first partitions disposed on the bottom plate and located in the first region and / or the second region, one end of each first partition connected to the first partition plate or the second partition plate, the first partitions disposed in the first region dividing the first region into a plurality of first main heat dissipation zones, and the first partitions disposed in the second region dividing the second region into a plurality of second main heat dissipation zones; A plurality of second spacers are arranged on the base plate and located in the first area and / or the second area, each second spacer is connected to the other end of the first spacer, the second spacer arranged in the first area divides the first area into a first liquid inlet area, the first through hole pair is located in the first liquid inlet area, the second spacer arranged in the second area divides the second area into a second liquid inlet area, the second through hole pair is located in the second liquid inlet area, and a main heat dissipation area liquid inlet is formed between two adjacent second spacers.

9. The heat sink according to claim 8, wherein The bottom shell also includes: Multiple protrusions are arranged on the base plate and located in the first area and / or the second area, one end of each protrusion is connected to the side plate parallel to the first spacer, and the main heat dissipation area liquid inlet is formed between the other end of the protrusion and the adjacent second spacer.

10. The heat sink according to claim 9, wherein The bottom shell further includes: a plurality of columns, which are disposed on the bottom plate and located in the first main heat dissipation area and / or the second main heat dissipation area.

11. The heat sink according to claim 7, wherein The cover plate is provided with a first slot corresponding to the first area, a second slot corresponding to the second area, a third slot corresponding to the first recirculation area, and a fourth slot corresponding to the second recirculation area; Among them, one end of the first heat sink fin is inserted into the first slot, and the other end of the first heat sink fin is inserted into the third slot, so that the first flow channel is connected with the first area and the first reflow area; one end of the second heat sink fin is inserted into the second slot, and the other end of the second heat sink fin is inserted into the fourth slot, so that the second flow channel is connected with the second area and the second reflow area.

12. The heat sink according to claim 10, wherein A top surface of at least one of the column, the protruding portion, the first spacer, and the second spacer abuts against the cover plate.

13. The heat sink according to claim 1, wherein The bottom surface of the base abuts against the heat source.

14. The heat sink according to claim 3, wherein The bottom shell is an integrated bottom shell.

15. The heat sink according to claim 1, wherein The base is rectangular.

16. The heat sink according to claim 6, wherein The thermal conductivity of the material of the first separator, the second separator, and the third separator is smaller than the thermal conductivity of the material of the side plate.

17. The heat sink according to claim 6, wherein The thermal conductivity of the material of the portion of the side plate that contacts the refrigerant in the first reflow area and the second reflow area is smaller than the thermal conductivity of the material of the remaining portion of the side plate.

18. The heat sink according to claim 1, wherein The first area is a high power consumption area, and the second area is a low power consumption area.

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