Hole opening structure of grinding layer of sintered grinding wheel

Abstract

The utility model relates to the technical field of thin-wall grinding wheels, in particular to a sintered grinding wheel grinding layer trepanning structure which comprises a grinding wheel rod, one end of the grinding wheel rod is fixedly connected with a grinding wheel head, the outer side end of the grinding wheel head is fixedly connected with a grinding part, and a chip removal hole assembly is arranged on the peripheral end face of the grinding part. The chip removal hole assembly comprises a single-hole structure and a double-hole structure, the single-hole structure and the double-hole structure are arranged in a staggered mode, the single-hole structure comprises first chip removal holes formed in the peripheral end face of the grinding part, and the double-hole structure comprises the single-hole structure and second chip removal holes formed in the bottom end face of the grinding part. According to the scheme, under the condition that other parameters of the grinding wheel rod are not changed, the structural strength of the head of the grinding wheel is improved, the problem that the grinding wheel cracks due to the fact that grinding force is increased in the machining process is solved, machining parameters are improved under the condition that machining quality is guaranteed, and therefore product machining efficiency is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of thin-walled grinding wheels, in particular to an open-hole structure of a grinding layer of a sintered grinding wheel. Background Art

[0002] When large-diameter grinding wheels are used for plane machining, the contact surface between the workpiece and the grinding wheel is large, and the resistance during grinding is relatively large. In actual machining, the machine tool, the workpiece, and the grinding wheel are often negatively affected due to excessive machine tool load. To avoid such situations, large-diameter plane machining grinding wheels often use thin-wall structures, such as the grinding wheel structure disclosed in Chinese patent number "CN113635226B", and in order to meet the cooling requirements during machining, the head generally has a partial hole groove structure. Conventional structures such as reference Figure 3 As shown, it is a multi-slot structure, which is widely used and relatively stable.

[0003] However, in actual applications, due to the deep grooves of this type of structure, the head will be divided into independent parts by the chip groove, resulting in insufficient overall strength of the grinding layer. When the grinding force is too large, the grinding layer is prone to cracking. Therefore, in actual use, the grinding parameters need to be controlled to prevent this phenomenon. This phenomenon seriously limits the improvement of processing efficiency. Therefore, improving the structural strength of thin-walled grinding wheels has become the primary issue for this type of grinding wheels. Utility Model Content

[0004] The purpose of the utility model is to solve the shortcomings of the prior art that the hole groove is deep and the head is divided into independent parts by the chip groove, resulting in insufficient overall strength of the grinding layer and easy cracking of the grinding layer when the grinding force is too large. A sintered grinding wheel grinding layer open hole structure is proposed.

[0005] In order to achieve the above purpose, the present invention adopts the following technical solutions:

[0006] A sintered grinding wheel grinding layer open hole structure is designed, comprising a grinding wheel rod, one end of the grinding wheel rod is fixedly connected to a grinding wheel head, the outer end of the grinding wheel head is fixedly connected to a grinding part, and a chip removal hole assembly is opened on the outer end surface of the grinding part;

[0007] The chip removal hole assembly includes a single-hole structure and a double-hole structure, and the single-hole structure and the double-hole structure are alternately arranged.

[0008] Preferably, the single-hole structure includes a first chip removal hole opened on the outer end surface of the grinding portion, and the first chip removal hole is configured as a rectangular structure.

[0009] Preferably, the double-hole structure includes the above single-hole structure and a second chip removal hole opened on the bottom end surface of the grinding part, and the second chip removal hole is set as a semicircular structure.

[0010] Preferably, the first chip removal hole and the second chip removal hole are arranged in a straight line, and there is a certain distance between the first chip removal hole and the second chip removal hole.

[0011] Preferably, the hole heights of the first chip removal hole and the second chip removal hole are both less than 2.5 mm.

[0012] Preferably, the chip removal hole assembly is provided as no less than one group.

[0013] Preferably, the multiple groups of chip removal hole assemblies are arranged in a circumferential distribution, and the spacing between the multiple groups of single-hole structures and the double-hole structures is equal.

[0014] Preferably, a plurality of groups of liquid inlet grooves are provided on the outer end surface of the grinding wheel head, and the plurality of groups of liquid inlet grooves are arranged to be distributed at equal intervals around the circumference.

[0015] The utility model proposes a sintered grinding wheel grinding layer opening structure, which has the beneficial effect of: without changing the grinding wheel processing size, the chip removal groove of the grinding wheel head is changed to a chip removal hole component structure evenly distributed in multiple places, this structure can improve the stress limit of the thin-walled structure, and the multiple staggered openings can ensure that the contact surface between the end face of the grinding wheel head and the workpiece is maintained in a stable state during the wear process, and the connecting bridges between the staggered holes can enable the grinding wheel head to maintain the overall structure. The chip removal holes are rectangular and semicircular in shape, and the hole height is less than 2.5mm, so that the end face of the grinding wheel is in a shallow groove state during the grinding wheel wear process, thereby ensuring the integrity of the thin-walled structure.

[0016] When cooling and chip removal are insufficient, the number of chip removal hole components can be increased. The hole size should not be increased to damage the stress structure. The strength of the thin-walled structure has been improved. When the processing parameters are too large, the end face cracking phenomenon can be improved. Therefore, the parameters can be appropriately increased during processing to improve processing efficiency while ensuring the processing quality of the grinding wheel. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 This is a schematic diagram of the structure of the opening structure of the grinding layer of a sintered grinding wheel proposed in the present invention;

[0018] Figure 2 This is a schematic cross-sectional view of an open-pore structure of a sintered grinding wheel grinding layer proposed in the present invention;

[0019] Figure 3 This is a comparison diagram between the open hole structure of the grinding layer of a sintered grinding wheel proposed in the present invention and the original structure;

[0020] Figure 4 This is a schematic diagram of the structure of a sintered grinding wheel grinding layer opening structure proposed by the present invention to increase the number of chip removal hole components;

[0021] Figure 5The utility model proposes a sintered grinding wheel grinding layer opening structure Figure 4 A partial enlarged view of the middle part;

[0022] Figure 6 This is a schematic diagram of the grinding portion structure of a sintered grinding wheel with an open-hole grinding layer proposed in the present invention.

[0023] In the figure: 1. Grinding wheel rod; 2. Grinding wheel head; 201. Liquid inlet tank; 3. Grinding part; 4. First chip removal hole; 5. Second chip removal hole. DETAILED DESCRIPTION

[0024] The technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all the embodiments.

[0025] Reference Figure 1-6 A sintered grinding wheel grinding layer open hole structure includes a grinding wheel rod 1, one end of the grinding wheel rod 1 is fixedly connected to a grinding wheel head 2, the outer end of the grinding wheel head 2 is fixedly connected to a grinding part 3, and a chip discharge hole component is opened on the outer end surface of the grinding part 3;

[0026] The chip removal hole assembly includes a single hole structure and a double hole structure, and the single hole structure and the double hole structure are staggered. Figure 3 Without changing the processing size of the grinding wheel, the chip groove of the grinding part 3 is changed to a chip removal hole component structure evenly distributed in multiple places. This structure can improve the stress limit of the thin-wall structure. Its staggered single-hole structure and double-hole structure can ensure that the contact surface between the grinding part 3 and the workpiece remains in a stable state during the wear process.

[0027] refer to Figure 1 In order to reduce the heat generated during the grinding process, multiple groups of liquid inlet grooves 201 are opened on the outer end face of the grinding wheel head 2. The multiple groups of liquid inlet grooves 201 are arranged to be distributed at equal intervals around the circumference, so that coolant can be injected from the inside, which can reduce the use of coolant and improve the cooling effect.

[0028] refer to Figure 5 In order to keep the grinding part 3 in a shallow groove state during the wear of the grinding wheel and ensure the integrity of the thin-walled structure, its single-hole structure includes a first chip removal hole 4 opened on the outer end face of the grinding part 3, and the first chip removal hole 4 is set to a rectangular structure, while the double-hole structure includes the above single-hole structure and a second chip removal hole 5 opened on the bottom end face of the grinding part 3, and the second chip removal hole 5 is set to a semicircular structure. In this way, without changing the other parameters of the grinding wheel rod, the structural strength of the grinding part of the grinding wheel is improved, and the problem of grinding wheel cracking caused by increased grinding force during processing is solved.

[0029] refer to Figure 1-6In order to avoid damaging the stress structure, the hole heights of the first chip removal hole 4 and the second chip removal hole 5 are both less than 2.5 mm, so that the strength of the thin-walled structure is improved.

[0030] refer to Figure 1-6 In order to improve the stability of the grinding wheel rod 1, the first chip removal hole 4 and the second chip removal hole 5 of the double-hole structure are distributed in a straight line. At the same time, there is a certain distance between the first chip removal hole 4 and the second chip removal hole 5. This distance is named as the connecting bridge, which can maintain the overall structure of the grinding wheel head 2.

[0031] refer to Figure 4 When insufficient cooling and chip removal is encountered, the number of chip removal hole assemblies can be increased. The chip removal hole assemblies are set to no less than one group, and multiple groups of chip removal hole assemblies are set to be distributed in a circle. The spacing between multiple groups of single-hole structures and double-hole structures is equal. In this way, the grinding effect can be further improved by increasing the number of chip removal hole assemblies.

[0032] Working method: During operation, without changing the processing size of the grinding wheel rod 1, the chip removal groove of the grinding wheel head 2 is changed to a chip removal hole assembly structure evenly distributed in multiple places, thereby improving the stress limit of the thin-walled structure and ensuring that the contact surface between the end face of the grinding part 3 and the workpiece is maintained in a stable state during the wear process, and the connecting bridge between the first chip removal hole 4 and the second chip removal hole 5 can enable the grinding part 3 to maintain the overall structure, and the chip removal hole shape is set to be rectangular and semicircular, and the hole height is limited to less than 2.5mm. At this time, the grinding part 3 is in a shallow groove state during the wear of the grinding wheel rod 1, which ensures the integrity of the thin-walled structure. When insufficient cooling and chip removal are encountered, the number of chip removal hole assemblies can be increased without increasing the hole size to avoid damaging the stress structure. The strength of the thin-walled structure is improved, and the end face cracking phenomenon can be improved when the processing parameters are too large. Therefore, the parameters can be appropriately increased during processing to improve the processing efficiency while ensuring the processing quality of the grinding wheel.

[0033] The above is only a preferred specific implementation method of the present invention, but the protection scope of the present invention is not limited to this. Any technician familiar with the technical field within the technical scope disclosed by the present invention can make equivalent replacements or changes based on the technical solution and utility model concept of the present invention, which should be covered by the protection scope of the present invention.

Claims

1. A sintered grinding wheel grinding layer open hole structure, comprising a grinding wheel rod (1), characterized in that: One end of the grinding wheel rod (1) is fixedly connected to a grinding wheel head (2), the outer end of the grinding wheel head (2) is fixedly connected to a grinding portion (3), and a chip removal hole assembly is provided on the outer end surface of the grinding portion (3); The chip removal hole assembly includes a single-hole structure and a double-hole structure, and the single-hole structure and the double-hole structure are alternately arranged.

2. The open-pore structure of the grinding layer of a sintered grinding wheel according to claim 1, characterized in that: The single-hole structure comprises a first chip removal hole (4) opened on the peripheral end surface of the grinding portion (3), and the first chip removal hole (4) is configured as a rectangular structure.

3. The open-pore structure of the grinding layer of a sintered grinding wheel according to claim 2, characterized in that: The double-hole structure comprises the above single-hole structure and a second chip removal hole (5) opened on the bottom end surface of the grinding portion (3), wherein the second chip removal hole (5) is configured as a semicircular structure.

4. The open-pore structure of the grinding layer of a sintered grinding wheel according to claim 3, characterized in that: The first chip removal hole (4) and the second chip removal hole (5) are arranged in a straight line, and there is a certain distance between the first chip removal hole (4) and the second chip removal hole (5).

5. The open-pore structure of the grinding layer of a sintered grinding wheel according to claim 4, characterized in that: The hole heights of the first chip removal hole (4) and the second chip removal hole (5) are both less than 2.5 mm.

6. The open-pore structure of the grinding layer of a sintered grinding wheel according to claim 1, characterized in that: The chip removal hole assembly is provided in at least one group.

7. The open-pore structure of the grinding layer of a sintered grinding wheel according to claim 6, characterized in that: The plurality of groups of chip removal hole components are arranged to be distributed in a circumferential manner, and the spacing between the plurality of groups of single-hole structures and the double-hole structures is equal.

8. The open-pore structure of the grinding layer of a sintered grinding wheel according to claim 1, characterized in that: A plurality of groups of liquid inlet grooves (201) are provided on the outer end surface of the grinding wheel head (2), and the plurality of groups of liquid inlet grooves (201) are arranged to be distributed at equal intervals around the circumference.

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