Heat dissipation power supply shell

Abstract

The utility model relates to a heat dissipation power supply shell which comprises an upper shell body and a lower shell body. A plurality of grooves are formed in the upper surface of the substrate; heat dissipation gaps are formed in the inner walls of one side or two sides of the groove; the width of the heat dissipation gap is smaller than the diameter of the wiring core; the power supply shell is ingenious in design, the grooves are formed in the upper surface of the substrate, so that the height difference exists on the upper surface of the substrate, airflow is accelerated in the grooves, the rapidly flowing air can take away more heat, and the heat exchange efficiency is high; by arranging the heat dissipation gaps in the grooves, heat transfer resistance can be reduced, heat can be conducted to the outer surface of the shell from the interior of the mounting cavity more easily and then dissipated to the surrounding environment, and stress and deformation caused by thermal expansion of the shell can be reduced; and the width of the heat dissipation gap is smaller than the diameter of the wiring core, so that the wire core can be well prevented from falling into the mounting cavity in the wire stripping and wiring process, and the use is safe.

Description

Technical Field

[0001] The utility model relates to the technical field of power supply equipment accessories, and more specifically to a heat dissipation power supply shell. Background Art

[0002] Existing power supply devices generate significant heat during use. To prevent overheating and fire, heat is typically dissipated by opening holes in the upper surface of the metal casing. The openings in existing technology are typically larger than 2mm. The smallest core diameter of a multi-strand wire is currently 0.2mm. When connecting power supply devices to power supply cables, users must strip and wire the wires. During this process, metal cores often fall through the holes in the casing into the power supply, potentially causing a short circuit and burnout, leading to serious economic losses and safety hazards.

[0003] Therefore, in order to solve the problem of the wire core of the stripped wire falling into the power supply device and causing a power short circuit without affecting the heat dissipation of the power supply, the power supply housing structure of the present invention is proposed. Utility Model Content

[0004] The technical problem to be solved by the present invention is to provide a heat dissipation power supply housing in view of the above-mentioned defects of the prior art.

[0005] The technical solution adopted by the present invention to solve the technical problem is as follows: a heat dissipation power supply housing, comprising an upper shell and a lower shell, wherein the upper shell and the lower shell are mutually enclosed to form an installation cavity; wherein the upper shell comprises a base plate, first side walls extending from the left and right sides of the base plate toward the lower shell, and second side walls extending from the front and rear sides of the base plate toward the lower shell; the upper surface of the base plate is provided with a plurality of grooves recessed toward the installation cavity; the inner wall of one side or both sides of the groove is provided with at least one heat dissipation gap connected to the installation cavity; the width of the heat dissipation gap is smaller than the diameter of the wiring core;

[0006] In the heat dissipation power supply housing of the present invention, the groove is arranged in a long strip shape and passes through both sides of the base plate; a plurality of the grooves are evenly distributed on the upper surface of the upper shell;

[0007] The heat dissipation power supply housing of the utility model, wherein the lower surface of the base plate is provided with a plurality of reinforcing ribs corresponding to the grooves one by one; the reinforcing ribs extend along the length direction of the grooves;

[0008] The heat dissipation power supply housing of the present invention, wherein the lower surface of the base plate is further provided with at least one first connecting rib; all the reinforcing ribs are connected by the first connecting rib;

[0009] The heat dissipation power supply housing of the present invention, wherein the first connecting rib is perpendicular to the plurality of grooves, and all the heat dissipation gaps intersect with the first connecting rib;

[0010] The heat dissipation power supply housing of the utility model, wherein the base plate is arranged obliquely; the groove is arranged obliquely along with the base plate; the height of the second side wall on one side of the base plate is greater than the height of the second side wall on the other side of the base plate;

[0011] The heat dissipation power supply housing of the present utility model, wherein the height of the first side wall is greater than the height of the second side wall;

[0012] The heat dissipation power supply housing of the present invention, wherein the first side wall is provided with a plurality of first heat dissipation holes connected to the installation cavity; a support rod is formed between two adjacent first heat dissipation holes;

[0013] The heat dissipation power supply housing of the present invention, wherein the plurality of first heat dissipation holes are uniformly arranged in sequence along the length direction of the first side wall; at least one second connecting rib is further fixedly provided on the first side wall; all the support rods are connected by the second connecting rib;

[0014] In the heat dissipation power supply housing of the present invention, a plurality of second heat dissipation holes communicating with the installation cavity are provided on the second side wall.

[0015] The beneficial effects of the present invention are: the power supply casing is cleverly designed, and a plurality of grooves are provided on the upper surface of the substrate so that there is a height difference on the upper surface of the substrate. According to the aerodynamic effect and the Bernoulli principle, when air flows over the upper surface of the substrate with the height difference, the airflow will be accelerated in the grooves due to the presence of the grooves. The fast-flowing air can take away more heat, and the heat exchange efficiency in the grooves is high, thereby improving the heat dissipation effect; by providing heat dissipation gaps on one side or both sides of the inner wall of the grooves, not only can the resistance to heat transfer be reduced, so that heat can be more easily conducted from the installation cavity to the outer surface of the casing and then dissipated into the surrounding environment, but also the stress and deformation of the casing caused by thermal expansion can be reduced; the width of the heat dissipation gap is smaller than the diameter of the wiring core, which can well prevent the wire core from falling into the installation cavity during the wire stripping and wiring process, and is safe to use. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the present invention will be further described below with reference to the accompanying drawings and embodiments. The drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative work:

[0017] Figure 1This is a three-dimensional exploded view of a heat dissipation power supply housing of a preferred embodiment of the utility model;

[0018] Figure 2 yes Figure 1 A schematic structural diagram of the upper middle housing 10 from a first perspective;

[0019] Figure 3 yes Figure 1 A schematic structural diagram of the upper middle housing 10 from a second viewing angle;

[0020] Figure 4 yes Figure 1 A schematic structural diagram of the upper middle housing 10 from a third viewing angle;

[0021] Figure 5 yes Figure 4 Cross-sectional view of AA;

[0022] Figure 6 yes Figure 4 Cross-sectional view of the BB. DETAILED DESCRIPTION

[0023] The terms "first," "second," "third," and "fourth," etc., in the specification, claims, and accompanying drawings of the present invention are used to distinguish between different items, not to describe a specific order. Furthermore, the terms "including," "having," and any variations thereof, are intended to cover non-exclusive inclusions. For example, a process, method, system, product, or apparatus comprising a series of steps or elements is not limited to the listed steps or elements, but may optionally include steps or elements not listed, or may optionally include other steps or elements inherent to the process, method, product, or apparatus.

[0024] References herein to "embodiments" mean that a particular feature, structure, or characteristic described in connection with the embodiments may be included in at least one embodiment of the present invention. The appearance of this phrase in various places in the specification does not necessarily refer to the same embodiment, nor does it constitute a separate or alternative embodiment that is mutually exclusive of other embodiments. It is understood, both explicitly and implicitly, by those skilled in the art that the embodiments described herein may be combined with other embodiments.

[0025] "Multiple" refers to two or more. "And / or" describes the relationship between associated objects, indicating that three possible relationships exist. For example, "A and / or B" can mean: A exists alone, A and B exist simultaneously, or B exists alone. The character " / " generally indicates that the associated objects are in an "or" relationship.

[0026] Moreover, the terms "up, down, front, back, left, right, upper end, lower end, longitudinal" and the like indicating directions are all based on the posture and position of the device or apparatus described in this solution during normal use.

[0027] To make the purpose, technical solutions, and advantages of the embodiments of the present invention more clear, the following will be a clear and complete description of the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are some embodiments of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work shall fall within the scope of protection of the present invention.

[0028] A heat dissipation power supply housing according to a preferred embodiment of the present invention is as follows Figure 1-6 As shown, it includes an upper shell 10 and a lower shell 20, and the upper shell 10 and the lower shell 20 are enclosed with each other to form an installation cavity; in this embodiment, the upper shell 10 can be made of plastic material; wherein, the upper shell 10 includes a base plate 11, a first side wall 12 extending from the left and right sides of the base plate 11 toward the lower shell 20, and a second side wall 13 extending from the front and rear sides of the base plate 11 toward the lower shell 20; in this embodiment, the upper shell 10 adopts the collision and insertion process of the plastic mold, and a plurality of recesses are provided on the upper surface of the base plate 11 toward the installation cavity. Grooves 111; the grooves 111 can be regarded as channels for air flow, which can guide the airflow to flow along a specific path, thereby increasing the contact time between the airflow and the heat source, thereby improving the heat dissipation efficiency; further, the inner wall of one side or both sides of the groove 111 is provided with at least one heat dissipation gap 112 connected to the installation cavity; the width of the heat dissipation gap 112 is smaller than the diameter of the wiring core. In the prior art, the minimum diameter of the wire core is 0.2 mm. The width of the heat dissipation gap in this embodiment is controlled within the range of less than 0.2 mm.

[0029] The power supply housing is cleverly designed. By providing multiple grooves on the upper surface of the substrate, a height difference exists on the upper surface of the substrate. According to the aerodynamic effect and Bernoulli's principle, when air flows over the upper surface of the substrate with the height difference, the airflow will be accelerated in the grooves due to the presence of the grooves. The fast-flowing air can carry away more heat, and the heat exchange efficiency in the grooves is high, thereby improving the heat dissipation effect. By providing heat dissipation gaps on one or both sides of the inner wall of the grooves, not only can the resistance to heat transfer be reduced, so that heat can be more easily conducted from the installation cavity to the outer surface of the housing and then dissipated into the surrounding environment, but the stress and deformation of the housing caused by thermal expansion can also be reduced. The width of the heat dissipation gap is smaller than the diameter of the wiring core, which can effectively prevent the wire core from falling into the installation cavity during the wire stripping and wiring process, ensuring safe use.

[0030] Furthermore, the groove 111 is arranged in a long strip shape and passes through both sides of the substrate 11; multiple grooves 111 are evenly distributed on the upper surface of the upper shell 10, so that the overall heat dissipation of the substrate is more uniform.

[0031] Furthermore, the lower surface of the substrate 11 is provided with a plurality of reinforcing ribs 113 corresponding one-to-one to the grooves 111 ; the reinforcing ribs 113 extend along the length direction of the grooves 111 ; the grooves are supported by the reinforcing ribs 113 , thereby enhancing the overall strength of the substrate 11 .

[0032] Optionally, in order to further increase the overall strength of the base plate 11 , at least one first connecting rib 114 is further provided on the lower surface of the base plate 11 ; and all the reinforcing ribs 113 are connected via the first connecting rib 114 .

[0033] Furthermore, the first connecting rib 114 is perpendicular to the multiple grooves 111, and all the heat dissipation gaps 112 intersect with the first connecting rib 114; in this embodiment, the grooves and the reinforcing ribs extend along the width direction of the substrate, and the first connecting rib extends along the length direction of the substrate; through the mutual perpendicular cross-connection, the structure of the substrate 11 can be made more stable, and the heat dissipation gap structure can also be ensured to be more stable.

[0034] Furthermore, the substrate 11 is arranged at an angle; the groove 111 is arranged at an angle along with the substrate 11; the height of the second side wall 13 on one side of the substrate 11 is greater than the height of the second side wall 13 on the other side of the substrate 11; the hot air in the installation cavity floats up through the heat dissipation gap in the inner wall of the groove during heat dissipation, and the pressure difference and airflow generated are used to slowly blow the copper wire fallen in the groove down along the slope of the obliquely set groove.

[0035] Furthermore, the height of the first side wall 12 is greater than the height of the second side wall 13 , so that the upper shell 10 can be better positioned and installed on the lower shell 20 .

[0036] Furthermore, in order to improve the heat dissipation efficiency, a plurality of first heat dissipation holes 121 connected to the mounting cavity are provided on the first side wall 12 by utilizing the plastic mold slide structure; a support rod 122 is formed between two adjacent first heat dissipation holes 121 .

[0037] Optionally, multiple first heat dissipation holes 121 are evenly arranged along the length direction of the first side wall 12; at least one second connecting rib 123 is also fixed on the first side wall 12; all support rods 122 are connected by the second connecting rib 123; the structure of the first side wall is more stable.

[0038] Furthermore, a plurality of second heat dissipation holes 131 communicating with the mounting cavity are provided on the second side wall 13 . In this embodiment, the second heat dissipation holes 131 and the reinforcing ribs 113 are staggered with each other, thereby achieving high heat dissipation efficiency.

[0039] It should be understood that those skilled in the art can make improvements or changes based on the above description, and all such improvements and changes should fall within the scope of protection of the claims attached to this utility model.

Claims

1. A heat dissipation power supply housing, comprising an upper housing and a lower housing, wherein the upper housing and the lower housing are mutually enclosed to form an installation cavity; characterized in that: The upper shell includes a base plate, a first side wall extending from the left and right sides of the base plate toward the lower shell, and a second side wall extending from the front and rear sides of the base plate toward the lower shell; the upper surface of the base plate is provided with a plurality of grooves recessed toward the mounting cavity; the inner wall on one side or both sides of the groove is provided with at least one heat dissipation gap connected to the mounting cavity; the width of the heat dissipation gap is smaller than the diameter of the wiring core.

2. The heat dissipation power supply housing according to claim 1, characterized in that: The groove is arranged in a long strip shape and passes through both sides of the base plate; a plurality of the grooves are evenly distributed on the upper surface of the upper shell.

3. The heat dissipation power supply housing according to claim 1 or 2, characterized in that: The lower surface of the substrate is provided with a plurality of reinforcing ribs corresponding to the grooves one by one; the reinforcing ribs extend along the length direction of the grooves.

4. The heat dissipation power supply housing according to claim 3, characterized in that: The lower surface of the base plate is further provided with at least one first connecting rib; all the reinforcing ribs are connected via the first connecting rib.

5. The heat dissipation power supply housing according to claim 4, characterized in that: The first connecting rib is perpendicular to the plurality of grooves, and all the heat dissipation gaps intersect with the first connecting rib.

6. The heat dissipation power supply housing according to any one of claims 1, 2, 4 and 5, characterized in that: The substrate is arranged obliquely; the groove is arranged obliquely along with the substrate; and the height of the second side wall on one side of the substrate is greater than the height of the second side wall on the other side of the substrate.

7. The heat dissipation power supply housing according to claim 6, characterized in that: The height of the first side wall is greater than the height of the second side wall.

8. The heat dissipation power supply housing according to claim 1, characterized in that: A plurality of first heat dissipation holes connected to the installation cavity are provided on the first side wall; and a support rod is formed between two adjacent first heat dissipation holes.

9. The heat dissipation power supply housing according to claim 8, characterized in that: The plurality of first heat dissipation holes are uniformly arranged in sequence along the length direction of the first side wall; at least one second connecting rib is also fixedly provided on the first side wall; and all the support rods are connected via the second connecting rib.

10. The heat dissipation power supply housing according to claim 8, characterized in that: The second side wall is provided with a plurality of second heat dissipation holes communicating with the installation cavity.

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