Heat sink and electronic component

Abstract

The present disclosure proposes a heat sink and an electronic component, the heat sink comprising a first side plate and a second side plate, where the first side plate and the second side plate are connected to each other at an annular peripheral connection region extending along the peripheries of the first side plate and the second side plate, the first side plate and the second side plate are at least partially spaced apart from each other in the thickness direction on the inner side of the peripheral connection region to define an evaporation chamber inside the heat sink, the evaporation chamber containing a coolant adapted to transition between a liquid state and a gaseous state, and wherein the first side plate has an outer surface opposite the evaporation chamber, the outer surface is divided in the height direction into a flat heat absorbing portion and a heat dissipating portion provided with a plurality of ribs each extending in the width direction. The electronic assembly comprises two radiating fins connected together and an electronic module clamped between the two radiating fins.

Description

Technical Field

[0001] The present disclosure relates to the field of heat dissipation of electronic modules such as memory modules, and more particularly, to a heat sink and an electronic component equipped with the heat sink. Background Art

[0002] Taking server memory as an example, thermal management is crucial for maintaining the performance, reliability, and lifespan of memory modules and server systems. Key challenges in memory module thermal management include: increased thermal design power (TDP) due to increased memory capacity and computing speed; limited space available for cooling solutions within servers; hot spots and uneven cooling caused by localized heat dissipation; high ambient temperatures in server rooms; and the limitations of traditional cooling methods such as heat sinks and fans. These challenges require innovative and effective thermal management strategies to address the growing thermal demands of modern server memory modules.

[0003] In the prior art, there are mainly two solutions for thermal management of memory modules, namely, memory clip heat sinks and memory water-cooled heat sinks. Among them, memory clip heat sinks are usually made of metals such as aluminum or copper, and are clamped on both sides of the memory module to improve the heat dissipation of the memory module. Although the structure is simple and the cost is low, there is a defect that it cannot provide sufficient cooling for high-performance memory modules. The memory water-cooled heat sink consists of a tube and a cold plate, and cools the memory module through circulating liquid. Although the heat dissipation effect is good, it is expensive, the structure is complex, the size is large, and there is a risk of leakage.

[0004] Therefore, there is an urgent need in the art for a thermal management solution that can effectively improve the heat dissipation of electronic modules and has a simple structure and high reliability. Utility Model Content

[0005] In order to solve the problems in the above-mentioned prior art, the present disclosure proposes a heat sink for cooling an electronic module, the heat sink comprising a first side plate and a second side plate, wherein the first side plate and the second side plate are connected to each other at an annular peripheral connection area extending along the periphery of the two sides, and are at least partially spaced apart from each other along the thickness direction on the inner side of the peripheral connection area to define an evaporation chamber inside the heat sink, the evaporation chamber containing a coolant suitable for transitioning between liquid and gaseous states, and wherein the first side plate has an outer surface opposite to the evaporation chamber, the outer surface being divided in the height direction into a flat heat-absorbing portion and a heat-dissipating portion provided with a plurality of ribs, each rib extending in the width direction.

[0006] According to an optional embodiment of the present disclosure, the evaporation chamber is divided into a heat absorption chamber corresponding to the heat absorption part and a heat dissipation chamber corresponding to the heat dissipation part in a height direction, and the heat absorption chamber is communicated with the heat dissipation chamber.

[0007] According to an optional embodiment of the present disclosure, each rib extends along the entire width of the heat sink.

[0008] According to an optional embodiment of the present disclosure, the heat sink is provided with at least one through hole, the through hole extends through the first side plate and the second side plate, and the first side plate and the second side plate are connected to each other around the through hole.

[0009] According to an optional embodiment of the present disclosure, the heat sink is provided with a through hole within the height range of the heat absorbing portion.

[0010] According to an optional embodiment of the present disclosure, the heat sink is provided with a plurality of through holes within a height range of the heat dissipation portion.

[0011] According to an optional embodiment of the present disclosure, some of the multiple through holes are in the peripheral connection area, and the remaining through holes are in multiple intermediate connection areas, the first side plate and the second side plate are connected to each other at each intermediate connection area, and each intermediate connection area is located on the inner side of the peripheral connection area.

[0012] According to an optional embodiment of the present disclosure, the plurality of ribs are distributed in the plurality of intermediate connection areas.

[0013] According to an optional embodiment of the present disclosure, each rib is arranged adjacent to one of the plurality of through holes.

[0014] According to an optional embodiment of the present disclosure, the heat sink further includes at least one positioning column, which is connected to the first side panel and passes through the first side panel to be connected to the second side panel, and is provided with a connecting hole, which extends through the positioning column and the second side panel.

[0015] Also in order to solve the problems in the above-mentioned prior art, the present disclosure also proposes an electronic component, which includes: two heat sinks as described in the present disclosure connected together; and an electronic module clamped between the heat-absorbing parts of the two heat sinks, wherein the electronic module includes a substrate and a plurality of electronic chips installed on both sides of the substrate.

[0016] According to an optional embodiment of the present disclosure, the multiple ribs of one heat sink and the multiple ribs of another heat sink are arranged in a staggered manner.

[0017] According to an optional embodiment of the present disclosure, the electronic component further includes a plurality of elastic thermally conductive pads, each elastic thermally conductive pad being clamped between an electronic chip and a heat absorbing portion of one of the two heat sinks.

[0018] According to an optional embodiment of the present disclosure, the electronic module is a memory stick, and the electronic chip is a memory chip.

[0019] Also in order to solve the problems in the above-mentioned prior art, the present disclosure also proposes an electronic component, which includes: a heat sink as described in the present disclosure; a positioning plate connected to the heat sink; and an electronic module clamped between the positioning plate and the heat-absorbing part of the heat sink, wherein the electronic module includes a substrate and an electronic chip mounted on one side of the substrate, and the heat-absorbing part faces the electronic chip.

[0020] The present disclosure can be embodied as the illustrative embodiments in the accompanying drawings. However, it should be noted that the drawings are merely illustrative and any changes conceived under the teachings of the present disclosure should be considered to be included within the scope of the present disclosure. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] The accompanying drawings illustrate exemplary embodiments of the present disclosure. These drawings should not be interpreted as necessarily limiting the scope of the present disclosure, wherein:

[0022] Figure 1 is a schematic front perspective view of a heat sink according to an embodiment of the present disclosure;

[0023] Figure 2 yes Figure 1 a schematic rear perspective view of the heat sink shown;

[0024] Figure 3 It is along Figure 2 A schematic cross-sectional view of the heat sink taken along line III-III in FIG.

[0025] Figure 4 is a schematic front view of a heat sink according to another embodiment of the present disclosure;

[0026] Figure 5 It is along Figure 4 A schematic cross-sectional view of the heat sink taken along line VV in FIG.

[0027] Figure 6 is a schematic exploded perspective view of an electronic assembly according to one embodiment of the present disclosure; and

[0028] Figure 7 yes Figure 6 A schematic assembly perspective view of the electronic components shown. DETAILED DESCRIPTION

[0029] Further features and advantages of the present disclosure will become more apparent from the following description with reference to the accompanying drawings. Exemplary embodiments of the present disclosure are shown in the accompanying drawings, and the drawings are not necessarily drawn to scale. However, the present disclosure may be implemented in many different forms and should not be construed as necessarily limited to the exemplary embodiments disclosed herein. Rather, these exemplary embodiments are provided solely to illustrate the present disclosure and to convey the spirit and substance of the present disclosure to those skilled in the art.

[0030] The present disclosure aims to provide a heat sink with a novel design for cooling electronic modules such as memory modules (also referred to as memory sticks), and an electronic assembly equipped with the heat sink. Due to the novel design according to the present disclosure, the heat sink can efficiently absorb and dissipate the heat generated by electronic chips such as memory chips during operation, thereby helping to improve the performance, reliability, and service life of the electronic modules and server systems using the electronic modules. In particular, due to the novel design according to the present disclosure, the heat sink also has high reliability and small size, thereby being able to reliably solve the heat dissipation problem of the electronic modules within a limited space and allowing more electronic modules to be arranged within a limited space.

[0031] Various optional but non-limiting embodiments of the heat sink and electronic assembly according to the present disclosure are described in detail below with reference to the accompanying drawings. It should be noted that the terms used herein to indicate relative orientation (e.g., thickness direction TT', height direction HH', width direction WW', etc.) are intended solely to more intuitively convey the teachings of the present disclosure in conjunction with the accompanying drawings, and that the thickness direction TT', height direction HH', and width direction WW' are used to refer to three mutually perpendicular directions in three-dimensional space. These terms indicating relative orientation should not be interpreted in any way as limiting the scope of protection of the present disclosure.

[0032] refer to Figure 1-Figure 3 ,in, Figure 1 shows a schematic front perspective view of a heat sink according to an embodiment of the present disclosure, Figure 2 Shown Figure 1 A schematic rear perspective view of the heat sink is shown, and Figure 3 Shown along Figure 2 Schematic cross-sectional view of the heat sink taken along line III-III in FIG. Figure 1-Figure 3As shown, the heat sink 100 has a hollow structure, which defines an evaporation chamber 101 therein. A coolant (also referred to as a refrigerant) 150, such as water or alcohol, is contained in the evaporation chamber 101. The coolant 150 is adapted to transition between a gaseous state and a liquid state by absorbing and releasing heat. More specifically, the coolant 150 can evaporate from a liquid state to a gaseous state by absorbing heat, and can condense from a gaseous state to a liquid state by releasing heat. Furthermore, the coolant 150 does not completely fill (i.e., does not completely fill) the evaporation chamber 101 when in a liquid state. That is, the coolant 150 only occupies a portion of the evaporation chamber 101, but not the entire portion, leaving space in the evaporation chamber 101 for accommodating the coolant 150 in a gaseous state after evaporation, as described in detail below.

[0033] Continue to refer Figure 1-Figure 3The heat sink 100 further includes a pair of side plates, namely, a first side plate 110 and a second side plate 120, wherein the first side plate 110 and the second side plate 120 are separated from each other along the thickness direction TT' (that is, a certain distance apart along the thickness direction TT'), so that the evaporation chamber 101 is defined between the first side plate 110 and the second side plate 120 in the thickness direction TT', and the first side plate 110 and the second side plate 120 are connected to each other at a generally annular peripheral connection area 102 extending along the periphery of the first side plate 110 and the second side plate 120, so that the peripheral connection area 102 can enclose the evaporation chamber 101 between the first side plate 110 and the second side plate 120. Furthermore, the outer surface 111 of the first side plate 110 (i.e., the surface facing away from or away from the evaporation chamber 101) is divided in the height direction HH' into a heat-absorbing portion 111a and a heat-dissipating portion 111b. Specifically, the outer surface 111 is composed of the heat-absorbing portion 111a and the heat-dissipating portion 111b arranged along the height direction HH', such that the heat-absorbing portion 111a occupies a portion of the height of the heat sink 100, while the heat-absorbing portion 111b occupies the remainder of the height of the heat sink 100. Consequently, the evaporation chamber 101 is also divided in the height direction HH' into the heat-absorbing chamber 101a, which corresponds to or overlaps with the heat-absorbing portion 111a in the height direction HH', and the heat-dissipating chamber 101b, which corresponds to or overlaps with the heat-dissipating portion 111b in the height direction HH'. The heat-absorbing chamber 101a is in fluid communication with the heat-dissipating chamber 101b. Furthermore, the heat-absorbing portion 111a is generally flat, that is, the first side plate 110 has a generally flat surface on the heat-absorbing portion 111a, while the heat-dissipating portion 111b is uneven. Specifically, the first side plate 110 is provided with a plurality of ribs (also referred to as fins) 112 on the heat-dissipating portion 111b. These ribs 112 are distributed along the height direction HH', that is, separated from each other along the height direction HH'. Each rib 112 protrudes from the outer surface 111 generally along the thickness direction TT' and extends generally along the width direction WW'. Thus, an airflow channel 113 extending along the width direction WW' is defined between any two adjacent ribs 112.

[0034] During use of the heat sink 100, an air flow flowing in the width direction WW' is supplied to the heat sink 100, and the heat sink 100 is Figure 1-Figure 3The positioning shown is such that the height direction HH' is oriented along the vertical direction, the heat dissipating portion 111b is located above the heat absorbing portion 111a, and the heat dissipating chamber 101b is located above the heat absorbing chamber 101a. In this case, the liquid coolant 150 will accumulate in the heat absorbing chamber 101a of the evaporation chamber 101 due to the effect of gravity, thereby at least partially overlapping or aligning with the heat absorbing portion 111a in the height direction HH' (i.e., the vertical direction). Under the above configuration, the heat sink 100 can absorb heat from the outside (for example, from the electronic chip of the electronic module) at the heat absorption portion 111a and transfer the heat to the liquid coolant 150 in the evaporation chamber 101. The coolant 150 will heat up as the heat is absorbed and evaporate from the liquid to the gaseous state. The gaseous coolant 150 will rise to the heat dissipation chamber 101b of the evaporation chamber 101, thereby at least partially overlapping or overlapping with the heat dissipation portion 111b in the height direction HH'. The heat dissipation portion 111b is aligned so that the heat dissipation portion 111b can absorb the heat of the coolant 150. Since the multiple ribs 112 of the heat dissipation portion 111b increase its contact area with the airflow, the heat dissipation portion 111b can quickly dissipate the heat into the airflow, thereby allowing the gaseous coolant 150 to quickly release heat and cool down, thereby condensing from gas to liquid. The liquid coolant 150 will return to the heat absorption chamber 101a of the evaporation chamber 101 due to the action of gravity and start absorbing heat again. Therefore, through the above configuration, the heat-absorbing chamber 101a is primarily used to accommodate the liquid coolant 150, while the heat-dissipating chamber 101b is primarily used to accommodate the gaseous coolant 150. Furthermore, the heat sink 100 is capable of rapidly and cyclically absorbing and releasing heat through the circulation of the coolant 150 between the heat-absorbing chamber 101a and the heat-dissipating chamber 101b, thereby rapidly cooling the electronic chip of the electronic module, thereby providing thermal management support for further improving the computing power of the electronic chip. Furthermore, due to its simple structure, it has low manufacturing costs and high reliability, and there is no risk of coolant leakage. Furthermore, it is worth mentioning that, because the heat sink 100 has a relatively flat structure, it does not significantly increase the size of the electronic module, and in particular, does not significantly increase the thickness of the electronic module. This improves the heat dissipation of the electronic module while saving space within the system (e.g., a server), thereby allowing more electronic modules to be installed in the system.

[0035] exist Figure 1-Figure 3 In the illustrated embodiment, in addition to the features described above, the heat sink 100 may also include but is not limited to the following features.

[0036] In particular, Figure 1-Figure 3As shown, each rib 112 extends along the entire width of the heat sink 100 or the first side plate 110. In this configuration, an airflow channel 113 extending along the entire width of the heat sink 100 or the first side plate 110 is formed between two adjacent ribs 112. This greatly increases the contact area between the heat dissipation portion 111b and the airflow, thereby further improving the heat dissipation capacity of the heat sink 100.

[0037] In particular, Figure 1-Figure 3 As shown, the heat sink 100 is further provided with connecting posts 130 (two connecting posts 130 are shown in the figure). These connecting posts 130 extend through the first side plate 110 and the evaporation chamber 101 along the thickness direction TT' and terminate at the second side plate 120. Connecting holes 131 are provided internally therein. These connecting holes 131 extend through the connecting posts 130 and the second side plate 120 along the thickness direction TT' for receiving fasteners such as screws and bolts. This allows the heat sink 100 to be secured to an electronic module or another heat sink 100 via these fasteners. More specifically, the connecting posts 130 are further connected to the first side plate 110 and the second side plate 120, thereby forming sealed areas between the connecting posts 130 and the first side plate 110 and between the connecting posts 130 and the second side plate 120. These sealed areas prevent the coolant 150 in the evaporation chamber 101 from leaking to the outside, thereby preventing the coolant 150 from contaminating the electronic module or even causing a short circuit in the electronic module, thereby improving the safety and reliability of the electronic module.

[0038] In particular, Figure 1-Figure 3 As shown, the heat sink 100 may further be provided with a lug 140 protruding from the first side plate 110 along the thickness direction TT' (the figure shows two lugs 140 located on opposite sides of the first side plate 110 along the width direction WW'). The lug 140 can be used to engage with the substrate of the electronic module, thereby helping to reliably hold the heat sink 100 and the electronic module together.

[0039] In particular, Figure 1-Figure 3As shown, the first side plate 110 and the second side plate 120 are connected not only at the peripheral connection region 102 but also at the intermediate connection region 103 located inside the peripheral connection region 102. That is, in addition to the peripheral connection region 102, the heat sink 100 also includes the intermediate connection region 103 located inside the peripheral connection region 120, connecting the first side plate 110 and the second side plate 120. In this configuration, the evaporation chamber 101 is defined between the peripheral connection region 102 and the intermediate connection region 103, more specifically, inside the peripheral connection region 102 and outside the intermediate connection region 103. In this case, the coolant 150 can only flow around or outside the intermediate connection region 103, but cannot flow within the intermediate connection region 103. Therefore, the intermediate connection region 103 can be considered to occupy a portion of the evaporation chamber 101. More specifically, the heat sink 100 is further provided with a through hole 104 extending through the first side plate 110 and the second side plate 120 at the intermediate connection region 103, so that the intermediate connection region 103 surrounds the through hole 104. Since the first side plate 110 and the second side plate 120 are connected to each other around the through hole 104, in other words, since the first side plate 110 and the second side plate 120 are connected to each other around the through hole 104, such connection of the first side plate 110 and the second side plate 120 separates the through hole 104 and the evaporation chamber 101 from each other, thereby preventing the coolant 150 in the evaporation chamber 101 from leaking to the outside through the through hole 104. Figure 1-Figure 3 In the illustrated embodiment, the intermediate connection region 103 is within the height range of the heat absorbing portion 111 a so that the through hole 104 can allow electronic components on the electronic module to pass through, thereby avoiding structural interference between the heat sink 100 and the electronic module.

[0040] refer to Figure 4 and Figure 5 ,in, Figure 4 shows a schematic front view of a heat sink according to another embodiment of the present disclosure, Figure 5 Shown along Figure 4 Schematic cross-sectional view of the heat sink taken along line VV in FIG.

[0041] Figure 4 and Figure 5 The embodiment shown is Figure 1-Figure 3A major difference of the illustrated embodiment is that the heat sink 100 is provided with a plurality of intermediate connection areas 103 connecting the first side plate 110 and the second side plate 120 to each other on the inner side of the peripheral connection area 102, wherein each intermediate connection area 103 is provided with at least one through hole 104 extending through the first side plate 110 and the second side plate 120, and the first side plate 110 and the second side plate 120 are connected to each other around each through hole 104, thereby spacing each through hole 104 from the evaporation chamber 101. In particular, each intermediate connection area 103 is spaced apart from the other intermediate connection areas 103. In particular, one of the plurality of intermediate connection areas 103 and its through hole 104 are substantially located within the height range of the heat absorbing portion 111a, so that the through hole 104 can be like Figure 1-Figure 3 As in the illustrated embodiment, electronic components on the electronic module are passed through, thereby avoiding structural interference between the heat sink 100 and the electronic module. The remaining intermediate connection regions 103 and their through-holes 104 are located within the height range of the heat dissipation portion 111b. These through-holes 104 within the height range of the heat dissipation portion 111b provide additional channels for airflow, allowing airflow to flow along the thickness direction TT' through these intermediate connection regions 103 within the height range of the heat dissipation portion 111b. This promotes cooling of these intermediate connection regions 103 and enables these intermediate connection regions 103 to reduce the temperature of the coolant 150 flowing around them, further enhancing the heat dissipation capacity of the heat sink 100. Specifically, the intermediate connection region 103 generally within the height range of the heat absorption portion 111a has one through-hole 104, while the intermediate connection region 103 within the height range of the heat dissipation portion 111b has two through-holes 104. It should be noted that the number of the above-mentioned through holes 104 is only for illustration, and any number of through holes 104 can be provided in each intermediate connection region 103 according to actual needs.

[0042] Figure 4 and Figure 5 The embodiment shown is Figure 1-Figure 3 Another major difference of the embodiment shown is that the plurality of ribs 112 do not extend along the entire width of the heat sink 100 or the first side plate 110, but are distributed in each intermediate connection area 103 within the height range of the heat dissipation portion 111b. Figure 5As shown, the first side plate 110 is provided with at least one rib 112 in each intermediate connection region 103 within the height range of the heat dissipation portion 111b. Each rib 112 protrudes from the outer surface 111 generally along the thickness direction TT' and extends generally along the width direction WW'. With this configuration, each rib 112 increases the contact area between each intermediate connection region 103 within the height range of the heat dissipation portion 111b and the airflow, thereby further promoting cooling of these intermediate connection regions 103 and enabling these intermediate connection regions 103 to further promote the cooling of the coolant 150, thereby further improving the heat dissipation capacity of the heat sink 100. Specifically, in each intermediate connection region 103 within the height range of the heat dissipation portion 111b, each rib 112 protrudes from the outer surface 111 of the first side plate 110 at the edge of a through-hole 104, so that each rib 112 is arranged adjacent to a through-hole 104. In this configuration, each rib 112 not only increases the contact area between the heat dissipation portion 111b and the airflow flowing through it along the width direction WW', but also increases the contact area between the heat dissipation portion 111b and the airflow flowing through it along the thickness direction TT'. This further promotes heat dissipation in each intermediate connection region 103 within the height range of the heat dissipation portion 111b, allowing these intermediate connection regions 103 to further promote cooling of the coolant 150, thereby further improving the heat dissipation capacity of the heat sink 100. In particular, the through-holes 104 and ribs 112 can also be arranged in the peripheral connection region 102 in the same manner as described above, which can also improve the heat dissipation capacity of the heat sink 100.

[0043] In addition, it is worth mentioning that although Figure 1-Figure 5 The heat sink 100 shown in the figure is generally rectangular, but this is only for illustration. In order to avoid structural interference with other components in the electronic system, the heat sink 100 can obviously also take other shapes according to actual needs, such as L-shape, U-shape, C-shape, etc.

[0044] The above is with the help of Figure 1-Figure 5 An optional but non-limiting embodiment of the heat sink according to the present disclosure is described below. Figure 6 and Figure 7 Alternative but non-limiting embodiments of electronic assemblies according to the present disclosure are described.

[0045] refer to Figure 6 and Figure 7 ,in, Figure 6 shows a schematic exploded perspective view of an electronic component according to an embodiment of the present disclosure, Figure 7 Shown Figure 6 The schematic assembly perspective view of the electronic components shown in FIG. Figure 6 and Figure 7 Before describing the electronic components, it is important to point out that although Figure 6 and Figure 7 The electronic components shown are assembled according to Figure 1-Figure 3 The heat sink of the embodiment shown is only exemplary. In other embodiments of the electronic assembly not shown, the electronic assembly can obviously also be assembled according to Figure 4 and Figure 5 The heat sink of the embodiment shown. Figure 6 and Figure 7 As shown, the electronic component 10 includes two heat sinks 100 connected together and an electronic module 200 clamped between the two heat sinks 100, wherein the two heat sinks 100 are connected together in a manner that the outer surfaces 111 of their respective first side panels 110 are opposite to each other (i.e., facing each other) (for example, connected together by fasteners 160 such as screws and bolts passing through the connecting holes 131 of the two), so that the outer surface 111 of the first side panel 110 of each heat sink 100 faces the electronic module 200, and the electronic module 200 is clamped between the heat absorbing portions 111a of the two outer surfaces 111. In this configuration, the two heat sinks 100 absorb heat generated by the electronic module 200 during operation through their respective heat-absorbing portions 111a. The heat is then transferred to their respective heat-dissipating portions 111b through the phase change of the coolant 150 within each heat sink 100. The heat is then dissipated into the airflow through the respective heat-dissipating portions 111b. This achieves reliable and efficient cooling of the electronic module 200, thereby further improving the computing power of the electronic module 200. Furthermore, the assembled electronic assembly 10 can be inserted as a whole into the mainboard of an electronic system, thereby reducing modification time and downtime, and lowering maintenance costs.

[0046] In particular, Figure 6As shown, electronic module 200 includes a substrate (e.g., a PCB) 210 and chips 220 mounted on both sides of substrate 210, such that the heat-absorbing portion 111a of one heat sink 100 faces the chip 220 on one side of substrate 210, while the heat-absorbing portion 111a of the other heat sink 100 faces the chip 220 on the other side of substrate 210. In this configuration, each chip 220 is positioned between substrate 210 and the heat-absorbing portion 111a of the heat sink 100. During operation, heat generated by each chip 220 is absorbed by the heat-absorbing portion 111a facing the chip and dissipated into the airflow by the corresponding heat-dissipating portion 111b, thereby achieving reliable and efficient cooling of the chips 220. More specifically, electronic module 200 includes four chips 220, with two chips 220 mounted on each side of substrate 210, thereby configuring electronic module 200 as a dual-in-line electronic module. Each heat sink 100 is configured to cool two chips 220 on the same side. In particular, the electronic module 200 can be a memory module (also known as a memory stick, for example, a dual in-line memory stick) in a server system, and the chip 220 can be a memory chip. Therefore, the heat sink 100 is configured to cool the memory module in the server system so as to provide the possibility of further improving the computing power and storage capacity of the memory module.

[0047] In particular, Figure 6 As shown, the electronic assembly 10 further includes a plurality of elastic thermal pads 300, wherein each elastic thermal pad 300 is sandwiched between a chip 220 and a corresponding heat absorbing portion 111a to transfer heat from the chip 220 to the heat absorbing portion 111a. In this configuration, the elastic thermal pad 300 can conform to the surface of the chip 220 and the heat absorbing portion 111a of the heat sink 100 due to its elasticity. Therefore, even if there are certain manufacturing errors (for example, certain non-uniformities) in the surface of the chip 220 and the heat absorbing portion 111a of the heat sink 100, the elastic thermal pad 300 can still well adhere to the surface of the chip 220 and the heat absorbing portion 111a of the heat sink 100, thereby ensuring sufficient contact area with both, thereby ensuring reliable and efficient heat transfer from the chip 220 to the heat absorbing portion 111a.

[0048] In particular, Figure 7As shown, the multiple ribs 112 of one heat sink 100 are arranged in a staggered manner with the multiple ribs 112 of another heat sink 100. That is, each rib 112 of one heat sink 100 is located between two ribs 112 of the other heat sink 100. In this configuration, airflow can flow between two adjacent ribs 112, and the surface area of the ribs 112 of each heat sink 100 can be greatly increased, thereby further increasing the contact area between the heat dissipation portion 111b of each heat sink 100 and the airflow, thereby improving the heat dissipation capacity of the heat sink 100. Furthermore, the ribs 112 of the two heat sinks 100 do not structurally interfere with each other.

[0049] It is worth mentioning that although in the above description, the electronic module 200 is provided with chips 220 on both sides, this is merely schematic. The electronic module 200 can be provided with the chip 220 only on one side, and accordingly, the heat sink 100 can be arranged only on the side of the electronic module 200 where the chip 220 is provided, and the heat sink 100 on the side of the electronic module 200 where there is no chip 220 is replaced with an ordinary positioning plate. The positioning plate only needs to be connected to the heat sink 100 to clamp the electronic module 200, and does not need to have the same heat dissipation capacity as the heat sink 100, thereby reducing the configuration cost of the electronic component 10.

[0050] The above describes in detail, with the aid of the accompanying drawings, optional but non-limiting embodiments of the heat sink and electronic assembly according to the present disclosure. It will be apparent to those skilled in the art that modifications and additions to the techniques and structures, as well as recombinations of features in the various embodiments, without departing from the spirit and substance of the present disclosure, are within the scope of this disclosure. Therefore, such modifications and additions as are conceivable under the teachings of this disclosure are considered part of this disclosure. The scope of this disclosure includes both known equivalent technologies as of the filing date of this disclosure and unforeseen equivalent technologies.

Claims

1. A heat sink, characterized in that: The heat sink (100) comprises a first side plate (110) and a second side plate (120), The first side plate (110) and the second side plate (120) are connected to each other at an annular peripheral connection area (102) extending along the periphery of the two sides, and are at least partially spaced apart from each other along the thickness direction (TT') on the inner side of the peripheral connection area (102) to define an evaporation chamber (101) inside the heat sink (100), wherein the evaporation chamber (101) contains a coolant (150) suitable for transitioning between liquid and gaseous states, and The first side plate (110) has an outer surface (111) opposite to the evaporation chamber (101), and the outer surface (111) is divided into a flat heat-absorbing portion (111a) and a heat-dissipating portion (111b) provided with a plurality of ribs (112) in a height direction (HH'), and each rib (112) extends along a width direction (WW').

2. The heat sink according to claim 1, wherein: The evaporation chamber (101) is divided into a heat absorption chamber (101a) corresponding to the heat absorption part (111a) and a heat dissipation chamber (101b) corresponding to the heat dissipation part (111b) in a height direction (HH'), and the heat absorption chamber (101a) is communicated with the heat dissipation chamber (101b).

3. The heat sink according to claim 1 or 2, characterized in that: Each rib (112) extends along the entire width of the heat sink (100).

4. The heat sink according to claim 1 or 2, characterized in that: The heat sink (100) is provided with at least one through hole (104), the through hole (104) extending through the first side plate (110) and the second side plate (120), and the first side plate (110) and the second side plate (120) are connected to each other around the through hole (104).

5. The heat sink according to claim 4, wherein: The heat sink (100) is provided with a through hole (104) within the height range of the heat absorbing portion (111a).

6. The heat sink according to claim 4, wherein: The heat sink (100) is provided with a plurality of through holes (104) within the height range of the heat dissipation portion (111b).

7. The heat sink according to claim 6, wherein: Some of the plurality of through holes (104) are located in the peripheral connection area (102), and the remaining through holes (104) are located in a plurality of intermediate connection areas (103); the first side plate (110) and the second side plate (120) are connected to each other at each intermediate connection area (103), and each intermediate connection area (103) is located on the inner side of the peripheral connection area (102).

8. The heat sink according to claim 7, wherein: The plurality of ribs (112) are distributed in the plurality of intermediate connection areas (103).

9. The heat sink according to claim 8, wherein: Each rib (112) is arranged adjacent to one of the plurality of through holes (104).

10. The heat sink according to claim 1 or 2, characterized in that: The heat sink (100) further includes at least one positioning post (130), the positioning post (130) being connected to the first side plate (110) and passing through the first side plate (110) to be connected to the second side plate (120), and being provided with a connecting hole (131), the connecting hole (131) extending through the positioning post (130) and the second side plate (120).

11. An electronic component, characterized in that: The electronic component (10) comprises: Two heat sinks (100) according to any one of claims 1 to 10 connected together; and An electronic module (200) is clamped between heat-absorbing portions (111a) of two heat sinks (100), wherein the electronic module (200) comprises a substrate (210) and a plurality of electronic chips (220) mounted on both sides of the substrate (210).

12. The electronic component according to claim 11, wherein: The plurality of ribs (112) of one heat sink (100) and the plurality of ribs (112) of another heat sink (100) are arranged in a staggered manner.

13. The electronic component according to claim 11 or 12, characterized in that: The electronic component (10) further comprises a plurality of elastic thermal conductive pads (300), each elastic thermal conductive pad (300) being clamped between an electronic chip (220) and a heat absorbing portion (111a) of one of the two heat sinks (100).

14. The electronic component according to claim 11 or 12, characterized in that: The electronic module (200) is a memory stick, and the electronic chip (220) is a memory chip.

15. An electronic component, characterized in that: The electronic component (10) include: The heat sink (100) according to any one of claims 1 to 10; a positioning plate connected to the heat sink (100); and The electronic module (200) is clamped between the positioning plate and the heat absorbing portion (111a) of the heat sink (100), wherein: The electronic module (200) includes a substrate (210) and an electronic chip (220) mounted on one side of the substrate (210), and the heat absorption portion (111a) faces the electronic chip (220).

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